JP2002237697A - Electronic component mounting machine, electronic component mounting method, and recording medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the time caused by an electronic component mounting machine failure, as much as possible, even in the case of abnormality such as no component supply and failure in the electronic component mounting machine that has the component supply unit for accommodating a plurality of electronic components and for appropriately supplying the plurality of electronic components to a component mounting unit. SOLUTION: The component supply units 14 and 16 are arranged at each of two positions, that are set to both the sides of the conveyance path of a printed circuit board 12. The printed circuit board 12 is positioned at a target position and is held between the component supply units 14 and 16. Additionally, the component mounting unit 30 is provided, where it takes out the electronic components from one that is selected from either the component supply units 14 and 16. By the component mounting unit, one of the component supply units is selected for starting the placement of the electronic components. After that, when the component supply unit that has been selected currently fails, another component supply unit is selected for continuing mounting of the electronic components by the component mounting unit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting machine for sequentially mounting a plurality of electronic components on a workpiece to be transported and positioned along a transport path. The present invention relates to reduction of downtime for repairing an electronic component mounting machine.

[0002]

2. Description of the Related Art There is already an electronic component mounting machine which sequentially mounts a plurality of electronic components on a mounting target material which is conveyed and positioned along a conveying path. The mounting target material is, for example, a printed circuit board.Electronic components mounted on such a mounting target material include, for example, a chip type electronic component such as a resistor and a capacitor, a flat package type electronic component, a connector, and the like.
Various electronic components with or without leads.

[0003] This type of electronic component mounting machine is generally
(A) a component supply unit that is arranged close to the transport path and accommodates a plurality of electronic components, (b) a component mounting unit that extracts an electronic component from the component supply unit and mounts the electronic component on a mounting target material; c) a component mounting unit control device for supplying a drive signal to the component mounting unit and controlling the component mounting unit.

[0004] In a conventional example of this type of electronic component mounting machine, the component supply unit has a configuration in which a plurality of component supply cartridges are arranged in parallel in the transport direction, and each component supply cartridge is arranged. Is to accommodate a plurality of electronic components in a carrier tape fed intermittently in a line in the direction in which the carrier tape extends.

[0005] In another conventional example of this type of electronic component mounting machine, the component supply unit has a configuration in which a plurality of component trays are arranged vertically one above the other.
Each component tray has a configuration in which a plurality of electronic components are arranged and accommodated in a plane.

[0006]

In any of the conventional examples, there is a case where an abnormality occurs in the component supply unit. Types of abnormalities include a component exhaustion in which the electronic component to be mounted on the mounting target material runs out in the component supply unit, and a failure in which the component supply unit cannot operate normally despite the presence of the electronic component in the component supply unit. .

[0007] However, in any of the conventional examples, when an abnormality occurs in the component supply unit, for example, a worker performs recovery work from the abnormality, and during that time,
The electronic component mounting machine had to be stopped. For example, if the type of abnormality is out of component, the electronic component mounting machine must be stopped while the electronic component is being supplied to the component supply unit, and the type of abnormality is a failure of the component supply unit. In some cases, the electronic component mounting machine had to be stopped while the component supply unit was being repaired.

[0008]

SUMMARY OF THE INVENTION In view of such circumstances, the present invention provides a method for controlling an electronic component even when an abnormality such as a component shortage or failure occurs in a component supply unit. The object of the present invention is to shorten the time required for the component mounting machine to go down as much as possible, and the following aspects can be obtained by the present invention. Each mode is described in the same manner as in the claims, divided into sections, each section is numbered, and described in the form of citing the numbers of other sections as necessary. This is to facilitate understanding of some of the technical features described in the present specification and some of the combinations thereof, and the technical features and the combinations thereof described in the present specification have the following aspects. It should not be construed as limited.

(1) An electronic component mounting machine that sequentially mounts a plurality of electronic components on a positioned mounting target material that is transported along a transporting path, wherein the transporting route separates the positioned mounting target material. Two component supply units arranged at both sides of the electronic component and accommodating a plurality of electronic components, and component mounting for taking out the electronic component from a selected one of the two component supply units and mounting the electronic component on the mounting target material A unit and a component mounting unit control device for controlling a component mounting unit by supplying a drive signal to the component mounting unit, wherein one of the two component supply units is selected to drive the component mounting unit. If an error occurs in the selected component supply unit after starting the signal supply, another component supply unit is selected and the component mounting unit is selected. An electronic component mounting machine including a device that continues to supply a drive signal to a kit [Claim 1]. In this electronic component mounting machine, after one of the two component supply units is selected and supply of a drive signal to the component mounting unit is started, if an error occurs in the selected component supply unit, another And the supply of the drive signal to the component mounting unit is continued. Therefore, according to this electronic component mounting machine, the mounting of the electronic component is continued as long as no abnormality occurs in any of the two component supply units. Therefore, it is not essential to stop the electronic component mounting machine due to the abnormality of the component supply unit, and the non-stop operation of the electronic component mounting machine can be easily realized. Further, in this electronic component mounting machine, two component supply units that are alternately selected in response to the occurrence of an abnormality are respectively disposed on both sides of the transport path of the mounting target material. Therefore, according to this electronic component mounting machine, it is easier to avoid that the transport path becomes longer than when the two component supply units are arranged side by side along the transport path of the mounting target material. I can do it. (2) The electronic component according to item (1), wherein the two component supply units should normally house all of a plurality of electronic components to be mounted on the mounting target material independently. Mounting machine. In this electronic component mounting machine, mounting of all electronic components on one mounting target material should be performed using only one of the two component supply units and not using the other component supply unit. As a matter of fact, the electronic components are accommodated in these two component supply units. (3) The type of the abnormality includes exhaustion of a component that has been exhausted in an electronic component to be mounted on the mounting target material, which is currently selected from the two component supply units, and the component mounting unit control device includes: The system further includes two monitors for respectively monitoring the states of the two component supply units, and based on a signal from the two monitors corresponding to the currently selected component supply unit, the currently selected one is selected. (1) or (2) including first mounting continuation means for continuing mounting of the electronic component by the component mounting unit by using another component supply unit when the component supply unit has run out of components. The electronic component mounting machine according to the item (2). According to this electronic component mounting machine, the mounting of the electronic components can be continued as long as the components do not run out in either of the two component supply units. (4) A failure in which the currently selected one of the two component supply units cannot operate normally despite the presence of electronic components to be mounted on the mounting target material. Wherein the component mounting unit control device includes two monitors for respectively monitoring the states of the two component supply units, and the two monitors corresponding to the currently selected component supply unit among the two monitors A second mounting continuation means for continuing mounting of the electronic component by the component mounting unit by using another component supplying unit when the currently selected component supplying unit fails based on the signal from The electronic component mounting machine according to any one of (1) to (3). According to this electronic component mounting machine, the mounting of the electronic component can be continued unless a failure occurs in any of the two component supply units. "Fault" in this section
For example, when the configuration of the component supply unit is such that the plurality of component supply cartridges described above are arranged, it is a feed failure of the carrier tape or the like. (5) The two component supply units accommodate a plurality of electronic components so as to be arranged in the same order.
The component mounting unit control device, when an abnormality occurs in the currently selected one of the two component supply units, and when the abnormality does not occur, the component mounting unit selects a plurality of electronic components at the moment. (1) to (4) including signal supply means for supplying a drive signal for extracting a plurality of electronic components from another component supply unit to the component mounting unit in the same order as the order of removal from the component supply unit. An electronic component mounting machine according to any one of claims 1 to 4. In this electronic component mounting machine, when an abnormality occurs in the currently selected component supply unit, a drive signal for another component supply unit is thereafter supplied to the component mounting unit. The signal can be generated as substantially the same as the original drive signal (the drive signal that would have been supplied to the component mounting unit when no abnormality occurred), or the original drive signal was modified. However, the change is relatively simple. Therefore, according to this electronic component mounting machine, the non-stop operation of the electronic component mounting machine can be easily realized without performing complicated processing on the drive signal to be supplied to the component mounting unit. (6) The electronic component mounting machine according to any one of (1) to (5), wherein the component mounting unit is provided commonly to the two component supply units. In this electronic component mounting machine, a component mounting unit is provided commonly to two component supply units that are alternately selected in response to the occurrence of an abnormality. Therefore, according to this electronic component mounting machine, compared to the case where the component mounting units are individually provided for these two component supply units,
The number of components of the electronic component mounting machine can be easily reduced, and the electronic component mounting machine can be easily downsized. (7) The electronic component mounting machine according to any one of (1) to (5), wherein the component mounting unit is provided in each of the two component supply units. (8) In each of the component supply units, the electronic component according to any one of (1) to (7), wherein a frame supporting the plurality of electronic components is fixed in position with respect to the transport path. Mounting machine. (9) In each of the component supply units, the electronic component according to any one of (1) to (7), wherein a frame supporting the plurality of electronic components is variable in position with respect to the transport path. Mounting machine. (10) Each of the component supply units is configured by arranging a plurality of component supply cartridges in parallel in the transport direction, and each component supply cartridge is provided with a plurality of electronic components on a carrier tape that is intermittently sent. (1) to (9) accommodate the ones that are housed in a line in the direction in which the carrier tape extends.
Electronic component mounting machine according to any one of the above items. (11) Each of the component supply units is configured by arranging a plurality of component trays in a vertically stacked manner,
The electronic component mounting machine according to any one of (1) to (9), wherein each component tray accommodates a component configured to accommodate a plurality of electronic components arranged in a plane. (12) The component mounting unit suctions and holds the electronic components one by one, and holds the suction head and holds the suction head in one plane with the selected component supply unit and the mounting. (1) The electronic component mounting machine according to any one of (1) to (11), including a motion imparting mechanism for causing a motion between the target material and the target material. (13) The electronic component mounting machine according to (12), wherein the motion imparting mechanism includes an XY slide mechanism that moves the suction head in the XY directions on the one plane. (14) The electronic component mounting machine according to (12) or (13), wherein the motion imparting mechanism includes a revolving mechanism that revolves the suction head around one orbit axis intersecting the one plane. (15) The electronic component mounting machine according to any one of (12) to (14), wherein the motion imparting mechanism includes a rotation mechanism that rotates the suction head around a single rotation axis that intersects the one plane. (16) Further, a transport unit that transports the mounting target material along the transport path is included (1) to (15).
Electronic component mounting machine according to any one of the above items. (17) The transport unit according to (16), wherein the transport unit includes a motion imparting mechanism that moves the mounting target material in a plane parallel to a surface of the mounting target material in a direction intersecting the direction of the transport path. Electronic component mounting machine. (18) An electronic component mounting machine that sequentially mounts a plurality of electronic components on a positioned mounting target material that is transported along a transport route, and (a) the transport route that separates the positioned mounting target material. Two component supply units that are respectively disposed at both side positions of the electronic component and accommodate a plurality of electronic components,
(B) a component mounting unit that extracts an electronic component from a selected one of the two component supply units and mounts the electronic component on the mounting target material; and (c) supplies a drive signal to the component mounting unit to mount the component. And a component mounting unit control device for controlling the unit.
After one of the two component supply units is selected and mounting of the electronic component by the component mounting unit is started, if an abnormality occurs in the selected component supply unit, another component supply unit is selected and the component supply unit is selected. An electronic component mounting method for continuing mounting of electronic components by the mounting unit [Claim 4]. According to this electronic component mounting method, the same effect as that of the electronic component mounting machine according to the above mode (1) can be realized according to the same principle. (19) The electronic component mounting method is performed in a state where the two component supply units accommodate a plurality of electronic components in a line in the same order, and are currently selected from the two component supply units. In the case where an abnormality occurs in the object, when the abnormality does not occur, the component mounting unit removes the plurality of electronic components from another component supply unit in the same order as the other components in the same order as the currently selected component supply unit. The electronic component mounting method according to claim 18, wherein a drive signal for taking out from the supply unit is supplied to the component mounting unit [18]. According to this electronic component mounting method, the same effect as that of the electronic component mounting machine according to the above mode (5) can be realized. (20) A recording medium in which a computer-executable program for executing the electronic component mounting method according to (18) or (19) is recorded in a computer-readable manner. If the program recorded on this recording medium is executed by a computer, the above (1)
The same operation and effect as the method according to the item (8) or (19) can be realized. The “recording medium” in this section can adopt various formats, for example, a magnetic recording medium such as a floppy (registered trademark) disk, an optical recording medium such as a CD or a CD-ROM, a magneto-optical recording medium such as an MO, At least one of an unremovable storage such as a ROM can be adopted.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Some specific embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a plan view conceptually showing the configuration of an electronic component mounting machine (hereinafter simply referred to as “mounting machine”) 10 according to a first embodiment of the present invention. This mounting machine 10
Is a device for mounting a plurality of electronic components on the printed circuit board 12 which is conveyed and positioned along a conveyance path (the direction is indicated by a white arrow in the figure).

The mounting machine 10 includes a first component supply unit 14
And a second component supply unit 16. Those two
The two component supply units 14 and 16 are disposed at two positions on both sides of the transport path and separated from the printed circuit board 12 positioned above. The two component supply units 14 and 16 have a common configuration with each other, and individually house all of a plurality of electronic components to be mounted on the printed circuit board 12 in a common arrangement. Further, the two component supply units 14,
16 are not used simultaneously but are used alternatively.

FIG. 2 shows the mounting machine 10 in a plan view. The mounting machine 10 has a base 20. In the base 20, one direction in one horizontal plane (coinciding with the left-right direction in the figure) is set as an X-axis direction, and one direction perpendicular to the X-axis direction in the same horizontal plane is set as a Y-axis direction. I have.

As shown in FIG. 2, a transport unit 22 for transporting the printed circuit board 12 is mounted on the base 20. In the present embodiment, the transport unit 22
However, there is provided a conveyor 24 extending along the transport path of the printed circuit board 12 (the direction thereof is indicated by a white arrow in the drawing). The transport path extends in the X-axis direction.
The conveyor 24 transports the printed circuit board 12 along a transport path in a horizontal position. The printed circuit board 12 transported by the transport unit 22 (in particular, the conveyor 24) is positioned at a predetermined target position by a positioning unit (not shown).

The above-described first component supply unit 14 and second component supply unit 16 are arranged on both sides of the base 20 in the Y-axis direction so as to sandwich the conveyor 24. These two component supply units 14, 16
Are fixed in position with respect to the transport path.

The two component supply units 14 and 16
In each case, a plurality of component supply cartridges 26 are accommodated in respective frames 25 in a state of being arranged in parallel in the X-axis direction, that is, in the transport direction. Hereinafter, for convenience of explanation, of the component supply cartridges 26, those contained in the first component supply unit 14 are referred to as “component supply cartridges 26a”, and those contained in the second component supply unit 16 are referred to as “component supply cartridges 26b”. Sometimes.

Each of the component supply cartridges 26 is a carrier tape (not shown) wound and held on a reel (not shown), in which a plurality of electronic components are accommodated in a line in an extending direction and arranged at equal intervals. To accommodate.
Each component supply cartridge 26 is provided with a control device 60 described later.
The carrier tape is intermittently fed on the basis of a command signal from the controller tape (see FIG. 3), whereby the electronic components contained in the carrier tape are supplied one by one to each of the component supply cartridges 26. It is driven so as to be moved to a position and positioned.

Each of the component supply cartridges 26 can be of a type accommodating one carrier tape or a type accommodating a plurality of carrier tapes. Each of the component supply cartridges 26 has a format for accommodating the same type of electronic components, and for example, accommodates a plurality of types of electronic components on the same carrier tape, or accommodates a plurality of types of electronic components on the plurality of types of carrier tape. It is possible to adopt a method of accommodating a plurality of types of electronic components by a method such as the above.

In the present embodiment, the first component supply unit 14 and the second component supply unit 16 each independently house all of a plurality of electronic components to be mounted on the printed circuit board 12, and The arrangement order of the plurality of component supply cartridges 26a and 26b in each of the component supply units 14 and 16 is set so that the plurality of electronic components can be supplied to the component mounting unit 30 described later in the same order.

It should be noted that, in this embodiment,
Both of the two component supply units 14 and 16 are configured to accommodate a plurality of electronic components by the plurality of component supply cartridges 26, but this is not essential for carrying out the present invention. Absent. For example, both of the two component supply units 14 and 16 are provided with a plurality of component trays for vertically stacking and storing a plurality of electronic components, and a plurality of electronic components are stacked by the component trays. It is possible to take the form to accommodate. Further, the first component supply unit 14 and the second component supply unit 16 may employ different electronic component accommodation formats. This applies to another embodiment described later in detail.

As shown in FIG. 2, a component mounting unit 30 is further mounted on the base 20. The component mounting unit 30 includes the first component supply unit 14 and the second
The electronic component is taken out from a component selected from the component supply unit 16 (this “selection” will be described later in detail), and the printed circuit board 1 positioned at the target position is taken out.
The electronic components are mounted on 2. That is, one component mounting unit 30 is provided commonly to the first component supply unit 14 and the second component supply unit 16.

The component mounting unit 30 includes a suction head 32
And an XY slide mechanism 34.

The suction head 32 is an electronic component to be mounted on the printed circuit board 12 and is the first component supply unit 1.
It has a mechanism for sucking and holding the components supplied by the fourth or second component supply unit 16 one by one. As the mechanism, for example, a mechanism adopted in a component suction head described in Japanese Patent No. 2824378,
Various types of mechanisms are known.
These known mechanisms can be appropriately selected and adopted.

The XY slide mechanism 34 is an X-axis slide 3
6 and a Y-axis slide 38 for holding the suction head 32.

The X-axis slide 36 is mounted on the base 20 so as to be movable in the X-axis direction in a posture extending in the Y-axis direction. The X-axis slide 36 is connected to the first component supply unit 14.
And the second component supply unit 16. The X-axis slide 36 has two X-axis ball screws 40,
Two nuts screwed to 41 (not shown)
Are supported so that they cannot rotate and cannot move relative to the X-axis slide 36. The X-axis slide 36 is an X-axis ball screw 4
By rotating the motors 0 and 41 in synchronization with each other by the X-axis servo motors 42 and 43, they are moved in the X-axis direction along guide rails (not shown).

The Y-axis slide 38 is mounted on the X-axis slide 36 so as to be movable in the Y-axis direction. Y axis slide 3
Numeral 8 supports a nut (not shown) screwed to the Y-axis ball screw 44 so as to be non-rotatable and relatively immovable with respect to the Y-axis slide 38. The Y-axis slide 38 is configured such that the Y-axis ball screw 44 is driven by a Y-axis servomotor 46 to drive the pair of gears 4.
By being rotated via 8, 49, it is moved in the Y-axis direction along the guide rail 50 provided on the X-axis slide 36. The Y-axis slide 38 is movable over substantially the entire length of the X-axis slide 36.

As shown in FIG. 2, the Y-axis slide 38 is
A holding mechanism 52 is provided. The holding mechanism 52 holds one suction head 32 at a position above a horizontal plane on which the printed circuit board 12 and the two component supply units 14 and 16 are arranged. The holding mechanism 52 holds, for example, the suction head 32 so as to be able to move up and down and rotate around one vertical axis.

In short, the XY slide mechanism 34 moves the suction head 32 between the first component supply unit 14 and the second component supply unit 16 on an arbitrary horizontal plane defined by the X-axis direction and the Y-axis direction. It is moved to the position.

Having described the configuration of the component mounting unit 30, the operation will now be described.

The component mounting unit 30 is driven as follows based on a command signal from the control device 60.

The component mounting unit 30 first moves the suction head 32 by the XY slide mechanism 34 to the component supply position of one of the component supply cartridges 26 in the selected one of the two component supply units 14 and 16. Let it. Here, “any one of the component supply cartridges 26” contains an electronic component to be mounted on the printed circuit board 12 this time (hereinafter, also simply referred to as “current electronic component”) among the plurality of component supply cartridges 26. Things.

The mounting head 32 and each component supply unit 1
In order to explain the relative positional relationship between the suction head 32 and the suction head 32, the state where the suction head 32 is located at the component supply position of a certain component supply cartridge 26 in the second component supply unit 16 is shown by a solid line in FIG. I have. In the figure,
The state where the suction head 32 is located at the component supply position of a certain component supply cartridge 26 in the first component supply unit 14 is indicated by a two-dot chain line.

Next, the component mounting unit 30 sucks the electronic component supplied to the component supply position by the suction head 32, takes it out of the component supply cartridge 26, and holds it. With this operation, the electronic component is supplied from the component supply cartridge 26 to the component mounting unit 30.

The component mounting unit 30 then holds the suction head 32 while holding the electronic component on the suction head 32.
2 is moved by the XY slide mechanism 34 to the target component mounting position on the printed circuit board 12 positioned at the target position.

Next, the component mounting unit 30 mounts the electronic component held by the suction head 32 on the printed circuit board 12.

The mechanical configuration and a part of the operation of the mounting machine 10 have been described above, and the electrical configuration thereof will be described below with reference to FIG.

The mounting machine 10 has a control device 60 for controlling its operation. The control device 60 includes a CPU 6
2, a computer 72 in which a memory 64, an input interface 66, and an output interface 68 are mutually connected by a bus 70.

The input interface 72 includes two component outage monitoring monitors 74 and 76 and two failure monitoring monitors 7.
8,80.

Two component outage monitoring monitors 74 and 76 are provided for the first component supply unit 14 and the second component supply unit 16, respectively. Each of the component out monitoring monitors 74 and 76 is provided with a corresponding component supply unit 14 and 1.
For each of the component supply cartridges 26, whether or not the electronic components are exhausted is monitored. When each of the component shortage monitoring monitors 74 and 76 detects a component shortage, the control device 60 outputs a signal indicating the detection together with an identification signal for identifying the component supply cartridge 26 in which the component shortage has occurred.
Output to

The component-out monitoring monitors 74 and 76 include, for example, a sensor for detecting the operation state of the component supply cartridge 26, a counter for counting the number of electronic components actually taken out of the component supply cartridge 26 or a number corresponding thereto. Is configured to include at least one of the following. An example of the sensor is that the electronic component is a component supply cartridge 26.
It is an optical sensor for checking whether or not the image remains.

The two failure monitoring monitors 78 and 80 are provided for the first component supply unit 14 and the second component supply unit 16 similarly to the component outage monitoring monitors 74 and 76, respectively. For each of the component supply units 14 and 16, each of the failure monitoring monitors 78 and 80 detects a failure (for example, an electronic component) that cannot operate normally despite containing an electronic component for each of the component supply cartridges 26. The feeding of the carrier tape containing the paper is monitored. Each of the failure monitoring monitors 78 and 80, like the component outage monitoring monitors 74 and 76, when detecting a failure, outputs a signal indicating the detection together with an identification signal for identifying the component supply cartridge 26 in which the failure has occurred. Output to control device 60. The failure monitoring monitors 78 and 80 have the same configuration as the component outage monitoring monitors 74 and 76. However, an example of the sensors as the failure monitoring monitors 78 and 80 for detecting the operation state of the component supply cartridge 26 is, for example, an operation of an actuator for driving the component supply cartridge 26 in order to detect a feeding failure of a carrier tape or the like. Is a sensor for confirming.

It should be noted that, in this embodiment,
In each of the component supply units 14 and 16, monitoring of the presence or absence of a component shortage and monitoring of the presence or absence of a failure are performed by separate monitors. However, the present invention is implemented by being performed by the same monitor. It is possible to

As shown in FIG. 3, the output interface 6
8 is connected to the first component supply unit 14, the second component supply unit 16, the component mounting unit 30, the transport unit 22, and the operator call device 82.

The operator call device 82 includes the control device 6
Based on the command signal from 0, an operator call is made to call attention to the operator of the mounting machine 10. The operator call device 82 is configured to include at least one of various notification devices such as an indicator light, a buzzer, and a display.

The memory 64 is configured to include a recording medium such as a ROM, a RAM, a magnetic disk, and an optical disk. Various programs including a component mounting program are stored in the memory 64 in advance. FIG. 4 is a flowchart conceptually showing the contents of the component mounting program.

Here, the contents of the component mounting program will be described. First, a conceptual description will be given.

The component mounting program selects one of the two component supply units 14 and 16 and supplies a command signal for driving to the component mounting unit 30 (that is, the electronic component by the component mounting unit 30). Is carried out. Further, this component mounting program is designed to start supplying a command signal to the component mounting unit 30 and, when an abnormality (the above-mentioned component shortage or failure) occurs in the selected component supply units 14 and 16, another component supply program is executed. By selecting the units 16 and 14, the component mounting unit 30
This is executed in order to continue supplying the command signal to.

Further, the component mounting program is executed by the component mounting unit 30 to take out a plurality of electronic components from the currently selected one of the two component supply units 14 and 16 in a preset order. You.
The “order” is set in advance for each printed circuit board 12 and stored in the memory 64. Further, the component mounting program is configured to execute a plurality of electronic components when an abnormality occurs in the currently selected component supply units 14 and 16 in an order that would have been realized when the abnormality did not occur. Another parts supply unit 1 in the same order
Performed to retrieve from 6,14.

Next, the contents of the component mounting program will be specifically described with reference to the flowchart of FIG.

This component mounting program is executed after the power supply of the computer 72 is turned on, for example, every time the printed circuit board 12 on which electronic components are to be mounted is positioned at the target position by the transport unit 22. At the time of each execution, first, step S1 (hereinafter simply referred to as “S1”).
The same applies to other steps. ), One of the two component supply units 14 and 16 corresponding to the device number specified by executing the production program (not shown) stored in the memory 64 or the one specified by the on-machine command Is provisionally selected as a device for supplying the current electronic component to the component mounting unit 30. In the description of the component mounting program, for convenience, the description will be made assuming that the first component supply unit 14 is provisionally selected in S1.

Next, in S2, among the plurality of component supply cartridges 26a in the tentatively selected first component supply unit 14, the one corresponding to the current electronic component (hereinafter, referred to as the "current component supply cartridge 26a"). In), it is determined whether an abnormality has been detected at the present time. Here, “abnormal” means that the current electronic component runs out of the current component supply cartridge 26a and that the current component supply cartridge 26a operates normally despite the current electronic component being accommodated. It is a failure that cannot be obtained. Whether the "out of parts" is detected
The determination is made based on a signal from the component exhaustion monitor 74. The presence / absence of "failure" is determined by the failure monitor 7
8 is determined based on the signal from the control unit 8.

If no abnormality is detected in the current component supply cartridge 26a, the determination in S2 is NO.
In S3, the first component supply unit 14
The selection as a device for supplying the electronic component to the component mounting unit 30 at this time is determined.

Subsequently, in S4, the first command signal for driving the current component supply cartridge 26a is the first command signal.
It is supplied to the component supply unit 14, and subsequently, in S5, a second command signal for driving the component mounting unit 30 is supplied to the component mounting unit 30. As a result of the supply of the first command signal and the second command signal, the current electronic component is supplied from the current supply cartridge 26a to the component mounting unit 30, and further, the electronic component is
It is mounted on the printed circuit board 12 positioned at the target position.

Thereafter, in S6, the printed circuit board 12
It is determined whether or not all of the electronic components to be mounted on the component mounting unit 30 have been supplied to the component mounting unit 30. If all the electronic components have not been supplied, the determination in S6 is NO, and the process returns to S1.

When all the electronic components are supplied to the component mounting unit 30 as a result of repeating the execution of S1 to S6 without determining that the abnormality is detected in S2, the determination in S6 becomes YES, One execution of this component mounting program ends.

As described above, the current component supply cartridge 26a
In the above, the case where no abnormality was detected was described. However, if the abnormality was detected, the determination in S2 is YES, and
Move to S7. In this step, a third command signal for performing an operator call prompting a process for an abnormality in the current component supply cartridge 26a is supplied to the operator call device 82. Here, the “processing for the abnormality” is processing for replenishing electronic components to the component supply cartridge 26a when the detected abnormality is out of parts, and when the detected abnormality is a failure. Is a recovery process of the current component supply cartridge 26a.

Thereafter, in S8, the one of the two component supply units 14, 16 which was not selected in S1 (the second component supply unit 16 corresponds in the description of this program) is replaced by the current electronic component. Is tentatively selected as a device for supplying the component mounting unit 30.

Subsequently, in step S9, a plurality of component supply cartridges 26b in the tentatively selected second component supply unit 16 accommodating the current electronic component in accordance with step S2 (hereinafter, referred to as “the cartridges”). It is determined whether an abnormality has been detected at this time in the current component supply cartridge 26b ”). Here "abnormal"
This means, like S2, that the current component supply cartridge 26b has run out of components and that the current component supply cartridge 26b has failed. Further, the presence or absence of the detection of “part missing” and “failure” is determined based on each signal from the part lack monitoring monitor 76 and the failure monitoring monitor 80, respectively, as in S2.

If no abnormality is detected in the current component supply cartridge 26b, the determination in S9 is NO.
In S10, the selection of the second component supply unit 16 as the device for supplying the current electronic component to the component mounting unit 30 is determined according to S3.

Thereafter, in S11, a fourth command signal for driving the current component supply cartridge 26b is supplied to the second component supply unit 16 in accordance with S4, and subsequently in S12, in accordance with S5. Thus, a fifth command signal for driving the component mounting unit 30 is supplied to the component mounting unit 30. As a result of the supply of the fourth command signal and the fifth command signal, as in the case of the supply of the first command signal and the second command signal,
The current electronic component is supplied to the component mounting unit 30 from the current supply cartridge 26b, and the electronic component is mounted on the printed circuit board 12.

Thereafter, in S13, it is determined whether or not all of the electronic components to be mounted on the printed circuit board 12 have been supplied to the component mounting unit 30 in accordance with S6. If not all electronic components are supplied,
The determination in S13 is NO, and the process returns to S8.

When all of the electronic components are supplied to the component mounting unit 30 as a result of repeating the above steps S8 to S13 without determining that an abnormality has been detected in S9, the determination in S13 becomes YES, and One execution of this component mounting program ends.

As described above, the current component supply cartridge 26b
In the above, the case where no abnormality was detected was described, but if an abnormality was detected, the determination in S9 is YES, and
Move to S14. In S14, a sixth command signal for performing an operator call prompting a process for an abnormality in the current component supply cartridge 26b is supplied to the operator call device 82 in accordance with S7. Here, the “process for an abnormality” is a replenishment process or a recovery process for the current component supply cartridge 26b, as in S7.

Thereafter, when all the electronic components are supplied to the component mounting unit 30 by repeating the execution of the corresponding steps among S1 to S14, one execution of the component mounting program is completed.

As is clear from the above description, according to the present embodiment, it is not necessary to stop the mounting machine 10 unless the two component supply units 14 and 16 simultaneously have an abnormality. Downtime of the mounting machine 10 due to an abnormality of the units 14 and 16 can be easily reduced.

This will be specifically described using numerical values. For example, a cycle which is a time required to take out one electronic component from one of the component supply units 14 and 16 and mount it on the printed circuit board 12 is described. If the time is 0.75 seconds and the component supply cartridge 26 can accommodate 2,000 electronic components per reel at a time, it takes until the electronic components no longer exist on one reel. The time is 2000 × 0.75 = 1500 (seconds). Here, assuming that the length of downtime, which cannot be avoided by the mounting machine 10 in order to replenish the reels of the component supply cartridge 26 with the electronic components, is 120 seconds, the mounting machine 10 is required to replenish the electronic components. The ratio of the time during which 10 must be stopped is (120/1500) × 100 = 8 (%). Therefore, according to the present embodiment, it is possible to improve the efficiency of producing the printed circuit board 12 at a ratio corresponding to the stop time ratio.

As is apparent from the above description, in the present embodiment, the printed circuit board 12 constitutes an example of the “material to be mounted” in the first and fourth aspects, and the component mounting unit 30 corresponds to the first to fifth aspects. A part of the control device 60 that constitutes an example of the “component mounting unit” and executes the component mounting program of FIG. 4 is an example of the “component mounting unit control device” in claims 1, 2, 4, and 5. 2 and at least the first component supply unit 1 in S3 of FIG.
The determination of the selection of the fourth component and the determination of the selection of the second component supply unit 16 in S10 respectively constitute an example of the “selection” in claims 1, 2, 4 and 5, and are executed by executing the component mounting program in FIG. The electronic component mounting method realized by the mounting machine 10 constitutes an example of the “electronic component mounting method” according to claims 4 and 5.

Further, in this embodiment, the computer 72 constitutes an example of the "computer" in claim 6, the component mounting program in FIG. 4 constitutes an example of the "program" in the claim, and the memory 64 This constitutes an example of the “recording medium” according to the claim.

Next, a second embodiment of the present invention will be described.
However, in the present embodiment, since many elements are common to the first embodiment, only different elements will be described in detail while comparing them with the first embodiment, and common elements will be described using the same reference numerals. The description will be omitted by substituting the description of the first embodiment.

In the first embodiment, the printed circuit board 1
2 cannot be moved in a horizontal plane in a direction intersecting the transport direction. On the other hand, in the mounting machine 200 according to the present embodiment, the movement is performed by a
04.

Further, in the first embodiment, the positioning of the printed circuit board 12 is performed for each printed circuit board 12, and the position of the printed circuit board 12 changes while a plurality of electronic components are mounted on the same printed circuit board 12. I can't.
On the other hand, in the present embodiment, during the mounting of a plurality of electronic components on the same printed circuit board 12, for each electronic component, according to the target component mounting position of the electronic component on the printed circuit board 12, The positioning of the printed circuit board 12 is performed.

Furthermore, in the first embodiment, neither the first component supply unit 14 nor the second component supply unit 16 can move along the transport path. On the other hand, in the present embodiment, movement along the transport path is enabled by support mechanisms 206 and 208 described later.

The printed board support mechanism 204 moves the XY table 210 to move the printed board 12 fixedly supported on the XY table 210 to the X-axis direction.
It is moved to an arbitrary position within a horizontal plane defined by the axial direction and the Y-axis direction.

The XY table 210 is mounted on the base 20 so as to be horizontally movable. The XY table 210 is an X-axis ball screw 2 screwed to a nut (not shown) that cannot rotate and cannot move relative to the XY table 210.
As the X. 12 is rotated by the X-axis servo motor 214, it is moved in the X-axis direction along the guide rails 216 and 217. Further, the XY table 210
As in the case of the movement in the X-axis direction, the Y-axis ball screw 218 screwed to the nut (not shown) is rotated by the Y-axis servomotor 220 to thereby move the Y-axis along the guide rail (not shown). Moved in the direction.

The printed board supporting mechanism 204 moves the XY table 210 together with the printed board 12 in accordance with the target component mounting position based on a command signal from the control device 60, and moves the printed board 12 at that position. Driven to position.

The support mechanisms 206 and 208 respectively
Support tables 224 and 226 are provided. Those supports 22
Reference numerals 4 and 226 are attached to the base 20 so as to be movable in the X-axis direction at two positions sandwiching the printed circuit board support mechanism 204. Each support base 224, 226 is 2
Of the two component supply units 14 and 16
The plurality of component supply cartridges 26 are accommodated so as to be aligned in parallel in the X-axis direction. Furthermore, each support 22
The guide rails 232 and 4226 are rotated by a servo motor 230 rotating a ball screw 228 screwed to a nut (not shown) which cannot rotate and cannot move relative to each of the support bases 224 and 226. 233
Along the X-axis.

Further, each of the support mechanisms 206 and 208 is provided with a plurality of component supply cartridges supported on the support bases 224 and 226 based on a command signal for driving the component supply units 14 and 16 from the control device 60. 26 to the corresponding component mounting units 250 and 252 (described later).
Is driven to move to a predetermined component supply position every time. Here, the "plural component supply cartridges 26
“Any of” means the one that contains the current electronic component among the plurality of component supply cartridges 26.

In the first embodiment, one component mounting unit 30 is provided commonly to the two component supply units 14 and 16, whereby the number of component mounting units 30 is one.

On the other hand, in the present embodiment, the first component supply unit 14 and the second component supply unit 16 are provided with the first component mounting unit 250 and the second component mounting unit 252, respectively. I have. The number of component mounting units 250 and 252 is two.

Further, in the first embodiment, the component mounting unit 30 causes the single suction head 32 to perform a combined motion of the linear motion in the X-axis direction and the linear motion in the Y-axis direction, thereby providing the electronic component. From each of the component supply units 14 and 16 to the printed circuit board 12.

On the other hand, in the present embodiment, each of the component mounting units 250 and 252 is
By rotating the 56 intermittently in a plane, the electronic components are transferred from the component supply units 14 and 16 to the printed circuit board 1.
Convey to 2.

The first component mounting unit 250 and the second
The configuration with the component mounting unit 252 will be described more specifically. The two component mounting units 250 and 252
Have basically the same configuration. In each of the component mounting units 250 and 252, the index table 2
56 is supported rotatably about one vertical axis fixed to the space. The index table 256 stores the plurality of suction heads 32 at equal angular intervals around the axis of the suction heads 32.
2 can be held in a state in which at least the up and down movement and the rotation can be performed. Thereby, the index table 256 can hold a plurality of electronic components at one time.

The intermittent rotation mechanism 254 transmits the driving force of the index servomotor (not shown) to the index table 256 via a motion transmission mechanism (not shown) such as a cam mechanism, so that the index table 256 is transmitted. Rotate intermittently.

In the present embodiment, as in the first embodiment, the electronic components are transferred one by one from the two component supply units 14 and 16 to the component mounting unit 30 and transferred to the printed circuit board 12. Instead of being mounted on a plurality of electronic components, a plurality of electronic components are grouped into one set, and a plurality of electronic components are sequentially arranged in each set into two component supply units 14 and 16.
The selected electronic component is transported from the selected component to the selected one of the two component mounting units 250 and 252 in accordance with the selection, and the plurality of transported electronic components are sequentially mounted on the printed circuit board 12. Has become.

In the present embodiment, a computer 72 executes a component mounting program having basically the same contents as the component mounting program in the first embodiment on the mounting machine 200 described above. Therefore, the component mounting program in the present embodiment is configured to include S1 to S14 corresponding to S1 to S14 in the component mounting program in the first embodiment, respectively.

However, as described above, the mounting machine 200
The mechanical configuration is partially different from the mounting machine 10 in the first embodiment. Therefore, the component mounting program according to the present embodiment is modified from the component mounting program according to the first embodiment in accordance with the difference in the mechanical configuration.

Specifically, in the first embodiment, the printed circuit board 12 cannot be moved in a direction intersecting the transport direction, and it is not necessary to position the printed circuit board 12 in the intersecting direction. In the present embodiment, the printed circuit board 12 is movable in a direction intersecting the transport direction, and it is necessary to position the printed circuit board 12 not only in the transport direction but also in a direction intersecting the transport direction.

Therefore, in the present embodiment, the step of supplying a command signal for driving the printed board support mechanism 204 to the printed board support mechanism 204 via the transport unit 202 between S2 and S6 is performed in S
21 and a similar step
Between 9 and S13, it is added as S22.

Further, in the first embodiment, since the number of the component mounting units 30 is one, even if the selection between the first component supply unit 14 and the second component supply unit 16 is changed, the component mounting is not performed. Therefore, the target to which the command signal is supplied is not changed. On the other hand, in the present embodiment, the number of the component mounting units 250 and 252 is two, and the component mounting units 250 and 2 are selected according to the selection of the first component supply unit 14 and the second component supply unit 16.
It is necessary to select 52.

Therefore, in the present embodiment, in S5, the first component mounting unit 250 corresponding to the first component supply unit 14 is selected and a command signal is supplied thereto. Similarly, in S12, the second component mounting unit 252 corresponding to the second component supply unit 16
And a command signal is supplied to it.

In the first embodiment, the number of electronic components that can be held by the component mounting unit 30 at one time is one, whereas in the present embodiment, each of the component mounting units 250 and 252 is The number of electronic components that can be held is plural.

For this reason, in the present embodiment, after the operation of the current component supply units 14 and 16 starts, an abnormality occurs in the current component supply units 14 and 16, and as a result, immediately after that, the current component supply unit Unit 14, 1
6, the two component mounting units 250, 252
Among them, the one corresponding to the current component supply unit 14, 16 is stopped, and then another component supply unit 14, 1
6 is selected and activated, and at the same time, the current component mounting units 250 and 252 corresponding to the other component supply units 14 and 16 are selected and activated. , 252 are the same as the electronic components remaining in the current component supply unit 1.
4, 16 and current component mounting units 250, 252
May not be mounted on the printed circuit board 12.

Therefore, in this embodiment, if an abnormality occurs in the current component supply units 14 and 16 after the operation of the current component supply units 14 and 16 starts,
The current component mounting units 250 and 252 are not stopped immediately, and after all the electronic components remaining in the current component mounting units 250 and 252 are mounted on the printed circuit board 12, the other component supply units 14 and 252 are stopped. 16 and the operation of the other component mounting units 250 and 252 are started.

As is apparent from the above description, in the present embodiment, the first component mounting unit 250 and the second component mounting unit 252 cooperate with each other, and
This constitutes an example of the “component mounting unit” in 2, 4, and 5.

Furthermore, in the present embodiment, the part of the control device 60 that executes the component mounting program is an example of the "component mounting unit control device" in claims 1, 2, 4 and 5, and " And a determination of the selection of the first component supply unit 14 in the step corresponding to S3 of FIG. 4 and the determination of the selection of the second component supply unit 16 in the step corresponding to S10. Constitute an example of “selection” in claims 1, 2, 4, and 5, and the electronic component mounting method realized in the mounting machine 200 by executing the component mounting program is described in “Electronics” in claims 4 and 5. The component mounting program constitutes an example of the "component mounting method", and the component mounting program constitutes an example of the "program" in claim 6.

Next, a third embodiment of the present invention will be described.
However, in the present embodiment, since many elements are common to the first embodiment, only different elements will be described in detail while comparing them with the first embodiment, and common elements will be described using the same reference numerals. The description will be omitted by substituting the description of the first embodiment.

In the first embodiment, the component mounting unit 30 controls the electronic component by one suction head 32.
Each of the components is taken out of each of the component supply units 14 and 16 and transported to the printed circuit board 12.

On the other hand, the mounting machine 3 according to the present embodiment
00, the component mounting unit 302 includes the plurality of suction heads 32 held in the index table 304.
Thus, a plurality of electronic components are sequentially taken out from the component supply units 14 and 16, and the held plurality of electronic components are sequentially transported to the printed circuit board 12.

The component mounting unit 302 includes a frame 306 that supports the index table 304 so as to be rotatable around one vertical axis, and the index table 304.
Is provided with an intermittent rotation mechanism 308 for intermittently rotating according to the same principle as in the second embodiment.

The component mounting unit 302 arranges the plurality of suction heads 32 on the index table 304 in such a manner that the suction heads 32 are arranged at equal angular intervals around the vertical axis and that the suction heads 32 can move up and down and rotate. ,Hold.

The component mounting unit 302 further includes a first
An XY slide mechanism 34 having the same configuration as that of the embodiment is provided. The XY slide mechanism 34 is provided for the index table 3
04 is moved in the X-axis direction and the Y-axis direction.

In this embodiment, as in the first embodiment, the electronic components are transferred one by one from the two component supply units 14 and 16 to the component mounting unit 30 one by one, and Instead of being mounted on a plurality of electronic components, as in the second embodiment, a plurality of electronic components are grouped into one set, and a plurality of electronic components are sequentially set for each set.
A selected one of the component supply units 14 and 16 is transported to the component mounting unit 302, and the plurality of transported electronic components are sequentially mounted on the printed circuit board 12.

In the present embodiment, the computer 72 executes a component mounting program having basically the same contents as the component mounting program in the first embodiment on the mounting machine 300 described above. Therefore, the component mounting program in the present embodiment is configured to include S1 to S14 corresponding to S1 to S14 in the component mounting program in the first embodiment, respectively.

In the first embodiment, the number of electronic components that can be held by the component mounting unit 30 at one time is one. On the other hand, in the present embodiment, the component mounting unit 3
02 can hold a plurality of electronic components at one time. Therefore, in the present embodiment, after the operation of the current component supply units 14 and 16 starts, an abnormality occurs in the current component supply units 14 and 16 and, as a result, immediately after that,
The component mounting unit 302 is stopped, and another component supply unit 14 or 16 is selected.
2 and the other component supply units 14 and 16 are activated, the electronic components remaining in the component mounting unit 302 at that time may not be mounted on the printed circuit board 12.

Therefore, in this embodiment, if an abnormality occurs in the current component supply units 14 and 16 after the operation of the current component supply units 14 and 16 starts,
The component mounting unit 302 is not stopped immediately, but waits until all the electronic components remaining in the component mounting unit 302 are mounted on the printed circuit board 12, and the operation of the other component supply units 14 and 16 and the components are stopped. The operation of the mounting unit 302 is started.

As is clear from the above description, in this embodiment, the component mounting unit 302 constitutes an example of the "component mounting unit" in claims 1 to 5, and executes the component mounting program in the control device 60. The steps to be performed constitute an example of the "component mounting unit control device" in claims 1, 2, 4, and 5, and an example of "signal supply means" in claim 2, and at least correspond to step S3 in FIG. The determination of the selection of the first component supply unit 14 and the determination of the selection of the second component supply unit 16 in the step corresponding to S10 are respectively performed in claim 1 and
An example of “selection” in 2, 4 and 5 is described, and the electronic component mounting method realized in the mounting machine 300 by executing the component mounting program is an example of the “electronic component mounting method” according to claims 4 and 5. Thus, the component mounting program constitutes an example of the “program” in claim 6.

In addition, in the above-described second and third embodiments, the index tables 256 and 304 that are intermittently rotated by a certain angle are used. It is possible to carry out the present invention by using a rotating body that can be rotated at a time at an angle.

As described above, some embodiments of the present invention have been described in detail with reference to the drawings. However, these are merely examples, and the embodiments described in the above-mentioned section "Means for Solving the Problems and Effects of the Invention" are described. The present invention can be implemented in other forms with various modifications and improvements based on the knowledge of those skilled in the art.

[Brief description of the drawings]

FIG. 1 is an electronic component mounting machine 1 according to a first embodiment of the present invention.
FIG. 2 is a plan view conceptually showing a configuration of a zero.

FIG. 2 is a plan view showing the electronic component mounting machine 10 shown in FIG.

FIG. 3 is a block diagram for explaining an electrical configuration of the electronic component mounting machine 10 shown in FIG.

FIG. 4 is a flowchart conceptually showing the contents of a component mounting program in FIG.

FIG. 5 is an electronic component mounting machine 2 according to a second embodiment of the present invention.
It is a top view which shows 00.

FIG. 6 is an electronic component mounting machine 3 according to a third embodiment of the present invention.
It is a top view which shows 00.

[Explanation of symbols]

 10, 200, 300 Electronic component placement machine 12 Printed circuit board 14 First component supply unit 16 Second component supply unit 30, 302 Component placement unit 60 Control device 72 Computer 250 First component placement unit 252 Second component placement unit

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Minoru Yoriki 19th Chausanyama, Yamamachi, Chiryu-shi, Aichi F-term in Fuji Machinery Manufacturing Co., Ltd. (reference) 5E313 AA02 AA11 AA15 AA23 DD02 DD03 DD21 DD31 DD49 EE02 EE03 EE06 EE24 EE25 EE35 FF24 FF28 FG02

Claims (6)

[Claims] 1. An electronic component mounting machine for sequentially mounting a plurality of electronic components on a mounting target material conveyed and positioned along a conveying path, wherein the electronic component mounting machine includes: Two component supply units respectively arranged at both side positions and accommodating a plurality of electronic components, and a component mounting unit for extracting an electronic component from a selected one of the two component supply units and mounting the electronic component on the mounting target material And a component mounting unit control device for supplying a drive signal to the component mounting unit to control the component mounting unit, wherein one of the two component supply units is selected and a drive signal to the component mounting unit is selected. In the case where an abnormality occurs in the selected component supply unit after the supply of the component is started, another component supply unit is selected and the component mounting unit is selected. Electronic component mounting machine including a device that continuously supplies a drive signal to the electronic component mounting device. 2. The two component supply units for accommodating a plurality of electronic components so as to be arranged in the same order as each other, and wherein the component mounting unit control device is currently selected from the two component supply units. In the case where an abnormality occurs in the component, if the abnormality does not occur, the component mounting unit separates the plurality of electronic components in the same order in which the plurality of electronic components are taken out from the currently selected component supply unit. The electronic component mounting machine according to claim 1, further comprising a signal supply unit configured to supply a drive signal for taking out from the component supply unit to the component mounting unit. 3. The component mounting unit, wherein the component mounting unit is provided commonly to the two component supply units.
Or the electronic component mounting machine according to 2. 4. An electronic component mounting machine for sequentially mounting a plurality of electronic components on a mounting target material conveyed and positioned along a conveying path, wherein: (a) the electronic component mounting machine is provided with the positioned mounting target material separated therefrom. (B) two component supply units arranged at both sides of the transport path and accommodating a plurality of electronic components, and (b) taking out the electronic component from a selected one of the two component supply units, And (c) a component mounting unit control device for controlling the component mounting unit by supplying a drive signal to the component mounting unit, wherein one of the two component supply units is provided. After selecting and starting mounting electronic components by the component mounting unit,
If an error occurs in the selected parts supply unit,
An electronic component mounting method in which another component supply unit is selected and mounting of electronic components by the component mounting unit is continued. 5. The electronic component mounting method is performed in a state in which the two component supply units accommodate a plurality of electronic components in the same order, and are currently selected from among the two component supply units. In the case where an abnormality occurs in the component, if the abnormality does not occur, the component mounting unit separates the plurality of electronic components in the same order in which the plurality of electronic components are taken out from the currently selected component supply unit. 5. The electronic component mounting method according to claim 4, wherein a drive signal for taking out from the component supply unit is supplied to the component mounting unit. 6. A recording medium in which a computer-executable program for executing the electronic component mounting method according to claim 4 or 5 is recorded in a computer-readable manner.