JP2002224872A - レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置 - Google Patents

レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置

Info

Publication number
JP2002224872A
JP2002224872A JP2001023347A JP2001023347A JP2002224872A JP 2002224872 A JP2002224872 A JP 2002224872A JP 2001023347 A JP2001023347 A JP 2001023347A JP 2001023347 A JP2001023347 A JP 2001023347A JP 2002224872 A JP2002224872 A JP 2002224872A
Authority
JP
Japan
Prior art keywords
panel
cutting
electro
laser
optical device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001023347A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002224872A5 (https=
Inventor
Atsushi Takei
厚 武居
Teruyuki Inukai
輝幸 犬飼
Hidehiro Ito
英博 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2001023347A priority Critical patent/JP2002224872A/ja
Publication of JP2002224872A publication Critical patent/JP2002224872A/ja
Publication of JP2002224872A5 publication Critical patent/JP2002224872A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Liquid Crystal (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2001023347A 2001-01-31 2001-01-31 レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置 Withdrawn JP2002224872A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001023347A JP2002224872A (ja) 2001-01-31 2001-01-31 レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001023347A JP2002224872A (ja) 2001-01-31 2001-01-31 レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置

Publications (2)

Publication Number Publication Date
JP2002224872A true JP2002224872A (ja) 2002-08-13
JP2002224872A5 JP2002224872A5 (https=) 2005-02-24

Family

ID=18888645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001023347A Withdrawn JP2002224872A (ja) 2001-01-31 2001-01-31 レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置

Country Status (1)

Country Link
JP (1) JP2002224872A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7426883B2 (en) 2002-11-22 2008-09-23 Mitsuboshi Diamond Ind Co Ltd Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method
CN120516227A (zh) * 2025-05-28 2025-08-22 浙江求是半导体设备有限公司 一种切割方法和切割装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7426883B2 (en) 2002-11-22 2008-09-23 Mitsuboshi Diamond Ind Co Ltd Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method
CN100519121C (zh) * 2002-11-22 2009-07-29 三星钻石工业股份有限公司 基板分断系统、基板制造装置
CN120516227A (zh) * 2025-05-28 2025-08-22 浙江求是半导体设备有限公司 一种切割方法和切割装置

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