JP3899879B2 - Color filter manufacturing method and manufacturing apparatus, liquid crystal device manufacturing method and manufacturing apparatus, EL device manufacturing method and manufacturing apparatus, inkjet head control apparatus, material discharging method and material discharging apparatus, and electronic apparatus - Google Patents

Color filter manufacturing method and manufacturing apparatus, liquid crystal device manufacturing method and manufacturing apparatus, EL device manufacturing method and manufacturing apparatus, inkjet head control apparatus, material discharging method and material discharging apparatus, and electronic apparatus Download PDF

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Publication number
JP3899879B2
JP3899879B2 JP2001294727A JP2001294727A JP3899879B2 JP 3899879 B2 JP3899879 B2 JP 3899879B2 JP 2001294727 A JP2001294727 A JP 2001294727A JP 2001294727 A JP2001294727 A JP 2001294727A JP 3899879 B2 JP3899879 B2 JP 3899879B2
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Prior art keywords
substrate
apparatus
color filter
formed
ink
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JP2002221617A (en
Inventor
智己 川瀬
久 有賀
浩史 木口
政春 清水
悟 片上
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セイコーエプソン株式会社
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/09Ink jet technology used for manufacturing optical filters

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a manufacturing method and a manufacturing apparatus for manufacturing a color filter used in an optical device such as a liquid crystal device. The present invention also relates to a method and apparatus for manufacturing a liquid crystal device having a color filter. The present invention also relates to a manufacturing method and a manufacturing apparatus of an EL device that performs display using an EL light emitting layer. The present invention also relates to a material discharging method and a material discharging apparatus for discharging a material to an object. Furthermore, the present invention relates to a liquid crystal device manufactured by using these manufacturing methods or an electronic apparatus equipped with an EL device.
[0002]
[Prior art]
In recent years, display devices such as liquid crystal devices and EL devices have been widely used in display units of electronic devices such as mobile phones and portable computers. Recently, full-color display is often performed by a display device. Full color display by the liquid crystal device is performed, for example, by passing light modulated by a liquid crystal layer through a color filter. The color filter has, for example, R (red), G (green), and B (blue) dot color filter elements on the surface of a substrate formed of glass, plastic, or the like in a stripe arrangement, delta arrangement, or mosaic. It is formed by arranging in a predetermined arrangement such as an arrangement.
[0003]
In addition, when full-color display is performed by an EL device, for example, R (red), G (green), and B (blue) dot-like colors EL are formed on the surface of a substrate formed of glass, plastic, or the like. The light emitting layers are arranged in a predetermined arrangement such as a stripe arrangement, a delta arrangement, or a mosaic arrangement, and these EL emission layers are sandwiched between a pair of electrodes to form pixel pixels, and the voltage applied to these electrodes is set to the pixel pixels. Each pixel pixel is caused to emit light in a desired color by controlling each time, thereby performing a full color display.
[0004]
Conventionally, it is known to use a photolithography method when patterning each color filter element such as R, G, B, etc. of a color filter, or when patterning each color pixel element, such as R, G, B, etc., of an EL device. ing. However, when this photolithography method is used, there are problems that the process is complicated and that each color material, photoresist and the like are consumed in a large amount, so that the cost is increased.
[0005]
In order to solve this problem, there has been proposed a method of forming a dot-shaped array of filaments, EL light-emitting layers, and the like by ejecting filter materials, EL light-emitting materials, and the like in the form of dots by an inkjet method.
[0006]
Now, in FIG. 22A, a large area substrate formed of glass, plastic, or the like, that is, an inner region of a plurality of panel regions 302 set on the surface of the so-called motherboard 301, as shown in FIG. Consider a case where a plurality of filter elements 303 arranged in a dot shape are formed based on an ink jet method. In this case, for example, as shown in FIG. 22C, an inkjet head 306 having a nozzle row 305 formed by arranging a plurality of nozzles 304 in a row is shown by arrows A1 and A2 in FIG. As shown, while the main scanning is performed a plurality of times (two times in FIG. 22) with respect to one panel region 302, the ink or filter material is selectively ejected from a plurality of nozzles during the main scanning. A filter element 303 is formed on the substrate.
[0007]
Since the filter element 303 is formed by arranging each color such as R, G, B, etc. in an appropriate arrangement form such as a stripe arrangement, a delta arrangement, a mosaic arrangement, etc., the ink jet head 306 shown in FIG. In the ink ejection process by the above, ink jet heads 306 for ejecting single colors of R, G, and B are provided in advance for three colors such as R, G, and B, and one of these ink jet heads 306 is used in sequence. A three-color array of R, G, B, etc. is formed on the motherboard 301.
[0008]
[Problems to be solved by the invention]
Incidentally, with respect to the inkjet head 306, generally, there are variations in the ink discharge amounts of the plurality of nozzles 304 constituting the nozzle row 305. For example, positions corresponding to both ends of the nozzle row 305 as shown in FIG. The ink discharge characteristic Q is such that the discharge amount is large, the central portion is the second largest, and the middle portion has a small discharge amount.
[0009]
Therefore, when the filter element 303 is formed by the inkjet head 306 as shown in FIG. 22B, as shown in FIG. 23B, the position P1 or the central portion P2 corresponding to the end of the inkjet head 306, Alternatively, there is a problem that streaks with high density are formed in both P1 and P2, and the planar light transmission characteristics of the color filter become non-uniform.
[0010]
The present invention has been made in view of the above-described problems. The optical characteristics of an optical member such as the light transmission characteristics of a color filter, the color display characteristics of a liquid crystal device, and the light emission characteristics of an EL light emitting surface are planarly obtained. It aims at providing the manufacturing method and manufacturing apparatus of each optical member which can be made uniform.
[0011]
[Means for Solving the Problems]
(1) In order to achieve the above object, a color filter manufacturing method according to the present invention is a color filter manufacturing method for manufacturing a color filter formed by arranging a plurality of filter elements on a substrate,
An ink jet head having a nozzle row in which a plurality of nozzles are arranged in a row, the nozzle row being divided into n groups, and one of the substrates is moved in the main scanning direction with respect to the other Forming a filter element on the substrate by selectively discharging a filter material from the plurality of nozzles, and sub-scanning one of the inkjet head and the substrate with respect to the other. B, and each of the filter elements is formed by n times of the process A, and in the formation of each of the filter elements, the nozzles that discharge in each time of the process A are different from each other. It belongs to a group.
[0012]
According to the color filter manufacturing method of this configuration, the individual filter elements in the color filter are not formed by a single scan of the ink jet head, but are overlapped by a plurality of nozzles belonging to different nozzle groups. Since a predetermined film thickness is formed by receiving the discharge, even if there is a variation in the ink discharge amount between a plurality of nozzles, it is possible to prevent a variation in the film thickness between a plurality of filter elements. Therefore, the light transmission characteristics of the color filter can be made uniform in a plane.
[0013]
Of course, since the method for producing a color filter of the present invention is a method using an inkjet head, there is no need to go through complicated steps as in the method using a photolithography method, and no material is wasted.
[0014]
In the color filter manufacturing method having the above-described configuration, one of the inkjet head and the substrate can be sub-scanned with respect to the other at a length that is an integral multiple of the length of the nozzle group in the sub-scanning direction. In this way, a plurality of nozzle groups scan the same portion of the substrate in an overlapping manner, and ink is supplied to the individual filter element regions by the nozzles in each nozzle group.
[0015]
Further, in the color filter manufacturing method having the above-described configuration, the nozzle row can be arranged to be inclined with respect to the sub-scanning direction. The nozzle row is formed by arranging a plurality of nozzles in a row. In this case, assuming that the arrangement state of the nozzle rows is parallel to the sub-scanning direction of the inkjet head, the interval between adjacent filter elements formed by the filter element material discharged from the nozzles, that is, the inter-element pitch. Is equal to the inter-nozzle pitch of the plurality of nozzles forming the nozzle row.
[0016]
If the inter-element pitch may be equal to the inter-nozzle pitch, the above can be left as it is.However, in such a case, it is a rare case. Usually, the inter-element pitch and the inter-nozzle pitch are There are many cases where they are different. When the inter-element pitch and the inter-nozzle pitch are different from each other, the nozzle row is inclined with respect to the sub-scanning direction of the ink jet head as in the above configuration, so that the inter-nozzle pitch is aligned with the sub-scanning direction. The length can be adjusted to the pitch between elements. In this case, the position of each nozzle constituting the nozzle row is shifted back and forth in the main scanning direction, but for this, by shifting the discharge timing of the filter element material from each nozzle, Ink droplets from each nozzle can be supplied to a desired position.
[0017]
Further, in the method for manufacturing a color filter having the above-described configuration, when the length of the nozzle row is L and the angle formed by the nozzle row and the sub-scanning direction is θ, δ≈ (L / n) cos θ can be set.
According to this configuration, the inkjet head can move a plurality of nozzles for each nozzle group in the sub-scanning direction. As a result, for example, when considering a case where the nozzle row is divided into four nozzle groups, each part on the substrate is subjected to main scanning by being overlapped by the four nozzle groups.
[0018]
Next, in the manufacturing method of the color filter having the above configuration, a control method can be adopted in which the filter element material is not ejected from several nozzles at both end portions of the nozzle row. As described with reference to FIG. 23A, the ink discharge distribution in a general ink jet head changes in both end portions of the nozzle row as compared with other portions. For an ink jet head having such an ink discharge distribution characteristic, if a plurality of nozzles having a uniform ink discharge distribution are used except for several nozzles at both ends of a nozzle row having a large change, the filter element The film thickness can be made uniform in a plane.
[0019]
In the color filter manufacturing method having the above configuration, when ink is not ejected from several nozzles at both ends of the nozzle row, the length of the nozzle row is L, and the nozzle row is in the sub-scanning direction. Is θ, the sub-scanning movement amount δ related to the process B can be set to δ≈ (L / n) cos θ.
[0020]
Next, the color filter manufactured by the method for manufacturing a color filter having the above configuration is R (red), G (green), B (blue), C (cyan), Y (yellow), M (magenta), or the like. It is considered that the multi-color filter elements are formed by arranging them in an appropriate pattern on a plane. When manufacturing such a color filter, an inkjet head that discharges one type of filter material of a plurality of colors from the nozzle row is provided independently for each number of colors, and “each nozzle in the nozzle row” is provided. The process of repeatedly performing the main scanning a plurality of times while sub-scanning the inkjet head so that the group scans the same portion of the substrate in an overlapping manner is performed on the one substrate with an inkjet head for each color. It can be realized by using them separately and sequentially.
[0021]
Further, when manufacturing a color filter having a plurality of color filter elements such as R, G, B, or C, Y, M as described above, a plurality of types of nozzle rows for discharging each color are formed in one head. The ink jet head is formed, and “the main scanning is repeated a plurality of times while the ink jet head is sub-scanned so that each nozzle group in the nozzle row overlaps and scans the same portion of the substrate.” This process can be performed simultaneously on a plurality of colors by the inkjet head.
[0022]
(2) Next, a color filter manufacturing apparatus according to the present invention is a color filter manufacturing apparatus for manufacturing a color filter formed by arranging a plurality of filter elements on a substrate, and a plurality of nozzles are arranged in a row. An inkjet head having an array of nozzle rows and divided into a plurality of groups, an ink supply means for supplying a filter material to the inkjet head, and one of the inkjet head and the substrate Main scanning driving means for moving the ink jet head in the main scanning direction, sub scanning driving means for moving one of the inkjet head and the substrate in the sub scanning direction with respect to the other, and the plurality of nozzles Nozzle ejection control means for controlling ink ejection, main scanning control means for controlling the operation of the main scanning drive means, and the sub-scanning One of the ink jet head and the substrate so that at least a part of each group can scan the same portion of the substrate in the main scanning direction. Is sub-scanned with respect to the other.
[0023]
(3) Next, a method for manufacturing a liquid crystal device according to the present invention is a method for manufacturing a liquid crystal device having a pair of substrates that sandwich a liquid crystal and a color filter in which a plurality of filter elements are arranged on at least one substrate. An inkjet head having a nozzle row in which a plurality of nozzles are arranged in a row, the nozzle row being divided into a plurality of groups, and one of the substrates with respect to the other A step of moving in a scanning direction, a step of selectively discharging a filter material from the plurality of nozzles to form the filter element on the substrate, and at least a part of each of the groups includes the same portion of the substrate. And a step of sub-scanning one of the inkjet head and the substrate with respect to the other so as to be able to scan in the main scanning direction.
.
[0024]
(4) Next, an apparatus for manufacturing a liquid crystal device according to the present invention manufactures a liquid crystal device having a pair of substrates that sandwich liquid crystal and a color filter in which a plurality of filter elements are arranged on at least one substrate. In the apparatus, an ink jet head having a nozzle array in which a plurality of nozzles are arranged in a line, the nozzle array being divided into a plurality of groups, and an ink supply means for supplying a filter material to the ink jet head; Main scanning driving means for moving one of the ink jet head and the substrate in the main scanning direction with respect to the other, and sub scanning for moving one of the ink jet head and the substrate in the sub scanning direction with respect to the other. Control of the operation of the driving means, the nozzle ejection control means for controlling the ejection of ink from the plurality of nozzles, and the main scanning driving means Main scanning control means and sub-scanning control means for controlling the operation of the sub-scan driving means, so that at least a part of each group can scan the same part of the substrate in the main scanning direction. One of the inkjet head and the substrate is sub-scanned with respect to the other. An apparatus for manufacturing a liquid crystal device.
[0025]
(5) Next, an EL device manufacturing method according to the present invention is an EL device manufacturing method in which a plurality of pixel pixels each including an EL light emitting layer are arranged on a substrate. An inkjet head in which the nozzle row is divided into n groups, and one of the substrates is moved in the main scanning direction with respect to the other while the plurality of the plurality of nozzle rows are arranged in the main scanning direction. A step A of selectively discharging an EL light emitting material from a nozzle to form the EL light emitting layer on the substrate; and a step B of sub-scanning one of the inkjet head and the substrate with respect to the other. Each of the pixel pixels is formed in n times of the process A, and in the formation of each of the pixel pixels, the nozzles that discharge in each of the processes A are different from each other. Characterized in that it belongs to the flop.
[0026]
(6) Next, an EL device manufacturing apparatus according to the present invention is an EL device manufacturing apparatus in which a plurality of pixel pixels each including an EL light emitting layer are arranged on a substrate. An ink jet head in which the nozzle row is divided into a plurality of groups, an ink supply means for supplying an EL light emitting material to the ink jet head, and a plurality of nozzles arranged in a row An inkjet head in which the nozzle array is divided into a plurality of groups, ink supply means for supplying the EL light emitting material to the inkjet head, and the inkjet head and the substrate. A main scanning driving means for moving one of the ink jet head in the main scanning direction, and one of the ink jet head and the substrate with respect to the other; Sub-scanning driving means for moving in the scanning direction, nozzle ejection control means for controlling ejection of ink from the plurality of nozzles, main scanning control means for controlling the operation of the main scanning driving means, and the sub-scanning driving means Sub-scanning control means for controlling the operation of the inkjet head and one of the inkjet head and the substrate so that at least a part of each group can scan the same portion of the substrate in the main scanning direction. Sub-scanning is performed on the other side.
[0027]
(7) Next, an ink jet head control apparatus according to the present invention includes a plurality of nozzles arranged in a line in the ink jet head control apparatus used in manufacturing an optical member formed by arranging a plurality of color patterns on a substrate. An ink jet head having a nozzle array arranged in a shape and divided into a plurality of groups, an ink supply means for supplying a filter material to the ink jet head, and the ink jet head and the substrate Main scanning driving means for moving one of the ink jet head in the main scanning direction, sub scanning driving means for moving one of the inkjet head and the substrate in the sub scanning direction, and the plurality of nozzles Nozzle ejection control means for controlling ink ejection from the main scanning control means, main scanning control means for controlling the operation of the main scanning driving means, Sub-scanning control means for controlling the operation of the sub-scanning driving means, and at least a part of each of the groups can scan the same part of the substrate in the main scanning direction of the inkjet head and the substrate. One of them is sub-scanned with respect to the other.
[0028]
In the ink jet head control apparatus having the above-described configuration, the “optical member” may be a color filter, an EL device or the like. When a color filter is considered as an optical member, R, G, and B filter elements correspond to the “color pattern”. When an EL device is considered as an optical member, R, G, and B light emitting layers, hole injection layers, and the like correspond to “color patterns”.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
A color filter manufacturing method and an embodiment of the manufacturing apparatus will be described below. First, prior to explaining these production methods and production apparatuses, color filters produced using those production methods and the like will be explained. FIG. 5A schematically shows a planar structure of an embodiment of the color filter. FIG. 6D shows a cross-sectional structure according to the VI-VI line of FIG.
[0030]
The color filter 1 of the present embodiment has a plurality of filter elements 3 formed in a dot pattern, in the present embodiment in the form of a dot matrix, on the surface of a rectangular substrate 2 formed of glass, plastic, or the like. As shown to d), it forms by laminating | stacking the protective film 4 on it. FIG. 5A shows the color filter 1 in a state where the protective film 4 is removed in a plan view.
[0031]
The filter element 3 is formed by filling a plurality of rectangular regions, which are partitioned by partition walls 6 formed in a lattice pattern with a resin material having no translucency and arranged in a dot matrix, with a color material. Each of these filter elements 3 is formed of a color material of any one color of R (red), G (green), and B (blue), and each color filter element 3 is arranged in a predetermined arrangement. Are listed. As this arrangement, for example, a stripe arrangement shown in FIG. 7A, a mosaic arrangement shown in FIG. 7B, a delta arrangement shown in FIG. 7C, and the like are known.
[0032]
The stripe arrangement is a color scheme in which all columns of the matrix are the same color. The mosaic arrangement is a color scheme in which any three filter elements arranged on a vertical and horizontal straight line have three colors of R, G, and B. The delta arrangement is a color arrangement in which the filter elements are arranged in different stages, and any three adjacent filter elements are R, G, and B colors.
[0033]
The size of the color filter 1 is, for example, 1.8 inches. The size of one filter element 3 is, for example, 30 μm × 100 μm. Moreover, the space | interval between each filter element 3, so-called element pitch is 75 micrometers, for example.
[0034]
When the color filter 1 of the present embodiment is used as an optical element for full-color display, one pixel is formed by using R, G, B3 filter elements 3 as one unit, and R, G in one pixel is formed. , B, or a combination thereof, by selectively passing light, a full color display is performed. At this time, the partition 6 formed of a resin material having no translucency functions as a black matrix.
[0035]
For example, the color filter 1 is cut out from a mother substrate 12 having a large area as shown in FIG. Specifically, first, a pattern for one color filter 1 is formed on the surface of each of the plurality of color filter forming regions 11 set in the mother substrate 12, and the surroundings of these color filter forming regions 11 are further formed. By forming grooves for cutting, and further cutting the mother substrate 12 along these grooves, individual color filters 1 are formed.
[0036]
Hereinafter, a manufacturing method and a manufacturing apparatus for manufacturing the color filter 1 shown in FIG.
[0037]
FIG. 6 schematically shows a method for manufacturing the color filter 1 in the order of steps. First, the partition walls 6 are formed on the surface of the mother substrate 12 in a lattice pattern as viewed from the direction of the arrow B with a resin material having no translucency. The lattice hole portion 7 of the lattice pattern is a region where the filter element 3 is formed, that is, a filter element region. The planar dimensions of the individual filter element regions 7 formed by the partition walls 6 when viewed from the direction of the arrow B are, for example, about 30 μm × 100 μm.
[0038]
The partition wall 6 has a function of blocking the flow of the filter element material supplied to the filter element region 7 and a function of a black matrix. Moreover, the partition 6 is formed by arbitrary patterning methods, for example, a photolithography method, and is further heated and baked with a heater as needed.
[0039]
After the partition wall 6 is formed, each filter element region 7 is filled with the filter element material 13 by supplying droplets 8 of the filter element material to each filter element region 7 as shown in FIG. In FIG. 6B, reference numeral 13R indicates a filter element material having a color of R (red), reference numeral 13G indicates a filter element material having a color of G (green), and reference numeral 13B indicates a filter element material of B (blue). A filter element material having a color is shown.
[0040]
When each filter element region 7 is filled with a predetermined amount of filter element material, the mother substrate 12 is heated to, for example, about 70 ° C. by a heater to evaporate the solvent of the filter element material. By this evaporation, the volume of the filter element material 13 is reduced and flattened as shown in FIG. When the volume is drastically reduced, the supply of droplets of the filter element material and the heating of the droplets are repeated until a sufficient film thickness is obtained for the color filter. As a result of the above processing, only the solid content of the filter element material remains to form a film, whereby the desired color filter elements 3 are formed.
[0041]
After the filter element 3 is formed as described above, a heat treatment is performed at a predetermined temperature for a predetermined time in order to completely dry the filaments 3. Thereafter, the protective film 4 is formed using an appropriate method such as a spin coating method, a roll coating method, a ripping method, or an ink jet method. The protective film 4 is formed for protecting the filter element 3 and the like and for flattening the surface of the color filter 1.
[0042]
FIG. 8 shows an embodiment of an ink jet apparatus for performing the supply process of the filter element material shown in FIG. The ink jet device 16 uses one of R, G, and B, for example, R color filter element material as ink droplets in each color filter forming region 11 in the mother substrate 12 (see FIG. 5B). It is an apparatus for discharging and adhering to a predetermined position. Ink jet apparatuses for the G color filter element material and the B color filter element material are also prepared for each. However, since the structures thereof can be the same as those in FIG. 8, description thereof will be omitted. .
[0043]
In FIG. 8, the inkjet device 16 includes a head unit 26 including an inkjet head 22, a head position control device 17 that controls the position of the inkjet head 22, a substrate position control device 18 that controls the position of the mother substrate 12, and A main scanning drive device 19 that moves the ink jet head 22 relative to the mother substrate 12, a sub scanning drive device 21 that moves the ink jet head 22 relative to the mother substrate 12, and the mother substrate 12 within the ink jet device 16. A substrate supply device 23 that supplies the substrate to a predetermined work position, and a control device 24 that controls the entire inkjet device 16.
[0044]
The head position control device 17, the substrate position control device 18, the main scanning drive device 19 that moves the inkjet head 22 relative to the mother substrate 12 in the main scanning, and the sub scanning drive device 21 are installed on the base 9. . Each of these devices is covered with a cover 14 as necessary.
[0045]
As shown in FIG. 10, for example, the inkjet head 22 has a nozzle row 28 formed by arranging a plurality of nozzles 27 in a row. The number of nozzles 27 is, for example, 180, the hole diameter of the nozzles 27 is, for example, 28 μm, and the nozzle pitch between the nozzles 27 is, for example, 141 μm. 5A and 5B, the main scanning direction x and the sub-scanning direction Y perpendicular to the color filter 1 and the mother substrate 12 are set as shown in FIG.
[0046]
The inkjet head 22 is positioned so that the nozzle row 28 extends in a direction crossing the main scanning direction x, and filter element material as ink is ejected from the plurality of nozzles 27 while moving in parallel in the main scanning direction x. By selectively discharging, the filter element material is adhered to a predetermined position in the mother substrate 12 (see FIG. 5B). Further, the ink jet head 22 can move the main scanning position by the ink jet head 22 at a predetermined interval by moving in parallel in the sub-scanning direction Y by a predetermined distance.
[0047]
The inkjet head 22 has, for example, an internal structure shown in FIGS. 12 (a) and 12 (b). Specifically, the inkjet head 22 includes, for example, a stainless steel nozzle plate 29, a diaphragm 31 facing the nozzle plate 29, and a plurality of partition members 32 that join them together. A plurality of ink chambers 33 and liquid reservoirs 34 are formed between the nozzle plate 29 and the vibration plate 31 by the partition member 32. The plurality of ink chambers 33 and the liquid reservoir 34 communicate with each other through a passage 38.
[0048]
An ink supply hole 36 is formed at an appropriate position of the vibration plate 31, and an ink supply device 37 is connected to the ink supply hole 36. The ink supply device 37 supplies one of R, G, and B, for example, R color filter element material M to the ink supply hole 36. The supplied filter element material M fills the liquid reservoir 34, and further fills the ink chamber 33 through the passage 38.
[0049]
The nozzle plate 29 is provided with a nozzle 27 for ejecting the filter element material M from the ink chamber 33 in the form of a jet. An ink pressurizing member 39 is attached to the back surface of the vibration plate 31 on which the ink chamber 33 is formed so as to correspond to the ink chamber 33. As shown in FIG. 12B, the ink pressurizing body 39 includes a piezoelectric element 41 and a pair of electrodes 42a and 42b that sandwich the piezoelectric element 41. The piezoelectric element 41 is bent and deformed so as to protrude outwardly as indicated by an arrow C by energization of the electrodes 42a and 42b, thereby increasing the volume of the ink chamber 33. Then, the filter element material M corresponding to the increased volume flows from the liquid reservoir 34 through the passage 38 into the ink chamber 33.
[0050]
Next, when energization to the piezoelectric element 41 is released, both the piezoelectric element 41 and the diaphragm 31 return to their original shapes. As a result, the ink chamber 33 also returns to its original volume, so that the pressure of the filter element material M inside the ink chamber 33 rises, and the filter element material is directed from the nozzle 27 toward the mother substrate 12 (see FIG. 5B). M is ejected as droplets 8. In addition, an ink repellent layer 43 made of, for example, a Ni-tetrafluoroethylene eutectoid plating layer is provided in the peripheral portion of the nozzle 27 in order to prevent the flight of the droplet 8 and the clogging of the nozzle 27.
[0051]
In FIG. 9, the head position control device 17 includes an α motor 44 that rotates the inkjet head 22 in-plane, a β motor 46 that swings and rotates the inkjet head 22 about an axis parallel to the sub-scanning direction Y, and the inkjet head 22. Has a γ motor 47 that swings and rotates around an axis parallel to the main scanning direction, and a Z motor 48 that translates the inkjet head 22 in the vertical direction.
[0052]
The substrate position control device 18 shown in FIG. 8 includes a table 49 on which the mother substrate 12 is placed and a θ motor 51 that rotates the table 49 in-plane as indicated by an arrow θ in FIG. Further, as shown in FIG. 9, the main scanning drive device 19 shown in FIG. 8 includes a guide rail 52 extending in the main scanning direction x and a slider 53 incorporating a pulse-driven linear motor. The slider 53 translates in the main scanning direction along the guide rail 52 when the built-in linear motor operates.
[0053]
Further, as shown in FIG. 9, the sub-scanning drive device 21 shown in FIG. 8 has a guide rail 54 extending in the sub-scanning direction Y and a slider 56 incorporating a pulse-driven linear motor. The slider 56 translates in the sub-scanning direction Y along the guide rail 54 when the built-in linear motor operates.
[0054]
The linear motor that is pulse-driven in the slider 53 and the slider 56 can finely control the rotation angle of the output shaft by the pulse signal supplied to the motor. Therefore, the main part of the ink jet head 22 supported by the slider 53 can be controlled. The position in the scanning direction x and the position in the sub-scanning direction Y of the table 49 can be controlled with high definition. The position control of the inkjet head 22 and the table 49 is not limited to the position control using the pulse motor, and can be realized by feedback control using a servo motor or any other control method.
[0055]
The substrate supply device 23 illustrated in FIG. 8 includes a substrate storage unit 57 that stores the mother substrate 12 and a robot 58 that transports the mother substrate 12. The robot 58 includes a base 59 placed on an installation surface such as a floor and the ground, a lift shaft 61 that moves up and down relative to the base 59, a first arm 62 that rotates about the lift shaft 61, and a first arm. The second arm 63 rotates with respect to 62, and the suction pad 64 provided on the lower surface of the tip of the second arm 63. The suction pad 64 can suck the mother substrate 12 by air suction or the like.
[0056]
In FIG. 8, a capping device 76 and a cleaning device 77 are disposed under the trajectory of the inkjet head 22 that is driven by the main scanning driving device 19 and moves in the main scanning direction, at one side position of the sub-scanning driving device 21. . An electronic balance 78 is disposed at the other side position. The cleaning device 77 is a device for cleaning the inkjet head 22. The electronic balance 78 is a device that measures the weight of ink droplets discharged from the individual nozzles 27 (see FIG. 10) in the inkjet head 22 for each nozzle. The capping device 76 is a device for preventing the nozzle 27 (see FIG. 10) from drying when the inkjet head 22 is in a standby state.
[0057]
A head camera 81 is disposed in the vicinity of the inkjet head 22 so as to move together with the inkjet head 22. A substrate camera 82 supported by a support device (not shown) provided on the base 9 is disposed at a position where the mother substrate 12 can be photographed.
[0058]
The control device 24 shown in FIG. 8 has a computer main body 66 containing a processor, a keyboard 67 as an input device, and a CRT (Cathode Ray Tube) display 68 as a display device. As shown in FIG. 14, the processor includes a CPU (Central Processing Unit) 69 that performs arithmetic processing, and a memory that stores various types of information, that is, an information storage medium 71.
[0059]
The head position control device 17, the substrate position control device 18, the main scanning drive device 19, the sub-scanning drive device 21, and the piezoelectric element 41 (see FIG. 12B) in the inkjet head 22 shown in FIG. 8 are driven. Each device of the head drive circuit 72 is connected to the CPU 69 via the input / output interface 73 and the bus 74 in FIG. The substrate supply device 23, the input device 67, the display 68, the electronic balance 78, the cleaning device 77, and the capping device 76 are also connected to the CPU 69 through the input / output interface 73 and the bus 74.
[0060]
The memory 71 is a concept including a semiconductor memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), an external storage device such as a hard disk, a CD-ROM reader, a disk-type storage medium, and the like. Is a storage area for storing program software in which the control procedure of the operation of the inkjet device 16 is described, or one of R, G, and B for realizing the various R, G, and B arrangements shown in FIG. A storage area for storing the ejection position in the mother substrate 12 (see FIG. 5) as coordinate data, a storage area for storing the sub-scanning movement amount of the mother substrate 12 in the sub-scanning direction Y in FIG. A work area for the CPU 69, an area functioning as a temporary file, and other various storage areas are set.
[0061]
The CPU 69 performs control for discharging ink, that is, a filter element material, to a predetermined position on the surface of the mother substrate 12 in accordance with the program software stored in the memory 71. A weight calculation operation for performing a weight measurement using the electronic balance 78 (see FIG. 8), a cleaning calculation unit for performing a calculation for realizing the processing, a capping calculation unit for realizing the capping process And a drawing calculation unit that performs calculation for drawing the filter element material by inkjet.
[0062]
If the drawing calculation unit is divided in detail, a drawing start position calculation unit for setting the inkjet head 22 to an initial position for drawing, and a control for scanning and moving the inkjet head 22 in the main scanning direction x at a predetermined speed. A main scanning control calculating unit that calculates the control, a sub-scanning control calculating unit that calculates control for shifting the mother substrate 12 in the sub-scanning direction Y by a predetermined sub-scanning amount, and a plurality of nozzles in the inkjet head 22 27 includes various function calculation units such as a nozzle discharge control calculation unit that performs calculation for controlling which of the nozzles 27 is operated to discharge ink, that is, the filter element material.
[0063]
In the present embodiment, each of the above functions is realized by software using the CPU 69. However, when each of the above functions can be realized by a single electronic circuit not using the CPU, such electronic It is also possible to use a circuit.
[0064]
Hereinafter, the operation of the ink jet apparatus 16 having the above-described configuration will be described with reference to the flowchart shown in FIG.
[0065]
When the ink jet device 16 is activated by power-on by the operator, first, initial setting is executed in step S1. Specifically, the head unit 26, the substrate supply device 23, the control device 24, and the like are set in a predetermined initial state.
[0066]
Next, when the weight measurement timing arrives (YES in step S2), the head unit 26 in FIG. 9 is moved to the electronic balance 78 in FIG. 8 by the main scanning drive device 19 (step S3). The amount of ink ejected is measured using the electronic balance 78 (step S4). Then, ink ejection from the nozzle 27
In accordance with the characteristics, the voltage applied to the piezoelectric element 41 corresponding to each nozzle 27 is adjusted (step S5).
[0067]
Next, when the cleaning timing comes (YES in step S6), the head unit 26 is moved to the cleaning device 77 by the main scanning drive device 19 (step S7), and the inkjet head 22 is cleaned by the cleaning device 77. (Step S8).
[0068]
When the weight measurement timing and the cleaning timing do not arrive (NO in steps S2 and S6), or when these processes are completed, in step S9, the substrate supply device 23 of FIG. 49. Specifically, the mother substrate 12 in the substrate housing portion 57 is sucked and held by the suction pad 64, and then the lifting shaft 61, the first arm 62, and the second arm 63 are moved to move the mother substrate 12 to the table 49. Then, it is pressed against a positioning pin 50 (FIG. 9) provided in advance at an appropriate position of the table 49. In order to prevent displacement of the mother substrate 12 on the table 49, it is desirable to fix the mother substrate 12 to the table 49 by means such as air suction.
[0069]
Next, while observing the mother board 12 with the board camera 82 in FIG. 8, the output shaft of the θ motor 51 in FIG. 9 is rotated in minute angle units to rotate the table 49 in-plane in minute angle units, thereby the mother. The substrate 12 is positioned (step S10). Next, the position at which drawing is started by the inkjet head 22 is determined by calculation while observing the mother substrate 12 by the head camera 81 of FIG. 8 (step S11), and the main scanning driving device 19 and the sub scanning driving device 21 are then determined. Is appropriately operated to move the inkjet head 22 to the drawing start position (step S12).
[0070]
At this time, the inkjet head 22 is disposed such that the nozzle row 28 is inclined at an angle θ with respect to the sub-scanning direction Y of the inkjet head 22, as shown in the position (a) of FIG. This is because, in the case of a normal ink jet apparatus, an inter-nozzle pitch that is an interval between adjacent nozzles 27 and an element pitch that is an interval between adjacent filter elements 3, that is, filter element forming regions 7, are different. This is a measure for making the dimensional component in the sub-scanning direction Y of the inter-nozzle pitch geometrically equal to the element pitch when the inkjet head 22 is moved in the main scanning direction x.
[0071]
When the inkjet head 22 is placed at the drawing start position in step S12 of FIG. 15, the inkjet head 22 is placed at the position (a) in FIG. Thereafter, main scanning in the main scanning direction x is started in step S13 in FIG. 15, and ink ejection is simultaneously started. Specifically, the main scanning drive device 19 of FIG. 9 operates to cause the inkjet head 22 to linearly scan and move at a constant speed in the main scanning direction x of FIG. When the nozzle 27 corresponding to the element region 7 arrives, ink, that is, the filter element material is discharged from the nozzle 27.
[0072]
The ink discharge amount at this time is not an amount that fills the entire volume of the filter element region 7, but is a fraction of the total amount, that is, a quarter of the total amount in this embodiment. This is because, as will be described later, each filter element region 7 is not filled by one ink discharge from the nozzle 27, but by four times of ink discharge multiple discharge, in this embodiment four times of overlap discharge. This is because the entire volume is to be filled by the above.
[0073]
When the main scanning for one line with respect to the mother substrate 12 is completed (YES in step S14), the inkjet head 22 is reversed and returned to the initial position (a) (step S15). Further, the inkjet head 22 is driven by the sub-scanning drive device 21 and moves in the sub-scanning direction Y by a predetermined sub-scanning amount δ (step S16).
[0074]
In the present embodiment, the CPU 69 conceptually divides the plurality of nozzles 27 forming the nozzle row 28 of the inkjet head 22 into a plurality of groups n in FIG. In the present embodiment, n = 4, that is, a nozzle row 28 having a length L composed of 180 nozzles 27 is divided into four groups. Accordingly, one nozzle group is determined to have a length L / n including 180/4 = 45 nozzles 27, that is, L / 4. The sub-scanning amount δ is set to the length in the sub-scanning direction of the nozzle group length L / 4, that is, (L / 4) cos θ.
[0075]
Accordingly, the inkjet head 22 that has returned to the initial position (a) after completion of the main scanning for one line moves in parallel in the sub-scanning direction Y by the distance δ in FIG. 1 and moves to the position (b). In FIG. 1, the position (a) and the position (b) are drawn with a slight shift with respect to the main scanning direction x, but this is a measure for making the explanation easy to understand. ) And position (b) are the same position in the main scanning direction x.
[0076]
The inkjet head 22 that has been sub-scanned to the position (b) repeats the main scanning movement and the ink ejection in step S13. During this main scanning movement, the second line in the color filter formation region 11 on the mother substrate 12 is first ejected by the first nozzle group, and the first line is formed by the second nozzle group from the top. A second ink discharge is received.
[0077]
Thereafter, the inkjet head 22 repeats the main scanning movement and the ink ejection while repeating the sub-scanning movement from the position (c) to the position (k) (step S13 to step S16), thereby the color of the mother substrate 12 is changed. The ink adhesion process for one row in the filter formation region 11 is completed. In this embodiment, since the nozzle row 28 is divided into four groups and the sub-scanning amount δ is determined, when the main scanning and the sub-scanning for one column of the color filter forming region 11 are finished, each filter element region 7 receives a total of four ink ejection processes, one by each of the four nozzle groups, so that a predetermined amount of ink, that is, the filter element material is supplied in its entire volume.
[0078]
When the ink ejection for one column in the color filter forming region 11 is completed in this way, the ink jet head 22 is driven by the sub-scan driving means 21 and conveyed to the initial position of the color filter forming region 11 in the next column (step S19). Filter elements are formed in the filter element formation region 7 by repeating main scanning, sub-scanning, and ink ejection with respect to the color filter formation region 11 of the row (steps S13 to S16).
[0079]
Thereafter, when filter elements 3 of one color of R, G, and B, for example, R1 color, are formed for all the color filter forming regions 11 in the mother substrate 12 (YES in step S18), the mother substrate 12 is changed in step S20. The processed mother substrate 12 is discharged to the outside by the substrate supply device 23 or by another transport device. After that, unless the operator gives an instruction to end the processing (NO in step S21), the process returns to step S2 to repeat the ink ejection operation for the R1 color on another mother board 12.
[0080]
When the operator gives an instruction to end the operation (YES in step S21), the CPU 69 conveys the inkjet head 22 to the capping device 76 in FIG. 8, and performs capping processing on the inkjet head 22 by the capping device 76. (Step S22).
[0081]
Thus, the patterning for the first color, for example, R color, of the R, G, B colors constituting the color filter is completed, and then the mother substrate 12 is moved to the second color for R, G, B, for example, G color. To the ink jet device 16 using the filter element material to perform G color patterning, and finally to the ink jet device 16 using the R, G, B third color, for example, B color, as the filter element material. B color patterning is performed. Thus, the mother substrate 12 on which a plurality of color filters 1 (FIG. 5A) having a desired R, G, B dot arrangement such as a stripe arrangement is formed is manufactured. By cutting this mother substrate 12 for each color filter region 11, a plurality of one color filter 1 are cut out.
[0082]
If the color filter 1 is used for color display of a liquid crystal device, an electrode, an alignment film, and the like are further laminated on the surface of the color filter 1. In such a case, if the mother substrate 12 is cut and the individual color filters 1 are cut out before laminating the electrodes, alignment films, and the like, the subsequent formation process of the electrodes and the like becomes very troublesome. Therefore, in such a case, the mother substrate 12 is not cut immediately after the color filter 1 is completed on the mother substrate 12, but necessary additional steps such as electrode formation and alignment film formation are completed. It is desirable to cut the mother substrate 12 later.
[0083]
As described above, according to the method and apparatus for manufacturing a color filter according to this embodiment, each filter element 3 in the color filter 1 shown in FIG. 5A is one of the inkjet head 22 (see FIG. 1). Rather than being formed by the main scanning x times, each one filter element 3 is subjected to ink ejection n times by a plurality of nozzles 27 belonging to different nozzle groups, four times in this embodiment. A predetermined film thickness is formed. For this reason, even if there is a variation in the amount of ink ejected between the plurality of nozzles 27, it is possible to prevent the variation in film thickness between the plurality of filter elements 3, and therefore, the light transmission characteristics of the color filter can be reduced. Can be made uniform.
[0084]
Of course, in the manufacturing method of the present embodiment, the filter element 3 is formed by ink ejection using the inkjet head 22, so that it is not necessary to go through complicated steps as in the method using the photolithography method, and the material is wasted. There is nothing to do.
[0085]
By the way, as described with reference to FIG. 23A, the distribution of the ink discharge amount of the plurality of nozzles 27 forming the nozzle row 28 of the inkjet head 22 becomes non-uniform. In addition, as described above, the number of nozzles 27 present at both ends of the nozzle row 28, for example, ten nozzles on one end side, particularly increases the ink discharge amount. Thus, it is not preferable to use a nozzle having a particularly large amount of ink ejection compared to other nozzles in terms of making the ink discharge film, that is, the filter element, uniform in film thickness.
[0086]
Therefore, desirably, as shown in FIG. 13, among a plurality of nozzles 27 forming the nozzle row 28, several, for example, about 10 existing at both ends E of the nozzle row 28 are set not to eject ink in advance. In addition, it is preferable to divide the nozzles 27 existing in the remaining portion F into a plurality of, for example, four groups and perform sub-scanning movement in units of the nozzle groups.
[0087]
In the first embodiment, a resin material that does not transmit light is used as the partition wall 6, but a light-transmitting resin material may be used as the partition wall 6. In that case, a black mask may be provided by separately providing a light-shielding metal film or a resin material at a position corresponding to the space between the filter elements, for example, above the partition wall 6 or below the partition wall 6. Alternatively, the partition wall 6 may be formed using a light-transmitting resin material and the black mask may not be provided.
[0088]
In the first embodiment, R, G, and B are used as filter elements. For example, C (cyan), M (magenta), or Y (yellow) may be adopted. In that case, instead of R, G, and B filter element materials, filter element materials having colors of C, M, and Y may be used.
[0089]
In the first embodiment, the partition walls 6 are formed by photolithography. However, the partition walls 6 can also be formed by an inkjet method in the same manner as the color filter.
[0090]
(Second Embodiment)
FIG. 2 shows an ink or filter for each filter element forming region 7 in the color filter forming region 11 in the mother substrate 12 using the ink jet head 22 according to another embodiment of the color filter manufacturing method and manufacturing apparatus according to the present invention. The case where an element material is supplied by discharge is schematically shown.
[0091]
The schematic steps performed by this embodiment are the same as those shown in FIG. 6, and the ink jet apparatus used for ink ejection is mechanically the same as the apparatus shown in FIG. Further, the CPU 69 in FIG. 14 conceptually groups the plurality of nozzles 27 forming the nozzle row 28 into n, for example, four groups, and corresponds to the length L / n or L / 4 of each nozzle group. The determination of the sub-scanning amount δ is the same as in the case of FIG.
[0092]
The difference between the present embodiment and the previous embodiment shown in FIG. 1 is that the program software stored in the memory 71 in FIG. 14 is modified. This is a modification of the sub-scanning control calculation.
[0093]
More specifically, in FIG. 2, the inkjet head 22 does not return to the initial position after the end of the scanning movement in the main scanning direction x, but immediately after the end of the main scanning movement in one direction. After moving to a position (b) by moving by a movement amount δ corresponding to one nozzle group, the sub-scan from the initial position (a) is performed by scanning in the direction opposite to the main scanning direction × 1 direction. Control is performed so as to return to the position (b ′) shifted by the distance δ in the direction. Ink is selectively discharged from the plurality of nozzles 27 in both periods during the main scanning from the position (a) to the position (b) and during the main scanning movement from the position (b) to the position (b ′). Of course, it is discharged.
[0094]
In other words, in the present embodiment, the main scanning and the sub scanning of the inkjet head 22 are alternately performed continuously without interposing the return operation, thereby omitting the time spent for the return operation. Work time can be shortened.
[0095]
(Third embodiment)
FIG. 3 shows an ink or filter for each filter element formation region 7 in the color filter formation region 11 in the mother substrate 12 using the inkjet head 22 according to another embodiment of the color filter manufacturing method and manufacturing apparatus according to the present invention. The case where an element material is supplied by discharge is schematically shown.
[0096]
The schematic steps performed by this embodiment are the same as those shown in FIG. 6, and the ink jet apparatus used for ink ejection is mechanically the same as the apparatus shown in FIG. In addition, the CPU 69 in FIG. 14 conceptually groups the plurality of nozzles 27 forming the nozzle row 28 into n, for example, four, as in the case of FIG.
[0097]
This embodiment differs from the previous embodiment shown in FIG. 1 in that when the inkjet head 22 is set at the drawing start position of the mother substrate 12 in step S12 of FIG. ) As shown in the position, the extending direction of the nozzle row 28 is parallel to the sub-scanning direction Y. Such an arrangement structure of nozzles is an advantageous structure when the pitch between nozzles related to the inkjet head 22 is equal to the pitch between elements related to the mother substrate 12.
[0098]
Also in this embodiment, the inkjet head 22 moves from the initial position (a) to the terminal position (k) in the scanning movement in the main scanning direction x, the return movement to the initial position, and the movement amount δ in the sub-scanning direction Y. The ink, that is, the filter element material is selectively ejected from the plurality of nozzles 27 during the main scanning movement period while repeating the sub-scanning movement in this manner, and thereby the filter elements in the color filter forming region 11 in the mother substrate 12 A filter element material is deposited in the forming area 7.
[0099]
In this embodiment, since the nozzle row 28 is set parallel to the sub-scanning direction Y, the sub-scan movement amount δ is set equal to the length L / n of the divided nozzle groups, that is, L / 4. Is done.
[0100]
(Fourth embodiment)
FIG. 4 shows an ink or filter for each filter element forming region 7 in the color filter forming region 11 in the mother substrate 12 using the inkjet head 22 according to another embodiment of the color filter manufacturing method and manufacturing apparatus according to the present invention. The case where an element material is supplied by discharge is schematically shown.
[0101]
The schematic steps performed by this embodiment are the same as those shown in FIG. 6, and the ink jet apparatus used for ink ejection is mechanically the same as the apparatus shown in FIG. Further, the CPU 69 in FIG. 14 conceptually groups the plurality of nozzles 27 forming the nozzle row 28 into n groups, for example, four groups, as in FIG.
[0102]
This embodiment differs from the previous embodiment shown in FIG. 1 in that when the ink jet head 22 is set at the drawing start position of the mother substrate 12 in step S12 of FIG. 15, the ink jet head 22 is shown in FIG. As shown in FIG. 2, the direction in which the nozzle row 28 extends is parallel to the sub-scanning direction Y, and the main scanning and sub-scanning of the inkjet head 22 are continuous without interposing the return operation, as in the embodiment of FIG. The points are alternately performed.
[0103]
In the present embodiment shown in FIG. 4 and the previous embodiment shown in FIG. 3, the main scanning direction x is a direction perpendicular to the nozzle row 28, so that the nozzle row 28 is main-scanned as shown in FIG. By providing two rows along the direction x, the filter element material can be supplied to one filter element region 7 by the two nozzles 27 mounted on the same main scanning line.
[0104]
(Fifth embodiment)
FIG. 16 shows an inkjet head 22A used in still another embodiment of the color filter manufacturing method and manufacturing apparatus according to the present invention. The ink jet head 22A differs from the ink jet head 22 shown in FIG. 10 in that there are three nozzle rows 28R for discharging R color ink, nozzle row 28G for discharging G color ink, and nozzle row 28B for discharging B color ink. Various types of nozzle rows are formed on one inkjet head 22A, and each of these three types is provided with the ink ejection system shown in FIGS. 12A and 12B, and ink corresponding to the R color nozzle row 28R. The R ink supply device 37R is connected to the discharge system, the G ink supply device 37G is connected to the ink discharge system corresponding to the G color nozzle row 28G, and the B ink is supplied to the ink discharge system corresponding to the B color nozzle row 28B. That is, the ink supply device 37B is connected.
[0105]
The schematic steps performed by this embodiment are the same as those shown in FIG. 6, and the ink jet apparatus used for ink ejection is basically the same as the apparatus shown in FIG. Further, the CPU 69 in FIG. 14 conceptually groups the plurality of nozzles 27 forming the nozzle rows 28R, 28G, and 28B into n groups, for example, four groups, and moves the inkjet head 22A by sub-scanning for each nozzle group. The sub-scanning movement by the amount δ is the same as in the case of FIG.
[0106]
In the embodiment shown in FIG. 1, since only one type of nozzle row 28 is provided in the inkjet head 22, when forming a color filter with R, G, B3 colors, the inkjet head shown in FIG. 22 had to be prepared for each of the three colors R, G and B. On the other hand, when the inkjet head 22A having the structure shown in FIG. 16 is used, the three colors R, G, and B are simultaneously applied to the mother substrate 12 by one main scanning in the main scanning direction x of the inkjet head 22A. Since only one inkjet head 22 can be prepared, it is sufficient. In addition, by matching the nozzle row spacing of each color with the pitch of the filter element region of the mother substrate, it is possible to simultaneously strike three colors of RGB.
[0107]
(Sixth embodiment)
FIG. 17 shows an embodiment of a method for manufacturing a liquid crystal device according to the present invention. FIG. 18 shows an embodiment of a liquid crystal device manufactured by the manufacturing method. FIG. 19 shows a cross-sectional structure of the liquid crystal device according to the line I × −I × in FIG. Prior to the description of the manufacturing method and the manufacturing apparatus of the liquid crystal device, first, an example of the liquid crystal device manufactured by the manufacturing method will be described. Note that the liquid crystal device of this embodiment is a transflective liquid crystal device that performs full-color display using a simple matrix method.
[0108]
In FIG. 18, a liquid crystal device 101 is mounted with liquid crystal driving ICs 103a and 103b as semiconductor chips on a liquid crystal panel 102, an FPC (Flexible Printed Circuit) 104 as a wiring connecting element is connected to the liquid crystal panel 102, and a liquid crystal
It is formed by providing a lighting device 106 as a backlight on the back side of the panel 102.
[0109]
The liquid crystal panel 102 is formed by bonding the first substrate 107 a and the second substrate 107 b with the sealant 108. The sealing material 108 is formed, for example, by attaching an epoxy resin to the inner surface of the first substrate 107a or the second substrate 107b in an annular manner by screen printing or the like. Further, as shown in FIG. 19, a conductive material 109 formed in a spherical shape or a cylindrical shape by a conductive material is included in the seal material 108 in a dispersed state.
[0110]
In FIG. 19, the first substrate 107a has a plate-like base material 111a formed of transparent glass, transparent plastic, or the like. A reflective film 112 is formed on the inner surface (upper surface in FIG. 19) of the substrate 111a, an insulating film 113 is laminated thereon, and the first electrode 114a is striped when viewed from the direction of arrow D (see FIG. 19). 18), and an alignment film 116a is further formed thereon. Further, a polarizing plate 117a is attached to the outer surface (the lower surface in FIG. 19) of the substrate 111a by sticking or the like.
[0111]
In FIG. 18, in order to show the arrangement of the first electrodes 114a in an easy-to-understand manner, the stripe interval is drawn so as to be much wider than the actual, and thus the number of the first electrodes 114a is shown to be small. A larger number of first electrodes 114a are formed on the substrate 111a.
[0112]
In FIG. 19, the second substrate 107b has a plate-like base material 111b formed of transparent glass, transparent plastic, or the like. A color filter 118 is formed on the inner surface (the lower surface in FIG. 19) of the base material 111b, and the second electrode 114b is formed in a stripe shape in the direction perpendicular to the first electrode 114a when viewed from the direction of the arrow D. (See FIG. 18), and an alignment film 116b is further formed thereon. A polarizing plate 117b is attached to the outer surface (upper surface in FIG. 19) of the substrate 111b by sticking or the like.
[0113]
In FIG. 18, in order to show the arrangement of the second electrodes 114b in an easy-to-understand manner, as in the case of the first electrodes 114a, their stripe intervals are drawn much wider than actual, and accordingly, the number of the second electrodes 114b However, in reality, a larger number of second electrodes 114b are formed on the substrate 111b.
[0114]
In FIG. 19, liquid crystal, for example, STN (Super Twisted Nematic) liquid crystal L is sealed in a gap surrounded by the first substrate 107a, the second substrate 107b, and the sealing material 108, so-called cell gap. A large number of minute and spherical spacers 119 are dispersed on the inner surface of the first substrate 107a or the second substrate 107b, and the presence of these spacers 119 in the cell gap keeps the thickness of the cell gap uniform. .
[0115]
The first electrode 114a and the second electrode 114b are arranged in an orthogonal relationship with each other, and their intersections are arranged in a dot matrix as seen from the direction of arrow D in FIG. Each intersection in the dot matrix form one pixel pixel. The color filter 118 arranges each color element of R (red), G (green), and B (blue) in a predetermined pattern when viewed from the direction of the arrow D, for example, a pattern such as a stripe arrangement, a delta arrangement, or a mosaic arrangement. Is formed by. The one picture element pixel corresponds to each one of R, G, and B, and the three color picture element pixels of R, G, and B constitute one unit to constitute one pixel.
[0116]
By selectively emitting light from a plurality of picture element pixels arranged in a dot matrix, and thus pixels, an image such as letters and numbers is displayed outside the second substrate 107b of the liquid crystal panel 102. The area where the image is displayed in this way is the effective pixel area, and the planar rectangular area indicated by the arrow V in FIGS. 18 and 19 is the effective display area.
[0117]
In FIG. 19, the reflective film 112 is formed of a light reflective material such as an APC alloy or Al (aluminum), and has an opening 121 at a position corresponding to each pixel pixel that is an intersection of the first electrode 114a and the second electrode 114b. Is formed. As a result, the openings 121 are arranged in the same dot matrix as the pixel pixels when viewed from the direction of arrow D in FIG.
[0118]
The first electrode 114a and the second electrode 114b are made of, for example, ITO which is a transparent conductive material. The alignment films 116a and 116b are formed by depositing a polyimide resin in a uniform thickness. When these alignment films 116a and 116b are subjected to a rubbing process, the initial alignment of liquid crystal molecules on the surfaces of the first substrate 107a and the second substrate 107b is determined.
[0119]
In FIG. 18, the first substrate 107a is formed to have a larger area than the second substrate 107b, and when these substrates are bonded together with the sealant 108, the first substrate 107a projects to the outside of the second substrate 107b. A substrate overhang 107c is provided. The substrate overhanging portion 107c is connected to the second electrode 114b on the second substrate 107b via a lead wire 114c extending from the first electrode 114a and a conductive material 109 (see FIG. 19) existing inside the sealing material 108. There are various wirings such as a lead wiring 114d that conducts to the liquid crystal, an input bump of the liquid crystal driving IC 103a, that is, a metal wiring 114e connected to the input terminal, and a metal wiring 114f connected to the input bump of the liquid crystal driving IC 103b. It is formed with an appropriate pattern.
[0120]
In the present embodiment, the lead-out wiring 114c extending from the first electrode 114a and the lead-out wiring 114d conducting to the second electrode 114b are formed of ITO which is the same material as those electrodes, that is, a conductive oxide. Further, the metal wirings 114e and 114f, which are wirings on the input side of the liquid crystal driving ICs 103a and 103b, are formed of a metal material having a low electric resistance value, for example, an APC alloy. The APC alloy is an alloy mainly containing Ag and accompanyingly containing Pd and Cu, for example, an alloy composed of Ag 98%, Pd 1%, Cu 1%.
[0121]
The liquid crystal driving IC 103a and the liquid crystal driving IC 103b are mounted by being adhered to the surface of the substrate extension portion 107c by an ACF (Anisotropic Conductive Film) 122. That is, in the present embodiment, a so-called COG (Chip On Glass) liquid crystal panel having a structure in which a semiconductor chip is directly mounted on a substrate is formed. In this COG mounting structure, the input side bumps of the liquid crystal driving ICs 103a and 103b and the metal wirings 114e and 114f are conductively connected by the conductive particles contained in the ACF 122, and the output side of the liquid crystal driving ICs 103a and 103b. The bumps and the lead wires 114c and 114d are conductively connected.
[0122]
In FIG. 18, the FPC 104 includes a flexible resin film 123, a circuit 126 including a chip component 124, and a metal wiring terminal 127. The circuit 126 is directly mounted on the surface of the resin film 123 by soldering or other conductive connection method. The metal wiring terminal 127 is formed of an APC alloy, Cr, Cu or other conductive material. The portion of the FPC 104 where the metal wiring terminal 127 is formed is connected to the portion of the first substrate 107a where the metal wiring 114e and the metal wiring 114f are formed by the ACF 122. Then, the metal wires 114e and 114f on the substrate side and the metal wire terminal 127 on the FPC side are electrically connected to each other by the action of the conductive particles contained in the ACF 122.
[0123]
An external connection terminal 131 is formed at the opposite end of the FPC 104, and the external connection terminal 131 is connected to an external circuit (not shown). Then, the liquid crystal driving ICs 103a and 103b are driven based on a signal transmitted from the external circuit, a scanning signal is supplied to one of the first electrode 114a and the second electrode 114b, and a data signal is supplied to the other. As a result, the voltage of the pixel pixels in the dot matrix array arranged in the effective display area V is controlled for each pixel, and as a result, the orientation of the liquid crystal L is controlled for each pixel pixel.
[0124]
In FIG. 18, the illuminating device 106 functioning as a so-called backlight includes, as shown in FIG. 19, a light guide 132 made of acrylic resin or the like and a diffusion provided on the light emitting surface 132b of the light guide 132. A sheet 133, a reflection sheet 134 provided on the opposite surface of the light guide 132 to the light emitting surface 132b, and an LED (Light Emitting Diode) 136 as a light source.
[0125]
The LED 136 is supported by an LED substrate 137, and the LED substrate 137 is attached to a support portion (not shown) formed integrally with the light guide 132, for example. When the LED substrate 137 is mounted at a predetermined position of the support portion, the LED 136 is placed at a position facing the light capturing surface 132a which is the side end surface of the light guide 132. Reference numeral 138 indicates a buffer material for buffering an impact applied to the liquid crystal panel 102.
[0126]
When the LED 136 emits light, the light is taken in from the light taking-in surface 132a, guided to the inside of the light guide 132, and diffused from the light emitting surface 132b while propagating while reflecting on the reflection sheet 134 or the wall surface of the light guide 132. The light is emitted through the sheet 133 as planar light.
[0127]
Since the liquid crystal device 101 of the present embodiment is configured as described above, when external light such as sunlight or room light is sufficiently bright, in FIG. 19, external light is transmitted from the second substrate 107b side to the liquid crystal panel. The light is taken into the inside of the liquid crystal 102, the light passes through the liquid crystal L, is reflected by the reflective film 112, and is supplied to the liquid crystal L again. The orientation of the liquid crystal L is controlled for each of the R, G, and B pixel pixels by the electrodes 114a and 114b sandwiching the liquid crystal L. Therefore, the light supplied to the liquid crystal L is modulated for each pixel pixel. Images such as letters and numbers are displayed outside the liquid crystal panel 102 by the light that passes through the polarizing plate 117b and the light that cannot pass. Thereby, a reflective display is performed.
[0128]
On the other hand, when a sufficient amount of external light cannot be obtained, the LED 136 emits light, and planar light is emitted from the light emitting surface 132 b of the light guide 132, and the light passes through the opening 121 formed in the reflective film 112. Supplied to the liquid crystal L. At this time, similarly to the reflective display, the supplied light is modulated for each pixel by the liquid crystal L whose orientation is controlled, and an image is displayed to the outside. Thereby, a transmissive display is performed.
[0129]
The liquid crystal device 101 having the above configuration is manufactured by, for example, a manufacturing method shown in FIG. In this manufacturing method, a series of steps P1 to P6 is a step for forming the first substrate 107a, and a series of steps P11 to P14 is a step for forming the second substrate 107b. The first substrate forming step and the second substrate forming step are usually performed independently.
[0130]
First, the first substrate forming process will be described. A plurality of reflective films 112 of the liquid crystal panel 102 are formed on the surface of a large-area mother material substrate formed of translucent glass, translucent plastic, or the like by photolithography. Then, an insulating film 113 is formed thereon using a known film formation method (step P1), and then the first electrode 114a and the wirings 114c and 114d are formed using a photolithography method or the like. , 114e, 114f are formed (process P2).
[0131]
Next, an alignment film 116a is formed on the first electrode 114a by coating, printing, or the like (process P3), and the alignment film 116a is rubbed to determine the initial alignment of the liquid crystal (process P4). ). Next, the sealing material 108 is formed in an annular shape by, for example, screen printing (process P5), and spherical spacers 119 are further dispersed thereon (process P6). As a result, a large-area mother first substrate having a plurality of panel patterns on the first substrate 107a of the liquid crystal panel 102 is formed.
[0132]
Separately from the first substrate forming process described above, the second substrate forming process (process P11 to process P14 in FIG. 17) is performed. First, a large-area mother material substrate formed of translucent glass, translucent plastic, or the like is prepared, and a plurality of color filters 118 for the liquid crystal panel 102 are formed on the surface (process P11). The color filter forming process is performed using the manufacturing method shown in FIG. 6, and the R, G, and B color filter elements in the manufacturing method are formed using the inkjet device 16 shown in FIG. This is executed according to the inkjet head control method shown in FIGS. Since the manufacturing method of these color filters and the control method of the ink jet head are the same as those already described, their description is omitted.
[0133]
When the color filter 1, that is, the color filter 118 is formed on the mother substrate 12, that is, the mother raw material base, as shown in FIG. 6D, the second electrode 114b is then formed by photolithography (process P12). Further, an alignment film 116b is formed by coating, printing, or the like (process P13), and the alignment film 116b is further rubbed to determine the initial alignment of the liquid crystal (process P14). As described above, a large mother second substrate having a plurality of panel patterns on the second substrate 107b of the liquid crystal panel 102 is formed.
[0134]
After the mother first substrate and the mother second substrate having a large area are formed as described above, the mother substrates are aligned with each other with the sealing material 108 interposed therebetween, that is, aligned, and then bonded to each other (process P21). As a result, an empty panel structure including a plurality of liquid crystal panel portions and not yet filled with liquid crystal is formed.
[0135]
Next, a scribe groove, that is, a cutting groove is formed at a predetermined position of the completed empty panel structure, and the panel structure is broken, that is, cut, with reference to the scribe groove (step P22). As a result, a so-called strip-shaped empty panel structure in which the liquid crystal injection opening 110 (see FIG. 18) of the sealing material 108 of each liquid crystal panel portion is exposed to the outside is formed.
[0136]
Thereafter, liquid crystal L is injected into each liquid crystal panel portion through the exposed liquid crystal injection opening 110, and each liquid crystal injection port 110 is sealed with a resin or the like (process P23). In the normal liquid crystal injection process, for example, liquid crystal is stored in a storage container, the storage container storing the liquid crystal and a strip-shaped empty panel are put into a chamber or the like, and the chamber or the like is evacuated and then the chamber This is performed by immersing a strip-shaped empty panel in the liquid crystal inside the chamber, and then opening the chamber to atmospheric pressure. At this time, since the interior of the empty panel is in a vacuum state, the liquid crystal pressurized by the atmospheric pressure is introduced into the panel through the liquid crystal injection opening. Since the liquid crystal adheres around the liquid crystal panel structure after the liquid crystal is injected, the strip-shaped panel after the liquid crystal injection process is subjected to a cleaning process in step 24.
[0137]
Thereafter, a scribe groove is formed again at a predetermined position on the strip-shaped mother panel after the liquid crystal injection and cleaning is completed, and the strip-shaped panel is cut with reference to the scribe groove, thereby a plurality of liquid crystals. Panels are cut out individually (step P25). As shown in FIG. 18, the liquid crystal driving ICs 103 a and 103 b are mounted on the individual liquid crystal panels 102 manufactured in this way, the lighting device 106 is mounted as a backlight, and the FPC 104 is connected to achieve the target. The liquid crystal device 101 is completed (process P26).
[0138]
The above-described method and apparatus for manufacturing a liquid crystal device have the following characteristics particularly at the stage of manufacturing a color filter. That is, the color filter 1 shown in FIG. 5A, that is, the individual filter elements 3 in the color filter 118 shown in FIG. 19, are not formed by one main scan × of the inkjet head 22 (see FIG. 1). Each of the filter elements 3 is formed to have a predetermined film thickness by receiving ink ejection n times, for example, four times, by a plurality of nozzles 27 belonging to different nozzle groups. For this reason, even if there is a variation in the amount of ink ejected between the plurality of nozzles 27, it is possible to prevent the variation in film thickness between the plurality of filter elements 3, and therefore, the light transmission characteristics of the color filter can be reduced. Can be made uniform. This means that a clear color display with no color unevenness can be obtained in the liquid crystal device 101 of FIG.
[0139]
Further, in the manufacturing method and manufacturing apparatus of the liquid crystal device of the present embodiment, the filter element 3 is formed by ink ejection using the ink jet head 22 by using the ink jet device 16 shown in FIG. There is no need to go through complicated processes such as the above, and no material is wasted.
[0140]
(Seventh embodiment)
FIG. 20 shows an embodiment of a method for manufacturing an EL device according to the present invention. FIG. 21 shows the main steps of the manufacturing method and the main cross-sectional structure of the EL device finally obtained. As shown in FIG. 21D, the EL device 201 forms pixel electrodes 202 on a transparent substrate 204, and banks 205 are formed between the pixel electrodes 202 in a lattice shape when viewed from the direction of the arrow G. A hole injection layer 220 is formed in the lattice-shaped recess, and the R-color light-emitting layer 203R, the G-color light-emitting layer 203G, and the B-color light-emitting layer 203B are arranged in a predetermined arrangement such as a stripe arrangement as viewed from the arrow G direction. It is formed by forming in the grid-like recesses and further forming the counter electrode 213 thereon.
[0141]
When the pixel electrode 202 is driven by a two-terminal active element such as a TFD (Thin Film Diode) element, the counter electrode 213 is formed in a stripe shape when viewed from the arrow G direction. When the pixel electrode 202 is driven by a three-terminal active element such as a TFT (Thin Film Transistor), the counter electrode 213 is formed as a single surface electrode.
[0142]
A region sandwiched between each pixel electrode 202 and each counter electrode 213 becomes one picture element pixel, and R, G, and B three-color picture element pixels form one unit to form one pixel. By controlling the current flowing through each picture element pixel, a desired one of the plurality of picture element pixels can be selectively emitted, whereby a desired full color image can be displayed in the direction of arrow H.
[0143]
The EL device 201 is manufactured by, for example, a manufacturing method shown in FIG. That is, as shown in step P51 and FIG. 21A, an active element such as a TFD element or a TFT element is formed on the surface of the transparent substrate 204, and a pixel electrode 202 is further formed. As a formation method, for example, a photolithography method, a vacuum deposition method, a sputtering method, a pyrosol method, or the like can be used. Pixel electrode materials include ITO (Indium Tin Oxide), tin oxide, and complex acid of indium oxide and zinc oxide.
A compound or the like can be used.
[0144]
Next, as shown in Step P52 and FIG. 21A, a partition wall, that is, a bank 205 was formed by using a well-known patterning method, for example, a photolithography method, and the space between the transparent electrodes 202 was filled with the bank 205. Thereby, it is possible to improve contrast, prevent color mixing of the light emitting material, and prevent light leakage from between the pixels. The material of the bank 205 is not particularly limited as long as it has durability against the solvent of the EL material, but can be treated with fluorine by fluorocarbon gas plasma treatment, for example, organic materials such as acrylic resin, epoxy resin, and photosensitive polyimide. Material is preferred.
[0145]
Next, immediately before applying the hole injection layer ink, the substrate 204 was subjected to continuous plasma treatment with oxygen gas and fluorocarbon gas plasma (process P53). Thereby, the polyimide surface is water-repellent, the ITO surface is hydrophilized, and the wettability on the substrate side for finely patterning ink jet droplets can be controlled. As an apparatus for generating plasma, an apparatus for generating plasma in a vacuum or an apparatus for generating plasma in the atmosphere can be used similarly.
[0146]
Next, as shown in Step P54 and FIG. 21A, the hole injection layer ink was ejected from the ink jet head 22 of the ink jet apparatus 16 of FIG. 8, and patterning coating was performed on each pixel electrode 202. As a specific control method of the ink jet head, the method shown in FIG. 1, FIG. 2, FIG. 3 or FIG. 4 was used. After the application, the solvent is removed under conditions of room temperature and 20 minutes in vacuum (1 torr) (step P55), and then heat treatment in the atmosphere at 20 ° C. (on a hot plate) for 10 minutes. An incompatible hole injection layer 220 was formed (process P56). The film thickness was 40 nm.
[0147]
Next, as shown in Step P57 and FIG. 21B, the ink for the R light emitting layer and the ink for the G light emitting layer were applied onto the hole injection layer 220 in each filter element region by using an ink jet method. Again, each light emitting layer ink was ejected from the inkjet head 22 of the inkjet device 16 of FIG. 8, and the control method of the inkjet head was in accordance with the method shown in FIG. 1, FIG. 2, FIG. According to the ink jet system, fine patterning can be performed easily and in a short time. Further, it is possible to change the film thickness by changing the solid content concentration and the ejection amount of the ink composition.
[0148]
After application of the light emitting layer ink, the solvent is removed under conditions of vacuum (1 torr), room temperature, 20 minutes, etc. (step P58), followed by conjugation by a heat treatment at 150 ° C. for 4 hours in a nitrogen atmosphere. The color light emitting layer 203R and the G color light emitting layer 203G were formed (process P59). The film thickness was 50 nm. The light-emitting layer conjugated by heat treatment is insoluble in the solvent.
[0149]
Note that, before forming the light emitting layer, the hole injection layer 220 may be subjected to continuous plasma treatment with oxygen gas and fluorocarbon gas plasma. As a result, a fluoride layer is formed on the hole injection layer 220 and the ionization potential is increased, whereby the hole injection efficiency is increased, and an organic EL device with high light emission efficiency can be provided.
[0150]
Next, as shown in Step P60 and FIG. 21C, the B-color light emitting layer 203B is overlaid on the R-color light-emitting layer 203R, the G-color light-emitting layer 203G, and the hole injection layer 220 in each pixel pixel. Formed. Accordingly, not only the three primary colors of R, G, and B can be formed, but also the steps of the R light emitting layer 203R and the G light emitting layer 203G and the bank 205 can be filled and flattened. Thereby, a short circuit between the upper and lower electrodes can be reliably prevented. By adjusting the film thickness of the B-color light emitting layer 203B, the B-color light-emitting layer 203B functions as an electron injecting and transporting layer in the stacked structure of the R-color light-emitting layer 203R and the G-color light-emitting layer 203G and emits light to the B color. do not do.
[0151]
As a method for forming the B-color light-emitting layer 203B as described above, for example, a general spin coating method can be adopted as a wet method, or a method for forming the R-color light-emitting layer 203R and the G-color light-emitting layer 203G. A similar ink jet method can also be employed.
[0152]
Then, as shown in process P61 and FIG.21 (d), the target EL apparatus 201 was manufactured by forming the counter electrode 213. FIG. When the counter electrode 213 is a surface electrode, for example, Mg, Ag, Al, Li or the like can be used as a material and can be formed using a film forming method such as a vapor deposition method or a sputtering method. In the case where the counter electrode 213 is a striped electrode, the formed electrode layer can be formed using a patterning method such as a photolithography method.
[0153]
According to the EL device manufacturing method and the manufacturing apparatus described above, the control method shown in FIG. 1, 2, 3, 4 or the like is adopted as the control method of the inkjet head. The hole injection layer 220 and the R, G, and B color light emitting layers 203R, 203G, and 203B in the pixel are not formed by one main scanning x of the inkjet head 22 (see FIG. 1), but one. The hole injection layer and / or each color light emitting layer in each pixel pixel is formed to have a predetermined film thickness by receiving ink ejection n times, for example, four times by a plurality of nozzles 27 belonging to different nozzle groups. . For this reason, even if there is a variation in the ink discharge amount between the plurality of nozzles 27, it is possible to prevent the variation in the film thickness between the plurality of pixel pixels, and therefore, the light emission distribution on the light emitting surface of the EL device. The characteristics can be made uniform in a plane. This means that a clear color display without color unevenness can be obtained in the EL device 201 of FIG.
[0154]
Further, in the EL device manufacturing method and manufacturing apparatus according to this embodiment, R, G, and B color pixel pixels are formed by ink discharge using the ink jet head 22 by using the ink jet device 16 shown in FIG. Further, it is not necessary to go through complicated steps as in the method using the photolithography method, and the material is not wasted.
[0155]
(Other embodiments)
The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made within the scope of the invention described in the claims.
[0156]
For example, in the color filter manufacturing apparatus shown in FIGS. 8 and 9, the inkjet head 22 is moved in the main scanning direction x to perform main scanning of the substrate 12, and the substrate 12 is moved by the sub-scanning driving device 21. Although the substrate 12 is sub-scanned by the head 22, on the contrary, the main scan can be executed by the movement of the substrate 12 and the sub-scan can be executed by the movement of the inkjet head 22.
[0157]
In the above-described embodiment, an ink jet head having a structure for ejecting ink using the bending deformation of the piezoelectric element is used. However, an ink jet head having any other structure may be used.
In the above embodiment, only the most general configuration in which the main scanning direction and the sub-scanning direction are orthogonal to each other is illustrated, but the relationship between the main scanning direction and the sub-scanning direction is not limited to the orthogonal relationship, and an arbitrary angle. If you cross at.
The material to be ejected can be variously selected according to the elements formed on the object such as the substrate. For example, in addition to the ink and EL light emitting material described above, a conductive material such as a silica glass precursor and a metal compound. Examples thereof include dielectric materials or semiconductor materials.
Moreover, although the said embodiment demonstrated as an example the manufacturing method and manufacturing apparatus of a color filter, the manufacturing method and manufacturing apparatus of a liquid crystal device, and the manufacturing method and manufacturing apparatus of an EL apparatus, this invention is limited to these. Without any problem, it can be used for all industrial techniques for performing fine patterning on an object.
For example, various semiconductor elements (thin film transistors, thin film diodes, etc.), various wiring patterns, formation of insulating films, and the like can be cited as examples of the range of use.
The material to be ejected from the head can be variously selected according to the elements to be formed on the object such as the substrate. For example, in addition to the ink and EL light emitting material described above, a silica glass precursor, a metal compound, etc. Examples thereof include a conductive material, a dielectric material, or a semiconductor material.
Moreover, in the said embodiment, although called the "inkjet head" for simplicity, the discharge material discharged from this inkjet head is not limited to an ink, For example, the above-mentioned EL luminescent material, a silica glass precursor, Needless to say, there are various conductive materials such as metal compounds, dielectric materials, and semiconductor materials. The liquid crystal device and the EL device manufactured by the manufacturing method of the above embodiment can be mounted on a display unit of an electronic device such as a mobile phone or a portable computer.
[0158]
【The invention's effect】
According to the color filter manufacturing method and the manufacturing apparatus of the present invention, the individual filter elements in the color filter are not formed by one scan of the inkjet head, but each one filter element is a different nozzle. Since a predetermined film thickness is formed by receiving ink discharge by overlapping a plurality of nozzles belonging to a group, even if there is a variation in the ink discharge amount between the plurality of nozzles, the film thickness between the plurality of filter elements Variation can be prevented, and therefore, the light transmission characteristics of the color filter can be made uniform in a plane.
[0159]
Further, since the present invention is a method using an ink jet head, there is no need to go through complicated steps as in a method using a photolithography method, and no material is wasted.
[0160]
Also, according to the method and apparatus for manufacturing a liquid crystal device according to the present invention, in the stage of manufacturing a color filter, the individual filter elements in the color filter are not formed by a single scan of the inkjet head. Each filter element is formed to have a predetermined film thickness by being subjected to ink discharge by being overlapped by a plurality of nozzles belonging to different nozzle groups, so that there is a variation in the ink discharge amount between the plurality of nozzles. However, it is possible to prevent the film thickness from being varied between the plurality of filter elements, and therefore, the light transmission characteristics of the color filter can be made uniform in a plane. As a result, a clear color image without color unevenness can be displayed.
[0161]
In addition, according to the EL device manufacturing method and apparatus according to the present invention, the R, G, and B light emitting layers in each pixel pixel are not formed by one main scan of the ink jet head. Each of the color light emitting layers is formed to have a predetermined film thickness by being subjected to ink ejection by being overlapped by a plurality of nozzles belonging to different nozzle groups. For this reason, even if there is a variation in the amount of ink discharged between a plurality of nozzles, it is possible to prevent a variation in film thickness between a plurality of pixel pixels, and hence the light emission distribution characteristics of the light emitting surface of the EL device. Can be made planar in a uniform manner, and as a result, a clear color display without color unevenness can be obtained.
[0162]
Further, in the EL device manufacturing method and manufacturing apparatus according to the present invention, R, G, and B color pixel elements are formed by ink ejection using an ink jet head, so that complicated steps such as a method using a photolithography method are performed. There is no need to go through, and no material is wasted.
[0163]
In addition, according to the control device for an ink jet head according to the present invention, each color pattern is not formed by one scan of the ink jet head, but each one color pattern has a plurality of nozzle groups belonging to different nozzle groups. Since a predetermined film thickness is formed by receiving ink discharge by overlapping nozzles, even if there is a variation in the amount of ink discharge between a plurality of nozzles, the film thickness varies among a plurality of color patterns. Therefore, the optical characteristics of the color pattern can be made uniform in the plane of the optical member.
[0164]
Thereby, R, G, B each color filter element as a color pattern in the color filter as an optical member can be formed with a uniform film thickness in a plane. In addition, R, G, B light emitting layers and hole injection layers as color patterns in an EL element as an optical member can be formed with a uniform thickness in a plane.
[Brief description of the drawings]
FIG. 1 is a plan view schematically showing main steps of an embodiment of a color filter manufacturing method according to the present invention.
FIG. 2 is a plan view schematically showing main steps of another embodiment of the color filter manufacturing method according to the present invention.
FIG. 3 is a plan view schematically showing main steps of still another embodiment of the color filter manufacturing method according to the present invention.
FIG. 4 is a plan view schematically showing main steps of still another embodiment of the color filter manufacturing method according to the present invention.
FIG. 5 is a plan view showing an embodiment of a color filter according to the present invention and an embodiment of a mother substrate serving as the basis thereof.
6 is a diagram schematically showing a manufacturing process of a color filter using a cross-sectional portion according to line VI-VI in FIG.
FIG. 7 is a diagram illustrating an arrangement example of R, G, and B three-color pixel pixels in a color filter.
FIG. 8 shows an embodiment of an ink jet apparatus which is a main part of each manufacturing apparatus such as a color filter manufacturing apparatus according to the present invention, a liquid crystal device manufacturing apparatus according to the present invention, and an EL apparatus manufacturing apparatus according to the present invention. It is a perspective view.
9 is an enlarged perspective view showing a main part of the apparatus shown in FIG.
10 is an enlarged perspective view showing an ink jet head which is a main part of the apparatus shown in FIG. 9;
FIG. 11 is a perspective view showing a modified example of the inkjet head.
12A and 12B are diagrams illustrating an internal structure of an inkjet head, in which FIG. 12A is a partially broken perspective view, and FIG. 12B is a cross-sectional structure taken along line JJ of FIG.
FIG. 13 is a plan view showing another modified example of the inkjet head.
14 is a block diagram showing an electric control system used in the ink jet head device of FIG. 8. FIG.
15 is a flowchart showing a flow of control executed by the control system of FIG.
FIG. 16 is a perspective view showing still another modified example of the ink jet head.
17 is a process chart showing one embodiment of a method for producing a liquid crystal device according to the present invention. FIG.
FIG. 18 is a perspective view showing an example of a liquid crystal device manufactured by the method for manufacturing a liquid crystal device according to the present invention in an exploded state.
19 is a cross-sectional view showing a cross-sectional structure of the liquid crystal device according to the line I × -I × in FIG.
FIG. 20 is a process diagram showing one embodiment of a method for manufacturing an EL device according to the present invention.
21 is a cross-sectional view of an EL device corresponding to the process drawing shown in FIG. 20. FIG.
FIG. 22 is a diagram illustrating an example of a conventional color filter manufacturing method.
FIG. 23 is a diagram for explaining the characteristics of a conventional color filter.
[Explanation of symbols]
1 Color filter
2 Substrate
3 Filter elements
4 Protective film
6 Bulkhead
7 Filter element formation area
11 Color filter formation area
12 Mother board
13 Filter element material
16 Inkjet device
17 Head position control device
18 Substrate position control device
19 Main scanning drive
21 Sub-scanning drive device
22 Inkjet head
26 head unit
27 nozzles
28 nozzle rows
39 Ink pressurizer
41 Piezoelectric element
49 tables
76 Capping device
77 Cleaning device
78 Electronic Balance
81 head camera
82 Board camera
101 Liquid crystal device
102 LCD panel
107a, 107b substrate
111a, 111b base material
114a, 114b electrode
118 Color filter
201 EL device
202 Pixel electrode
203R, 203G, 203B Light emitting layer
204 substrates
205 banks
213 Counter electrode
220 hole injection layer
L liquid crystal
M Filter element material
× Main scan direction
Y Sub-scanning direction

Claims (4)

  1. A color filter manufacturing method for manufacturing a color filter comprising a plurality of filter elements arranged on a substrate,
    An ink-jet head having a nozzle row in which a plurality of nozzles are arranged in a row, the nozzle row being divided into n groups, and one of the substrates is moved in the main scanning direction with respect to the other Process A selectively forming a filter element on the substrate by discharging a filter material from the plurality of nozzles;
    And sub-scanning one of the inkjet head and the substrate with respect to the other, and
    Each of the filter elements is formed by n times of the step A,
    In the formation of each filter element, the nozzles that discharge in each step A belong to the different groups from each other.
  2. When the length of the nozzle row is L and the angle formed by the nozzle row and the sub-scanning direction is θ, the sub-scanning movement amount δ according to the step B
    δ ≒ (L / n) cosθ
    The method for producing a color filter according to claim 1, wherein:
  3. In the case where ink is not ejected from several nozzles at both ends of the nozzle row, when the length of the nozzle row is L and the angle formed by the nozzle row with the sub-scanning direction is θ, Regarding the sub-scanning movement amount δ,
    δ ≒ (L / n) cosθ
    The method for producing a color filter according to claim 1, wherein:
  4. In a method of manufacturing an EL device in which a plurality of pixel pixels each including an EL light emitting layer are arranged on a substrate,
    An ink jet head having a nozzle row in which a plurality of nozzles are arranged in a row, the nozzle row being divided into n groups, and one of the substrates is moved in the main scanning direction with respect to the other Forming an EL light emitting layer on the substrate by selectively discharging an EL light emitting material from the plurality of nozzles,
    And sub-scanning one of the inkjet head and the substrate with respect to the other, and
    Each pixel pixel is formed by n times of the process A,
    The method of manufacturing an EL device according to claim 1, wherein in forming each pixel pixel, the nozzles that discharge in each step A belong to different groups.
JP2001294727A 2000-11-21 2001-09-26 Color filter manufacturing method and manufacturing apparatus, liquid crystal device manufacturing method and manufacturing apparatus, EL device manufacturing method and manufacturing apparatus, inkjet head control apparatus, material discharging method and material discharging apparatus, and electronic apparatus Active JP3899879B2 (en)

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JP5233099B2 (en) 2006-08-31 2013-07-10 凸版印刷株式会社 Manufacturing method of optical element, manufacturing method of color filter, and manufacturing method of organic electroluminescence element
JP5444849B2 (en) * 2009-05-27 2014-03-19 セイコーエプソン株式会社 Droplet discharge method and droplet discharge apparatus

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