JP2002223100A - Electronic component mounting method, electronic component mounting device and electronic component mounting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable mounting of an electronic component whose whole characteristic of a circuit is not restricted by individual characteristic of an electronic component by providing an electronic component mounting method and an electronic component mounting device and an electronic component mounting system, which enable mounting by changing an electronic component, which is to be mounted on other position, according to individual characteristic of a specific electronic component to be mounted. SOLUTION: When a desired electronic component is unloaded from an electronic component supply part and mounted on a prescribed position on a substrate based on mounting data 61 wherein a mounting position of an electronic component and a component supply position of an electronic component in an electronic component supply part storing a plurality of electronic component are recorded in order of mounting, a dissimilar characteristic electronic component, wherein a plurality of kinds of individual characteristic exist, is supplied to a component supply position one by one, and mounting data to an electronic component excepting a dissimilar characteristic electronic component is changed and the electronic component is mounted according to individual characteristic of the supplied dissimilar characteristic electronic component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method, an electronic component mounting apparatus, and an electronic component mounting system for forming an electronic circuit by mounting a predetermined electronic component at a predetermined position on an electronic circuit board. More specifically, the present invention relates to a technology for changing the characteristics of other electronic components in accordance with the component characteristics of the electronic component to be mounted.

[0002]

2. Description of the Related Art A conventional electronic component mounting apparatus mounts an electronic component having a predetermined characteristic at a predetermined mounting position on a circuit formed on a mounting substrate (substrate), and mounts the electronic component on a substrate lot. This is repeated for each substrate or each formed circuit. This includes, for example, as shown in FIG.
An electronic component mounting apparatus 7 including a control unit 1, an electronic component supply unit 3, and a component transfer unit 5 is used. In the electronic component mounting apparatus 7, mounting position data for mounting a predetermined electronic component on the substrate 9 and component supply position data 11 corresponding to each mounting position are stored in the control unit 1 in advance, as shown in FIG. Based on the mounting position data and the component supply position data 11, the control unit 1 controls the operation of the board positioning unit 15, the electronic component supply unit 3, and the component transfer unit 5, and mounts the electronic component at a predetermined position on the substrate 9. I do. The electronic components supplied here are generally supplied with the same characteristics at each component supply position. The reason for this is that there has been a basic request for the electronic component mounting apparatus 7 to create a large number of circuits of the same type.

[0003]

However, in an electronic circuit such as a mobile communication system in recent years, a characteristic variation between individual electronic components is changed by changing a characteristic of an additional component to equalize the characteristics of the entire circuit. The need has arisen.
This is, as shown in FIG. 17, the specific electronic component CX to be mounted.
Additional parts (C
100, C103, R2, and R3) are changed and mounted.
A circuits 17 and 19 are formed. Conversely,
In some cases, it is necessary to change the characteristics of each mounted circuit. This corresponds to each of the boards 21 and 23 to be mounted as shown in FIG.
Electronic components mounted for each circuit (C100, C103, R
2, R3) to realize the formation of circuit characteristics AA and AB different for each of the substrates 21 and 23 or each circuit.
These two problems are different from each other in terms of circuit design, but from the viewpoint of an electronic component mounting method, they can be said to be the same in that different electronic components are mounted for each substrate or each circuit. Also, electronic components with different individual characteristics
As shown in FIG. 19, it is general that the electronic component is stored in the component supply tape 25 in the same manner as a normal electronic component. In order to determine how many parts of the component supply tape 25 have been used during component supply, only the data on the number of components used in the control unit of the electronic component mounting apparatus is a determination factor. for that reason,
If specific electronic components with different individual characteristics are supplied only depending on the data on the number of used components, if the electronic component mounting equipment malfunctions, the supply order will be different from the predetermined order, and erroneous mounting will occur. May occur.

The present invention has been made in view of the above circumstances, and an electronic component mounting method and an electronic component mounting method capable of changing and mounting an electronic component to be mounted at another position for each individual characteristic of a specific electronic component to be mounted. An object of the present invention is to provide a component mounting apparatus and an electronic component mounting system, and to enable electronic component mounting in which the overall characteristics of a circuit are not restricted by the individual characteristics of the electronic component.

[0005]

According to a first aspect of the present invention, there is provided an electronic component mounting method, comprising: a mounting position of an electronic component; and an electronic component supply unit accommodating a plurality of electronic components. Based on mounting data in which the component supply position of the electronic component is recorded in the mounting order and component allocation data in which the type of the electronic component corresponding to the component supply position is recorded, a desired electronic component is supplied from the electronic component supply unit. In the electronic component mounting method of taking out and mounting at a predetermined position on a substrate, a heterogeneous characteristic electronic component having a plurality of individual characteristics is sequentially supplied to the component supply position, and the supplied heterogeneous characteristic electronic component is individually supplied. The mounting data for electronic components other than the electronic component having different characteristics is changed according to the characteristics, and different types of electronic components are mounted at the mounting positions of the other electronic components. And wherein the door.

In this electronic component mounting method, different characteristic electronic components having a plurality of individual characteristics are sequentially supplied to a component supply position, and according to the individual characteristics of the supplied different characteristic electronic components, other than the different characteristic electronic components. By changing the mounting data for the other electronic components, different types of electronic components are mounted at the mounting positions of the other electronic components, and the characteristics of the entire circuit can be changed. As a result, it is possible to mount electronic components in which the overall characteristics of the circuit are not restricted by the characteristics of the heterogeneous electronic components. For example, it is possible to produce the circuit with the same characteristics for each circuit regardless of the individual characteristics of the heterogeneous electronic components. .

According to a second aspect of the present invention, there is provided an electronic component mounting method, wherein combination data in which conversion information for changing a component supply position of a specific electronic component to a component supply position for another electronic component is provided in advance is provided. A combination flag is added to the electronic component having the different characteristic, and for a circuit having mounting data to which the combination flag is added, an electronic component supply position of an electronic component mounted on the circuit is determined using the combination data. It is characterized by changing.

According to this electronic component mounting method, a combination flag is added to the mounting data for the electronic component having the different characteristic, so that the component supply position of the mounting data for the circuit in which the mounting data having the combination flag exists exists. Is changed based on the combination data. Thus, even when different-type electronic components having different characteristics are mounted for each circuit, the electronic components to be mounted at other positions can be automatically changed and mounted according to the individual characteristics of the different-characteristic electronic components.

According to a third aspect of the present invention, there is provided an electronic component mounting method, comprising: mounting data in which a mounting position of an electronic component and a component supply position of the electronic component in an electronic component supply unit accommodating a plurality of electronic components are recorded in a mounting order; An electronic component mounting method for taking out a desired electronic component from the electronic component supply unit and mounting the electronic component at a predetermined position on a board based on component allocation data in which the type of the electronic component corresponding to the component supply position is recorded. A plurality of heterogeneous electronic components, each having a plurality of individual characteristics, are accommodated in a plurality of components, but are accommodated on a component supply tape formed in a row with a predetermined number of blanks for each predetermined number of continuous and at the time of mounting electronic components. When taking out the different characteristic electronic component from the component supply tape, the presence or absence of the different characteristic electronic component is detected, and the coincidence with the set continuous number and blank number is confirmed. To.

In this electronic component mounting method, when the different characteristic electronic components housed in the component supply tape are sequentially taken out from the end of the component supply tape, the presence or absence of the different characteristic electronic components is detected, and the set continuous number and the set number are determined. Make sure it matches the number of blanks,
Electronic components are mounted on the condition that the actual number of continuations matches the actual number of blanks. This makes it possible to confirm that the electronic component mounting apparatus mounts the electronic components in a predetermined supply order, and that the correct electronic component mounting in accordance with the electronic component supply order is being performed during the electronic component mounting. And it is possible to prevent defective production.

According to a fourth aspect of the present invention, there is provided an electronic component mounting method, comprising: mounting data in which a mounting position of an electronic component and a component supply position of the electronic component in an electronic component supply unit accommodating a plurality of electronic components are recorded in a mounting order; An electronic component mounting apparatus takes out a desired electronic component from the electronic component supply unit and mounts the electronic component at a predetermined position on a board based on component allocation data in which the type of the electronic component corresponding to the component supply position is recorded. In the electronic component mounting method, the mounting data and the component allocation data are input to an external control device connected to the electronic component mounting device, and the external control device controls the electronic component based on the mounting data and the component supply data. Generate a mounting program for performing a mounting operation, send the mounting program from the external control device to the electronic component mounting device, and And performing implementation based on the mounting program by electronic component mounting apparatus.

In this electronic component mounting method, mounting data and component allocation data are input to an external control device, and the external control device generates a mounting program for mounting an electronic component based on the mounting data and the component supply data. Generate. This mounting program is sent from the external control device to the electronic component mounting apparatus, and the electronic component mounting apparatus executes the mounting program. For this reason, the electronic component mounting apparatus only needs to have a function of performing a mounting operation in accordance with a mounting program sent from the external control device. Thus, it is possible to change the electronic components mounted at other positions.

According to a fifth aspect of the present invention, there is provided an electronic component mounting apparatus, comprising: mounting data in which a mounting position of an electronic component and a component supply position of the electronic component in an electronic component supply unit accommodating a plurality of electronic components are recorded in a mounting order; An electronic component mounting apparatus that takes out a desired electronic component from the electronic component supply unit and mounts the electronic component at a predetermined position on a board based on component allocation data in which the type of the electronic component corresponding to the component supply position is recorded. Storing the mounting data, the component allocation data, and combination data recording conversion information for changing a component supply position of a specific electronic component to a component supply position for another electronic component; A control unit that changes a component supply position of the mounting data for the circuit using the combination data for a circuit in which the component exists. And wherein the door.

In this electronic component mounting apparatus, mounting data, component allocation data, and combination data are stored, and a component supply position of mounting data for this circuit is combined with a circuit having electronic components having different characteristics. Make changes based on your data. Thus, different types of electronic components are mounted at other mounting positions, and the characteristics of the entire circuit can be changed. Thus, electronic components can be mounted in which the overall characteristics of the circuit are not restricted by the characteristics of the heterogeneous electronic components. For example, the characteristics of each circuit can be made the same regardless of the individual characteristics of the heterogeneous electronic components.

According to a sixth aspect of the present invention, in the electronic component mounting apparatus, a component supply tape accommodating the heterogeneous characteristic electronic component in a plurality of component housings formed in a row with a predetermined number of blanks left for every predetermined number of consecutive units. Is provided in the electronic component supply unit, and when the control unit sequentially takes out the different characteristic electronic components from the end of the component supply tape, the control unit detects presence / absence of the different characteristic electronic component and determines the set continuous number. And matching means for confirming the match with the number of blanks.

In this electronic component mounting apparatus, when the different characteristic electronic component is taken out from the component supply tape provided in the electronic component supply unit, the presence / absence of the different characteristic electronic component is detected by the comparing unit of the control unit, and the setting is performed. The coincidence between the continuous number and the blank number is confirmed, and the electronic component is mounted on condition that the actual continuous number and the blank number match. This makes it possible to confirm that the electronic component mounting apparatus mounts the electronic components in a predetermined supply order, and that the correct electronic component mounting in accordance with the electronic component supply order is being performed during the electronic component mounting. And it is possible to prevent defective production.

An electronic component mounting system according to claim 7 is
The mounting position of the electronic component, and mounting data in which the component supply position of the electronic component in the electronic component supply unit that accommodates a plurality of electronic components is recorded in the mounting order, and the type of the electronic component corresponding to the component supply position is recorded. An electronic component mounting system in which an electronic component mounting apparatus takes out a desired electronic component from the electronic component supply unit and mounts the electronic component at a predetermined position on a board based on the component allocation data. An external control device to which the allocation data is input and connected to the electronic component mounting apparatus generates a mounting program for mounting an electronic component based on the mounting data and the component supply data, and executes the mounting program on the electronic component mounting apparatus. By sending the electronic component mounting device to the device, the electronic component mounting device performs mounting based on the mounting program.

In this electronic component mounting system, mounting data and component allocation data are input to an external control device, and the external control device generates a mounting program for mounting an electronic component based on the mounting data and the component supply data. I do. This mounting program is sent from the external control device to the electronic component mounting apparatus, and the electronic component mounting apparatus executes the mounting program. For this reason, the electronic component mounting apparatus only needs to have a function of performing a mounting operation in accordance with a mounting program sent from the external control device. Thus, it is possible to change the electronic components mounted at other positions.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of an electronic component mounting method, an electronic component mounting apparatus and an electronic component mounting system according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is an external perspective view of a first embodiment of an electronic component mounting apparatus according to the present invention, FIG. 2 is a plan view showing a schematic configuration of a component mounting mechanism in the electronic component mounting apparatus of FIG. 1, and FIG. FIG. 4 is a side view partially showing a schematic configuration of a component mounting mechanism in the electronic component mounting apparatus, and FIG. 4 is a schematic plan view of a rotary head for explaining an operation of the component mounting mechanism.

As shown in FIGS. 1 and 2, the electronic component mounting apparatus 31 mainly includes an electronic component supply unit 33 for continuously supplying electronic components, and a predetermined component supply position 33a of the electronic component supply unit 33. A rotary head 36 for holding the electronic component 35 and mounting the electronic component 35 on a substrate 37 (see FIG. 3).
And an XY table 39 for positioning the substrate 37. The substrate 37 supplied from the substrate carry-in section 38 is placed on the XY table 39, and the electronic component 35 is supplied from the electronic component supply section 33 by the rotary head 36. After the holding, the board is mounted on the board 37 by performing an appropriate correction process.
Is to be carried out. Also, the electronic component mounting apparatus 31
An input unit 43 for inputting various data, control conditions, and the like;
The display unit 45 includes a display unit 45 that displays the state of the apparatus, the contents of data, image data, and the like, and a control unit 47 (see FIG. 2) that controls the operations of these units.

As shown in FIG. 3, a plurality of component supply units 49 accommodating a large number of electronic components 35 are arranged in parallel in the direction perpendicular to the paper surface of the electronic component supply unit 33, and the component supply units 49 are arranged in the parallel direction. By moving, a desired electronic component 35 is supplied to the component supply position 33a. The XY table 39 is movably provided between the substrate carrying-in part 38 and the substrate carrying-out part 41, moves to a position connected to the substrate carrying path of the substrate carrying-in part 38, and receives the board 37 before component mounting.
The board 37 is fixed and moved to the component mounting position of the rotary head 36. Then, the movement of the board 37 according to the mounting position of each electronic component 35 is repeated, and when the component mounting is completed, the XY table 39 moves to a position where it is connected to the board unloading unit 41, and the board 37 is transferred to the board unloading unit 41. Send out.

The rotary head 36 includes a plurality of mounting heads 51 for holding the electronic components 35, and a rotary frame 53 that is rotatably driven while supporting the mounting head 51 on its peripheral surface so as to be vertically movable.
And an index rotation driving device 55 that drives the rotation frame 53 to rotate in the index direction.

The mounting head 51 moves from the component supply position 33a of the electronic component supply unit 33 to the original component supply position 33a through the component mounting position on the opposite side by rotation of the rotary frame 53.
Rotate to move up. Details of this operation will be described below with reference to FIG. As shown in FIG. 4, the rotary head 36 has a plurality of (in this embodiment, a total of 12) mounting heads 51 supported on the outer periphery of the rotary frame 53 so as to be vertically movable and rotatable. Accommodates a plurality of (in this embodiment, a total of five) suction nozzles 57 that can hold electronic components of different sizes by suction. Then, the suction nozzle 57 corresponding to the electronic component is arranged at the outermost diameter position 59 by the rotation of the mounting head 51, and the suction nozzle 57 at the outermost diameter position holds and holds the electronic component.
The mounting operation is performed. The rotary head 36 can perform predetermined processing continuously at each station by rotating the mounting head 51 clockwise by an index.

Next, the processing in each station will be described. First, a station 1 (hereinafter abbreviated as ST1) is a component suction position, which coincides with the component supply position 33a of the electronic component supply section 33, and The electronic component 35 is held by the suction nozzle 57 from the supply unit 33. ST3 is a component suction confirmation position, in which the two-dimensional line sensor measures the electronic component 35 held by the suction nozzle 57 and notifies the electronic component mounting apparatus 31 of the measured value. At this time, when the thickness of the electronic component 35 is equal to or less than a predetermined fixed value, the electronic component mounting apparatus 31 determines that a component is not held or an improper component is held and performs a predetermined operation in a subsequent stage.
ST4 is a component recognition position. The electronic component 35 held by the suction nozzle 57 is imaged from below by a two-dimensional CCD camera (deviation amount measuring means), and the dimension center and the inclination angle of the electronic component 35 are measured. Notify the component mounting apparatus 31. ST6 is a rotation position of the suction nozzle 57, and the suction nozzle 57 itself is rotated in a horizontal plane by a predetermined mounting angle of the electronic component 35 and a tilt angle measured at the component recognition position.

ST7 is a component mounting position. After positioning the XY table 39 based on the result measured at the component recognition position, the mounting head 51 is pushed downward, and the electronic component 35 is moved to the substrate 37 at the lowest point. It is mounted on the upper predetermined position. ST9 is a component disposal position. When it is determined that an inappropriate electronic component 35 is held at the component suction confirmation position and the component recognition position, the electronic component 35 is placed in the component disposal box attached at this position. Discard. ST11 is a nozzle selection position, in which the mounting head 51 is rotated in accordance with the type of electronic component to be sucked and held, and a suitable suction nozzle 57 is moved to the outermost position 59.

As a means for correcting the inclination angle of the electronic component, a method may be used in which the mounting head 51 itself is rotated, and the horizontal displacement caused by the rotation is absorbed by the movement of the XY table 39.

The electronic component mounting apparatus 31 provided with such a basic operation function for mounting electronic components is further provided with a heterogeneous electronic component having a plurality of individual characteristics in accordance with the individual characteristics. It has a function of appropriately changing the characteristics of an electronic component mounted at a position other than the electronic component having different characteristics and mounting the electronic component. The change function will be described with reference to FIGS.

FIGS. 5A and 5B show a mounting position 1 (1-D) on the substrates 37a (substrate number 1) and 37b (substrate number 2).
The individual characteristics of the heterogeneous electronic components mounted in (1, 2-1) differ depending on the supply order, and the mounting positions 2 (1-2, 2-2) and 5 (1-
5, 2-5), and 6 (1-6, 2-6) schematically show examples where it is necessary to change the electronic components. Also,
The combination of each electronic component on the substrates 37a and 37b is shown in FIG.
The content is as shown in FIG.

FIG. 6 shows a control unit 47 of the electronic component mounting apparatus 31.
FIG. 6 shows various data stored in advance in FIG.
FIG. 6A is a storage table 61 showing mounting data such as mounting position data, component supply position data, and combination data in a table format. FIG. 6B is a mounting position data and component to be changed for each circuit number of the board. FIG. 6C shows a storage table 63 in which the combination data in which the supply position data is set is shown in a table format, and FIG. 6C shows the component supply positions and the electronic components when the boards 37 a and 37 b are mounted based on the data shown in the storage tables 61 and 63. 9 is a storage table 65 showing component allocation data of component names in a table format.

Next, using the electronic component mounting apparatus 31 described above, for the electronic component mounted at a mounting position other than the electronic component having the different characteristic, the component supply position data in the mounting data is converted into the electronic component having the different characteristic. The procedure of the electronic component mounting method that changes according to the individual characteristics of the component will be described with reference to the flowchart in FIG.

First, the control unit 47 of the electronic component mounting apparatus 31 previously stores the number of boards to be produced, the mounting data and the combination data shown in the storage tables 61 and 63, and starts production (step 1; Abbreviated). Substrate 37
Arrives at the XY table 39 (S2), the controller 47
Counts up the number of production boards (S3). Then, one step of the mounting data is read (S4), and it is confirmed that the step is not the end step (S5).

If it is not the end step, it is determined whether a combination flag is specified in the read mounting data (S6). If the step has a combination flag, the designated combination data is read, and the number of production boards at this time is set as a board number (S7). Based on the read combination data, the control unit 47 rewrites the component supply position data of the specified mounting data to the content specified by the combination data (S8).

According to the rewritten mounting data, the electronic component is taken out of the electronic component supply unit 33 by the rotary head 36, and the board 37 is moved by the XY table 39 to mount the electronic component on the board 37 (S
9). Then, the process proceeds to the next step (S4) of the mounting position data. If the combination data is not specified in the read mounting position data, the electronic component is mounted as it is according to the mounting position data (S9).

If the mounting position data has reached the end step, it is determined whether or not the number of production boards has reached the number of planned production boards (S10). S11) Wait for the next substrate to arrive. When the number of boards to be produced has been reached, the production ends (S1).
2).

By performing the above operation based on the mounting data and the combination data shown in FIG. 6, the operation shown in FIG.
As shown in (a) and (b), the electronic components at the mounting positions 2, 5, and 6 can be changed and mounted according to the supply order (order of characteristics) of the electronic components having different characteristics at the mounting position 1. As a result, the circuit characteristics of the substrates 37a and 37b can be made the same.

In this embodiment, the mounting data is 1
The presence / absence of a combination flag is determined each time a step is read.
When 7 arrives, the combination data is read in batch,
The rewriting process of the component supply position may be completed, and the electronic component mounting operation up to the end step may be continuously performed.

Further, in this embodiment, a combination flag for setting the mounting position data of the change destination and the component supply position data is added to the mounting data for which the component supply position data needs to be changed. The component supply position data in the mounting data of the change destination is changed with reference to the combination flag. Here, a case has been described as an example where the number of pieces of mounting data having the combination flag is one. However, other pieces of mounting data may have the combination flag. In this case, the combination flag is indicated by the number of the combination data prepared in plural types. Specifically, the flag may be, for example, "2" (necessary change by flag number 2 of combination data) in addition to "none" (no change required) or "1" (necessary change by flag number 1 of combination data). As described above, the board number may be set for each board. As a result, different electronic components can be mounted for each characteristic of the electronic component having different characteristics mounted on the board, and for each substrate (or circuit), for each individual characteristic of the specific electronic component, the type of electronic component mounted at another position Can be changed and implemented. Conversely, even when the individual characteristics of the supplied electronic components are the same, it is possible to mount electronic components that form electronic circuits having different characteristics for each substrate (circuit).

Further, in this embodiment, an example is shown in which one circuit (the number of circuit patterns) is provided for each production substrate. However, even in a substrate in which a plurality of circuits are formed on one substrate, a circuit unit may be used. The present invention can be similarly applied by storing the combination data in.

As described above, according to the electronic component mounting method according to the present embodiment, electronic components having different characteristics mounted at predetermined mounting positions are grasped in advance for each component characteristic and supplied in a known component characteristic order. . Then, the component supply position data of the mounting data for the electronic component mounted at another mounting position is changed according to the component characteristics of the heterogeneous electronic component, and the electronic component is mounted at another position according to the individual characteristics of the heterogeneous electronic component. The type of the electronic component is changed and mounted. As a result, an electronic circuit having the same characteristics can be formed for each substrate and each circuit even when electronic components having different characteristics having different individual characteristics are supplied.

Next, a description will be given of a second embodiment of the electronic component mounting method according to the present invention. FIG. 8 is an explanatory diagram showing an example of a component supply tape used in the second embodiment of the present invention and its component supply data, and FIG. 9 is a flowchart illustrating an operation procedure of the second embodiment. . In the following embodiments, the same members as those shown in FIGS. 1 to 4 are denoted by the same reference numerals, and overlapping description will be omitted.

In this embodiment, a component supply tape 71 is used, which accommodates electronic components 35 having different characteristic components having different characteristics and arranged in a predetermined number of spaces with a predetermined number of blank spaces. The component supply tape 71 accommodates a plurality of components, but is formed in a line.
5 are accommodated. Further, the control unit 47 previously stores a predetermined continuous number and a predetermined blank number, and
When sequentially supplying the different-characteristic electronic components 35 held at the end from the end of the component supply tape, there is provided collation means for collating the stored continuous number and blank number with the actual continuous number and blank number. As the collating means, a two-dimensional line sensor at the component suction confirmation position (ST3) of the rotary head 36 described above can be used. In the present embodiment, in order to determine the supply order of the electronic components 35, the continuous number of the electronic components 35 is set to, for example, 8, and the blank number is set to, for example, 1.

In the electronic component mounting method of the present embodiment, when it is determined that the mounting data is not mounting data having combination data (that is, a mounting flag of mounting data), a mounting operation using normal mounting data is performed (S23). After that, the process moves to the mounting operation of the mounting data in the next step. On the other hand, when it is determined that the mounting data has combination data (when mounting electronic components having different characteristics), the number of components used for component mounting from the component supply position indicated by the mounting data (generally, a component for each component supply position) The used number is measured), and FIG.
The remainder (the remainder calculation is expressed as MOD in FIG. 9) obtained by dividing by the number of continuous parts indicated by the part supply data 73 of FIG. 9B is calculated, and it is determined whether the result is 0 (S).
24).

If the remainder is 0, it is determined that the next component supply order is the position of the empty number, and the operation proceeds to the confirmation / inspection operation (S25 to S30) of the empty number. If the remainder is not 0, it is determined that the electronic component indicated by the continuous number is being supplied, and the number of used components is incremented by 1 (S31), and the process shifts to the mounting operation of the next mounting position data.

In the operation of checking and inspecting the number of blanks, first, the number of blanks indicated by the component supply data 73 is set in advance as the number of times of dummy transfer (S25). Next, the transfer operation is performed once from the main supply position (S26). Since the transfer operation here is for confirming the number of blanks, it is an operation of taking out the electronic component from the electronic component supply unit. After the transfer operation, it is determined whether the rotary head 36 holds the electronic component (S27).

If it is determined that the electronic component is held, it is determined that the supply order of the electronic component is out of the predetermined order, the electronic component mounting apparatus stops the error, and the content of the content for confirming the usage status of the electronic component is determined. Display is performed (S30). If it is determined that the electronic component is not held, the number of times of dummy transfer is decremented by one (S28). Next, it is determined whether the number of times of dummy transfer is 0 (S29). If the number of times of dummy transfer is not 0, the process returns to S26 and the operation of checking the number of blanks is continued.
If the number of times of dummy transfer is 0, it is determined that the supply order of the electronic components is the predetermined order, and the process proceeds to the mounting operation of the next mounting position data.

As described above, according to the electronic component mounting method according to the present embodiment, when the different-characteristic electronic components held on the component supply tape 71 are sequentially supplied from the end of the component supply tape, the stored continuous number and Electronic components of different characteristics are mounted on condition that the number of blanks matches the actual number of continuous and blank numbers. Therefore, it is possible to confirm that the electronic component mounting apparatus mounts the electronic components having different characteristics in a predetermined supply order. As a result, it is possible to confirm during the mounting of the electronic component that the correct mounting of the electronic component in accordance with the supply order of the supplied electronic components having the different characteristics is performed. Outflow and useless consumption of electronic components can be suppressed.

Next, an embodiment of an electronic component mounting system according to the present invention will be described. FIG. 10 is a plan view showing a schematic configuration of an electronic component mounting system according to the present invention. FIG.
Reference numeral 81 denotes a control unit of the electronic component mounting apparatus, 83 denotes an external control device that sends mounting data, component combination data, component allocation data, and the like to the control unit 81, and 85 denotes various types of signals between the control unit 81 and the external control device 83. Communication means for transmitting and receiving data.

FIG. 11 is a flowchart for explaining the operation procedure of the third embodiment. FIG. 12 shows data stored in the external control device in advance. FIG. FIG. 12 shows a storage table 87 showing, in a table form, component combination data for each supply order showing electronic components mounted at other mounting positions for electronic components having different characteristics.
(B) is a storage table 8 showing, in a tabular form, mounting data indicating a mounting position of each electronic component and a basic state of the component supply position.
9 and FIG. 12C are diagrams showing a storage table 91 in which component supply positions and electronic component allocation data included in the mounting data of the storage table 89 are shown in a table format. Here, each of the above data is represented in a table format for easy understanding, but is not limited to the table format as long as the relevance of the data is similarly shown.

The electronic component mounting system 93 according to this embodiment includes an electronic component mounting device 94 and an external control device 83.
They are roughly divided into The electronic component mounting apparatus 94 moves the electronic component supply unit 33 for accommodating a plurality of electronic components, the rotary head 36 having a plurality of mounting heads for detachably adsorbing and holding the electronic components, and the substrate 37 in a horizontal plane. XY
It comprises a table 39 and a control section 81 for controlling the operation of each section of the apparatus. Therefore, unlike the configuration of the control unit 47 described above, the control unit 81 of the electronic component mounting apparatus 94 according to the present embodiment does not store the storage tables 61, 63, and 65.

On the other hand, an external control device 83 is connected to the electronic component mounting device 94 via communication means 85. The external control device 83 supplies component combination data of each electronic component on the board, which is set in accordance with the component supply order of the heterogeneous electronic components mounted at a predetermined position, and mounts mounting position data and component allocation data. Data and component allocation data are input, and a mounting program can be created for each board, each board lot, or each circuit based on the input data. The external control device 83 also stores this mounting program in the electronic component mounting device 9.
4 to the control unit 81 to cause the electronic component mounting apparatus 94 to mount electronic components.

The procedure of the electronic component mounting method by the electronic component mounting system 93 thus configured will be described with reference to the flowchart of FIG. First, supply order component combination data, mounting data, and component allocation data are input to the external control device 83 in advance (S41). Further, the planned number of boards to be mounted is input to the external control device 83, and 0 is set as the initial value of the production board number (S42).

After making these settings, the external control device 83
Is executed (S43). When the production is started, the external control device 83 adds 1 to the production board number (S44). Then, a mounting program is created from the supply order component combination data, mounting data, and component allocation data indicated by the production board number, and transmitted to the control unit 81 of the electronic component mounting apparatus 94 (S45).

Next, the external control device 83 instructs the control unit 81 of the electronic component mounting device 94 to start mounting in the production of one board (S46). The electronic component mounting apparatus 94 mounts the electronic component on the board according to the transmitted mounting program. It is assumed that electronic components are installed and supplied to the electronic component supply unit in advance according to the component allocation data. When the external control device 83 receives that the electronic component mounting apparatus 94 has completed the mounting of the electronic component as instructed and unloaded the board (S4).
7), the external control device 83 determines whether the production board number is less than the planned number of productions (S48).

If the production board number is less than the planned production quantity, the flow returns to S44. If the production board number is not less than the planned production quantity, the production is completed assuming that the production quantity of the production board has been produced (S49).

FIG. 13 shows the result of the mounting process generated by the electronic component mounting system 93 based on the supply order component combination data, mounting data, and component allocation data of FIG. That is, components (C100, C103) mounted at other positions (position 2, position 5, position 6) for each individual characteristic of the specific electronic component (CX-A, CX-B) mounted at position 1 shown in FIG. , R102, R103)
Has been changed.

According to the electronic component mounting method by the electronic component mounting system 93, supply order combination data indicating the type of electronic component mounted at another mounting position is input to the external control device 83. The mounting program is sent from the 83 to the electronic component mounting device 94, and the electronic component mounting device 94 mounts the electronic component. That is,
The electronic component mounting apparatus 94 only needs to have a function of performing the mounting operation according to the mounting program sent from the external control device 83 for each production board lot, each production board, or each circuit of the production board as in the conventional case. Thus, the electronic component mounting apparatus 94 can perform the electronic component mounting in which the component to be mounted at another position is changed according to the individual characteristic of the electronic component having the different characteristic while maintaining the function of mounting the electronic component as in the related art.

In the electronic component mounting system 93, an example in which the combination of electronic components mounted on each board is changed has been described. However, the combination of electronic components is changed for each circuit formed in the board. In some cases. In that case, the “board number” in the combination data in the description of the present embodiment is replaced with “circuit number”, the “production board number” is replaced with “production circuit number”, and the “planned production number” is replaced with “production number”. It may be replaced with “planned number of circuits”, and the unloading of the mounting-completed board (S47) in FIG.

In this case, for each circuit existing on one board, the external control device 83 creates a mounting program for the circuit, and uses the mounting program for these circuits as a mounting program for the entire board. After integration into the mounting program, the control unit 8 of the electronic component mounting apparatus 94
1 transmission method. Note that the communication unit 85 may use any communication medium such as wired, wireless, or optical communication as long as it can transmit and receive data.

In each of the above embodiments, an example is described in which electronic components are mounted using the electronic component mounting apparatus 94 provided with the rotary head 36. However, the electronic component mounting method according to the present invention is not limited to this. For example, as shown in FIG. 14, an electronic component supply unit 95 including parts feeders 95a and 95b for accommodating a plurality of electronic components, a mounting head 96 for detachably adsorbing and holding the electronic components, and a mounting head 96
Electronic component mounting apparatus which has an XY robot 98 for moving the electronic component in a horizontal plane, and a control unit 97 for controlling these components, and mounts the electronic component by moving the mounting head 96 to a predetermined position on the substrate 37 in the XY direction. The present invention can be similarly applied to 100.

[0060]

As described above in detail, according to the electronic component mounting method according to the present invention, the mounting position of the electronic component and the component supply of the electronic component in the electronic component supply unit accommodating a plurality of electronic components. Based on the mounting data in which the position is recorded in the mounting order and the component allocation data in which the type of the electronic component corresponding to the component supply position is recorded, a desired electronic component is taken out from the electronic component supply unit, and When mounting at a predetermined position, different characteristic electronic components having a plurality of individual characteristics are sequentially supplied to the component supply position, and according to the individual characteristics of the supplied different characteristic electronic components, other than the different characteristic electronic components, By changing the mounting data for other electronic components, different types of electronic components are mounted at the mounting positions of the other electronic components, and the characteristics of the entire circuit can be changed. As a result, it is possible to mount electronic components in which the overall characteristics of the circuit are not restricted by the characteristics of the heterogeneous electronic components. For example, it is possible to produce the circuit with the same characteristics for each circuit regardless of the individual characteristics of the heterogeneous electronic components. .

According to the electronic component mounting apparatus of the present invention,
The mounting data, the component allocation data, and the combination data are stored, and the component supply position of the mounting data for the substrate on which the electronic component having the different characteristic is mounted is changed based on the combination data. Thus, different types of electronic components are mounted at other mounting positions, and the characteristics of the entire circuit can be changed. Thus, electronic components can be mounted in which the overall characteristics of the circuit are not restricted by the characteristics of the heterogeneous electronic components. For example, the characteristics of each circuit can be made the same regardless of the individual characteristics of the heterogeneous electronic components.

According to the electronic component mounting system according to the present invention, the external control device connected to the electronic component mounting apparatus which receives the mounting data and the component allocation data mounts the electronic component based on the mounting data and the component supply data. By generating a mounting program for causing the electronic component mounting apparatus to transmit the mounting program to the electronic component mounting apparatus, the electronic component mounting apparatus executes the mounting program. For this reason, the electronic component mounting apparatus only needs to have a function of performing a mounting operation in accordance with a mounting program sent from the external control device. Thus, it is possible to change the electronic components mounted at other positions.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a first embodiment of an electronic component mounting apparatus according to the present invention.

FIG. 2 is a plan view illustrating a schematic configuration of a component mounting mechanism in the electronic component mounting apparatus of FIG. 1;

FIG. 3 is a side view showing a schematic cross section of a schematic configuration of a component mounting mechanism in the electronic component mounting apparatus of FIG. 1;

FIG. 4 is a schematic plan view of a rotary head illustrating an operation of a component mounting mechanism.

FIGS. 5A and 5B are boards that need to be replaced with electronic components.
FIG. 3 is an explanatory diagram showing a combination (c) of electronic components on a substrate.

FIG. 6 shows various data (a) stored in a control unit.
It is explanatory drawing which showed (b) and (c).

FIG. 7 is a flowchart illustrating a procedure of an electronic component mounting method according to the first embodiment.

FIG. 8 is an explanatory diagram showing an example of a component supply tape used in a second embodiment of the present invention and its component supply data.

FIG. 9 is a flowchart illustrating an operation procedure according to the second embodiment.

FIG. 10 is a plan view showing a schematic configuration of an electronic component mounting system according to the present invention.

FIG. 11 is a flowchart illustrating an operation procedure according to the third embodiment.

FIG. 12 is an explanatory diagram showing various data (a), (b), and (c) stored in the external control device in advance.

FIG. 13 is an explanatory diagram showing an implementation program generated by an external control device.

FIG. 14 is a schematic configuration diagram of an electronic component mounting apparatus in which a mounting head moves in XY directions.

FIG. 15 is a schematic configuration diagram of a conventional electronic component mounting apparatus.

FIG. 16 is an explanatory diagram of mounting position data stored in a control unit in a conventional electronic component mounting apparatus.

FIG. 17 is an explanatory view showing boards (a) and (b) having the same circuit characteristics and combinations (c) and (d) of electronic components on the board.

FIG. 18 is an explanatory view showing boards (a) and (b) having different circuit characteristics and combinations (c) and (d) of electronic components on the board.

FIG. 19 is a plan view of a conventional component supply tape that holds electronic components having different individual characteristics.

[Explanation of symbols]

 31, 94, 100 Electronic component mounting device 33, 95 Electronic component supply unit 35 Electronic component 36 Rotary head 37 Substrate 39 XY table 47, 81, 97 Control unit 57 Suction nozzle 71 Component supply tape 83 External control device 93 Electronic component mounting system 96 mounting head

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Takeshi Kuribayashi 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E313 AA01 AA11 AA18 CD06 DD15 EE02 EE03 EE05 EE24 FF24 FF29 FG10

Claims (7)

[Claims] An electronic component corresponding to a mounting position where the mounting position of the electronic component and a component supply position of the electronic component in an electronic component supply unit accommodating a plurality of electronic components are recorded in a mounting order. In the electronic component mounting method of taking out a desired electronic component from the electronic component supply unit and mounting the electronic component at a predetermined position on the board based on the component allocation data in which the type of the component is recorded, Characteristic electronic components are sequentially supplied to the component supply position, and according to the supplied individual characteristics of the different characteristic electronic components, the mounting data for other electronic components other than the different characteristic electronic components is changed, and the other Electronic component mounting method, wherein different types of electronic components are mounted at the mounting position of the electronic component. 2. Combination data in which conversion information for changing a component supply position of a specific electronic component to a component supply position for another electronic component is provided in advance, and a combination data for the different characteristic electronic component in the mounting data is provided. A combination flag is added, and an electronic component supply position of an electronic component mounted on the circuit is changed using the combination data for a circuit having mounting data to which the combination flag is added. Item 7. The electronic component mounting method according to Item 1. 3. Mounting data in which a mounting position of an electronic component and a component supply position of the electronic component in an electronic component supply unit accommodating a plurality of electronic components are recorded in a mounting order, and an electronic component corresponding to the component supply position. In the electronic component mounting method of taking out a desired electronic component from the electronic component supply unit and mounting the electronic component at a predetermined position on the board based on the component allocation data in which the type of the component is recorded, Characteristic electronic components are accommodated in a plurality of components, but are accommodated in a component supply tape formed in a row with a predetermined number of blanks left for each predetermined number of consecutive times, and when the electronic components are mounted, heterogeneous characteristic electronic components are removed from the component supply tape. Detecting the presence or absence of an electronic component having a different characteristic and confirming the coincidence with the set continuous number and blank number. 4. Mounting data in which the mounting position of an electronic component and the component supply position of the electronic component in an electronic component supply unit accommodating a plurality of electronic components are recorded in the mounting order, and an electronic component corresponding to the component supply position. The electronic component mounting method in which the electronic component mounting apparatus takes out a desired electronic component from the electronic component supply unit and mounts the electronic component at a predetermined position on a board based on the component allocation data in which the type of the component is recorded. And the component allocation data to an external control device connected to the electronic component mounting device, and the external control device generates a mounting program for mounting the electronic component based on the mounting data and the component supply data. The mounting program is sent from the external control device to the electronic component mounting device, and the mounting program is transmitted by the electronic component mounting device. An electronic component mounting method characterized in that mounting is performed based on a program. 5. Mounting data in which the mounting position of an electronic component and the component supply position of the electronic component in an electronic component supply unit accommodating a plurality of electronic components are recorded in the mounting order, and an electronic component corresponding to the component supply position. An electronic component mounting apparatus that takes out a desired electronic component from the electronic component supply unit and mounts the electronic component at a predetermined position on a board based on component allocation data in which the type of the component is recorded, wherein the mounting data and the component allocation Data and combination data in which conversion information for changing a component supply position of a specific electronic component to a component supply position for another electronic component is stored, and for a circuit in which the heterogeneous characteristic electronic component exists, A control unit for changing a component supply position of the mounting data with respect to the circuit using the combination data. 6. A component supply tape in which a plurality of component housing tapes formed in a row and containing the different characteristic electronic components with a predetermined number of spaces left between them for a predetermined continuous number is provided in the electronic component supply unit. When the control unit sequentially takes out the different characteristic electronic components from the end of the component supply tape, the control unit detects the presence or absence of the different characteristic electronic components and confirms the coincidence with the set continuous number and blank number. 6. The electronic component mounting apparatus according to claim 5, further comprising matching means. 7. Mounting data in which a mounting position of an electronic component and a component supply position of the electronic component in an electronic component supply unit accommodating a plurality of electronic components are recorded in a mounting order, and an electronic component corresponding to the component supply position. An electronic component mounting system in which an electronic component mounting apparatus takes out a desired electronic component from the electronic component supply unit and mounts the electronic component at a predetermined position on a board, based on the component allocation data in which the type of the component is recorded. An external control device to which the mounting data and the component allocation data are input and connected to the electronic component mounting device generates a mounting program for mounting an electronic component based on the mounting data and the component supply data, and the mounting program Is transmitted to the electronic component mounting apparatus, whereby the electronic component mounting apparatus performs mounting based on the mounting program. The electronic component mounting system.