JP2002225259A - Ejecting method and device for material, manufacturing method and device for color filter, manufacturing method and device for liquid crystal device, manufacturing method and device for el device, and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make optical characteristics of optical members uniform in a plane such as light transmission properties of a color filter, a color display property of a liquid crystal device, light emission properties of an El light emission surface, etc. SOLUTION: This color filter manufacturing method comprises a plurality of filter elements 3 arranged on a substrate 12. A filter material is ejected from at least one of nozzles among a plurality of nozzles 27 while moving either the head 22 having a nozzle array 28 having a plurality of nozzles 27 arranged therein and the substrate 12 in the main scanning direction with respect to the other. At this time, the nozzles located at the end parts of the nozzle array 28 are so controlled as not to eject the filter material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a material discharging method and a material discharging apparatus for discharging a material to an object.
Further, the present invention relates to a manufacturing method and a manufacturing apparatus for manufacturing a color filter used for an optical device such as a liquid crystal device. Further, the present invention relates to a method and an apparatus for manufacturing a liquid crystal device having a color filter. Further, the present invention relates to a method and an apparatus for manufacturing an EL device which performs display using an EL light emitting layer. Further, the present invention relates to a liquid crystal device manufactured by using these manufacturing methods or an electronic device equipped with an EL device.

[0002]

2. Description of the Related Art In recent years, display devices such as liquid crystal devices and EL devices have been widely used for display units of electronic devices such as mobile phones and portable computers. Also recently,
Display devices often perform full-color display. Full-color display by a liquid crystal device is performed, for example, by passing light modulated by a liquid crystal layer through a color filter. Then, the color filter is formed on the surface of the substrate formed of glass, plastic, or the like.
For example, it is formed by arranging R (red), G (green), and B (blue) dot-shaped color filter elements in a predetermined arrangement such as a stripe arrangement, a delta arrangement, or a mosaic arrangement.

When full-color display is performed by an EL device, for example, R (red), G (red),
(Green) and B (blue) dot-shaped EL light emitting layers are arranged in a predetermined arrangement such as a stripe arrangement, a delta arrangement, or a mosaic arrangement, and these EL emission layers are sandwiched between a pair of electrodes to form picture element pixels. Then, by controlling the voltage applied to these electrodes for each pixel pixel, the pixel pixel emits light of a desired color, thereby performing full-color display.

[0004] Conventionally, when patterning each color filter element such as R, G, B of a color filter, or by EL
It is known to use a photolithography method when patterning each color picture element pixel such as R, G, B of the apparatus. However, when this photolithography method is used, there are problems that the process is complicated and the cost is increased because a large amount of each color material and photoresist are consumed.

In order to solve this problem, a filter material or an EL light emitting material or the like is ejected in the form of dots by an ink-jet method, so that a filament or EL having a dot arrangement is formed.
A method for forming a light emitting layer and the like has been proposed.

Now, in FIG. 22A, a large-area substrate formed of glass, plastic, or the like, that is, a plurality of panel regions 302 set on the surface of a so-called motherboard 301, is provided in FIG. As shown, consider a case where a plurality of filter elements 303 arranged in a dot shape are formed based on an inkjet method. In this case, for example, as shown in FIG. 22C, an inkjet head 306 having a nozzle row 305 formed by arranging a plurality of nozzles 304 in a row is indicated by arrows A1 and A2 in FIG. As shown, one panel area 3
While performing main scanning a plurality of times (twice in FIG. 22) with respect to 02, a filter element 303 is formed at a desired position by selectively discharging ink, that is, a filter material from a plurality of nozzles during the main scanning.

The filter element 303 is formed by arranging each color of R, G, B and the like in an appropriate arrangement such as a stripe arrangement, a delta arrangement, a mosaic arrangement, etc., and is shown in FIG. The ink ejection process by the inkjet head 306 is performed by setting the inkjet head 306 that ejects a single color of R, G, and B to R, G, and B.
The three color arrangements of R, G, B, etc. are formed in advance on one motherboard 301 by using the ink jet heads 306 in order for three colors such as B.

[0008]

The ink jet head 306 generally has a nozzle row 305.
23, there is a variation in the amount of ink discharged from the plurality of nozzles 304. For example, as shown in FIG. 23A, the amount of discharge at positions corresponding to both ends of the nozzle row 305 is large, and In many cases, the ink has an ink ejection characteristic Q such that the ejection amount of the intermediate portion is small.

Accordingly, when the filter element 303 is formed by the ink jet head 306 as shown in FIG. 22B, as shown in FIG. 23B, the position P1 corresponding to the end of the ink jet head 306 or the center P1 is formed. A streak having a high density is formed in the portion P2 or in both the portions P1 and P2, and there is a problem that the planar light transmission characteristics of the color filter become non-uniform.

The present invention has been made in view of the above problems, and has been made in consideration of the optical characteristics of an optical member, such as the light transmission characteristics of a color filter, the color display characteristics of a liquid crystal device, and the light emission characteristics of an EL light emitting surface. It is an object of the present invention to provide a method and apparatus for manufacturing each optical member that can be made uniform in a plane. Another object of the present invention is to provide a general industrial technique capable of discharging some material from a nozzle to an object such as a substrate and accurately attaching the material to the object.

[0011]

In order to achieve the above object, a method for discharging a material according to the present invention is a method for discharging a material onto an object, comprising a nozzle having a plurality of nozzles arranged therein. A head having a row, and discharging a material from at least one of the plurality of nozzles while moving one of the objects in the main scanning direction with respect to the other, including the step of: A nozzle located at an end of the nozzle row is controlled so as not to discharge the material.

In this case, it is preferable that a plurality of nozzles positioned at the end of the nozzle row are controlled so as not to discharge the material.

As described with reference to FIG. 23 (a), in a general head, the material discharge distribution changes at the end of the nozzle row as compared with other portions. With respect to the ink jet head having such an ink ejection distribution characteristic, if a plurality of nozzles having a uniform ink ejection distribution are used except for a plurality of nozzles at the end portion of a nozzle row having a large change, the film thickness of the material may be reduced. Can be made planarly uniform.

Further, the nozzle row is virtually divided into a plurality of groups, and the head and the object are arranged so that each group can scan the same portion of the object in the main scanning direction. It is preferable that the method further includes a step of sub-scanning one of them with respect to the other.

According to this structure, the material is used for the head 1.
Rather than being formed by multiple scans, a plurality of nozzles belonging to different nozzle groups receive a material discharge in a superimposed manner to form a predetermined film thickness, so that the material discharge amount varies among a plurality of nozzles. Can be prevented from occurring in the film thickness among a plurality of forming elements even when the film forming element exists.

In the method of applying a material having the above-described structure, one of the head and the substrate can be sub-scanned with respect to the other by a length that is an integral multiple of the length of the nozzle group in the sub-scanning direction. In this way, a plurality of nozzle groups scan the same portion of the object in an overlapping manner, and the nozzles in each nozzle group supply the material to the individual forming element regions in an overlapping manner.

Further, in the method of discharging a material having the above structure,
The nozzle row may be arranged to be inclined with respect to the sub-scanning direction. The nozzle row is formed by arranging a plurality of nozzles in a row. In this case, assuming that the arrangement state of the nozzle rows is parallel to the sub-scanning direction of the head, the interval between adjacent filter elements formed by the filter element material ejected from the nozzles, that is, the element-to-element pitch is And the pitch between the nozzles of the plurality of nozzles forming the nozzle row.

When the pitch between the elements can be equal to the pitch between the nozzles, the above condition may be used. However, such a case is a rather rare case. At present, the pitch is often different. When the pitch between the elements and the pitch between the nozzles are different from each other, the nozzle row is inclined with respect to the sub-scanning direction of the head as described above, so that the pitch between the nozzles along the sub-scanning direction is increased. The length can be adjusted to the pitch between the elements. In this case, the positions of the nozzles forming the nozzle row are shifted back and forth with respect to the main scanning direction. However, by shifting the ejection timing of the material from each nozzle, Can be supplied to a desired position.

The nozzle row is virtually divided into n nozzle groups, and the length of a portion of the nozzle row excluding the nozzles controlled so that the material is not discharged is L, When the number of nozzle groups is n and the angle between the nozzle row and the sub-scanning direction is θ, the sub-scanning movement amount δ is δ ≒ (L / n) cos θ.

According to this configuration, the head can move a plurality of nozzles in the sub-scanning direction for each nozzle group. As a result, for example, considering that the nozzle row is divided into four nozzle groups,
The main scanning is performed in an overlapping manner by the nozzle groups.

Further, a plurality of heads are provided, and different materials are ejected from nozzle rows of each head. Further, the head is provided with a plurality of the nozzle rows, and different materials are discharged from each of the nozzle rows.

Next, a material discharging apparatus according to the present invention has a nozzle row in which a plurality of nozzles are arranged, and a material discharging apparatus which discharges a material from at least one of the plurality of nozzles. And a discharge control unit that controls discharge of a material from the nozzle, wherein the discharge control unit controls a nozzle located at an end of the nozzle row so as not to discharge the material. And

Next, a method of manufacturing a color filter according to the present invention is a method of manufacturing a color filter for manufacturing a color filter in which a plurality of filter elements are arranged,
A head having a nozzle row in which a plurality of nozzles are arranged, and a step of discharging a filter material from at least one of the plurality of nozzles while moving one of the substrates in the main scanning direction with respect to the other; Wherein in the step, the nozzle located at the end of the nozzle row is controlled so as not to discharge the filter material.

Next, the color filter manufacturing apparatus of the present invention has a nozzle row in which a plurality of nozzles are arranged,
An apparatus for manufacturing a color filter that discharges a filter material from at least one of the plurality of nozzles, comprising: a discharge control unit configured to control discharge of the filter material from the nozzle, wherein the discharge control unit includes: A nozzle located at an end of the nozzle row is controlled so as not to discharge the filter material. Next, a method for manufacturing a liquid crystal device according to the present invention is a method for manufacturing a liquid crystal device having a pair of substrates that sandwich liquid crystal and a color filter in which a plurality of filter elements are arranged on at least one substrate. A head having a nozzle row in which a plurality of nozzles are arranged, and a step of discharging a filter material from at least one of the plurality of nozzles while moving one of the substrates in the main scanning direction with respect to the other; Wherein in the step, the nozzle located at the end of the nozzle row is controlled so as not to discharge the filter material. Next, the apparatus for manufacturing a liquid crystal device according to the present invention is an apparatus for manufacturing a liquid crystal device having a nozzle row in which a plurality of nozzles are arranged, and discharging a filter material from at least one of the plurality of nozzles. Discharge control means for controlling discharge of the filter material from the nozzles, wherein the discharge control means controls a nozzle located at an end of the nozzle row so as not to discharge the filter material. Features.

Next, the method for manufacturing an EL device according to the present invention is as follows.
What is claimed is: 1. A method for manufacturing an EL device comprising a plurality of pixel pixels including a light-emitting layer arranged on a substrate, comprising: a head having a nozzle row in which a plurality of nozzles are arranged; Ejecting an EL light emitting material from at least one of the plurality of nozzles while moving the EL light emitting material in the main scanning direction. In the step, the nozzle positioned at an end of the nozzle row includes the EL light emitting material. It is characterized in that it is controlled not to discharge the material.

Next, the apparatus for manufacturing an EL device according to the present invention has a nozzle row in which a plurality of nozzles are arranged, and an EL device which discharges an EL luminescent material from at least one of the plurality of nozzles. A manufacturing apparatus comprising: a discharge control unit configured to control discharge of an EL light-emitting material from the nozzle, wherein the discharge control unit does not discharge the EL light-emitting material at a nozzle positioned at an end of the nozzle row. It is characterized by the following control.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) An embodiment of a method for manufacturing a color filter and an apparatus for manufacturing the same will be described below. First, before describing the manufacturing method and the manufacturing apparatus, a color filter manufactured by using the manufacturing method and the like will be described. FIG. 5A schematically shows a planar structure of one embodiment of a color filter. FIG. 6D shows a cross-sectional structure along the line VI-VI in FIG. 5A.

The color filter 1 of the present embodiment is a rectangular substrate 2 made of glass, plastic, or the like.
A plurality of filter elements 3 are formed in a dot pattern shape, in this embodiment, in a dot matrix shape, on the surface of the above, and further, as shown in FIG. 6D, formed by laminating a protective film 4 thereon. . FIG. 5A is a plan view showing the color filter 1 with the protective film 4 removed.

The filter element 3 is formed by filling a plurality of rectangular regions which are partitioned by partition walls 6 formed in a grid pattern with a non-translucent resin material and arranged in a dot matrix with a coloring material. Is done. Each of these filter elements 3 has R
(Red), G (green), and B (blue) are formed of one of the color materials, and the respective color filter elements 3 are arranged in a predetermined arrangement. For this array,
For example, the stripe arrangement shown in FIG.
And a delta arrangement shown in FIG. 7 (c).

The stripe arrangement is a color arrangement in which all columns of the matrix have the same color. In the mosaic arrangement, any three filter elements arranged on a vertical and horizontal line are R, G,
B is a three-color arrangement. The delta arrangement is a color arrangement in which the arrangement of the filter elements is different, and any three adjacent filter elements have three colors of R, G, and B.

The size of the color filter 1 is, for example,
1.8 inches. The size of one filter element 3 is, for example, 30 μm × 100 μm.
The interval between the filter elements 3, that is, the so-called element pitch is, for example, 75 μm.

When the color filter 1 of the present embodiment is used as an optical element for full-color display, R, R
One pixel is formed by using the three G and B filter elements 3 as one unit, and light is selectively passed through any one of R, G, and B or a combination thereof in one pixel, thereby providing full color. Display. At this time, the partition 6 formed of a non-light-transmitting resin material functions as a black matrix.

The above color filter 1 is, for example, as shown in FIG.
It is cut out from a large-area mother substrate 12 as shown in FIG. Specifically, first, a pattern for one color filter 1 is formed on each surface of the plurality of color filter forming regions 11 set in the mother substrate 12, and further, around the color filter forming regions 11. The color filters 1 are formed by forming cutting grooves on the substrate and cutting the mother substrate 12 along the grooves.

The color filter 1 shown in FIG.
A manufacturing method and a manufacturing apparatus for manufacturing the same will be described.

FIG. 6 schematically shows a method of manufacturing the color filter 1 in the order of steps. First, the partition walls 6 are formed in a lattice pattern on the surface of the mother substrate 12 using a non-translucent resin material as viewed in the direction of arrow B. The portion 7 of the lattice hole of the lattice pattern is a region where the filter element 3 is formed, that is, a filter element region. Individual filter element regions 7 formed by the partition walls 6
The plane dimension when viewed from the arrow B direction is, for example, 30 μm.
It is formed to about mx100 μm.

The partition 6 has a function of preventing the flow of the filter element material supplied to the filter element region 7 and a function of a black matrix. Also,
The partition 6 is formed by an arbitrary patterning method, for example, a photolithography method, and is further heated and baked by a heater as necessary.

After the partition walls 6 are formed, the filter element regions 7 are filled with the filter element material 13 by supplying droplets 8 of the filter element material to the respective filter element regions 7 as shown in FIG. . In FIG. 6B, reference numeral 13R denotes a filter element material having a color of R (red), and reference numeral 13G denotes G (green).
And 13B indicates a filter element material having a B (blue) color.

When a predetermined amount of filter element material is filled in each filter element region 7, the mother substrate 12 is heated to, for example, about 70 ° C. by a heater to evaporate the solvent of the filter element material. As a result of this evaporation, as shown in FIG.
3 is reduced in volume and flattened. When the volume is drastically reduced, the supply of the droplets of the filter element material and the heating of the droplets are repeatedly performed until a sufficient film thickness as a color filter is obtained. By the above processing, only the solid content of the filter element material is finally left to form a film.
Is formed.

After the filter elements 3 are formed as described above, a heating process is performed at a predetermined temperature for a predetermined time in order to completely dry the filaments 3. Thereafter, the protective film 4 is formed by using an appropriate method such as a spin coating method, a roll coating method, a ripping method, or an inkjet method. The protective film 4 is formed for protecting the filter element 3 and the like and flattening the surface of the color filter 1.

FIG. 8 shows an embodiment of an ink jet apparatus for performing the supply processing of the filter element material shown in FIG. 6B. This inkjet device 1
Reference numeral 6 denotes a mother substrate 12 in which a filter element material of one of R, G, and B, for example, R, is used as an ink droplet.
Each color filter forming area 11 in (see FIG. 5B)
This is a device for discharging and attaching to a predetermined position in the inside.
Ink jet devices for the G filter element material and the B filter element material are also prepared, but their structures can be the same as those in FIG. .

In FIG. 8, the ink jet device 16
A head unit 26 having an inkjet head 22; a head position controller 17 for controlling the position of the inkjet head 22; a substrate position controller 18 for controlling the position of the mother substrate 12;
A main scanning drive device 19 that moves the inkjet head 22 in the main scanning direction with respect to the mother substrate 12, a sub scanning driving device 21 that moves the inkjet head 22 in the sub scanning direction with respect to the mother substrate 12,
A substrate supply device 23 for supplying the mother substrate 12 to a predetermined working position in the inkjet device 16; and a control device 2 for controlling the overall control of the inkjet device 16
And 4.

The head position control device 17, the substrate position control device 18, the main scanning drive device 19 for moving the ink jet head 22 in the main scanning direction with respect to the mother substrate 12, and the sub-scanning drive device 21 are mounted on the base 9. Will be installed. Each of those devices is covered with a cover 14 as needed.

The ink jet head 22 is, for example, as shown in FIG.
As shown in FIG. 0, a nozzle row 28 is formed by arranging a plurality of nozzles 27 in a row. Nozzle 27
Is 180, for example, the hole diameter of the nozzle 27 is, for example, 28 μm, and the nozzle pitch between the nozzles 27 is, for example, 141 μm. 5A and 5B, the main scanning direction x and the sub-scanning direction Y orthogonal to the color filter 1 and the mother substrate 12 are set as shown in FIG.

The ink jet head 22 is positioned so that its nozzle row 28 extends in a direction intersecting with the main scanning direction x, and during the parallel movement in the main scanning direction x, a plurality of filter element materials as ink are used. Nozzle 2
7 to discharge the mother substrate 12
A filter element material is adhered to a predetermined position in (see FIG. 5B). In addition, the inkjet head 22 moves in parallel in the sub-scanning direction Y by a predetermined distance,
The main scanning position by the inkjet head 22 can be shifted at predetermined intervals.

The ink jet head 22 has, for example, an internal structure shown in FIGS. 12 (a) and 12 (b).
Specifically, the inkjet head 22 includes a nozzle plate 29 made of, for example, stainless steel, a diaphragm 31 facing the nozzle plate 29, and a plurality of partition members 32 that join them together.
And A plurality of ink chambers 33 and liquid reservoirs 34 are formed between the nozzle plate 29 and the vibration plate 31 by the partition member 32. A plurality of ink chambers 33 and a liquid reservoir 34
Communicate with each other via a passage 38.

An ink supply hole 36 is formed at an appropriate position of the vibration plate 31, and an ink supply device 37 is formed in the ink supply hole 36.
Is connected. The ink supply device 37 supplies the filter element material M of one of R, G, and B, for example, R, to the ink supply hole 36. The supplied filter element material M fills the liquid reservoir 34 and further fills the ink chamber 33 through the passage 38.

The nozzle plate 29 is provided with nozzles 27 for jetting the filter element material M from the ink chamber 33 in a jet shape. The ink chamber 33 is provided on the back surface of the diaphragm 31 on which the ink chamber 33 is formed.
The ink pressurizing member 39 is attached so as to correspond to.
As shown in FIG. 12B, the ink pressurizing body 39
It has a piezoelectric element 41 and a pair of electrodes 42a and 42b sandwiching the same. The piezoelectric element 41 has electrodes 42a and 42
When the electric current is supplied to b, the ink chamber 33 bends and deforms so as to protrude outward as indicated by the arrow C, thereby increasing the volume of the ink chamber 33. Then, the filter element material M corresponding to the increased volume flows from the liquid reservoir 34 through the passage 38 into the ink chamber 33.

Next, when the power supply to the piezoelectric element 41 is released, both the piezoelectric element 41 and the diaphragm 31 return to their original shapes. As a result, the ink chamber 33 also returns to its original volume, so that the pressure of the filter element material M inside the ink chamber 33 increases, and the mother substrate 12 (FIG.
The filter element material M is ejected as droplets 8 toward (b). In the vicinity of the nozzle 27,
An ink-repellent layer 43 made of, for example, a Ni-tetrafluoroethylene eutectoid plating layer is provided in order to prevent the flight of the droplet 8 and the clogging of the hole of the nozzle 27.

In FIG. 9, the head position controller 17
Is an α motor 44 for rotating the inkjet head 22 in a plane, a β motor 46 for swinging and rotating the inkjet head 22 around an axis parallel to the sub-scanning direction Y, and an α motor 44 for rotating the inkjet head 22 around an axis parallel to the main scanning direction. And a Z motor 48 for vertically moving the inkjet head 22 in parallel.

The board position control device 18 shown in FIG. 8 includes a table 49 on which the mother board 12 is placed as shown in FIG.
And a θ motor 51 for rotating the table 49 in-plane as indicated by an arrow θ. As shown in FIG. 9, the main scanning drive device 19 shown in FIG. 8 includes a guide rail 52 extending in the main scanning direction x and a slider 53 containing a pulse-driven linear motor. The slider 53 translates in the main scanning direction along the guide rail 52 when the built-in linear motor operates.

The sub-scanning driving device 21 shown in FIG.
Has a guide rail 54 extending in the sub-scanning direction Y and a slider 56 containing a pulse-driven linear motor, as shown in FIG. The slider 56 moves in the sub-scanning direction Y along the guide rail 54 when the built-in linear motor operates.

The linear motor pulse-driven in the slider 53 or the slider 56 can precisely control the rotation angle of the output shaft by a pulse signal supplied to the motor. Therefore, the inkjet head supported by the slider 53 22 in the main scanning direction x position on table 4
9 can be controlled with high definition in the sub-scanning direction Y. The position control of the ink jet head 22 and the table 49 is not limited to the position control using a pulse motor, but can also be realized by feedback control using a servo motor or any other control method.

The substrate supply device 23 shown in FIG. 8 includes a substrate accommodating portion 57 for accommodating the mother substrate 12 and a mother substrate 12.
And a robot 58 for transporting. The robot 58
A base 59 placed on an installation surface such as a floor, the ground, etc .; an elevating shaft 61 moving up and down with respect to the base 59; a first arm 62 rotating about the elevating shaft 61;
And a suction pad 64 provided on the lower surface of the distal end of the second arm 63. The suction pad 64 can suction the mother substrate 12 by air suction or the like.

In FIG. 8, the ink jet head 22 which is driven by the main scanning driving device 19 and moves in the main scanning.
A capping device 76 and a cleaning device 77 are disposed below the locus and at one side position of the sub-scanning driving device 21. An electronic balance 78 is provided at the other side position. The cleaning device 77 is a device for cleaning the inkjet head 22. The electronic balance 78 is a device that measures the weight of ink droplets ejected from each nozzle 27 (see FIG. 10) in the inkjet head 22 for each nozzle. The capping device 76 is a device for preventing the nozzle 27 (see FIG. 10) from drying when the inkjet head 22 is in a standby state.

A head camera 81 is disposed near the ink jet head 22 so as to move integrally with the ink jet head 22. Further, the substrate camera 8 supported by a supporting device (not shown) provided on the base 9.
2 is arranged at a position where the mother substrate 12 can be photographed.

The control device 24 shown in FIG. 8 includes a computer main body 66 containing a processor, a keyboard 67 as an input device, and a CRT as a display device.
(Cathode Ray Tube) display 68. As shown in FIG. 14, the processor has a CPU (Central Processing Unit) 69 for performing arithmetic processing, and a memory for storing various information, that is, an information storage medium 71.

The head position control device 17, substrate position control device 18, main scan drive device 19, sub-scan drive device 21, and piezoelectric element 41 in the ink jet head 22 shown in FIG. 8 (see FIG. 12B). 14 are connected to the CPU 69 via the input / output interface 73 and the bus 74 in FIG. Further, each device of the substrate supply device 23, the input device 67, the display 68, the electronic balance 78, the cleaning device 77, and the capping device 76 is also connected to the CPU 69 via the input / output interface 73 and the bus 74.

The memory 71 has a random access memory (RAM).
mory), semiconductor memory such as ROM (Read Only Memory), hard disk, CD-ROM reader,
This is a concept including an external storage device such as a disk-type storage medium, and functionally includes a storage area for storing program software in which a control procedure of the operation of the inkjet device 16 is described, and various R, A mother board 12 of one of R, G, and B for realizing the G and B arrangements (FIG. 5)
9), a storage area for storing the amount of sub-scanning movement of the mother substrate 12 in the sub-scanning direction Y in FIG. 9, and a work area for the CPU 69. And an area functioning as a temporary file or the like, and other various storage areas are set.

The CPU 69 controls the ejection of ink, that is, the filter element material, to a predetermined position on the surface of the mother substrate 12 in accordance with the program software stored in the memory 71. A cleaning operation unit for performing an operation for implementing the cleaning process, a capping operation unit for implementing the capping process, and an operation for implementing weight measurement using the electronic balance 78 (see FIG. 8) It has a weight measurement calculation unit and a drawing calculation unit that performs calculation for drawing the filter element material by the inkjet.

If the drawing calculation unit is divided in detail, a drawing start position calculation unit for setting the ink jet head 22 to the initial position for drawing, and the ink jet head 2
A main scanning control calculation unit for calculating a control for moving the scanning substrate 2 at a predetermined speed in the main scanning direction x and a control for shifting the mother substrate 12 by a predetermined sub-scanning amount in the sub-scanning direction Y A sub-scanning control operation unit, and a nozzle ejection control operation unit that performs an operation for controlling which of the plurality of nozzles 27 in the inkjet head 22 is operated to eject ink, that is, the filter element material. It has various function calculation units.

In this embodiment, each of the above functions is implemented by C
Although the software is realized by using the PU 69, when each of the above functions can be realized by a single electronic circuit without using the CPU, such an electronic circuit can be used.

Hereinafter, the operation of the ink jet apparatus 16 having the above configuration will be described with reference to the flowchart shown in FIG.

When the ink-jet apparatus 16 is operated by turning on the power by the operator, first, in step S1, initialization is executed. Specifically, the head unit 26, the substrate supply device 23, the control device 24, and the like are set to a predetermined initial state.

Next, when the weight measurement timing comes (YES in step S2), the head unit 26 shown in FIG.
Is moved by the main scanning drive unit 19 to the position of the electronic balance 78 in FIG. 8 (step S3), and the amount of ink ejected from the nozzles 27 is measured using the electronic balance 78 (step S4). Then, the voltage applied to the piezoelectric element 41 corresponding to each nozzle 27 is adjusted according to the ink ejection characteristics of the nozzle 27 (step S5).

Next, when the cleaning timing comes (YES in step S6), the head unit 26 is moved to the cleaning device 77 by the main scanning drive device 19 (step S7), and the ink jet head is moved by the cleaning device 77. 22 is cleaned (step S8).

When the weight measurement timing or the cleaning timing has not arrived (N in steps S2 and S6)
O) Or, when those processes are completed, the motherboard 12 is supplied to the table 49 by operating the substrate supply device 23 of FIG. Specifically, the mother substrate 12 in the substrate housing portion 57 is
Then, the mother substrate 12 is transported to the table 49 by moving the elevating shaft 61, the first arm 62, and the second arm 63, and the positioning pins 50 ( (Fig. 9). In order to prevent the mother substrate 12 from being displaced on the table 49, it is desirable to fix the mother substrate 12 to the table 49 by means such as air suction.

Next, while observing the mother board 12 with the board camera 82 shown in FIG. 8, the output shaft of the θ motor 51 shown in FIG.
The mother substrate 12 is positioned by rotating the substrate 9 in a plane by a minute angle (step S10). Next, while observing the mother substrate 12 with the head camera 81 of FIG. 8, the position at which drawing is started by the inkjet head 22 is determined by calculation (step S11), and the main scanning drive device 19 and the sub-scanning drive device 21 are determined. Is operated to move the inkjet head 22 to the drawing start position (step S12).

At this time, the ink jet head 22
As shown in the position (a) of FIG. 1, the nozzle row 28 is disposed so as to be inclined at an angle θ with respect to the sub-scanning direction Y of the inkjet head 22. This is because, in the case of a normal ink jet apparatus, the pitch between nozzles, which is the interval between adjacent nozzles 27, and the element pitch, which is the interval between adjacent filter elements 3, that is, the filter element formation region 7, are different. This is a measure to make the dimension component of the pitch between nozzles in the sub-scanning direction Y geometrically equal to the element pitch when the inkjet head 22 is moved in the main scanning direction x.

When the inkjet head 22 is placed at the drawing start position in step S12 of FIG. 15, the inkjet head 22 is placed at the position (a) in FIG. Thereafter, in step S13 in FIG. 15, main scanning in the main scanning direction x is started, and at the same time, ink ejection is started. Specifically, the main scanning drive device 19 shown in FIG. 9 is operated to linearly scan and move the ink jet head 22 in the main scanning direction x shown in FIG. 1 at a constant speed. When the nozzle 27 corresponding to the element region 7 reaches, the ink, that is, the filter element material is ejected from the nozzle 27.

The ink ejection amount at this time is not an amount that fills the entire volume of the filter element region 7, but is a fraction of the total amount, and in the present embodiment, an amount of 1/4 of the total amount. This is because, as will be described later, each filter element region 7 is not filled by one ink ejection from the nozzle 27, but by several ink ejections in this embodiment, and in this embodiment, four overlapping ejections. This is to fill the entire volume.

When the main scanning for one line on the mother substrate 12 is completed (YES in step S14), the ink jet head 22 reversely moves to return to the initial position (a) (step S15). Further, the inkjet head 22 is driven by the sub-scanning driving device 21 and moves in the sub-scanning direction Y by a predetermined sub-scanning amount δ (step S16).

In the present embodiment, the CPU 69 conceptually divides the plurality of nozzles 27 forming the nozzle row 28 of the ink jet head 22 into a plurality of groups n in FIG. In this embodiment, it is considered that n = 4, that is, the nozzle row 28 having a length L including 180 nozzles 27 is divided into four groups. Thus, one nozzle group is determined to have a length L / n, ie, L / 4, including 180/4 = 45 nozzles 27. The sub-scanning amount δ is set to the length in the sub-scanning direction of the nozzle group length L / 4, that is, (L / 4) cos θ.

Accordingly, the ink jet head 22 having returned to the initial position (a) after the main scanning for one line is completed moves in parallel in the sub-scanning direction Y by the distance δ to the position (b) in FIG. In FIG. 1, the position (a) and the position (b) are drawn slightly shifted with respect to the main scanning direction x, but this is a measure for making the description easier to understand.
Actually, the position (a) and the position (b) are the same position in the main scanning direction x.

The ink-jet head 22 that has moved to the position (b) in the sub-scanning direction repeatedly executes the main-scanning movement and the ink ejection in step S13. During this main scanning movement,
Color filter formation region 11 on mother substrate 12
The first line receives the ink discharge for the first time from the first nozzle group, and the second line receives the second ink discharge from the first nozzle group.

Hereinafter, the ink jet head 22
The main scanning movement and the ink ejection are repeated while repeating the sub-scanning movement as in the position (c) to the position (k) (steps S13 to S16).
The ink adhering process for one row of the second color filter forming area 11 is completed. In the present embodiment, since the sub-scanning amount δ is determined by dividing the nozzle row 28 into four groups, when the main scanning and sub-scanning for one row of the color filter forming area 11 are completed, each filter element area 7 is once for each of the four nozzle groups, for a total of 4
After receiving the ink discharge process a plurality of times, a predetermined amount of ink, that is, the filter element material is supplied in its entire volume in its entire volume.

Thus, one of the color filter forming regions 11
When the ink discharge for the row is completed, the inkjet head 22 is driven by the sub-scanning drive unit 21 to be conveyed to the initial position of the color filter formation area 11 of the next row (step S19), and the color filter formation area 11 of the row The main scanning, sub-scanning and ink ejection are repeated to form a filter element in the filter element forming area 7 (steps S13 to S16).

Thereafter, when the filter element 3 of one color of R, G, B, for example, R1 color is formed for all the color filter forming regions 11 in the mother substrate 12 (YES in step S18), the mother is formed in step S20. Substrate 1
The processed mother substrate 12 is discharged to the outside by the substrate supply device 23 or another transport device. Thereafter, as long as the operator does not give an instruction to end the process (NO in step S21), the process returns to step S2 to repeatedly perform the ink discharging operation for the R1 color on another mother substrate 12.

When the operator gives an instruction to end the work (YES in step S21), the CPU 69 conveys the ink jet head 22 to the capping device 76 in FIG. 8, and the capping device 76 caps the ink jet head 22. Processing is performed (step S22).

As described above, the patterning of the first color, for example, the R color of the three colors R, G, and B constituting the color filter is completed.
The second color of G and B, for example, G is conveyed to the ink jet device 16 which uses G as a filter element material to perform patterning of G color, and finally, the third color of R, G and B, for example, B color is filtered. The material is conveyed to the ink jet device 16 as an element material, and is subjected to B color patterning. As a result, a mother substrate 12 on which a plurality of color filters 1 (FIG. 5A) having a desired R, G, B dot arrangement such as a stripe arrangement is formed. By cutting the mother substrate 12 for each color filter region 11, a plurality of one color filters 1 are cut out.

If the present color filter 1 is used for color display of a liquid crystal device, an electrode, an alignment film and the like are further laminated on the surface of the present color filter 1. In such a case, if the mother substrate 12 is cut and the individual color filters 1 are cut out before laminating the electrodes and the alignment films, the subsequent steps of forming the electrodes and the like become very troublesome. Therefore, in such a case, after the color filter 1 is completed on the mother substrate 12, the necessary additional processes such as electrode formation and alignment film formation are completed, instead of cutting the mother substrate 12 immediately. It is desirable to cut the mother substrate 12 later.

As described above, according to the method and the apparatus for manufacturing a color filter according to the present embodiment, each filter element 3 in the color filter 1 shown in FIG.
Is not formed by one main scan x of the inkjet head 22 (see FIG. 1), but each one filter element 3 is n times by a plurality of nozzles 27 belonging to different nozzle groups, in this embodiment. A predetermined film thickness is formed by receiving ink ejection four times in a superimposed manner. For this reason, even if the ink ejection amount varies among the plurality of nozzles 27, it is possible to prevent the film thickness from varying among the plurality of filter elements 3, and therefore, the light transmission characteristics of the color filter can be reduced. Can be uniformly uniform.

Of course, in the manufacturing method of the present embodiment, since the filter element 3 is formed by ink ejection using the ink jet head 22, there is no need to go through a complicated process such as a method using a photolithography method. No waste of material.

As described with reference to FIG. 23A, the distribution of the ink ejection amount of the plurality of nozzles 27 forming the nozzle row 28 of the ink jet head 22 becomes non-uniform. In addition, in particular, several nozzles 27 at both ends of the nozzle row 28, for example,
However, as described above, the ink ejection amount is particularly large. It is not preferable to use a nozzle having a particularly large ink ejection amount as compared with other nozzles in terms of making the ink ejection film, that is, the filter element, uniform in film thickness.

Therefore, preferably, as shown in FIG. 13, several of the plurality of nozzles 27 forming the nozzle array 28, for example, about 10 nozzles existing at both ends E of the nozzle array 28 do not eject ink in advance. Preferably, the nozzles 27 in the remaining portion F are divided into a plurality of groups, for example, four groups, and the sub-scanning movement is performed for each nozzle group.

In the first embodiment, a non-light-transmitting resin material is used for the partition 6, but a light-transmitting resin material may be used for the partition 6. In that case, a black mask may be formed by separately providing a light-shielding metal film or a resin material at a position corresponding to between the filter elements, for example, above the partition 6, below the partition 6, or the like. Alternatively, the partition wall 6 may be formed of a translucent resin material without a black mask.

In the first embodiment, R, G, and B are used as the filter elements.
G. FIG. It is not limited to B, for example, C (cyan),
M (magenta) and Y (yellow) may be adopted. In that case, filter element materials having C, M, and Y colors may be used instead of the R, G, and B filter element materials.

In the first embodiment, the partition 6
Was formed by photolithography, but it is also possible to form the partition 6 by an ink-jet method as in the case of a color filter.

(Second Embodiment) FIG. 2 shows another embodiment of a method and an apparatus for manufacturing a color filter according to the present invention.
2 schematically shows a case in which ink, that is, a filter element material is supplied to each filter element forming region 7 in a color filter forming region 11 in a discharge 2 by discharging.

The general steps performed by this embodiment are the same as those shown in FIG. 6, and the ink jet apparatus used for discharging ink is mechanically the same as the apparatus shown in FIG. Further, the CPU 69 in FIG. 14 conceptually divides the plurality of nozzles 27 forming the nozzle row 28 into n, for example, four groups, and sets the length L of each nozzle group.
The determination of the sub-scanning amount δ corresponding to / n or L / 4 is the same as in the case of FIG.

The present embodiment differs from the previous embodiment shown in FIG. 1 in that the program software stored in the memory 71 in FIG. 14 is modified. That is, the control operation and the sub-scanning control operation have been modified.

More specifically, in FIG.
The inkjet head 22 does not return to the initial position after the end of the scanning movement in the main scanning direction x, and immediately after the end of the main scanning movement in one direction, the movement amount δ corresponding to one nozzle group in the sub-scanning direction. Just move to position (b)
Then, scanning is performed in the direction opposite to the one direction of the main scanning direction x, and control is performed so as to return to the position (b ') shifted from the initial position (a) by the distance δ in the sub-scanning direction. In addition, during the main scanning from the position (a) to the position (b) and during the main scanning movement from the position (b) to the position (b ′), ink is selectively supplied from the plurality of nozzles 27 during both periods. Of course, it is discharged.

That is, in the present embodiment, the main scanning and the sub-scanning of the ink jet head 22 are performed alternately and continuously without interposing the return operation, thereby reducing the time spent for the return operation. Omitting it can shorten the work time.

(Third Embodiment) FIG. 3 shows another embodiment of a method and apparatus for manufacturing a color filter according to the present invention.
2 schematically shows a case in which ink, that is, a filter element material is supplied to each filter element forming region 7 in a color filter forming region 11 in a discharge 2 by discharging.

The general steps performed by this embodiment are the same as the steps shown in FIG. 6, and the ink jet apparatus used for discharging ink is mechanically the same as the apparatus shown in FIG. Also, the CPU 69 in FIG. 14 conceptually divides the plurality of nozzles 27 forming the nozzle row 28 into n groups, for example, four, as in the case of FIG.

This embodiment is different from the previous embodiment shown in FIG. 1 in that when the inkjet head 22 is set at the drawing start position on the mother substrate 12 in step S12 in FIG. (A)
As shown in the position, the extending direction of the nozzle row 28 is parallel to the sub-scanning direction Y. Such a nozzle arrangement structure is advantageous when the pitch between the nozzles of the inkjet head 22 and the pitch between the elements of the motherboard 12 are equal.

Also in this embodiment, the inkjet head 22 moves from the initial position (a) to the end position (k) in the main scanning direction x, moves back to the initial position, and moves in the sub-scanning direction Y. While repeating the sub-scanning movement with the moving amount δ, ink, that is, the filter element material is selectively ejected from the plurality of nozzles 27 during the main scanning movement, whereby the color filter forming region 11 in the mother substrate 12 The filter element material is adhered into the filter element forming region 7 of FIG.

In this embodiment, since the nozzle row 28 is positioned parallel to the sub-scanning direction Y, the sub-scanning movement amount δ is equal to the length L / n of the divided nozzle group, ie, L / 4. Is set equal to

(Fourth Embodiment) FIG. 4 shows another embodiment of a method and an apparatus for manufacturing a color filter according to the present invention.
2 schematically shows a case in which ink, that is, a filter element material is supplied to each filter element forming region 7 in a color filter forming region 11 in a discharge 2 by discharging.

The general steps performed by this embodiment are the same as those shown in FIG. 6, and the ink jet apparatus used for discharging ink is mechanically the same as the apparatus shown in FIG. Also, the CPU 69 of FIG. 14 conceptually divides the plurality of nozzles 27 forming the nozzle row 28 into n groups, for example, four groups, as in the case of FIG.

This embodiment is different from the previous embodiment shown in FIG. 1 in that when the ink jet head 22 is set at the drawing start position on the mother substrate 12 in step S12 in FIG. As shown in (a), the direction in which the nozzle row 28 extends is the sub-scanning direction Y.
2 in that the main scanning and the sub-scanning of the inkjet head 22 are performed continuously and alternately without interposing a return operation, as in the embodiment of FIG.

In the present embodiment shown in FIG. 4 and the previous embodiment shown in FIG. 3, since the main scanning direction x is a direction perpendicular to the nozzle row 28, the nozzle row 28 is formed as shown in FIG. By providing two rows along the main scanning direction x
The two nozzles 27 on the same main scanning line cause 1
One filter element region 7 can be supplied with filter element material.

(Fifth Embodiment) FIG. 16 shows an ink jet head 22A used in still another embodiment of a method and an apparatus for manufacturing a color filter according to the present invention. This ink jet head 22A is different from the ink jet head 22 shown in FIG. 10 in that a nozzle row 28R for discharging R color ink, a nozzle row 28G for discharging G color ink, and a nozzle row 28B for discharging B color ink.
12 are formed in one inkjet head 22A, and each of the three types is shown in FIG.
(A) and the ink ejection system shown in FIG.
An R ink supply device 37R is connected to the ink ejection system corresponding to the R nozzle row 28R, a G ink supply device 37G is connected to the ink ejection system corresponding to the G nozzle row 28G, and the B nozzle row 28B Is connected to a B ink supply device 37B.

The outline steps performed by the present embodiment are the same as those shown in FIG. 6, and the ink jet apparatus used for discharging ink is basically the same as the apparatus shown in FIG. Further, the CPU 69 in FIG. 14 conceptually divides the plurality of nozzles 27 forming the nozzle rows 28R, 28G, 28B into n groups, for example, four groups, and moves the inkjet head 22A in the sub-scanning direction for each of those nozzle groups. The sub-scanning movement by the amount δ is the same as in FIG.

In the embodiment shown in FIG. 1, only one type of nozzle row 28 is provided in the ink jet head 22, so that when a color filter is formed by three colors of R, G and B, it is shown in FIG. Inkjet head 2
2 had to be prepared for each of the three colors R, G and B. On the other hand, when the inkjet head 22A having the structure shown in FIG. 16 is used, three colors of R, G, and B are simultaneously applied to the mother substrate 12 by one main scan in the main scan direction x of the inkjet head 22A. The ink-jet head 2 can be attached.
You only need to prepare one for 2. Further, by adjusting the nozzle row interval of each color to the pitch of the filter element area of the mother substrate, it is possible to simultaneously strike three colors of RGB.

(Sixth Embodiment) FIG. 17 shows an embodiment of a method for manufacturing a liquid crystal device according to the present invention. Also,
FIG. 18 shows an embodiment of a liquid crystal device manufactured by the manufacturing method. FIG. 19 shows a cross-sectional structure of the liquid crystal device according to the line Ix-Ix in FIG. Prior to description of a method and an apparatus for manufacturing a liquid crystal device, first, a liquid crystal device manufactured by the manufacturing method will be described with reference to an example. The liquid crystal device of the present embodiment is a transflective liquid crystal device that performs full-color display by a simple matrix method.

In FIG. 18, a liquid crystal device 101 includes a liquid crystal driving IC 1 as a semiconductor chip on a liquid crystal panel 102.
03a and 103b are mounted, and F
It is formed by connecting a PC (Flexible Printed Circuit) 104 to the liquid crystal panel 102 and further providing an illumination device 106 as a backlight on the back side of the liquid crystal panel 102.

The liquid crystal panel 102 is formed by bonding a first substrate 107a and a second substrate 107b with a sealing material. The sealing material 108 is formed by, for example, attaching an epoxy resin in an annular shape to the inner surface of the first substrate 107a or the second substrate 107b by screen printing or the like. In addition, the sealing material 10
As shown in FIG. 19, a conductive material 109 formed in a spherical or cylindrical shape by a conductive material is included in the inside of the conductor 8 in a dispersed state.

In FIG. 19, the first substrate 107a has a plate-like base member 111a made of transparent glass, transparent plastic, or the like. A reflective film 112 is formed on the inner surface (upper surface in FIG. 19) of the base material 111a, an insulating film 113 is laminated thereon, and a first electrode 114a is formed on the reflective film 112 in a stripe shape (see FIG. 19). FIG.
), And an alignment film 116a is further formed thereon. Further, a polarizing plate 117a is attached to the outer surface (the lower surface in FIG. 19) of the base material 111a by sticking or the like.

In FIG. 18, in order to clearly show the arrangement of the first electrodes 114a, the spacing between the stripes of the first electrodes 114a is drawn much wider than the actual one. Therefore, the number of the first electrodes 114a is reduced. In practice, the first electrode 11
As for 4a, a larger number are formed on the base material 111a.

In FIG. 19, the second substrate 107b has a plate-like substrate 111b made of transparent glass, transparent plastic, or the like. A color filter 118 is formed on the inner surface (the lower surface in FIG. 19) of the base material 111b, and the second electrode 114b is provided thereon with the first electrode 1b.
14a, is formed in a stripe shape (see FIG. 18) in the direction perpendicular to the direction of arrow D when viewed from the direction of arrow D, and furthermore the alignment film 1
16b are formed. Further, a polarizing plate 117b is attached to the outer surface (upper surface in FIG. 19) of the base material 111b by bonding or the like.

In FIG. 18, in order to clearly show the arrangement of the second electrodes 114b, as in the case of the first electrodes 114a, the spacing between the stripes is drawn much wider than the actual one. Although the number of the second electrodes 114b is small, in practice, a larger number of the second electrodes 114b are formed on the base material 111b.

In FIG. 19, the first substrate 107a and the second
In a gap surrounded by the substrate 107b and the sealing material 108, a so-called cell gap, a liquid crystal such as STN
(SuperTwisted Nematic) Liquid crystal L is sealed. A large number of minute and spherical spacers 119 are dispersed on the inner surface of the first substrate 107a or the second substrate 107b, and the thickness of the cell gap is kept uniform by the presence of these spacers 119 in the cell gap. .

The first electrode 114a and the second electrode 114b are arranged orthogonally to each other, and their intersections are arranged in a dot matrix when viewed from the direction of arrow D in FIG. Then, each intersection in the dot matrix forms one picture element pixel. The color filter 118
It is formed by arranging each color element of (red), G (green), and B (blue) in a predetermined pattern as viewed in the direction of arrow D, for example, a pattern such as a stripe arrangement, a delta arrangement, and a mosaic arrangement. The one picture element pixel corresponds to each of R, G, and B, and the three-color picture element pixels of R, G, and B form one unit to constitute one pixel.

By selectively emitting light from a plurality of picture element pixels arranged in a dot matrix, that is, pixels, an image such as a character or a number is displayed on the outside of the second substrate 107b of the liquid crystal panel 102. . The area in which an image is displayed in this way is an effective pixel area, and the planar rectangular area indicated by an arrow V in FIGS. 18 and 19 is an effective display area.

In FIG. 19, a reflection film 112 is formed of a light-reflective material such as an APC alloy or Al (aluminum), and is located at a position corresponding to each pixel, which is an intersection between the first electrode 114a and the second electrode 114b. Opening 1
21 are formed. As a result, the opening 121 is
, Are arranged in the same dot matrix as the picture element pixels.

The first electrode 114a and the second electrode 114b
Is formed of, for example, ITO which is a transparent conductive material. The alignment films 116a and 116b are formed by attaching a polyimide resin to a film having a uniform thickness. By subjecting these alignment films 116a and 116b to the rubbing treatment, the initial alignment of the liquid crystal molecules on the surfaces of the first substrate 107a and the second substrate 107b is determined.

In FIG. 18, the first substrate 107a is
The first substrate 107a has a larger area than the substrate 107b, and the first substrate 107a has a substrate overhang portion 107c that extends outside the second substrate 107b when these substrates are bonded to each other with the sealant 108. The substrate extension 107c is connected to the second electrode 114b on the second substrate 107b via a lead wire 114c extending from the first electrode 114a and a conductive material 109 (see FIG. 19) existing inside the seal member. A wiring 114d that is electrically connected to the IC, a bump for input of the liquid crystal driving IC 103a, that is, a metal wiring 114e connected to an input terminal, and a liquid crystal driving IC.
Metal wiring 114f connected to input bump 103b
And the like are formed in an appropriate pattern.

In this embodiment, the lead wiring 114c extending from the first electrode 114a and the lead wiring 114d conducting to the second electrode 114b are formed of ITO, that is, a conductive oxide, which is the same material as those electrodes. The metal wires 114e and 114f, which are wires on the input side of the liquid crystal driving ICs 103a and 103b, are formed of a metal material having a low electric resistance value, for example, an APC alloy.
APC alloys are alloys that mainly contain Ag and concomitantly contain Pd and Cu, for example, 98% Ag, 1% Pd, Cu
1% alloy.

Liquid crystal driving IC 103a and liquid crystal driving IC
C103b is an ACF (Anisotropic Conductive Fil)
m: anisotropic conductive film) 122
It is mounted by being adhered to the surface of c. That is, in the present embodiment, a so-called COG (Chip On Glass) liquid crystal panel having a structure in which a semiconductor chip is directly mounted on a substrate is formed. In this COG type mounting structure, the input side bumps of the liquid crystal driving ICs 103a and 103b and the metal wirings 114e and 114f are conductively connected by the conductive particles contained in the ACF 122, and the output side of the liquid crystal driving ICs 103a and 103b. The bumps and the lead wirings 114c and 114d are conductively connected.

In FIG. 18, the FPC 104 has a flexible resin film 123, a circuit 126 including a chip part 124, and a metal wiring terminal 127. The circuit 126 is directly mounted on the surface of the resin film 123 by soldering or another conductive connection method. The metal wiring terminals 127 are formed of an APC alloy, Cr, Cu, or another conductive material. The portion of the FPC 104 where the metal wiring terminals 127 are formed is the first substrate 10
The ACF 122 is connected to a portion of the wiring 7a where the metal wiring 114e and the metal wiring 114f are formed. Then, due to the function of the conductive particles contained in the ACF 122, the metal wirings 114e and 114f on the substrate side and the metal wiring terminal 127 on the FPC side are conducted.

An external connection terminal 131 is formed on the opposite side end of the FPC 104, and the external connection terminal 131 is connected to an external circuit (not shown). Then, based on the signal transmitted from the external circuit, the liquid crystal driving IC 103a
And 103b are driven, and a scanning signal is supplied to one of the first electrode 114a and the second electrode 114b, and a data signal is supplied to the other. Thereby, the voltage of the pixel elements in the dot matrix arranged in the effective display area V is controlled for each pixel, and as a result, the orientation of the liquid crystal L is controlled for each pixel element.

In FIG. 18, a lighting device 106 functioning as a so-called backlight is provided as shown in FIG.
A light guide 132 made of acrylic resin or the like, a diffusion sheet 133 provided on a light exit surface 132b of the light guide 132, and a reflection sheet provided on a surface opposite to the light exit surface 132b of the light guide 132 134 and L as a light source
ED (Light Emitting Diode) 136.

The LED 136 is supported by an LED board 137, and the LED board 137 is mounted on a support (not shown) formed integrally with the light guide 132, for example. LE
When the D substrate 137 is mounted at a predetermined position on the support, the LED 136 is placed at a position facing the light intake surface 132 a, which is a side end surface of the light guide 132. Reference numeral 138 denotes a cushioning material for buffering an impact applied to the liquid crystal panel 102.

When the LED 136 emits light, the light is taken in from the light taking-in surface 132a and guided to the inside of the light guide 132, and is propagated while being reflected by the reflection sheet 134 and the wall surface of the light guide 132 while being propagated. The light is emitted as planar light from 132b through diffusion sheet 133 to the outside.

Since the liquid crystal device 101 of the present embodiment is configured as described above, if the external light such as sunlight or indoor light is sufficiently bright, the external light from the second substrate 107b side in FIG. Is taken into the liquid crystal panel 102, the light passes through the liquid crystal L, is reflected by the reflection film 112, and is supplied to the liquid crystal L again. The orientation of the liquid crystal L is controlled for each of the R, G, and B picture elements by the electrodes 114a and 114b sandwiching the liquid crystal L.
The light supplied to the liquid crystal panel 102 is modulated for each pixel pixel, and an image such as a character or a number is displayed outside the liquid crystal panel 102 by the light that passes through the polarizing plate 117b and the light that cannot pass through the modulation. Thus, a reflective display is performed.

On the other hand, when the amount of external light is not sufficient, the LED 136 emits light to emit plane light from the light emitting surface 132b of the light guide 132, and the light is
The liquid crystal L is supplied to the liquid crystal L through an opening 121 formed in the liquid crystal L. At this time, similarly to the reflection type display, the supplied light is modulated for each pixel by the liquid crystal L whose orientation is controlled, whereby an image is displayed outside. As a result, a transmissive display is performed.

The liquid crystal device 101 having the above configuration is manufactured by, for example, a manufacturing method shown in FIG. In this manufacturing method, a series of steps P1 to P6 is a step of forming the first substrate 107a, and steps P11 to P1 are performed.
A series of steps 4 is a step of forming the second substrate 107b. Usually, each of the first substrate forming step and the second substrate forming step is independently performed.

First, the step of forming the first substrate will be described. The liquid crystal panel 10 is formed on the surface of a large-area mother raw material base formed of a light-transmitting glass, a light-transmitting plastic or the like.
A plurality of reflective films 112 are formed by photolithography or the like, and an insulating film 113 is further formed thereon by a known film forming method (step P1). Using the first electrode 114a and the wiring 1
14c, 114d, 114e and 114f are formed (Step P2).

Next, an alignment film 116a is formed on the first electrode 114a by coating, printing, or the like (step P3), and rubbing is performed on the alignment film 116a to determine the initial alignment of the liquid crystal. (Step P4). next,
For example, the sealing material 108 is formed in a ring shape by screen printing or the like (Step P5), and the spherical spacers 119 are dispersed thereon (Step P6). As described above, a large-area mother first substrate having a plurality of panel patterns on the first substrate 107a of the liquid crystal panel 102 is formed.

A second substrate forming step (steps P11 to P14 in FIG. 17) is performed separately from the above-described first substrate forming step. First, a large-area mother raw material base formed of a light-transmitting glass, a light-transmitting plastic, or the like is prepared, and a plurality of color filters 1 of the liquid crystal panel 102 are provided on the surface thereof.
18 are formed (Step P11). The process of forming the color filter is performed by using the manufacturing method shown in FIG. 6, and the formation of each of the R, G, and B color filter elements in the manufacturing method is performed by using the inkjet apparatus 16 of FIG. 2, executed in accordance with the control method of the ink jet head shown in FIGS. The method of manufacturing these color filters and the method of controlling the ink jet head are the same as those already described, and thus description thereof will be omitted.

As shown in FIG. 6D, when the color filter 1, ie, the color filter 118, is formed on the mother substrate 12, ie, the mother raw material base material, the second electrode 114b is then formed by photolithography. (Step P12) Further, the alignment film 1 is formed by coating, printing, or the like.
16b is formed (step P13), and the alignment film 1
Rubbing treatment is performed on 16b to determine the initial alignment of the liquid crystal (step P14). Thus, a large-area mother second substrate having a plurality of panel patterns on the second substrate 107b of the liquid crystal panel 102 is formed.

After the mother first substrate and the mother second substrate having a large area are formed as described above, the mother substrates are aligned with each other with the sealing material 108 interposed therebetween, that is, the mother substrates are bonded together (step P21). ). As a result, an empty panel structure including the panel portions for a plurality of liquid crystal panels and in which the liquid crystal is not yet sealed is formed.

Next, a scribe groove, that is, a cutting groove is formed at a predetermined position of the completed empty panel structure, and the panel structure is broken, that is, cut based on the scribe groove (step P22). As a result, the liquid crystal injection opening 11 of the sealing material 108 of each liquid crystal panel portion is formed.
A so-called strip-shaped empty panel structure in which 0 (see FIG. 18) is exposed to the outside is formed.

Thereafter, the liquid crystal L is injected into each liquid crystal panel through the exposed liquid crystal injection opening 110, and each liquid crystal injection port 110 is sealed with a resin or the like (step P23). In a normal liquid crystal injection process, for example, a liquid crystal is stored in a storage container, and the storage container storing the liquid crystal and a strip-shaped empty panel are placed in a chamber or the like, and the chamber or the like is evacuated, and then the chamber is evacuated. This is performed by immersing a strip-shaped empty panel in the liquid crystal inside the device, and then opening the chamber to atmospheric pressure. At this time, since the inside of the empty panel is in a vacuum state, the liquid crystal pressurized by the atmospheric pressure is introduced into the inside of the panel through the liquid crystal injection opening. Since the liquid crystal adheres around the liquid crystal panel structure after the liquid crystal injection, the strip-shaped panel after the liquid crystal injection processing is subjected to a cleaning process in step 24.

Thereafter, a scribe groove is formed again at a predetermined position on the strip-shaped mother panel after the liquid crystal injection and washing are completed, and the strip-shaped panel is cut with reference to the scribe groove to obtain a plurality of pieces. The individual liquid crystal panels are cut out individually (step P25). As shown in FIG. 18, liquid crystal driving ICs 103a and 103b are mounted on each of the liquid crystal panels 102 thus manufactured, and a lighting device 106 is mounted as a backlight.
By connecting the liquid crystal device 104 to the target liquid crystal device 10
1 is completed (Step P26).

The above-described method and apparatus for manufacturing a liquid crystal device have the following features, particularly at the stage of manufacturing a color filter. That is, the color filter 1 shown in FIG.
The individual filter elements 3 in 8 are not formed by one main scan x of the ink jet head 22 (see FIG. 1), but each filter element 3 has a plurality of nozzles 27 belonging to different nozzle groups. The ink is ejected n times, for example, four times, thereby forming a predetermined film thickness. For this reason, even if the ink ejection amount varies among the plurality of nozzles 27, it is possible to prevent the film thickness from varying among the plurality of filter elements 3, and therefore, the light transmission characteristics of the color filter can be reduced. Can be uniformly uniform. This means that in the liquid crystal device 101 of FIG. 19, clear color display without color unevenness can be obtained.

In the method and apparatus for manufacturing a liquid crystal device according to the present embodiment, the filter element 3 is formed by ink ejection using the inkjet head 22 by using the inkjet device 16 shown in FIG. It is not necessary to go through a complicated process such as a method using, and there is no waste of material.

(Seventh Embodiment) FIG. 20 shows an embodiment of a method of manufacturing an EL device according to the present invention. Also,
FIG. 21 shows the main steps of the manufacturing method and the main cross-sectional structure of the finally obtained EL device. As shown in FIG. 21D, in the EL device 201, a pixel electrode 202 is formed on a transparent substrate 204, and a bank 2 is provided between the pixel electrodes 202.
05 are formed in a lattice shape when viewed in the direction of arrow G, the hole injection layer 220 is formed in the lattice-shaped recesses, and R color light emission is performed in a predetermined arrangement such as a stripe arrangement when viewed in the direction of arrow G. The layer 203R, the G-color light-emitting layer 203G, and the B-color light-emitting layer 203B are formed in each lattice-shaped recess, and the counter electrode 213 is formed thereon.

The above-mentioned pixel electrode 202 is connected to a TFD (Thin Film).
When driven by a two-terminal type active element such as a diode (thin film diode) element, the counter electrode 213 is formed in a stripe shape when viewed from the direction of arrow G. In addition, the pixel electrode 202 is connected to a TFT (Thin Film Transi
In the case of driving by a three-terminal type active element such as a stor (thin film transistor), the above-described counter electrode 21 is used.
3 is formed as a single plane electrode.

The area sandwiched between each pixel electrode 202 and each counter electrode 213 is one picture element pixel.
G, B three color picture element pixels become one unit and 1
To form one pixel. By controlling the current flowing through each picture element pixel, a desired one of the plurality of picture element pixels is selectively caused to emit light, whereby a desired full-color image can be displayed in the direction of arrow H.

The EL device 201 is manufactured, for example, by the manufacturing method shown in FIG. That is, the process P5
1 and an active element such as a TFD element or a TFT element is formed on the surface of the transparent substrate 204 as shown in FIG.
Further, a pixel electrode 202 is formed. As a formation method,
For example, a photolithography method, a vacuum deposition method, a sputtering method, a pyrosol method, or the like can be used. The material of the pixel electrode is ITO (Indium Tin Oxide),
Tin oxide, a composite oxide of indium oxide and zinc oxide, or the like can be used.

Next, as shown in a step P52 and FIG. 21A, a partition wall, that is, a bank 205 is formed by using a well-known patterning method, for example, a photolithography method. buried. Thus, it is possible to improve contrast, prevent color mixing of light emitting materials, and prevent light leakage between pixels. The material of the bank 205 is not particularly limited as long as it has durability with respect to the solvent of the EL material, but can be fluorinated by fluorocarbon gas plasma treatment, for example, an organic resin such as an acrylic resin, an epoxy resin, or a photosensitive polyimide. Materials are preferred.

Next, immediately before the ink for the hole injection layer was applied, the substrate 204 was subjected to continuous plasma processing of oxygen gas and fluorocarbon gas plasma (step P53). Thereby, the polyimide surface is made water-repellent, the ITO surface is made hydrophilic, and the wettability on the substrate side for finely patterning the inkjet droplets can be controlled. As a device for generating plasma, a device for generating plasma in a vacuum or a device for generating plasma in the atmosphere can be used in the same manner.

Next, as shown in step P54 and FIG. 21A, the hole injection layer ink is discharged from the ink jet head 22 of the ink jet device 16 in FIG. went. A specific method of controlling the ink jet head used the method shown in FIG. 1, FIG. 2, FIG. 3, or FIG. After the application, vacuum (1t
(orr), removing the solvent under the conditions of room temperature and 20 minutes (step P55), and then injecting holes incompatible with the light emitting layer ink by heat treatment in the air at 20 ° C. (on a hot plate) for 10 minutes. The layer 220 was formed (Step P56).
The film thickness was 40 nm.

Next, as shown in Step P57 and FIG. 21B, the hole injection layer 22 in each filter element region is formed.
The ink for the R light emitting layer and the ink for the G light emitting layer were applied on 0 using an ink jet method. Also in this case, the ink for each light emitting layer is ejected from the ink jet head 22 of the ink jet device 16 in FIG. 8, and the control method of the ink jet head follows the method shown in FIG. 1, FIG. 2, FIG. 3, or FIG. According to the inkjet method, fine patterning can be performed easily and in a short time. Further, the film thickness can be changed by changing the solid content concentration and the ejection amount of the ink composition.

After applying the light emitting layer ink, vacuum (1 torr)
r), the solvent is removed under the conditions of room temperature, 20 minutes, etc. (step P58), and then conjugated by heat treatment at 150 ° C. for 4 hours in a nitrogen atmosphere to form the R color light emitting layer 203R and the G color light emitting layer 203G. Was formed (Step P59). The film thickness is 50
nm. The light emitting layer conjugated by the heat treatment is insoluble in the solvent.

Before forming the light emitting layer, the hole injection layer 2
20 may be subjected to continuous plasma processing of oxygen gas and fluorocarbon gas plasma. Thereby, the hole injection layer 2
By forming a fluorinated layer on the substrate 20 and increasing the ionization potential, the hole injection efficiency is increased and an organic EL device with high luminous efficiency can be provided.

Next, as shown in step P60 and FIG. 21C, the B-color light-emitting layer 203B is replaced with the R-color light-emitting layer 203R, the G-color light-emitting layer 203G, and the hole injection layer 2G in each pixel pixel.
20 and formed on top of each other. Accordingly, not only the three primary colors of R, G, and B can be formed, but also the level difference between the banks 205 and the R light emitting layers 203R and 203G and the bank 205 can be flattened. As a result, a short circuit between the upper and lower electrodes can be reliably prevented. By adjusting the thickness of the B-color light-emitting layer 203B, the B-color light-emitting layer 203B acts as an electron injection / transport layer in the laminated structure of the R-color light-emitting layer 203R and the G-color light-emitting layer 203G, and emits light of the B color. do not do.

As a method for forming the B-color light-emitting layer 203B as described above, for example, a general spin coating method as a wet method can be adopted, or the R-color light-emitting layer 2B can be used.
An inkjet method similar to the method of forming the 03R and G color light emitting layers 203G can be employed.

Thereafter, as shown in a step P61 and FIG. 21D, the target EL device 201 was manufactured by forming the counter electrode 213. When the counter electrode 213 is a plane electrode, for example, Mg, Ag, A
It can be formed using a film forming method such as a vapor deposition method or a sputtering method using l, Li or the like as a material. When the counter electrode 213 is a stripe-shaped electrode, the formed electrode layer can be formed by using a patterning method such as a photolithography method.

According to the EL device manufacturing method and the manufacturing apparatus described above, the control method shown in FIG. 1, FIG. 2, FIG. 3, or FIG. The hole injection layer 220 and the R, G, and B color light emitting layers 203R and 203 in each pixel pixel
G and 203B are not formed by one main scan x of the inkjet head 22 (see FIG. 1), but are formed by a hole injection layer and / or each color light emitting layer in one pixel pixel having a different nozzle. Multiple nozzles 2 belonging to a group
7, the ink is ejected n times, for example four times, to form a predetermined film thickness. For this reason, even if there is a variation in the ink ejection amount between the plurality of nozzles 27, it is possible to prevent a variation in the film thickness among the plurality of picture element pixels, and therefore, the emission distribution of the light emitting surface of the EL device. The characteristics can be made uniform in a plane.
This is because the EL device 201 shown in FIG.
This means that a clear color display without color unevenness can be obtained.

In the method and apparatus for manufacturing an EL device according to the present embodiment, the R, G, and B color picture element pixels are discharged by ink discharge using the ink jet head 22 by using the ink jet device 16 shown in FIG. Since it is formed, there is no need to go through a complicated process such as a method using a photolithography method, and no material is wasted.

(Other Embodiments) The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications may be made within the scope of the invention described in the claims. Can be modified to

For example, in the color filter manufacturing apparatus shown in FIGS. 8 and 9, the substrate 12 is main-scanned by moving the ink jet head 22 in the main scanning direction x, and the substrate 12 is moved by the sub-scanning driving device 21. Thus, the substrate 12 is sub-scanned by the inkjet head 22. Conversely, the main scanning may be performed by moving the substrate 12, and the sub-scanning may be performed by moving the inkjet head 22.

Further, in the above-described embodiment, the ink jet head having a structure in which ink is ejected by using the bending deformation of the piezoelectric element is used, but an ink jet head having any other structure may be used. In the above embodiment,
Although only the most general configuration in which the main scanning direction and the sub-scanning direction are orthogonal to each other has been illustrated, the relationship between the main scanning direction and the sub-scanning direction is not limited to the orthogonal relationship, but may be any intersection at any angle. . In the above embodiments, the method and apparatus for manufacturing a color filter, the method and apparatus for manufacturing a liquid crystal device, and the method and apparatus for manufacturing an EL device have been described as examples. However, the present invention is not limited to these. Instead, the present invention can be used for general industrial techniques for performing fine patterning on an object. For example, various semiconductor elements (thin film transistor, thin film diode, etc.), various wiring patterns, formation of an insulating film, and the like are given as examples of the application range. The material to be ejected from the head can be variously selected according to the elements to be formed on an object such as a substrate. For example, in addition to the above-described ink and EL light emitting material, a silica glass precursor, a metal compound, Conductive materials, dielectric materials,
Alternatively, a semiconductor material is given as an example. In the above embodiment, the “inkjet head” is used for simplicity.
However, the ejected matter ejected from this inkjet head is not limited to ink, and may be, for example, the aforementioned EL light-emitting material, a silica glass precursor, a conductive material such as a metal compound, a dielectric material, or a semiconductor. It goes without saying that there are various materials and the like. The liquid crystal device and the EL device manufactured by the manufacturing method of the above embodiment can be mounted on a display unit of an electronic device such as a mobile phone and a portable computer.

[0156]

According to the method and the apparatus for manufacturing a color filter according to the present invention, each filter element in the color filter is not formed by one scanning of the ink jet head, but is formed by each one. Since the filter element is formed to have a predetermined film thickness by receiving ink discharge by a plurality of nozzles belonging to different nozzle groups, even if there is a variation in the ink discharge amount among the plurality of nozzles, a plurality of filter elements are provided. Variations in the film thickness between the elements can be prevented, so that the light transmission characteristics of the color filter can be made uniform in a plane.

Further, since the present invention is a method using an ink-jet head, there is no need to go through a complicated process such as a method using a photolithography method, and there is no waste of materials.

According to the method and apparatus for manufacturing a liquid crystal device according to the present invention, in the step of manufacturing a color filter, each filter element in the color filter is formed by one scan of the ink jet head. Instead, each filter element is formed to have a predetermined film thickness by receiving ink discharge by overlapping with a plurality of nozzles belonging to different nozzle groups, so that the ink discharge amount varies among the plurality of nozzles. Even when it is present, it is possible to prevent the film thickness from being varied among the plurality of filter elements, and therefore, it is possible to make the light transmission characteristics of the color filter uniform in a plane. As a result, a clear color image without color unevenness can be displayed.

According to the method and apparatus for manufacturing an EL device according to the present invention, the R, G, and B light emitting layers in each pixel are formed by one main scan of the ink jet head. Instead, the respective color light-emitting layers are formed to have a predetermined film thickness by receiving ink ejection by overlapping a plurality of nozzles belonging to different nozzle groups. For this reason, even if there is a variation in the ink ejection amount among a plurality of nozzles, it is possible to prevent a variation in the film thickness between a plurality of picture element pixels, and therefore,
The light emission distribution characteristics of the light emitting surface of the EL device can be made uniform in a plane, and as a result, a clear color display without color unevenness can be obtained.

In the method and apparatus for manufacturing an EL device according to the present invention, R, G, and B color picture element pixels are formed by ink discharge using an ink jet head. There is no need to go through complicated processes and no waste of materials.

According to the control apparatus of the ink jet head according to the present invention, each color pattern is not formed by one scan of the ink jet head, but each color pattern is assigned to a different nozzle group. Since a predetermined film thickness is formed by receiving ink ejection by overlapping a plurality of nozzles, even if the ink ejection amount varies among the plurality of nozzles, the film thickness varies among the plurality of color patterns. Can be prevented, and therefore, the optical characteristics of the color pattern can be made uniform within the plane of the optical member.

Thus, the R, G, and B color filter elements as color patterns in the color filter as the optical member can be formed with a uniform thickness in a plane. Further, the R, G, B light emitting layers and the hole injection layers as color patterns in the EL element as an optical member can be formed with a uniform thickness in a plane.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing main steps of an embodiment of a color filter manufacturing method according to the present invention.

FIG. 2 is a plan view schematically showing main steps of another embodiment of the method for manufacturing a color filter according to the present invention.

FIG. 3 is a plan view schematically showing main steps of still another embodiment of the color filter manufacturing method according to the present invention.

FIG. 4 is a plan view schematically showing main steps of still another embodiment of the method for manufacturing a color filter according to the present invention.

FIG. 5 is a plan view showing an embodiment of a color filter according to the present invention and an embodiment of a mother substrate on which the color filter is based.

FIG. 6 is a diagram schematically illustrating a color filter manufacturing process using a cross-sectional portion along the line VI-VI in FIG. 5A.

FIG. 7 is a diagram illustrating an example of an arrangement of picture element pixels of three colors R, G, and B in a color filter.

FIG. 8 shows an embodiment of an ink jet apparatus which is a main part of each manufacturing apparatus such as a color filter manufacturing apparatus according to the present invention, a liquid crystal device manufacturing apparatus according to the present invention, and an EL device manufacturing apparatus according to the present invention. It is a perspective view.

9 is an enlarged perspective view showing a main part of the device of FIG. 8;

FIG. 10 is an enlarged perspective view showing an ink jet head which is a main part of the apparatus shown in FIG. 9;

FIG. 11 is a perspective view showing a modified example of the ink jet head.

FIGS. 12A and 12B are views showing the internal structure of the inkjet head, wherein FIG. 12A is a partially cutaway perspective view, and FIG. 12B is a cross-sectional structure taken along line JJ of FIG.

FIG. 13 is a plan view showing another modification of the ink jet head.

FIG. 14 is a block diagram showing an electric control system used in the ink jet head device of FIG.

FIG. 15 is a flowchart showing a flow of control executed by the control system of FIG. 14;

FIG. 16 is a perspective view showing still another modified example of the ink jet head.

FIG. 17 is a process chart showing one embodiment of a method for manufacturing a liquid crystal device according to the present invention.

FIG. 18 is an exploded perspective view showing an example of a liquid crystal device manufactured by the method for manufacturing a liquid crystal device according to the present invention.

19 is a cross-sectional view showing a cross-sectional structure of the liquid crystal device according to the line Ix-Ix in FIG.

FIG. 20 is a process chart showing one embodiment of a method for manufacturing an EL device according to the present invention.

21 is a cross-sectional view of the EL device corresponding to the process diagram shown in FIG.

FIG. 22 is a diagram illustrating an example of a conventional color filter manufacturing method.

FIG. 23 is a diagram illustrating characteristics of a conventional color filter.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Color filter 2 Substrate 3 Filter element 4 Protective film 6 Partition wall 7 Filter element formation area 11 Color filter formation area 12 Mother substrate 13 Filter element material 16 Ink jet device 17 Head position control device 18 Substrate position control device 19 Main scanning drive device 21 Sub Scanning drive device 22 Inkjet head 26 Head unit 27 Nozzle 28 Nozzle row 39 Ink pressurizing body 41 Piezoelectric element 49 Table 76 Capping device 77 Cleaning device 78 Electronic balance 81 Head camera 82 Camera for substrate 101 Liquid crystal device 102 Liquid crystal panel 107a, 107b Substrate 111a, 111b Base material 114a, 114b Electrode 118 Color filter 201 EL device 202 Pixel electrode 203R, 203G, 203B Light emitting layer 2 04 substrate 205 bank 213 counter electrode 220 hole injection layer L liquid crystal M filter element material × main scanning direction Y sub scanning direction

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G02F 1/1335 505 H05B 33/10 4D075 H05B 33/10 33/12 B 4F041 33/12 33/14 A 33 / 14 B41J 3/04 101Z (72) Inventor Satoru Katagami 3-5-5 Yamato, Suwa-shi, Nagano Seiko Epson Corporation (72) Inventor Masaharu Shimizu 3-5-2-5 Yamato, Suwa-shi, Nagano Seiko-Epson (72) Inventor Hiroshi Kiguchi 3-3-5 Yamato, Suwa-shi, Nagano Pref. 2H091 FA02Y FA35Y FB02 FC12 FC29 FD04 GA13 LA15 LA18 3K007 AB04 AB18 BA06 CB01 DA00 DB03 EB00 FA00 FA01 FA03 4D075 AC0 7 AC73 AC93 CB08 DA06 DB13 DB31 DC21 DC24 EA07 EA33 EC60 4F041 AA01 AA02 AA05 AA06 AB02 BA13 BA21

Claims (16)

[Claims] 1. A material discharging method for discharging a material onto an object, comprising: a head having a nozzle row in which a plurality of nozzles are arranged; and one of the objects being moved in the main scanning direction with respect to the other. Discharging a material from at least one nozzle of the plurality of nozzles while moving, wherein in the step, a nozzle located at an end of the nozzle row is controlled so as not to discharge the material. A method for discharging a material, characterized in that: 2. The material discharging method according to claim 1, wherein a plurality of nozzles located at an end of the nozzle row are controlled so as not to discharge the material. Method. 3. The material discharging method according to claim 2, wherein the nozzle row is virtually divided into a plurality of groups, and each of the groups scans the same part of the target object in the main scanning. A step of sub-scanning one of the head and the object with respect to the other so as to scan in the direction. 4. The material discharging method according to claim 1, wherein the nozzle row is virtually divided into n nozzle groups, and the nozzle row is controlled so as not to discharge the material. Assuming that the length of the portion excluding the nozzle to be performed is L, the number of the nozzle groups is n, and the angle between the nozzle row and the sub-scanning direction is θ, the sub-scanning movement amount δ is δ (L / N) cos θ 2. 5. The material discharging method according to claim 1, wherein a plurality of the heads are provided, and different materials are discharged from nozzle rows of each of the heads. . 6. The material discharging method according to claim 1, wherein the head is provided with a plurality of nozzle rows, and different materials are discharged from each of the nozzle rows. Discharge method. 7. A material discharging apparatus comprising a nozzle row in which a plurality of nozzles are arranged, wherein the material is discharged from at least one of the plurality of nozzles, wherein the material is discharged from the nozzles. A discharge control means for controlling the discharge of the material, wherein the discharge control means controls a nozzle located at an end of the nozzle row to not discharge the material. 8. The material discharge apparatus according to claim 7, wherein the discharge control means controls a plurality of nozzles located at an end of the nozzle row to not discharge the material. Material discharge device. 9. A color filter manufacturing method for manufacturing a color filter in which a plurality of filter elements are arranged on a substrate, comprising: a head having a nozzle row in which a plurality of nozzles are arranged; Discharging a filter material from at least one nozzle of the plurality of nozzles while moving one in the main scanning direction with respect to the other, wherein the nozzle located at an end of the nozzle row includes A method of manufacturing the color filter, wherein the color filter material is controlled not to be discharged. 10. A color filter manufacturing apparatus comprising a nozzle row in which a plurality of nozzles are arranged, and discharging a filter material from at least one of the plurality of nozzles. A color filter manufacturing apparatus comprising: a discharge control unit configured to control discharge of a material; wherein the discharge control unit controls a nozzle located at an end of the nozzle row to not discharge the filter material. . 11. A method for manufacturing a liquid crystal device, comprising: a pair of substrates for sandwiching liquid crystal; and a color filter in which a plurality of filter elements are arranged on at least one substrate, wherein a plurality of nozzles are arranged. Discharging a filter material from at least one of the plurality of nozzles while moving one of the substrates in the main scanning direction with respect to the other, the head having a nozzle row; and A method of manufacturing a liquid crystal device, wherein a nozzle positioned at an end of the nozzle row is controlled so as not to discharge the filter material. 12. A manufacturing apparatus for a liquid crystal device, comprising: a nozzle row in which a plurality of nozzles are arranged; and discharging a filter material from at least one of the plurality of nozzles. Manufacturing a liquid crystal device, comprising: discharge control means for controlling discharge of a filter material, wherein the discharge control means controls a nozzle located at an end of the nozzle row to not discharge the filter material. apparatus. 13. A method of manufacturing an EL device comprising a plurality of picture element pixels including an EL light emitting layer arranged on a substrate, comprising: a head having a nozzle row in which a plurality of nozzles are arranged; Discharging an EL light-emitting material from at least one of the plurality of nozzles while moving one of the nozzles in the main scanning direction with respect to the other, wherein the step is performed at an end of the nozzle row. A method of manufacturing an EL device, wherein a nozzle is controlled so as not to discharge the EL light emitting material. 14. An apparatus for manufacturing an EL device, comprising: a nozzle row in which a plurality of nozzles are arranged; and discharging an EL light emitting material from at least one of the plurality of nozzles. An EL device, comprising: discharge control means for controlling discharge of an EL light-emitting material, wherein the discharge control means controls a nozzle located at an end of the nozzle row so as not to discharge the EL light-emitting material. Manufacturing equipment. 15. An electronic apparatus equipped with a liquid crystal device manufactured by using the method for manufacturing a liquid crystal device according to claim 11. 16. An electronic device equipped with an EL device manufactured by using the method for manufacturing an EL device according to claim 13.