JP2002217350A - Method of manufacturing modular component - Google Patents

Method of manufacturing modular component

Info

Publication number
JP2002217350A
JP2002217350A JP2001007341A JP2001007341A JP2002217350A JP 2002217350 A JP2002217350 A JP 2002217350A JP 2001007341 A JP2001007341 A JP 2001007341A JP 2001007341 A JP2001007341 A JP 2001007341A JP 2002217350 A JP2002217350 A JP 2002217350A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
semiconductor bare
bare chip
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001007341A
Other languages
Japanese (ja)
Inventor
Yuji Yagi
優治 八木
Masaaki Hayama
雅昭 葉山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001007341A priority Critical patent/JP2002217350A/en
Publication of JP2002217350A publication Critical patent/JP2002217350A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
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    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
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    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83009—Pre-treatment of the layer connector or the bonding area
    • H01L2224/83051—Forming additional members, e.g. dam structures
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
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    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming a modular component by directly packaging a semiconductor bare chip on a printed circuit board without accommodating in a package, and to provide a method for packaging the semiconductor bare chip and passive components by bringing them much closer. SOLUTION: After a surface-mounting component 1 is positioned on the printed circuit board 3 that is coated with solder paste 2, the component 1 is mounted and is passed through a reflow, thus melting the solder paste 2, and connecting and fixing the surface-mounting component 1 on the printed circuit board 3. After the printed circuit board 3 is washed, a thermosetting resin 7 is heated and pressed via a rubber sheet 6 for applying to the printed circuit board 3. After a plurality of semiconductor bare chips 9 is positioned on the printed circuit board 3, they are mounted via the thermosetting resin 7. Finally, the plurality of semiconductor bare chips 9 is heated and pressed simultaneously for connecting and fixing to the printed circuit board 3.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は半導体や受動部品等
を基板実装して機能モジュール化するモジュール部品の
製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a module component for mounting a semiconductor, a passive component or the like on a substrate to form a functional module.

【０００２】[0002]

【従来の技術】近年、機器の高機能化に伴い、各機能を
モジュール部品化した商品が多数提案されてきている。
モジュール部品は、図１０に示すように、主に受動部品
や半導体を基板に実装することによって構成される。現
在のモジュール部品は、受動部品１には、表面実装タイ
プのチップ部品を用い、半導体には、まず受動部品同様
に表面実装できるように半導体ベアチップ９をパッケー
ジに収容した半導体パッケージ２３を用い、（工程ａ）
半田ペースト２を印刷したプリント基板３に受動部品１
と半導体パッケージ２３をマウントし、（工程ｂ）一括
でリフローに通すことにより、受動部品１及び半導体パ
ッケージ２３をプリント基板３に接続、固定する方法で
形成される。2. Description of the Related Art In recent years, along with the sophistication of equipment, a number of products in which each function is modularized have been proposed.
As shown in FIG. 10, the module component is mainly configured by mounting a passive component or a semiconductor on a substrate. As the current module component, a surface mounting type chip component is used for the passive component 1, and a semiconductor package 23 containing a semiconductor bare chip 9 in a package so as to be surface mounted like a passive component is used for a semiconductor ( Step a)
Passive components 1 on printed circuit board 3 on which solder paste 2 is printed
Then, the passive component 1 and the semiconductor package 23 are connected and fixed to the printed circuit board 3 by mounting the semiconductor package 23 and the semiconductor package 23 (step b) and passing the package through the reflow at a time.

【０００３】[0003]

【発明が解決しようとする課題】しかしながら、近年、
モジュール部品は、携帯機器への使用が多くなってきて
おり、小型化要求が高まってきているが、現状のモジュ
ール部品の構成では、その要求に十分に対応できていな
い。特に、モジュール部品の容積の大部分を占める半導
体パッケージの小型化が課題となっている。However, in recent years,
The use of module components for portable devices is increasing, and the demand for miniaturization is increasing. However, the current configuration of module components cannot sufficiently meet the demand. In particular, miniaturization of a semiconductor package that occupies most of the volume of the module component has been an issue.

【０００４】そこで本発明は、モジュール部品の大幅な
小型化を図るため、半導体ベアチップをパッケージに収
容せずに、直接、プリント基板に実装して、モジュール
部品を形成する方法と、更には半導体ベアチップや受動
部品をより近接して実装できる方法を提供するものであ
る。Accordingly, the present invention provides a method for forming a module component by directly mounting a semiconductor bare chip on a printed circuit board without accommodating the semiconductor bare chip in order to greatly reduce the size of the module component. And a method for mounting passive components closer to each other.

【０００５】[0005]

【課題を解決するための手段】この課題を解決するため
に本発明のモジュール部品の製造方法は、表面実装部品
と半導体ベアチップをプリント基板の表面に実装してな
るモジュール部品において、表面実装部品をプリント基
板に実装した後、前記プリント基板を洗浄し、その後、
半導体ベアチップを前記プリント基板に実装してなるこ
とを特徴としている。SUMMARY OF THE INVENTION In order to solve this problem, a method of manufacturing a module component according to the present invention is directed to a module component comprising a surface mounted component and a semiconductor bare chip mounted on a surface of a printed circuit board. After mounting on a printed circuit board, the printed circuit board is washed, and then
A semiconductor bare chip is mounted on the printed circuit board.

【０００６】まず、半導体ベアチップを直接、プリント
基板に実装する場合、半導体ベアチップを保護する封止
樹脂を実装部及び半導体ベアチップの周辺に形成する必
要があるが、この封止樹脂は、半導体ベアチップ最外郭
よりも大きくはみ出して形成されるため、受動部品の実
装を半導体ベアチップの実装後に行うと、封止樹脂のは
み出しよりも更に外側にしか受動部品を実装できず、モ
ジュール部品の小型化にはあまり効果が得られないのに
対し、この発明によれば、受動部品をプリント基板に接
続、固定後、受動部品に掛かるように封止樹脂形成して
も全く問題ないため、より半導体ベアチップと受動部品
を近接して実装することができる。しかし、受動部品を
表面実装した後では、封止樹脂の性能を劣化させるプリ
ント基板表面の汚れを生じるため、半導体ベアチップの
実装の前に、プリント基板の洗浄を行うことにより、そ
の課題も解決することができ、より小型のモジュール部
品を形成することができるようになる。First, when a semiconductor bare chip is directly mounted on a printed circuit board, it is necessary to form a sealing resin for protecting the semiconductor bare chip around the mounting portion and the periphery of the semiconductor bare chip. If the passive components are mounted after the semiconductor bare chip is mounted, the passive components can only be mounted further outside the sealing resin because they are formed so as to protrude beyond the outer shell. According to the present invention, although no effect can be obtained, there is no problem even if the sealing resin is formed so as to hang on the passive component after connecting and fixing the passive component to the printed circuit board. Can be mounted in close proximity. However, after the passive components are surface-mounted, the printed circuit board surface is stained, which degrades the performance of the sealing resin. Therefore, the problem is solved by cleaning the printed circuit board before mounting the semiconductor bare chip. Therefore, a smaller module component can be formed.

【０００７】[0007]

【発明の実施の形態】本発明の請求項１に記載のモジュ
ール部品の製造方法は、表面実装部品と半導体ベアチッ
プをプリント基板の表面に実装してなるモジュール部品
において、表面実装部品をプリント基板に実装した後、
前記プリント基板を洗浄し、その後、半導体ベアチップ
を前記プリント基板に実装してなることを特徴としてお
り、上記（課題を解決するための手段）で述べた通りの
効果が得られる。A method for manufacturing a module component according to a first aspect of the present invention is directed to a module component comprising a surface-mounted component and a semiconductor bare chip mounted on the surface of a printed circuit board. After implementation,
The printed circuit board is cleaned, and thereafter, a semiconductor bare chip is mounted on the printed circuit board, and the same effects as described above (means for solving the problem) can be obtained.

【０００８】本発明の請求項２に記載のモジュール部品
の製造方法は、請求項１記載のモジュール部品の製造方
法において、熱硬化性樹脂を用いて半導体ベアチップを
プリント基板に実装することを特徴としている。According to a second aspect of the present invention, there is provided a method of manufacturing a module component according to the first aspect, wherein the semiconductor bare chip is mounted on a printed circuit board using a thermosetting resin. I have.

【０００９】本発明の請求項３に記載のモジュール部品
の製造方法は、請求項１記載のモジュール部品の製造方
法において、導電性接着剤を用いて半導体ベアチップを
プリント基板に実装することを特徴としている。According to a third aspect of the present invention, there is provided a method of manufacturing a module component according to the first aspect, wherein the semiconductor bare chip is mounted on a printed circuit board using a conductive adhesive. I have.

【００１０】本発明の請求項４に記載のモジュール部品
の製造方法は、フィルム状の熱硬化性樹脂をプリント基
板に貼る際、前記フィルム状の熱硬化性樹脂を、ゴムシ
ートを介して、加熱、加圧することを特徴としており、
ゴムシートの弾力性を利用することにより、熱硬化性樹
脂フィルムよりも厚い表面実装部品を近接して実装して
いても、容易に熱硬化性樹脂フィルムを加圧することが
できる。According to a fourth aspect of the present invention, in the method of manufacturing a module component, when attaching the film-like thermosetting resin to a printed circuit board, the film-like thermosetting resin is heated via a rubber sheet. Is characterized by pressurizing,
By utilizing the elasticity of the rubber sheet, the thermosetting resin film can be easily pressed even when a surface-mounted component thicker than the thermosetting resin film is mounted close to the component.

【００１１】本発明の請求項５に記載のモジュール部品
の製造方法は、熱硬化性樹脂を介して、複数の半導体ベ
アチップをプリント基板にマウントし、前記複数の半導
体ベアチップを一度に加熱、加圧することにより、前記
プリント基板に接続、固定することを特徴としており、
複数の半導体ベアチップを近接して、別々に加圧するに
は、加圧装置に非常に高精度な位置決め機構が必要とな
るため、コストアップに繋がるが、一度に加熱、加圧す
ると、その課題が解決するだけでなく、更に高速でモジ
ュール形成が実現できるという効果も得られる。According to a fifth aspect of the present invention, there is provided a module component manufacturing method, wherein a plurality of semiconductor bare chips are mounted on a printed circuit board via a thermosetting resin, and the plurality of semiconductor bare chips are heated and pressed at once. By connecting to the printed circuit board, it is characterized by being fixed,
Pressing a plurality of semiconductor bare chips in close proximity and separately requires an extremely high-precision positioning mechanism in the pressurizing device, which leads to an increase in cost. In addition to solving the problem, an effect that a module can be formed at a higher speed can be obtained.

【００１２】本発明の請求項６に記載のモジュール部品
の製造方法は、複数の半導体ベアチップを、熱硬化性樹
脂を介して、プリント基板にマウントし、前記複数の半
導体ベアチップを一度に加圧し、前記プリント基板表面
からの高さを揃わせた後、前記複数の半導体ベアチップ
を一度に加熱、加圧することにより、前記プリント基板
に接続、固定することを特徴としており、請求項５と同
様の効果を狙ったもので、更に、熱硬化性樹脂を加熱す
る前に、複数の半導体ベアチップを一度に加圧して、複
数の半導体ベアチップの高さを揃えておくことにより、
熱硬化性樹脂を加圧しながら加熱する際、半導体ベアチ
ップの厚みやバンプの高さのばらつきにより生じる熱や
圧力のばらつきを低減することができる。According to a sixth aspect of the present invention, there is provided a module component manufacturing method, wherein a plurality of semiconductor bare chips are mounted on a printed circuit board via a thermosetting resin, and the plurality of semiconductor bare chips are pressed at once. 6. After the heights from the surface of the printed circuit board are equalized, the plurality of semiconductor bare chips are connected and fixed to the printed circuit board by heating and pressurizing the semiconductor bare chips at a time. In addition, before heating the thermosetting resin, by pressing multiple semiconductor bare chips at once, by aligning the height of multiple semiconductor bare chips,
When the thermosetting resin is heated while being pressurized, variations in heat and pressure caused by variations in the thickness of the semiconductor bare chip and the height of the bumps can be reduced.

【００１３】本発明の請求項７に記載のモジュール部品
の製造方法は、請求項５または６記載のモジュール部品
の製造方法において、半導体ベアチップの厚みと金バン
プの高さの合計が５μｍ以下の差になるように、金バン
プを形成してなる複数の半導体ベアチップを用いること
を特徴としており、予め半導体ベアチップの厚みと金バ
ンプの高さの合計を揃えておくことで、熱硬化性樹脂を
加圧しながら加熱する際、半導体ベアチップの厚みやバ
ンプの高さのばらつきにより生じる熱や圧力のばらつき
を低減することができる。According to a seventh aspect of the present invention, there is provided the module component manufacturing method according to the fifth or sixth aspect, wherein the sum of the thickness of the semiconductor bare chip and the height of the gold bumps is 5 μm or less. It is characterized by using a plurality of semiconductor bare chips formed with gold bumps so that the sum of the thickness of the semiconductor bare chips and the height of the gold bumps can be adjusted in advance to add a thermosetting resin. When heating while applying pressure, variations in heat and pressure caused by variations in the thickness of the semiconductor bare chip and the height of the bumps can be reduced.

【００１４】本発明の請求項８に記載のモジュール部品
の製造方法は、半導体ベアチップを表面に、表面実装部
品を裏面に実装するように回路形成したプリント基板に
半導体ベアチップと表面実装部品を実装してなることを
特徴としており、実装形態の違う半導体ベアチップと表
面実装部品をプリント基板の表裏面に分けて実装するこ
とにより、封止樹脂のはみ出しによる半導体ベアチップ
と表面実装部品の近接間隔の制約や表面実装部品の実装
によって生じるプリント基板の汚れに影響されることな
く、半導体ベアチップ及び表面実装部品を容易に実装す
ることができる。According to a second aspect of the present invention, there is provided a method of manufacturing a module component, comprising mounting the semiconductor bare chip and the surface mounted component on a printed circuit board having a circuit formed so that the semiconductor bare chip is mounted on the front surface and the surface mounted component is mounted on the back surface. By mounting semiconductor bare chips and surface mount components with different mounting forms on the front and back surfaces of the printed circuit board separately, the gap between the semiconductor bare chip and surface mount components due to the protrusion of the sealing resin is restricted. The semiconductor bare chip and the surface mount component can be easily mounted without being affected by the contamination of the printed circuit board caused by the mounting of the surface mount component.

【００１５】本発明の請求項９に記載のモジュール部品
の製造方法は、熱硬化性樹脂または導電性接着剤を用い
て半導体ベアチップをプリント基板の表面に実装した
後、表面実装部品を前記プリント基板の裏面に実装する
ことを特徴としており、請求項８記載のモジュール部品
の製造方法を示している。According to a method of manufacturing a module component according to a ninth aspect of the present invention, a semiconductor bare chip is mounted on a surface of a printed circuit board using a thermosetting resin or a conductive adhesive, and then the surface mounted component is mounted on the printed circuit board. A method for manufacturing a module component according to claim 8 is characterized in that the module component is mounted on the back surface.

【００１６】本発明の請求項１０に記載のモジュール部
品の製造方法は、請求項８記載のモジュール部品の製造
方法において、半導体ベアチップをプリント基板の表面
に実装した後、前記半導体ベアチップを研磨により薄板
化することを特徴としており、プリント基板の表裏面に
半導体ベアチップと表面実装部品を分けて実装すること
により、プリント基板の面積が小さくでき、半導体ベア
チップを研磨することにより、モジュール部品の厚みが
薄くできるため、モジュール部品の小型化を図ることが
できる。According to a tenth aspect of the present invention, in the method for manufacturing a module part according to the eighth aspect, after mounting the semiconductor bare chip on the surface of the printed circuit board, the semiconductor bare chip is polished into a thin plate. By mounting semiconductor bare chips and surface mount components separately on the front and back surfaces of a printed circuit board, the area of the printed circuit board can be reduced, and by polishing the semiconductor bare chips, the thickness of module components can be reduced. Therefore, the size of the module component can be reduced.

【００１７】本発明の請求項１１に記載のモジュール部
品の製造方法は、表面実装部品と半田バンプまたは金バ
ンプを形成してなる半導体ベアチップを、半田ペースト
を介して、プリント基板上にマウントし、一度にリフロ
ーに通すことにより、前記プリント基板に前記表面実装
部品と前記半導体ベアチップを接続、固定することを特
徴としており、表面実装部品と半導体ベアチップを同じ
工程で実装する方法を示す。According to a method of manufacturing a module component according to the present invention, a semiconductor bare chip formed with a surface mount component and a solder bump or a gold bump is mounted on a printed board via a solder paste. The method is characterized in that the surface mounting component and the semiconductor bare chip are connected and fixed to the printed circuit board by passing through the reflow at a time, and a method of mounting the surface mounting component and the semiconductor bare chip in the same process is described.

【００１８】本発明の請求項１２に記載のモジュール部
品の製造方法は、請求項１１記載のモジュール部品の製
造方法において、半導体ベアチップの実装部への半田の
印刷パターンが四角形を成すスクリーン印刷版を用い
て、半田ペーストを印刷することを特徴としており、安
定した半田ペーストの印刷条件を得るためには、スクリ
ーン印刷版の厚みに対する開口径の比がより大きいこと
が望まれるが、半導体ベアチップの端子間隔は非常に狭
いため、その条件でもより大きな開口面積の得られる四
角形を成すことにより、より安定した印刷条件を得ると
いうものである。According to a twelfth aspect of the present invention, there is provided the module component manufacturing method according to the eleventh aspect, wherein the solder printing pattern on the mounting portion of the semiconductor bare chip has a square shape. It is characterized in that the solder paste is printed, and in order to obtain stable solder paste printing conditions, it is desired that the ratio of the opening diameter to the thickness of the screen printing plate is large, but the terminal of the semiconductor bare chip is desired. Since the interval is very small, a more stable printing condition can be obtained by forming a square having a larger opening area even under the condition.

【００１９】本発明の請求項１３に記載のモジュール部
品の製造方法は、請求項１１記載のモジュール部品の製
造方法において、実装部に凹状の段差を設けたプリント
基板に半導体ベアチップ及び表面実装部品を実装するこ
とを特徴としており、スクリーン印刷版の厚みに対する
開口径の比をより大きくするためには、スクリーン印刷
版の厚みが薄いほど良いが、半田ペーストをより厚く形
成する必要のある表面実装部品には、逆効果となるた
め、プリント基板の実装部に凹状の段差を設けて、スク
リーン印刷版を薄くしても、半田ペーストを厚く形成で
きるようにする。According to a thirteenth aspect of the present invention, there is provided the module component manufacturing method according to the eleventh aspect, wherein the semiconductor bare chip and the surface mounting component are mounted on a printed circuit board having a recessed step in a mounting portion. In order to increase the ratio of the opening diameter to the thickness of the screen printing plate, the smaller the thickness of the screen printing plate is, the better it is, but it is necessary to form a thicker solder paste. Therefore, a concave step is provided in the mounting portion of the printed circuit board so that the solder paste can be formed thick even if the screen printing plate is made thin.

【００２０】本発明の請求項１４に記載のモジュール部
品の製造方法は、請求項１３記載のモジュール部品の製
造方法において、電極の周囲にソルダーレジストを形成
することにより、ソルダーレジストの厚みを用いて、凹
状の段差を設けることを特徴としている。According to a fourteenth aspect of the present invention, in the method for manufacturing a module part according to the thirteenth aspect, a solder resist is formed around the electrode to thereby use the thickness of the solder resist. , A concave step is provided.

【００２１】本発明の請求項１５に記載のモジュール部
品の製造方法は、請求項１３記載のモジュール部品の製
造方法において、電極の周囲にソルダーレジストを形成
し、エッチングにより、電極に凹状の段差を形成するこ
とを特徴としている。According to a fifteenth aspect of the present invention, in the method for manufacturing a module component according to the thirteenth aspect, a solder resist is formed around the electrode, and a concave step is formed on the electrode by etching. It is characterized by forming.

【００２２】本発明の請求項１６に記載のモジュール部
品の製造方法は、フラックスを介して、半田バンプを形
成してなる半導体ベアチップをプリント基板にマウント
し、半田ペーストを介して、表面実装部品を前記プリン
ト基板にマウントし、一度に半田バンプが溶融する温度
条件のリフローへ通すことにより、前記プリント基板に
前記半導体ベアチップと前記表面実装部品を接続、固定
することを特徴としており、半田ペーストの印刷が困難
な半導体ベアチップは、フラックスを使ってマウント
し、半田バンプを溶融させることによって、プリント基
板との接続、固定を行うことにより、表面実装部品との
一括実装が容易に実現できるようになる。According to a method of manufacturing a module component according to a sixteenth aspect of the present invention, a semiconductor bare chip having solder bumps formed thereon is mounted on a printed board via a flux, and the surface mount component is mounted via a solder paste. The semiconductor bare chip and the surface mount component are connected and fixed to the printed board by mounting on the printed board and passing through a reflow at a temperature condition at which the solder bump melts at a time, and printing of solder paste. A semiconductor bare chip, which is difficult to mount, can be easily mounted together with a surface mount component by mounting and using a flux, melting a solder bump, and connecting and fixing to a printed circuit board.

【００２３】本発明の請求項１７に記載のモジュール部
品の製造方法は、半導体ベアチップを実装したプリント
基板の前記半導体ベアチップ実装部の反対面に、前記半
導体ベアチップのサイズと同等もしくは小さい別の半導
体ベアチップを、熱硬化性樹脂を用いて実装することを
特徴としており、反対面に実装しようとする半導体ベア
チップに加圧する際、既に実装済みの半導体ベアチップ
がその圧力を前面で受けるため、均等に圧力が加えら
れ、半導体ベアチップの安定した接続、固定が実現でき
る。The method for manufacturing a module component according to claim 17, wherein another semiconductor bare chip having a size equal to or smaller than the size of the semiconductor bare chip is provided on a surface of the printed board on which the semiconductor bare chip is mounted, opposite to the semiconductor bare chip mounting portion. Is mounted using a thermosetting resin, and when pressure is applied to the semiconductor bare chip to be mounted on the opposite surface, the already mounted semiconductor bare chip receives the pressure on the front surface, so the pressure is evenly distributed. In addition, stable connection and fixation of the semiconductor bare chip can be realized.

【００２４】本発明の請求項１８に記載のモジュール部
品の製造方法は、プリント基板の表面に、１個もしくは
複数個の半導体ベアチップを、熱硬化性樹脂を用いて実
装した後、前記プリント基板の裏面に、別の１個もしく
は複数個の半導体ベアチップを、熱硬化性樹脂を用いて
実装してなるモジュール部品において、プリント基板の
表面への実装に用いる熱硬化性樹脂のガラス転移点温度
よりも低い温度で前記プリント基板の裏面の熱硬化性樹
脂を硬化させることを特徴としており、既に硬化した表
面の熱硬化性樹脂が軟化しないガラス転移点以下の温度
で、裏面の熱硬化性樹脂を硬化させることにより、表面
の半導体ベアチップの実装部に再度圧力を加えて破壊す
ることを防止する。According to a method of manufacturing a module component according to the present invention, one or more semiconductor bare chips are mounted on a surface of a printed circuit board using a thermosetting resin, and then the printed circuit board is mounted on the printed circuit board. In a module component in which another one or more semiconductor bare chips are mounted on the back surface using a thermosetting resin, the temperature is higher than the glass transition temperature of the thermosetting resin used for mounting on the surface of the printed circuit board. It is characterized in that the thermosetting resin on the back surface of the printed circuit board is cured at a low temperature, and the thermosetting resin on the back surface is cured at a temperature not higher than the glass transition point at which the thermosetting resin on the already cured surface does not soften. By doing so, it is possible to prevent the mounting portion of the semiconductor bare chip on the surface from being damaged by applying pressure again.

【００２５】本発明の請求項１９に記載のモジュール部
品の製造方法は、プリント基板の表面に、１個もしくは
複数個の半導体ベアチップを実装し、更に前記プリント
基板の表面を樹脂モールド成型した後、前記プリント基
板の裏面に、別の１個もしくは複数個の半導体ベアチッ
プを、熱硬化性樹脂を用いて実装することを特徴として
おり、表面の既に実装済みの半導体ベアチップを樹脂モ
ールド成型することにより、表面が平坦化するため、裏
面に実装しようとする半導体ベアチップに均等に圧力が
加えられるだけでなく、裏面の半導体ベアチップに圧力
を加えた時、表面の半導体を壊すことが防止できる。According to a method of manufacturing a module component according to a nineteenth aspect of the present invention, one or more semiconductor bare chips are mounted on a surface of a printed circuit board, and further, the surface of the printed circuit board is molded with a resin. On the back surface of the printed circuit board, another one or more semiconductor bare chips are characterized by being mounted using a thermosetting resin, and the already mounted semiconductor bare chips on the front surface are molded by resin molding. Since the front surface is flattened, not only is the pressure applied evenly to the semiconductor bare chip to be mounted on the back surface, but also the semiconductor on the front surface can be prevented from being broken when pressure is applied to the semiconductor bare chip on the back surface.

【００２６】本発明の請求項２０に記載のモジュール部
品の製造方法は、プリント基板の表面に、１個もしくは
複数個の半導体ベアチップを、熱硬化性樹脂を用いて実
装した後、前記プリント基板の裏面に、別の１個もしく
は複数個の半導体ベアチップを、半田ペーストまたは導
電性接着剤を用いて実装することを特徴としており、何
も実装されていないプリント基板の表面には、熱硬化性
樹脂を用いて半導体ベアチップを実装し、裏面には、半
導体ベアチップを実装する際、既に実装済みの部品によ
る制約を受け難い、半田ペーストまたは導電性接着剤を
用いて、モジュール形成を行う。According to a twentieth aspect of the present invention, in the method of manufacturing a module component, one or a plurality of semiconductor bare chips are mounted on a surface of a printed circuit board using a thermosetting resin, and then the printed circuit board is mounted. One or more semiconductor bare chips are mounted on the back side using a solder paste or a conductive adhesive, and the surface of the printed circuit board on which nothing is mounted is a thermosetting resin. A semiconductor bare chip is mounted by using a solder paste, and a module is formed on the rear surface by using a solder paste or a conductive adhesive, which is hardly restricted by components already mounted when mounting the semiconductor bare chip.

【００２７】（実施の形態１）本発明の実施の形態１に
ついて、図を用いて説明する。(Embodiment 1) Embodiment 1 of the present invention will be described with reference to the drawings.

【００２８】図１は、実施の形態１でのモジュール部品
の製造方法を示す工程図である。図１において、１は表
面実装部品、２は半田ペースト、３はプリント基板、４
は基板の汚れ、５は加熱・加圧手段、６はゴムシート、
７は熱硬化性樹脂、８は保護シート、９は半導体ベアチ
ップ、１０は金バンプを示す。FIG. 1 is a process chart showing a method for manufacturing a module component according to the first embodiment. In FIG. 1, 1 is a surface mount component, 2 is a solder paste, 3 is a printed board,
Is a substrate stain, 5 is a heating / pressing means, 6 is a rubber sheet,
7 is a thermosetting resin, 8 is a protective sheet, 9 is a semiconductor bare chip, and 10 is a gold bump.

【００２９】実施の形態１での工程は、図１に示すよう
に、まず、（工程ａ）半田ペースト２を塗布したプリン
ト基板３に表面実装部品１を位置決めした後、マウント
し、（工程ｂ）リフローに通すことにより、半田ペース
ト２を溶融させて、表面実装部品１をプリント基板３に
接続、固定し、（工程ｃ）プリント基板３を洗浄後、
（工程ｄ）ゴムシート６を介して、熱硬化性樹脂７を加
熱・加圧手段５を用いて加熱・加圧することにより、プ
リント基板３に貼り付け、（工程ｅ）複数の半導体ベア
チップ９をプリント基板３に位置決めした後、貼り付け
した熱硬化性樹脂７を介して、マウントし、最後に、
（工程ｆ）複数の半導体ベアチップ９を同時に加熱・加
圧手段５を用いて加熱・加圧することにより、プリント
基板３に接続、固定する。As shown in FIG. 1, the steps in the first embodiment are as follows. (Step a) First, the surface mount component 1 is positioned on the printed circuit board 3 on which the solder paste 2 has been applied, and then mounted (Step b). ) Through the reflow, the solder paste 2 is melted, and the surface mount component 1 is connected and fixed to the printed circuit board 3. (Step c) After the printed circuit board 3 is washed,
(Step d) The thermosetting resin 7 is heated and pressurized by using the heating and pressurizing means 5 via the rubber sheet 6 to be attached to the printed circuit board 3 (Step e). After positioning on the printed circuit board 3, it is mounted via the attached thermosetting resin 7, and finally,
(Step f) The plurality of semiconductor bare chips 9 are connected to and fixed to the printed circuit board 3 by simultaneously heating and pressurizing the semiconductor bare chips 9 using the heating and pressurizing means 5.

【００３０】まず、本発明では、半導体ベアチップを用
いてモジュール部品を形成するため、従来の半導体パッ
ケージを用いる場合と比べ、大幅なモジュール部品の小
型化が実現できる。さらに、表面実装部品を先に実装し
た後、半導体ベアチップを実装することにより、半導体
ベアチップを保護する封止樹脂のはみ出しに影響され
ず、表面実装部品を半導体ベアチップに近接して実装す
ることができ、更にモジュール部品の小型化が実現でき
る。また、半田ペーストを用いて表面実装部品を実装し
た後では、封止樹脂の性能を劣化させるプリント基板表
面の汚れを生じるが、半導体ベアチップの実装の前に、
プリント基板の洗浄を行うことにより、封止樹脂の性能
を最大限に引き出すことができる。First, in the present invention, since a module component is formed using a semiconductor bare chip, it is possible to realize a significant reduction in the size of the module component as compared with the case where a conventional semiconductor package is used. Further, by mounting the semiconductor bare chip after mounting the surface mount component first, the surface mount component can be mounted close to the semiconductor bare chip without being affected by the protrusion of the sealing resin for protecting the semiconductor bare chip. In addition, downsizing of module components can be realized. In addition, after mounting the surface mount components using solder paste, the surface of the printed circuit board becomes dirty, which degrades the performance of the sealing resin, but before mounting the semiconductor bare chip,
By cleaning the printed circuit board, the performance of the sealing resin can be maximized.

【００３１】なお、ここでは、フィルム状の熱硬化性樹
脂を用いた例を示しているが、ペースト状の熱硬化性樹
脂でも同様の効果が得られる。ただし、この場合、（工
程ｄ）の工程は、プリント基板に熱硬化性樹脂ペースト
を塗布する工程に変わる。Although an example using a film-like thermosetting resin is shown here, the same effect can be obtained with a paste-like thermosetting resin. However, in this case, the step (step d) is replaced with a step of applying a thermosetting resin paste to the printed circuit board.

【００３２】（実施の形態２）本発明の実施の形態２に
ついて、図を用いて説明する。(Embodiment 2) Embodiment 2 of the present invention will be described with reference to the drawings.

【００３３】図２は、実施の形態２でのモジュール部品
の製造方法を示す工程図である。図２において、１は表
面実装部品、２は半田ペースト、３はプリント基板、４
は基板の汚れ、９は半導体ベアチップ、１０は金バン
プ、１１は導電性接着剤、１２は封止樹脂を示す。FIG. 2 is a process chart showing a method for manufacturing a module component according to the second embodiment. In FIG. 2, 1 is a surface mount component, 2 is a solder paste, 3 is a printed board,
Denotes a substrate stain, 9 denotes a semiconductor bare chip, 10 denotes a gold bump, 11 denotes a conductive adhesive, and 12 denotes a sealing resin.

【００３４】実施の形態２での工程は、図２に示すよう
に、まず、（工程ａ）半田ペースト２を塗布したプリン
ト基板３に表面実装部品１を位置決めした後、マウント
し、（工程ｂ）リフローに通すことにより、半田ペース
ト２を溶融させて、表面実装部品１をプリント基板３に
接続、固定し、（工程ｃ）プリント基板３を洗浄後、
（工程ｄ）金バンプ１０に導電性接着剤１１を転写した
複数の半導体ベアチップ９をプリント基板３に位置決め
した後、マウントし、さらに、（工程ｅ）プリント基板
３と複数の半導体ベアチップ９の間に封止樹脂１２を充
填して、最後に、（工程ｆ）封止樹脂１２を硬化するこ
とにより、複数の半導体ベアチップ９をプリント基板３
に接続、固定する。As shown in FIG. 2, the steps in the second embodiment are as follows. (Step a) First, the surface mount component 1 is positioned on the printed circuit board 3 to which the solder paste 2 has been applied, and then mounted (Step b). ) Through the reflow, the solder paste 2 is melted, and the surface mount component 1 is connected and fixed to the printed circuit board 3. (Step c) After the printed circuit board 3 is washed,
(Step d) A plurality of semiconductor bare chips 9 having the conductive adhesive 11 transferred to the gold bumps 10 are positioned on the printed circuit board 3 and then mounted. (Step e) Between the printed board 3 and the plurality of semiconductor bare chips 9 Is filled with the sealing resin 12, and finally (step f) the sealing resin 12 is cured, so that the plurality of semiconductor bare chips 9 are
Connect to and fix.

【００３５】本発明でも実施の形態１と同様の効果が得
られる。According to the present invention, the same effect as in the first embodiment can be obtained.

【００３６】（実施の形態３）本発明の実施の形態３に
ついて、図を用いて説明する。(Embodiment 3) Embodiment 3 of the present invention will be described with reference to the drawings.

【００３７】図３は、実施の形態３でのモジュール部品
の製造方法を示す工程図である。図３において、１は表
面実装部品、３はプリント基板、５は加熱・加圧手段、
７は熱硬化性樹脂、９は半導体ベアチップ、１０は金バ
ンプ、１３は加圧手段を示す。FIG. 3 is a process chart showing a method for manufacturing a module component according to the third embodiment. In FIG. 3, 1 is a surface mount component, 3 is a printed circuit board, 5 is a heating / pressing means,
Reference numeral 7 denotes a thermosetting resin, 9 denotes a semiconductor bare chip, 10 denotes a gold bump, and 13 denotes a pressing unit.

【００３８】実施の形態３での工程は、実施の形態１で
の（工程ａ）から（工程ｅ）までは同じで、それ以降が
違う。図３に示すように、（工程ａ）複数の半導体ベア
チップ９をプリント基板３に位置決めした後、マウント
し、（工程ｂ）複数の半導体ベアチップ９を同時に加圧
することにより、プリント基板３表面からの複数の半導
体ベアチップ９の高さを揃え、その後、（工程ｃ）熱硬
化性樹脂７を加熱・加圧することにより、複数の半導体
ベアチップ９を、一度にプリント基板３に接続、固定す
る。The steps in the third embodiment are the same from (step a) to (step e) in the first embodiment, and the subsequent steps are different. As shown in FIG. 3, (step a) the plurality of semiconductor bare chips 9 are positioned on the printed board 3, and then mounted, and (step b) the plurality of semiconductor bare chips 9 are simultaneously pressed, so that the The heights of the plurality of semiconductor bare chips 9 are made uniform, and then (step c) the thermosetting resin 7 is heated and pressed to connect and fix the plurality of semiconductor bare chips 9 to the printed circuit board 3 at once.

【００３９】熱硬化性樹脂を用いて半導体ベアチップを
実装する場合、熱硬化性樹脂を硬化する際、所望の加熱
・加圧条件を熱硬化性樹脂に加える必要があるが、半導
体ベアチップの厚みや金バンプの高さのばらつきによ
り、複数の半導体ベアチップ間で加熱・加圧条件にばら
つきが生じ、複数の半導体ベアチップに所望の加熱・加
圧条件を同時に加えることが困難となる。本発明では、
予め複数の半導体ベアチップをプリント基板上で同時に
加圧しておくことにより、プリント基板表面からの複数
の半導体ベアチップの高さが揃えられ、複数の半導体ベ
アチップを同時に加熱・加圧しても、ばらつきを最小限
に抑えることができる。When a semiconductor bare chip is mounted using a thermosetting resin, it is necessary to apply desired heating and pressing conditions to the thermosetting resin when the thermosetting resin is cured. Variations in the height of the gold bumps cause variations in the heating and pressing conditions among the plurality of semiconductor bare chips, making it difficult to simultaneously apply desired heating and pressing conditions to the plurality of semiconductor bare chips. In the present invention,
By simultaneously pressing a plurality of semiconductor bare chips on the printed circuit board at the same time, the height of the plurality of semiconductor bare chips from the printed circuit board surface is aligned, and even if the plurality of semiconductor bare chips are simultaneously heated and pressed, the variation is minimized. Can be minimized.

【００４０】（実施の形態４）本発明の実施の形態４に
ついて、図を用いて説明する。(Embodiment 4) Embodiment 4 of the present invention will be described with reference to the drawings.

【００４１】図４は、実施の形態４でのモジュール部品
の製造方法を示す工程図である。図４において、１は表
面実装部品、３はプリント基板、５は加熱・加圧手段、
７は熱硬化性樹脂、９は半導体ベアチップ、１０は金バ
ンプ、１４はレベリング台を示す。FIG. 4 is a process chart showing a method for manufacturing a module component according to the fourth embodiment. In FIG. 4, 1 is a surface mount component, 3 is a printed board, 5 is a heating / pressing means,
Reference numeral 7 denotes a thermosetting resin, 9 denotes a semiconductor bare chip, 10 denotes a gold bump, and 14 denotes a leveling table.

【００４２】実施の形態４での工程は、実施の形態１で
の（工程ａ）から（工程ｄ）までは同じで、それ以降が
違う。図４に示すように、まず、（工程ａ）複数の半導
体ベアチップ９をレベリング台１４に加圧することによ
り、半導体ベアチップ９の厚みと金バンプ１０の高さの
合計を揃え、（工程ｂ）複数の半導体ベアチップ９をプ
リント基板３に位置決めした後、貼り付けした熱硬化性
樹脂７を介して、マウントし、最後に、（工程ｃ）複数
の半導体ベアチップ９を同時に加熱・加圧することによ
り、プリント基板３に接続、固定する。The steps in the fourth embodiment are the same from (step a) to (step d) in the first embodiment, and the subsequent steps are different. As shown in FIG. 4, first, (step a) a plurality of semiconductor bare chips 9 are pressed against the leveling table 14 so that the total of the thickness of the semiconductor bare chips 9 and the height of the gold bumps 10 are aligned. After positioning the semiconductor bare chip 9 on the printed circuit board 3, the semiconductor bare chip 9 is mounted via the attached thermosetting resin 7, and finally (step c), a plurality of semiconductor bare chips 9 are simultaneously heated and pressed to perform printing. It is connected to the substrate 3 and fixed.

【００４３】本発明のように、実装する前に予め半導体
ベアチップの厚みと金バンプの高さの合計を揃えておく
ことにより、実施の形態３と同様、複数の半導体ベアチ
ップ間での加熱・加圧条件のばらつきを抑えることがで
きる。As in the present invention, by making the total of the thickness of the semiconductor bare chip and the height of the gold bump in advance before mounting, as in the third embodiment, heating / heating between a plurality of semiconductor bare chips is performed. Variations in pressure conditions can be suppressed.

【００４４】なお、本説明では、金バンプを加圧してレ
ベリングすることにより、ばらつきを抑える方法を示し
ているが、予め半導体ベアチップの厚みを計測し、その
計測結果に基づいて算出した高さで金バンプを形成して
も同様の効果が得られる。In this description, a method of suppressing the variation by pressing and leveling the gold bump is shown. However, the thickness of the semiconductor bare chip is measured in advance, and the height is calculated based on the measurement result. Similar effects can be obtained by forming gold bumps.

【００４５】また、本実施の形態４と実施の形態３を組
み合わせて、モジュール部品の製造工程を構築すれば、
更にその効果を増すことができる。Further, by combining the fourth embodiment and the third embodiment and constructing a module component manufacturing process,
Further, the effect can be increased.

【００４６】（実施の形態５）本発明の実施の形態５に
ついて、図を用いて説明する。(Fifth Embodiment) A fifth embodiment of the present invention will be described with reference to the drawings.

【００４７】図５は、実施の形態５でのモジュール部品
の製造方法を示す工程図である。図５において、１は表
面実装部品、２は半田ペースト、３はプリント基板、５
は加熱・加圧手段、７は熱硬化性樹脂、９は半導体ベア
チップ、１０は金バンプ、１５は研磨機を示す。FIG. 5 is a process chart showing a method for manufacturing a module component according to the fifth embodiment. In FIG. 5, 1 is a surface mount component, 2 is a solder paste, 3 is a printed circuit board, 5
Denotes a heating / pressing means, 7 denotes a thermosetting resin, 9 denotes a semiconductor bare chip, 10 denotes a gold bump, and 15 denotes a polishing machine.

【００４８】実施の形態５での工程は、図５に示すよう
に、まず、（工程ａ）複数の半導体ベアチップ９をプリ
ント基板３の表面に位置決めした後、貼り付けした熱硬
化性樹脂７を介して、マウントし、（工程ｂ）複数の半
導体ベアチップ９を加熱・加圧することにより、プリン
ト基板３に接続、固定し、（工程ｃ）裏面に半田ペース
ト２を塗布したプリント基板３に表面実装部品１を位置
決めした後、マウントし、（工程ｄ）リフローに通すこ
とにより、半田ペースト２を溶融させて、表面実装部品
１をプリント基板３に接続、固定し、（工程ｅ）半導体
ベアチップ９を研磨することにより、モジュール部品の
薄型化を図る。As shown in FIG. 5, the steps in the fifth embodiment are as follows: (Step a) After positioning a plurality of semiconductor bare chips 9 on the surface of the printed circuit board 3, the attached thermosetting resin 7 is removed. (Step b) Connect and fix the plurality of semiconductor bare chips 9 to the printed circuit board 3 by heating and pressing, and (Step c) Surface mount the printed circuit board 3 with the solder paste 2 applied to the back surface After the component 1 is positioned, it is mounted and (step d) is passed through reflow to melt the solder paste 2 and connect and fix the surface mount component 1 to the printed circuit board 3 (step e) to attach the semiconductor bare chip 9 The polishing reduces the thickness of the module component.

【００４９】本発明では、実装形態の違う半導体ベアチ
ップと表面実装部品をプリント基板の表裏面に分けて実
装することにより、封止樹脂のはみ出しによる半導体ベ
アチップと表面実装部品の近接間隔の制約や表面実装部
品の実装によって生じるプリント基板の汚れに影響され
ることなく、半導体ベアチップ及び表面実装部品を容易
に実装することができる。また、プリント基板の表裏面
に半導体ベアチップと表面実装部品を分けて実装するこ
とにより、プリント基板の面積が小さくでき、半導体ベ
アチップを研磨することにより、モジュール部品の厚み
が薄くできるため、モジュール部品の小型化も図ること
ができる。According to the present invention, the semiconductor bare chip and the surface-mounted component having different mounting forms are mounted separately on the front and back surfaces of the printed circuit board, thereby restricting the proximity distance between the semiconductor bare chip and the surface-mounted component due to the protrusion of the sealing resin and the surface. The semiconductor bare chip and the surface mount component can be easily mounted without being affected by the contamination of the printed circuit board caused by the mounting of the mount component. Also, by separately mounting the semiconductor bare chip and the surface mount component on the front and back surfaces of the printed circuit board, the area of the printed circuit board can be reduced, and by polishing the semiconductor bare chip, the thickness of the module component can be reduced. The size can also be reduced.

【００５０】（実施の形態６）本発明の実施の形態６に
ついて、図を用いて説明する。Embodiment 6 Embodiment 6 of the present invention will be described with reference to the drawings.

【００５１】図６は、実施の形態６でのモジュール部品
の製造方法を示す工程図である。図６において、１は表
面実装部品、２は半田ペースト、３はプリント基板、９
は半導体ベアチップ、１２は封止樹脂、１６はスクリー
ン印刷版、１７は開口部、１８は半田バンプ、１９はソ
ルダーレジストを示す。FIG. 6 is a process chart showing a method for manufacturing a module component according to the sixth embodiment. In FIG. 6, 1 is a surface mount component, 2 is a solder paste, 3 is a printed circuit board, 9
Denotes a semiconductor bare chip, 12 denotes a sealing resin, 16 denotes a screen printing plate, 17 denotes an opening, 18 denotes a solder bump, and 19 denotes a solder resist.

【００５２】実施の形態６での工程は、図６に示すよう
に、まず、（工程ａ）半田ペーストを印刷する部分を凹
状に形成したプリント基板３にスクリーン印刷を用いて
半田ペースト２を印刷し、（工程ｂ）半田バンプを形成
した半導体ベアチップ９と表面実装部品１をプリント基
板３に位置決めした後、マウントし、（工程ｃ）リフロ
ーに通すことにより、半田ペースト２を溶融させて、半
導体ベアチップ９と表面実装部品１をプリント基板３に
接続し、（工程ｄ）プリント基板３と半導体ベアチップ
９の間に封止樹脂１２を充填して、最後に、（工程ｅ）
封止樹脂１２を硬化することにより、半導体ベアチップ
９をプリント基板３に固定する。In the process of the sixth embodiment, as shown in FIG. 6, first, (step a) solder paste 2 is printed by screen printing on a printed circuit board 3 in which a portion for printing the solder paste is formed in a concave shape. (Step b) After positioning the semiconductor bare chip 9 on which the solder bumps have been formed and the surface mount component 1 on the printed circuit board 3, mounting the same, and (Step c) reflowing the solder paste 2 to melt the semiconductor paste The bare chip 9 and the surface mount component 1 are connected to the printed circuit board 3 (step d), and the sealing resin 12 is filled between the printed board 3 and the semiconductor bare chip 9, and finally (step e).
The semiconductor bare chip 9 is fixed to the printed board 3 by curing the sealing resin 12.

【００５３】本発明のモジュール部品の製造方法は、半
導体ベアチップと表面実装部品を、同じ半田ペーストを
用いて、同時にプリント基板に接続する方法を示す。そ
れを実現するためには、半導体ベアチップを実装する部
品に安定した半田ペースト印刷を行う必要がある。ま
た、安定した半田ペーストの印刷条件を得るためには、
スクリーン印刷版の厚みに対する開口径の比がより大き
いことが望まれる。そこで、開口部をより大きな面積の
得られる四角形にする。さらに、スクリーン印刷版の厚
みに対する開口径の比をより大きくするためには、スク
リーン印刷版の厚みが薄いほど良いが、半田ペーストを
より厚く形成する必要のある表面実装部品には、逆効果
となるため、プリント基板の実装部に凹状の段差を設け
て、スクリーン印刷版を薄くしても、半田ペーストを厚
く形成できるようにする。また、凹状の段差は、電極の
周囲にソルダーレジストを形成することにより、ソルダ
ーレジストの厚みを用いて形成する方法や、エッチング
により形成する方法で容易に実現できる。The method for manufacturing a module component according to the present invention shows a method for simultaneously connecting a semiconductor bare chip and a surface mount component to a printed circuit board using the same solder paste. In order to realize this, it is necessary to perform stable solder paste printing on a component on which a semiconductor bare chip is mounted. Also, in order to obtain stable solder paste printing conditions,
It is desired that the ratio of the opening diameter to the thickness of the screen printing plate is larger. Therefore, the opening is formed in a square shape with a larger area. Furthermore, in order to increase the ratio of the opening diameter to the thickness of the screen printing plate, the smaller the thickness of the screen printing plate is, the better. However, for a surface mount component that needs to form a thicker solder paste, the opposite effect is obtained. Therefore, a concave step is provided in the mounting portion of the printed circuit board so that the solder paste can be formed thick even if the screen printing plate is thinned. Further, the concave step can be easily realized by forming a solder resist around the electrode, using a method using the thickness of the solder resist or a method using etching.

【００５４】なお、本説明では、半田バンプを形成した
半導体ベアチップを用いた場合を示しているが、金バン
プを用いた場合でも同様の効果が得られる。In the present description, the case where a semiconductor bare chip having solder bumps formed thereon is used, but the same effect can be obtained when gold bumps are used.

【００５５】（実施の形態７）本発明の実施の形態７に
ついて、図を用いて説明する。(Embodiment 7) Embodiment 7 of the present invention will be described with reference to the drawings.

【００５６】図７は、実施の形態７でのモジュール部品
の製造方法を示す工程図である。図７において、１は表
面実装部品、２は半田ペースト、３はプリント基板、９
は半導体ベアチップ、１２は封止樹脂、１８は半田バン
プ、２０はフラックスを示す。FIG. 7 is a process chart showing a method for manufacturing a module component according to the seventh embodiment. In FIG. 7, 1 is a surface mount component, 2 is a solder paste, 3 is a printed circuit board, 9
Denotes a semiconductor bare chip, 12 denotes a sealing resin, 18 denotes a solder bump, and 20 denotes a flux.

【００５７】実施の形態７での工程は、図７に示すよう
に、まず、（工程ａ）表面実装部品の実装部に半田ペー
スト２を印刷したプリント基板３に表面実装部品１と、
半田バンプ１８にフラックス２０を転写した半導体ベア
チップ９を位置決めした後、マウントし、（工程ｂ）半
田バンプ１８を溶融できる温度条件のリフローに通すこ
とにより、半導体ベアチップ９と表面実装部品１をプリ
ント基板３に接続し、（工程ｃ）プリント基板３と半導
体ベアチップ９の間に封止樹脂１２を充填して、最後
に、（工程ｄ）封止樹脂１２を硬化することにより、半
導体ベアチップ９をプリント基板３に固定する。As shown in FIG. 7, the steps in the seventh embodiment are as follows. (Step a) First, the surface mount component 1 is printed on the printed board 3 on which the solder paste 2 is printed on the mounting portion of the surface mount component.
After positioning the semiconductor bare chip 9 on which the flux 20 has been transferred to the solder bumps 18, the semiconductor bare chip 9 and the surface mount component 1 are mounted on the printed circuit board by passing through a reflow process at a temperature condition at which the solder bumps 18 can be melted. 3, (step c) the sealing resin 12 is filled between the printed board 3 and the semiconductor bare chip 9, and finally (step d) the sealing resin 12 is cured to print the semiconductor bare chip 9. It is fixed to the substrate 3.

【００５８】本発明のモジュール部品の製造方法は、表
面実装部品と半導体ベアチップを同じ工程で実装する方
法を示す。実施の形態６と類似した実装工程であるが、
半田ペーストの印刷が困難な半導体ベアチップ実装部に
は、半田ペーストを供給せずに、半田バンプに転写した
フラックスの粘着性を利用して半導体ベアチップをプリ
ント基板にマウントし、半田バンプを溶融させる温度条
件のリフローに通すことにより、この半田バンプによる
半導体ベアチップの接続を実現する。本方法では、半田
ペースト印刷の困難な半導体ベアチップ実装部に半田ペ
ーストを供給しなくても、表面実装部品同様、リフロー
によって半導体ベアチップの実装を行えるため、容易に
表面実装部品の実装と半導体ベアチップの実装を同じ工
程で実現することができる。The method for manufacturing a module component of the present invention shows a method for mounting a surface mount component and a semiconductor bare chip in the same process. Although the mounting process is similar to that of the sixth embodiment,
The temperature at which the semiconductor bare chip is mounted on the printed circuit board using the adhesiveness of the flux transferred to the solder bump without supplying the solder paste to the semiconductor bare chip mounting part where printing of the solder paste is difficult, and the solder bump is melted By passing through the condition reflow, connection of the semiconductor bare chip by the solder bumps is realized. In this method, the semiconductor bare chip can be mounted by reflow as well as the surface mounted component without supplying the solder paste to the semiconductor bare chip mounting part where solder paste printing is difficult. The mounting can be realized in the same process.

【００５９】（実施の形態８）本発明の実施の形態８に
ついて、図を用いて説明する。Embodiment 8 Embodiment 8 of the present invention will be described with reference to the drawings.

【００６０】図８は、実施の形態８でのモジュール部品
を示す断面図である。図８において、３はプリント基
板、５は加熱・加圧手段、７ａは熱硬化性樹脂１、７ｂ
は熱硬化性樹脂２、９ａは半導体ベアチップ１、９ｂは
半導体ベアチップ２、１０は金バンプ、２１はステー
ジ、２２はモールド樹脂を示す。FIG. 8 is a sectional view showing a module component according to the eighth embodiment. In FIG. 8, 3 is a printed circuit board, 5 is a heating / pressing means, 7a is a thermosetting resin 1, 7b
Denotes a thermosetting resin 2, 9a denotes a semiconductor bare chip 1, 9b denotes a semiconductor bare chip 2, 10 denotes a gold bump, 21 denotes a stage, and 22 denotes a molding resin.

【００６１】本実施の形態８は、プリント基板の表面に
半導体ベアチップを実装した後、裏面に半導体ベアチッ
プを、熱硬化性樹脂を用いて実装する場合についての発
明である。Embodiment 8 is an invention in which a semiconductor bare chip is mounted on the front surface of a printed circuit board, and then the semiconductor bare chip is mounted on the back surface using a thermosetting resin.

【００６２】熱硬化性樹脂を用いて半導体ベアチップを
確実に実装するためには、半導体ベアチップに均等に圧
力を加える必要がある。例えば、図８（ｃ）は、悪い例
で、プリント基板３の裏面に半導体ベアチップ９ｂを、
熱硬化性樹脂７ｂを用いて実装しようとした場合、表面
に既に半導体ベアチップ９ｂよりも面積の小さい半導体
ベアチップ９ａが実装されていると、圧力が均等に掛け
られず、半導体ベアチップ９ｂの安定した接続、固定が
できない。そこで、裏面に半導体ベアチップを実装する
際、均等に圧力を掛けられるようにするため、図８
（ａ）に示すように、プリント基板の表面に先に実装す
る半導体ベアチップには、裏面に実装する半導体ベアチ
ップよりも大きな面積を有したものを用いる方法と、図
８（ｂ）に示すように、プリント基板の表面を樹脂モー
ルド成型して平坦化する方法を提案する。さらに、前者
の方法では、表面の熱硬化性樹脂が軟化しないガラス転
移点以下の温度で、裏面の熱硬化性樹脂を硬化させるこ
とにより、表面の半導体ベアチップの実装部に再度圧力
を加えて破壊することも防止できる。In order to reliably mount the semiconductor bare chip using the thermosetting resin, it is necessary to apply pressure evenly to the semiconductor bare chip. For example, FIG. 8C shows a bad example in which a semiconductor bare chip 9 b is
When the mounting is performed using the thermosetting resin 7b, if the semiconductor bare chip 9a having a smaller area than the semiconductor bare chip 9b is already mounted on the surface, the pressure is not evenly applied and the semiconductor bare chip 9b is stably connected. , Cannot be fixed. Therefore, when mounting the semiconductor bare chip on the back surface, in order to apply pressure evenly, FIG.
As shown in FIG. 8A, a semiconductor bare chip mounted first on the front surface of a printed circuit board has a larger area than a semiconductor bare chip mounted on the back surface, and as shown in FIG. A method for flattening the surface of a printed circuit board by resin molding is proposed. Furthermore, in the former method, the thermosetting resin on the back surface is cured at a temperature equal to or lower than the glass transition point at which the thermosetting resin on the front surface does not soften, thereby applying pressure again to the mounting portion of the semiconductor bare chip on the front surface and breaking it. Can also be prevented.

【００６３】なお、図８（ｂ）では、プリント基板の表
面に半導体ベアチップを実装する方法として、熱硬化性
樹脂を用いて行うように示しているが、その方法に限定
されず、その他の例えば、導電性接着剤による方法や半
田による方法やワイヤーボンディングによる方法でも同
様の効果が得られる。FIG. 8 (b) shows a method of mounting a semiconductor bare chip on the surface of a printed circuit board by using a thermosetting resin. However, the method is not limited to this method. The same effect can be obtained by a method using a conductive adhesive, a method using solder, or a method using wire bonding.

【００６４】（実施の形態９）本発明の実施の形態９に
ついて、図を用いて説明する。Embodiment 9 Embodiment 9 of the present invention will be described with reference to the drawings.

【００６５】図９は、実施の形態９でのモジュール部品
の製造方法を示す工程図である。図９において、３はプ
リント基板、５は加熱・加圧手段、７は熱硬化性樹脂、
９ａ，９ｂは半導体ベアチップ、１０は金バンプ、１１
は導電性接着剤、１２は封止樹脂を示す。FIG. 9 is a process chart showing a method for manufacturing a module component according to the ninth embodiment. In FIG. 9, 3 is a printed circuit board, 5 is a heating / pressing means, 7 is a thermosetting resin,
9a, 9b are semiconductor bare chips, 10 is gold bumps, 11
Denotes a conductive adhesive, and 12 denotes a sealing resin.

【００６６】実施の形態９での工程は、図９に示すよう
に、まず、（工程ａ）半導体ベアチップ９ｂをプリント
基板３の表面に位置決めした後、貼り付けした熱硬化性
樹脂７を介して、マウントし、（工程ｂ）半導体ベアチ
ップ９ｂを加熱・加圧することにより、プリント基板３
に接続、固定し、（工程ｃ）金バンプ１０に導電性接着
剤１１を転写した半導体ベアチップ９ａをプリント基板
３の裏面に位置決めした後、マウントし、さらに、（工
程ｄ）プリント基板３と半導体ベアチップ９ａの間に封
止樹脂１２を充填して、最後に、（工程ｅ）封止樹脂１
２を硬化することにより、半導体ベアチップ９ａをプリ
ント基板３に接続、固定する。As shown in FIG. 9, the steps in the ninth embodiment are as follows. (Step a) First, the semiconductor bare chip 9b is positioned on the surface of the printed circuit board 3, and then the semiconductor bare chip 9b is placed via the thermosetting resin 7 attached. , Mounting, and (step b) the semiconductor bare chip 9b is heated and pressurized to form the printed circuit board 3
(Step c) The semiconductor bare chip 9a having the conductive adhesive 11 transferred to the gold bump 10 is positioned on the back surface of the printed circuit board 3 and then mounted. (Step d) The printed circuit board 3 and the semiconductor The sealing resin 12 is filled between the bare chips 9a, and finally (step e) the sealing resin 1
By curing the substrate 2, the semiconductor bare chip 9a is connected and fixed to the printed circuit board 3.

【００６７】本発明では、何も実装されていないプリン
ト基板の表面には、熱硬化性樹脂を用いて半導体ベアチ
ップを実装し、裏面には、半導体ベアチップを実装する
際、既に実装済みの部品による制約を受け難い、導電性
接着剤を用いて実装することにより、プリント基板の両
面に半導体を実装するモジュール部品において、半導体
ベアチップのみを用いて容易にモジュール部品を形成で
き、モジュール部品の小型化を図ることができる。According to the present invention, a semiconductor bare chip is mounted on the surface of a printed circuit board on which nothing is mounted by using a thermosetting resin, and on the back surface, when mounting the semiconductor bare chip, components which have already been mounted are used. By mounting using a conductive adhesive, which is not easily restricted, it is possible to easily form module components using only semiconductor bare chips in module components that mount semiconductors on both sides of the printed circuit board, and reduce the size of module components. Can be planned.

【００６８】なお、本説明では、プリント基板の裏面へ
の半導体ベアチップの実装には、導電性接着剤を用いた
方法を示しているが、半田を用いた実装方法でも同様の
効果が得られる。In the present description, a method using a conductive adhesive is shown for mounting the semiconductor bare chip on the back surface of the printed circuit board. However, a similar effect can be obtained by a mounting method using solder.

【００６９】[0069]

【発明の効果】以上のように本発明でのモジュール部品
の製造方法は、半導体ベアチップを用いてモジュール部
品を形成するため、従来の半導体パッケージを用いる場
合と比べ、大幅なモジュール部品の小型化が実現でき
る。さらに、表面実装部品を先に実装した後、半導体ベ
アチップを実装することにより、半導体ベアチップを保
護する封止樹脂のはみ出しに影響されず、表面実装部品
を半導体ベアチップに近接して実装することができ、更
にモジュール部品の小型化が実現できる。As described above, in the method of manufacturing a module component according to the present invention, since the module component is formed using the semiconductor bare chip, the size of the module component can be significantly reduced as compared with the case where the conventional semiconductor package is used. realizable. Further, by mounting the semiconductor bare chip after mounting the surface mount component first, the surface mount component can be mounted close to the semiconductor bare chip without being affected by the protrusion of the sealing resin for protecting the semiconductor bare chip. In addition, downsizing of module components can be realized.

【図面の簡単な説明】[Brief description of the drawings]

【図１】実施の形態１でのモジュール部品の製造方法を
示す工程図FIG. 1 is a process chart showing a method for manufacturing a module component according to a first embodiment.

【図２】実施の形態２でのモジュール部品の製造方法を
示す工程図FIG. 2 is a process chart showing a method for manufacturing a module component according to a second embodiment.

【図３】実施の形態３でのモジュール部品の製造方法を
示す工程図FIG. 3 is a process chart showing a method for manufacturing a module component according to a third embodiment.

【図４】実施の形態４でのモジュール部品の製造方法を
示す工程図FIG. 4 is a process chart showing a method for manufacturing a module component according to a fourth embodiment.

【図５】実施の形態５でのモジュール部品の製造方法を
示す工程図FIG. 5 is a process chart showing a method for manufacturing a module component according to a fifth embodiment.

【図６】実施の形態６でのモジュール部品の製造方法を
示す工程図FIG. 6 is a process chart showing a method for manufacturing a module component according to the sixth embodiment.

【図７】実施の形態７でのモジュール部品の製造方法を
示す工程図FIG. 7 is a process chart showing a method for manufacturing a module component according to a seventh embodiment.

【図８】実施の形態８でのモジュール部品を示す断面図FIG. 8 is a sectional view showing a module component according to the eighth embodiment.

【図９】実施の形態９でのモジュール部品の製造方法を
示す工程図FIG. 9 is a process chart showing a method for manufacturing a module component according to the ninth embodiment.

【図１０】従来のモジュール部品の製造方法を示す工程
図FIG. 10 is a process chart showing a conventional method for manufacturing a module component.

【符号の説明】[Explanation of symbols]

１ 表面実装部品（受動部品） ２ 半田ペースト ３ プリント基板 ４ 汚れ ５ 加熱・加圧手段 ６ ゴムシート ７ 熱硬化性樹脂 ８ 保護シート ９ 半導体ベアチップ １０ 金バンプ DESCRIPTION OF SYMBOLS 1 Surface mount component (passive component) 2 Solder paste 3 Printed circuit board 4 Dirt 5 Heating / pressing means 6 Rubber sheet 7 Thermosetting resin 8 Protective sheet 9 Semiconductor bare chip 10 Gold bump

Claims (20)

【特許請求の範囲】[Claims] 【請求項１】 表面実装部品と半導体ベアチップをプリ
ント基板の表面に実装してなるモジュール部品におい
て、表面実装部品をプリント基板に実装した後、前記プ
リント基板を洗浄し、その後、半導体ベアチップを前記
プリント基板に実装してなるモジュール部品の製造方
法。1. A module component comprising a surface mounted component and a semiconductor bare chip mounted on the surface of a printed circuit board. After mounting the surface mounted component on the printed circuit board, the printed circuit board is washed, and then the semiconductor bare chip is printed on the printed circuit board. A method for manufacturing module components mounted on a board. 【請求項２】 熱硬化性樹脂を用いて半導体ベアチップ
をプリント基板に実装することを特徴とする請求項１記
載のモジュール部品の製造方法。2. The method according to claim 1, wherein the semiconductor bare chip is mounted on a printed circuit board using a thermosetting resin. 【請求項３】 導電性接着剤を用いて半導体ベアチップ
をプリント基板に実装することを特徴とする請求項１記
載のモジュール部品の製造方法。3. The method according to claim 1, wherein the semiconductor bare chip is mounted on a printed circuit board using a conductive adhesive. 【請求項４】 フィルム状の熱硬化性樹脂をプリント基
板に貼る際、前記フィルム状の熱硬化性樹脂を、ゴムシ
ートを介して、加熱、加圧することを特徴とする請求項
２記載のモジュール部品の製造方法。4. The module according to claim 2, wherein when applying the film-like thermosetting resin to a printed circuit board, the film-like thermosetting resin is heated and pressed via a rubber sheet. The method of manufacturing the part. 【請求項５】 熱硬化性樹脂を介して、複数の半導体ベ
アチップをプリント基板にマウントし、前記複数の半導
体ベアチップを一度に加熱、加圧することにより、前記
プリント基板に接続、固定することを特徴とするモジュ
ール部品の製造方法。5. A plurality of semiconductor bare chips are mounted on a printed board via a thermosetting resin, and the plurality of semiconductor bare chips are connected to and fixed to the printed board by heating and pressurizing the plurality of semiconductor bare chips at once. Manufacturing method of module parts. 【請求項６】 複数の半導体ベアチップを、熱硬化性樹
脂を介して、プリント基板にマウントし、前記複数の半
導体ベアチップを一度に加圧し、前記プリント基板表面
からの高さを揃わせた後、前記複数の半導体ベアチップ
を一度に加熱、加圧することにより、前記プリント基板
に接続、固定することを特徴とするモジュール部品の製
造方法。6. A plurality of semiconductor bare chips are mounted on a printed circuit board via a thermosetting resin, and the plurality of semiconductor bare chips are pressurized at once, and the heights from the surface of the printed circuit board are aligned. A method for manufacturing a module component, wherein the plurality of semiconductor bare chips are connected to and fixed to the printed circuit board by heating and pressing at one time. 【請求項７】 半導体ベアチップの厚みと金バンプの高
さの合計が５μｍ以下の差になるように、金バンプを形
成してなる複数の半導体ベアチップを用いることを特徴
とする請求項５または６記載のモジュール部品の製造方
法。7. A plurality of semiconductor bare chips having gold bumps formed thereon so that the sum of the thickness of the semiconductor bare chips and the height of the gold bumps is 5 μm or less. A method for manufacturing the module component described in the above. 【請求項８】 半導体ベアチップを表面に、表面実装部
品を裏面に実装するように回路形成したプリント基板に
半導体ベアチップと表面実装部品を実装してなるモジュ
ール部品の製造方法。8. A method of manufacturing a module component comprising mounting a semiconductor bare chip and a surface mounting component on a printed circuit board on which a circuit is formed such that a semiconductor bare chip is mounted on a front surface and a surface mounting component is mounted on a rear surface. 【請求項９】 熱硬化性樹脂または導電性接着剤を用い
て半導体ベアチップをプリント基板の表面に実装した
後、表面実装部品を前記プリント基板の裏面に実装する
ことを特徴とする請求項８記載のモジュール部品の製造
方法。9. The printed circuit board according to claim 8, wherein the semiconductor bare chip is mounted on the front surface of the printed circuit board by using a thermosetting resin or a conductive adhesive, and then the surface mount component is mounted on the back surface of the printed circuit board. Manufacturing method of module parts. 【請求項１０】 半導体ベアチップをプリント基板の表
面に実装した後、前記半導体ベアチップを研磨により薄
板化することを特徴とする請求項８記載のモジュール部
品の製造方法。10. The method according to claim 8, wherein after mounting the semiconductor bare chip on the surface of the printed circuit board, the semiconductor bare chip is thinned by polishing. 【請求項１１】 表面実装部品と半田バンプまたは金バ
ンプを形成してなる半導体ベアチップを、半田ペースト
を介して、プリント基板上にマウントし、一度にリフロ
ーに通すことにより、前記プリント基板に前記表面実装
部品と前記半導体ベアチップを接続、固定することを特
徴とするモジュール部品の製造方法。11. A semiconductor bare chip having a surface mount component and a solder bump or a gold bump formed thereon is mounted on a printed circuit board via a solder paste, and is passed through reflow at a time, whereby the surface of the printed circuit board is formed on the printed circuit board. A method for manufacturing a module component, comprising connecting and fixing a mounted component and the semiconductor bare chip. 【請求項１２】 半導体ベアチップの実装部への半田の
印刷パターンが四角形を成すスクリーン印刷版を用い
て、半田ペーストを印刷することを特徴とする請求項１
１記載のモジュール部品の製造方法。12. The method according to claim 1, wherein the solder paste is printed using a screen printing plate having a square printed pattern of the solder on the mounting portion of the semiconductor bare chip.
2. A method for manufacturing the module component according to 1. 【請求項１３】 実装部に凹状の段差を設けたプリント
基板に半導体ベアチップ及び表面実装部品を実装するこ
とを特徴とする請求項１１記載のモジュール部品の製造
方法。13. The method for manufacturing a module component according to claim 11, wherein the semiconductor bare chip and the surface mount component are mounted on a printed circuit board having a concave step on the mounting portion. 【請求項１４】 電極の周囲にソルダーレジストを形成
することにより、凹状の段差を設けたプリント基板を用
いることを特徴とする請求項１３記載のモジュール部品
の製造方法。14. The method according to claim 13, wherein a printed circuit board having a concave step is formed by forming a solder resist around the electrode. 【請求項１５】 電極の周囲にソルダーレジストを形成
し、エッチングにより、前記電極に凹状の段差を設けた
プリント基板を用いることを特徴とする請求項１３記載
のモジュール部品の製造方法。15. The method for manufacturing a module component according to claim 13, wherein a solder resist is formed around the electrode, and a printed circuit board having a concave step formed on the electrode by etching is used. 【請求項１６】 フラックスを介して、半田バンプを形
成してなる半導体ベアチップをプリント基板にマウント
し、半田ペーストを介して、表面実装部品を前記プリン
ト基板にマウントし、一度に半田バンプが溶融する温度
条件のリフローへ通すことにより、前記プリント基板に
前記半導体ベアチップと前記表面実装部品を接続、固定
することを特徴とするモジュール部品の製造方法。16. A semiconductor bare chip having solder bumps formed thereon is mounted on a printed circuit board via a flux, and a surface mount component is mounted on the printed circuit board via a solder paste. A method for manufacturing a module component, comprising connecting and fixing the semiconductor bare chip and the surface mount component to the printed circuit board by passing through a reflow under a temperature condition. 【請求項１７】 半導体ベアチップを実装したプリント
基板の前記半導体ベアチップ実装部の反対面に、前記半
導体ベアチップのサイズと同等もしくは小さい別の半導
体ベアチップを、熱硬化性樹脂を用いて実装することを
特徴とするモジュール部品の製造方法。17. A semiconductor bare chip having a size equal to or smaller than the size of the semiconductor bare chip is mounted on the opposite surface of the printed circuit board on which the semiconductor bare chip is mounted, using a thermosetting resin. Manufacturing method of module parts. 【請求項１８】 プリント基板の表面に、１個もしくは
複数個の半導体ベアチップを、熱硬化性樹脂を用いて実
装した後、前記プリント基板の裏面に、別の１個もしく
は複数個の半導体ベアチップを、熱硬化性樹脂を用いて
実装してなるモジュール部品において、プリント基板の
表面への実装に用いる熱硬化性樹脂のガラス転移点温度
よりも低い温度で前記プリント基板の裏面の熱硬化性樹
脂を硬化させることを特徴とするモジュール部品の製造
方法。18. One or more semiconductor bare chips are mounted on the surface of a printed circuit board using a thermosetting resin, and then another one or more semiconductor bare chips are mounted on the back surface of the printed circuit board. In a module component mounted using a thermosetting resin, the thermosetting resin on the back surface of the printed circuit board at a temperature lower than the glass transition temperature of the thermosetting resin used for mounting on the surface of the printed circuit board. A method for producing a module component, which comprises curing. 【請求項１９】 プリント基板の表面に、１個もしくは
複数個の半導体ベアチップを実装し、更に前記プリント
基板の表面を樹脂モールド成型した後、前記プリント基
板の裏面に、別の１個もしくは複数個の半導体ベアチッ
プを、熱硬化性樹脂を用いて実装することを特徴とする
モジュール部品の製造方法。19. One or more semiconductor bare chips are mounted on the surface of a printed circuit board, and the surface of the printed circuit board is molded with a resin. Then, another one or more semiconductor bare chips are mounted on the back surface of the printed circuit board. Mounting the semiconductor bare chip according to (1) using a thermosetting resin. 【請求項２０】 プリント基板の表面に、１個もしくは
複数個の半導体ベアチップを、熱硬化性樹脂を用いて実
装した後、前記プリント基板の裏面に、別の１個もしく
は複数個の半導体ベアチップを、半田ペーストまたは導
電性接着剤を用いて実装することを特徴とするモジュー
ル部品の製造方法。20. One or more semiconductor bare chips are mounted on the surface of a printed circuit board using a thermosetting resin, and then another one or more semiconductor bare chips are mounted on the back surface of the printed circuit board. Mounting method using a solder paste or a conductive adhesive.
JP2001007341A 2001-01-16 2001-01-16 Method of manufacturing modular component Pending JP2002217350A (en)

Priority Applications (1)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publications (1)

Publication Number Publication Date
JP2002217350A true JP2002217350A (en) 2002-08-02

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Family Applications (1)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251721A (en) * 2007-03-29 2008-10-16 Fujikura Ltd Through wiring board and its manufacturing method
JP2013256634A (en) * 2012-06-14 2013-12-26 Daicel Corp Packing material for semiconductor device three-dimensional mounting
CN109877479A (en) * 2019-03-29 2019-06-14 中国科学院上海技术物理研究所 A kind of two step inverse bonding process of focus planar detector
CN113910515A (en) * 2021-10-29 2022-01-11 西安微电子技术研究所 Device and method for reinforcing radiating gasket inside power module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251721A (en) * 2007-03-29 2008-10-16 Fujikura Ltd Through wiring board and its manufacturing method
JP2013256634A (en) * 2012-06-14 2013-12-26 Daicel Corp Packing material for semiconductor device three-dimensional mounting
CN109877479A (en) * 2019-03-29 2019-06-14 中国科学院上海技术物理研究所 A kind of two step inverse bonding process of focus planar detector
CN113910515A (en) * 2021-10-29 2022-01-11 西安微电子技术研究所 Device and method for reinforcing radiating gasket inside power module
CN113910515B (en) * 2021-10-29 2024-04-26 西安微电子技术研究所 Device and method for reinforcing heat dissipation gasket in power module

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