JP2002217529A - 部品実装基板 - Google Patents
部品実装基板Info
- Publication number
- JP2002217529A JP2002217529A JP2001008096A JP2001008096A JP2002217529A JP 2002217529 A JP2002217529 A JP 2002217529A JP 2001008096 A JP2001008096 A JP 2001008096A JP 2001008096 A JP2001008096 A JP 2001008096A JP 2002217529 A JP2002217529 A JP 2002217529A
- Authority
- JP
- Japan
- Prior art keywords
- component mounting
- mounting board
- component
- flux layer
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 24
- 230000004907 flux Effects 0.000 claims abstract description 90
- 229910000679 solder Inorganic materials 0.000 claims abstract description 41
- 239000004020 conductor Substances 0.000 claims abstract description 40
- 239000000853 adhesive Substances 0.000 claims description 30
- 230000001070 adhesive effect Effects 0.000 claims description 30
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 24
- 239000004840 adhesive resin Substances 0.000 claims description 21
- 229920006223 adhesive resin Polymers 0.000 claims description 21
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid group Chemical group C(CCC(=O)O)(=O)O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 16
- 150000001735 carboxylic acids Chemical class 0.000 claims description 14
- 239000001361 adipic acid Substances 0.000 claims description 12
- 235000011037 adipic acid Nutrition 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000001384 succinic acid Substances 0.000 claims description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 4
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 229910052745 lead Inorganic materials 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000004848 polyfunctional curative Substances 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 13
- 238000001723 curing Methods 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000001029 thermal curing Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000013008 thixotropic agent Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000010301 surface-oxidation reaction Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001008096A JP2002217529A (ja) | 2001-01-16 | 2001-01-16 | 部品実装基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001008096A JP2002217529A (ja) | 2001-01-16 | 2001-01-16 | 部品実装基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002217529A true JP2002217529A (ja) | 2002-08-02 |
| JP2002217529A5 JP2002217529A5 (enExample) | 2005-12-15 |
Family
ID=18875748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001008096A Pending JP2002217529A (ja) | 2001-01-16 | 2001-01-16 | 部品実装基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002217529A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014112425A1 (ja) * | 2013-01-15 | 2014-07-24 | 昭和電工株式会社 | フラックス転写シート、フラックス付着方法およびろう付け方法 |
| JP2014136223A (ja) * | 2013-01-15 | 2014-07-28 | Showa Denko Kk | フラックス転写シート、フラックス付着方法およびろう付け方法 |
| JP2014184473A (ja) * | 2013-03-25 | 2014-10-02 | Showa Denko Kk | フラックス付ブレージングシートおよびフラックス付ブレージングシートの製造方法 |
| JP2014213371A (ja) * | 2013-04-30 | 2014-11-17 | 昭和電工株式会社 | ろう材転写シート、ろう材付着方法およびろう付け方法 |
-
2001
- 2001-01-16 JP JP2001008096A patent/JP2002217529A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014112425A1 (ja) * | 2013-01-15 | 2014-07-24 | 昭和電工株式会社 | フラックス転写シート、フラックス付着方法およびろう付け方法 |
| JP2014136223A (ja) * | 2013-01-15 | 2014-07-28 | Showa Denko Kk | フラックス転写シート、フラックス付着方法およびろう付け方法 |
| JP2014184473A (ja) * | 2013-03-25 | 2014-10-02 | Showa Denko Kk | フラックス付ブレージングシートおよびフラックス付ブレージングシートの製造方法 |
| JP2014213371A (ja) * | 2013-04-30 | 2014-11-17 | 昭和電工株式会社 | ろう材転写シート、ろう材付着方法およびろう付け方法 |
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Legal Events
| Date | Code | Title | Description |
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| A521 | Written amendment |
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| A871 | Explanation of circumstances concerning accelerated examination |
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| A975 | Report on accelerated examination |
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| A521 | Written amendment |
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