JP2002224872A5 - - Google Patents

Download PDF

Info

Publication number
JP2002224872A5
JP2002224872A5 JP2001023347A JP2001023347A JP2002224872A5 JP 2002224872 A5 JP2002224872 A5 JP 2002224872A5 JP 2001023347 A JP2001023347 A JP 2001023347A JP 2001023347 A JP2001023347 A JP 2001023347A JP 2002224872 A5 JP2002224872 A5 JP 2002224872A5
Authority
JP
Japan
Prior art keywords
panel
workpiece
cutting
electro
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001023347A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002224872A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001023347A priority Critical patent/JP2002224872A/ja
Priority claimed from JP2001023347A external-priority patent/JP2002224872A/ja
Publication of JP2002224872A publication Critical patent/JP2002224872A/ja
Publication of JP2002224872A5 publication Critical patent/JP2002224872A5/ja
Withdrawn legal-status Critical Current

Links

JP2001023347A 2001-01-31 2001-01-31 レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置 Withdrawn JP2002224872A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001023347A JP2002224872A (ja) 2001-01-31 2001-01-31 レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001023347A JP2002224872A (ja) 2001-01-31 2001-01-31 レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置

Publications (2)

Publication Number Publication Date
JP2002224872A JP2002224872A (ja) 2002-08-13
JP2002224872A5 true JP2002224872A5 (https=) 2005-02-24

Family

ID=18888645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001023347A Withdrawn JP2002224872A (ja) 2001-01-31 2001-01-31 レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置

Country Status (1)

Country Link
JP (1) JP2002224872A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101596723B (zh) 2002-11-22 2012-05-30 三星钻石工业股份有限公司 基板分断方法
CN120516227B (zh) * 2025-05-28 2025-10-17 浙江求是半导体设备有限公司 一种切割方法和切割装置

Similar Documents

Publication Publication Date Title
JP6034269B2 (ja) 超短パルスレーザによる透明材料処理
TW498006B (en) Laser cutting method, laser cutting apparatus, and method and apparatus for manufacturing liquid crystal device
JP6422033B2 (ja) レーザビーム焦線を用いたシート状基板のレーザベースの機械加工方法及び装置
US8168514B2 (en) Laser separation of thin laminated glass substrates for flexible display applications
KR20200105827A (ko) 복합재의 분단 방법
TW200816300A (en) Method of scribing stuck mother substrate and method of dividing stuck mother substrate
WO2008117717A1 (ja) 樹脂製部材の接合方法
CN105269608A (zh) 层积型光学膜切割装置及层积型光学膜切割方法
US20150114044A1 (en) Method for processing glass plate
TWI899225B (zh) 複合材之分斷方法及複合材
TWI886032B (zh) 複合材之分斷方法
TWI862553B (zh) 複合材之分斷方法
WO2021009961A1 (ja) 複合材の分断方法
CN207052568U (zh) 划片设备
JP2002224871A5 (https=)
JP2002293560A5 (https=)
JP2002224872A5 (https=)
ATE550162T1 (de) Vorrichtung zum schneiden von papier und anderen aufgerollten grafischen substraten in zwei senkrechten achsen gleichzeitig mit automatischer fehlerkorrektur
US20240270623A1 (en) Method for dividing composite material
TW201247575A (en) Processing method for brittle material substrate
DE50009104D1 (de) Verfahren und Vorrichtung zum Durchtrennen von Folien in Verbundglas
TW202330222A (zh) 片材之分斷方法
KR102633196B1 (ko) 스크라이빙 장치 및 스크라이빙 방법
KR20170006489A (ko) 유리 가공물 절단방법
KR102953361B1 (ko) 복합재의 분단 방법