JP2002212536A - Adhesive member and method for manufacturing the same, and substrate for mounting semiconductor comprising the adhesive member and semiconductor device using the substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive member, for mounting a semiconductor chip on a substrate, capable of securing rigidity and preventing warpage when it is stuck on the substrate by making the adhesive member have a multilayered structure and have adhesive on both the sides of a rigid substrate, and a method for manufacturing the same. SOLUTION: The adhesive member has a multilayered structure, and it has a thermosetting resin-made adhesive layers B and C on both the sides of a rigid base material A. The ratio between the thickness of the base material A and the total thickness of the adhesive layers B and C satisfies the following relation: (B+C)/A=0.5-6.0.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive member having a multilayer structure, an adhesive member having an adhesive layer on both surfaces of a rigid substrate, a method of manufacturing the same, and a wiring board for mounting a semiconductor provided with the adhesive member. And a semiconductor device using the same.

[0002]

2. Description of the Related Art In recent years, with the miniaturization of electronic devices, semiconductor packages have been required to be mounted at high density on substrates. As miniaturization and weight reduction progress, CSP (chip size package) and μBGA (ball grid array)
The development of a small package called a "small package" is underway.

The connection reliability of a mounting board on which various electronic components are mounted is a very important item. The cause of the decrease in connection reliability is thermal stress caused by a difference in thermal expansion coefficient between a semiconductor chip and a substrate on which electronic components are mounted.
Many structures have been proposed for SP and μBGA in order to ensure connection reliability. For example, in a μBGA, an insulating adhesive member is used between a semiconductor chip and a wiring substrate called an interposer so as to reduce thermal stress caused by a difference in thermal expansion coefficient between the semiconductor chip and a wiring substrate. Examples of the insulating adhesive member include an epoxy resin and a modified acrylic rubber-based adhesive disclosed in JP-A-10-330696 and JP-A-11-12545.

Conventionally, a rigid board made of a material such as a glass epoxy resin has been used as a wiring board, but a flexible tape board made of a material such as a polyimide resin has been generally used. The tape substrate has less rigidity than the rigid substrate, and depending on the package structure, a problem such as warpage of the substrate may occur when an adhesive is attached for chip mounting. Further, since a unique package structure is being developed and examined by each manufacturer, an adhesive member having flexibility in the rigidity and thickness of the adhesive member is often required.

In the CSP, in order to secure connection reliability, an insulating adhesive member is used between the semiconductor chip and the wiring board so as to reduce thermal stress caused by a difference in thermal expansion coefficient between the semiconductor chip and the wiring board. In some cases, the substrate may be warped, which may cause restrictions on package design. As a measure for preventing warpage, it has been necessary to improve the rigidity of the substrate, for example, by selecting a substrate material. However, there has been a problem that the number of steps in assembling the package is increased and the cost is increased.
Further, since each manufacturer is studying a unique package structure, there is a case where a degree of freedom is required with respect to the rigidity and thickness of the adhesive member.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an adhesive member for mounting a semiconductor chip on a wiring board, wherein the adhesive member has a multilayer structure and has an adhesive on both surfaces of a rigid base material. The object of the present invention is to provide an adhesive member capable of securing the rigidity of the adhesive member and preventing warpage when the adhesive member is attached to the substrate, and a method of manufacturing the same. Another object of the present invention is to provide a wiring board for mounting a semiconductor and a semiconductor device using the above-mentioned adhesive member.

[0007]

SUMMARY OF THE INVENTION The present invention relates to an adhesive member having a multilayer structure, having an adhesive layer B and an adhesive layer C made of a thermosetting resin component on both surfaces of a rigid base material A. Wherein the ratio of the thickness of the substrate A to the total thickness of the adhesive layers B and C is in the range of (B + C) /A=0.5 to 6.0.

[0008] The present invention also provides a thermosetting resin component,
(1) 100 parts by weight of an epoxy resin and its curing agent, (2) glycidyl (meth) acrylate units 2 to 6
100 to 300 parts by weight of an epoxy group-containing acrylic copolymer having a Tg (glass transition temperature) of −10 ° C. or more and a weight average molecular weight of 800,000 or more, containing
The present invention relates to the above adhesive member, which is a resin composition containing (3) 0.1 to 5 parts by weight of a curing accelerator and (4) 0.1 to 10 parts by weight of a coupling agent.

In the present invention, the adhesive layer may further comprise (5)
The adhesive member according to claim 2, which is an adhesive layer made of a thermosetting resin component containing 10 to 40 parts by weight of a phenoxy resin.

In the present invention, the adhesive layer may further comprise (6)
The present invention relates to the above adhesive member, which is an adhesive made of a thermosetting resin component containing 5 to 50 parts by weight of an inorganic filler.

According to the present invention, there is also provided an epoxy resin wherein at least one of the adhesive layers is (1) a brominated epoxy resin.
75 parts by weight and 75 to 25 parts by weight of curing agent in total of 100
Tg (glass transition temperature) containing 2 to 6% by weight of (2) glycidyl (meth) acrylate unit is -1 with respect to parts by weight.
50 to 300 parts by weight of an epoxy group-containing acrylic copolymer having a temperature of 0 ° C. or more and a weight average molecular weight of 800,000 or more, (3) 0.1 to 10 parts by weight of a curing accelerator, (4) coupling agent 0 The present invention relates to the above adhesive member, which is an adhesive comprising a flame-retardant thermosetting resin component containing 0.1 to 10 parts by weight and (5) 5 to 30 parts by weight of antimony oxide.

The present invention also relates to the above-mentioned adhesive member in which the thicknesses of the adhesive layers B and C are different.

The present invention also relates to a method for manufacturing an adhesive member in which an adhesive layer B and an adhesive layer C made of the above-mentioned thermosetting resin component are bonded to both surfaces of a rigid base material A by thermocompression bonding.

The present invention also relates to a wiring board for mounting a semiconductor, comprising the above-mentioned adhesive member on a semiconductor chip mounting surface of the wiring board.

The present invention also relates to a semiconductor device in which a semiconductor chip and a wiring board are bonded by using the bonding member according to the first aspect.

[0016]

FIG. 1 is a sectional view of an adhesive member according to the present invention, in which an adhesive layer 2 is provided on both surfaces of a substrate 1.
FIG. 2 is a sectional view of a semiconductor device having a semiconductor chip mounted on a wiring board for mounting a semiconductor according to an embodiment of the present invention. The adhesive member of the present invention is bonded to the semiconductor chip mounting surface of the semiconductor wiring substrate 4 having the wiring 3, and a part of the wiring 3 is connected to a bonding pad of the semiconductor chip as a semiconductor chip connecting member 6, and sealing is performed. The periphery of the semiconductor chip 5 is sealed with a material 7 to provide a solder ball 8.

The adhesive member of the present invention has adhesive layers B and C made of a thermosetting resin component on both sides of a rigid substrate A, and the thickness of the substrate A and the thickness of the adhesive layers B and C are determined. The ratio of (B
By setting the range of + C) /A=0.5 to 6.0, the rigidity of the adhesive member can be adjusted.

Further, in the adhesive member of the present invention, a specific epoxy group-containing acrylic copolymer and an epoxy resin are used for an adhesive layer composed of a thermosetting resin component, and the elastic modulus near room temperature is reduced. It is characterized by. Epoxy group-containing acrylic copolymers, like epoxy resins, have excellent reactivity with curing agents, and the cured product is chemically and physically stable.
Excellent in moisture resistance test such as T treatment and reliability test such as reflow property. Further, the inorganic filler component is chemically stable to the reaction of the epoxy group, and improves the adhesiveness at a high temperature without impairing the properties of the adhesive. When a brominated epoxy resin is used, flame retardancy can be imparted to the adhesive. Antimony oxide is chemically stable to the reaction of the epoxy group, and improves the adhesiveness at high temperatures without impairing the properties of the adhesive.

In the present invention, since the thickness of the substrate A and the thickness of the adhesive layers B and C on both surfaces can be changed respectively,
It can respond according to the PKG structure and the embedding property of the substrate wiring. The thickness of the adhesive layers B and C is preferably such that the thickness of the thin layer is 50 to 80% of the thickness of the thick layer.

As the adhesive layer of the adhesive member used in the present invention, it is preferable to use an adhesive made of an insulating epoxy resin. The epoxy resin in the component comprising the epoxy resin and its curing agent may be any as long as it exhibits an adhesive action upon curing, and is preferably bifunctional or more, preferably has a molecular weight of less than 5,000, and more preferably has a molecular weight of 3,
It is desirable to use less than 000 epoxy resin. Examples of the bifunctional epoxy resin include bisphenol A type and bisphenol F type resins. The bisphenol A type or bisphenol F type liquid resin is commercially available from Toto Kasei Co., Ltd. under the trade names of YD8125 and YDF170. As the epoxy resin, a polyfunctional epoxy resin may be added for the purpose of increasing Tg. Examples of the polyfunctional epoxy resin include a phenol novolak epoxy resin and a cresol novolak epoxy resin. The phenol novolak epoxy resin is commercially available from Nippon Kayaku Co., Ltd. under the trade name EPPN-201. Also, cresol novolac type epoxy resin is available from Sumitomo Chemical Co., Ltd. as ESCN-001, ESCN-001.
-195 and EOCN1012, EOCN1025, EOCN
It is marketed under the trade name 1027. Further, it is commercially available from Toto Kasei Co., Ltd. under the trade name of YDCN-703.

As the curing agent for the epoxy resin, those usually used as curing agents for the epoxy resin can be used. An amine, a polyamide, an acid anhydride, a polysulfide, boron trifluoride and a phenolic hydroxyl group are contained in one molecule. Bisphenol A, bisphenol F,
Bisphenol S, a novolak resin, etc. are mentioned. In particular, it is preferable to use a phenol novolak resin, a bisphenol novolak resin, or a cresol novolak resin because of its excellent electric corrosion resistance during moisture absorption. It is also preferable to use a phenol / xylene glycol dimethyl ether condensate having good water absorbency. Such particularly preferred curing agents include phenolite LF2882, phenolite LF2822, phenolite TD-2090, and phenolite TD-214 from Dainippon Ink and Chemicals, Inc.
9, phenolite VH4150, phenolite VH41
70 as MILEX XLC from Mitsui Chemicals, Inc.
-LL, XLC-4L are commercially available.
The ratio of the epoxy resin to the curing agent is 25 to 75 parts by weight of the epoxy resin and 75 to 25 parts by weight of the curing agent with respect to 100 parts by weight in total.
The ratio by weight is preferable because the wettability of the adhesive and the high adhesiveness can be ensured.

Glycidyl (meth) acrylate unit 2
An epoxy group-containing acrylic copolymer having a Tg of −10 ° C. or more and a weight average molecular weight of 80,000 or more containing 6% by weight is a trade name of HTR-860P-3 commercially available from Teikoku Chemical Industry Co., Ltd. Can be used. The epoxy group-containing acrylic copolymer is obtained by copolymerizing a (meth) acrylic monomer containing glycidyl (meth) acrylate. The amount of glycidyl (meth) acrylate used as the functional group monomer is 2 to 6
It is assumed that the copolymer ratio is weight%. The content is set to 2% by weight or more to obtain an adhesive force, and is set to 6% by weight or less to prevent gelation of rubber. The remainder preferably uses ethyl (meth) acrylate or butyl (meth) acrylate or a mixture of both, but the mixing ratio is determined in consideration of the Tg of the copolymer. If the Tg is less than -10 ° C, the tackiness of the adhesive film in the B-stage state is increased and the handling property is deteriorated. Examples of the polymerization method include pearl polymerization, solution polymerization, and the like, which can be obtained. The weight-average molecular weight of the epoxy group-containing acrylic copolymer is 800,000 or more, and within this range, the strength and flexibility of the sheet or film are not significantly reduced and the tackiness is not increased. The epoxy group-containing acrylic copolymer contains an epoxy resin and a curing agent 10 in order to prevent a decrease in film strength and an increase in tackiness.
It is preferably blended in an amount of 100 to 300 parts by weight with respect to 0 parts by weight. When the blending amount of the epoxy group-containing acrylic polymer increases, the number of phases of the rubber component increases and the number of epoxy resin phases decreases, so that the handleability at high temperatures tends to decrease.

It is preferable to use a curing accelerator together with the curing agent, and it is preferable to use various imidazoles as the curing accelerator. Examples of imidazole include 2-methylimidazole, 2-ethyl-4-methylimidazole,
Examples thereof include 1-cyanoethyl-2-phenylimidazole and 1-cyanoethyl-2-phenylimidazolium trimellitate. Imidazoles were obtained from Shikoku Chemicals Corporation, 2E4MZ, 2PZ-CN, 2PZ-CN.
It is marketed under the trade name S. The curing accelerator does not advance the curing of the adhesive more than necessary, and from the viewpoint of ensuring long-term stability, with respect to 100 parts by weight of the epoxy resin and the curing agent,
It is desirable to mix in the range of 0.1 to 10 parts by weight.

As the coupling agent, a silane coupling agent is preferable. As a silane coupling agent, γ
-Glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-ureidopropyltriethoxysilane, N-β-aminoethyl-γ-aminopropyltrimethoxysilane and the like. Can be The above-mentioned silane coupling agent is such that γ-glycidoxypropyltrimethoxysilane is NCU A-187, γ-mercaptopropyltrimethoxysilane is NCU A-189, and γ-aminopropyltriethoxysilane is NCU A-110.
0, γ-ureidopropyltriethoxysilane is NCU
A-1160 and N-β-aminoethyl-γ-aminopropyltrimethoxysilane are commercially available from Nippon Unicar Co., Ltd. under the trade names of NCU and A-1120, and can be suitably used. The amount of the coupling agent is preferably 1 to 100 parts by weight of the epoxy resin and its curing agent, based on the effect of the addition, heat resistance and cost.
It is preferable to add 10 to 10 parts by weight.

The phenoxy resin is used as a compatible component with the epoxy resin, and is available from Toto Kasei Co., Ltd. as phenothoto YP-40, phenotote YP-50 and phenotote Y.
It is commercially available under a trade name such as P-60. As the amount of the phenoxy resin, from the relationship with the adhesive properties and tackiness,
10 to 10 parts by weight of epoxy resin and its curing agent
A range of 40 parts by weight is desirable.

The inorganic filler component is effective for improving the adhesive properties of the adhesive layer, and is commercially available from Nippon Aerosil Co., Ltd. under the product names R972, R972V and R972CF. The amount of the epoxy resin and its curing agent 1 is determined based on the relationship between the adhesive properties and other physical properties such as the elastic modulus.
The range of 5 to 50 parts by weight to 00 parts by weight is desirable.

Examples of the brominated epoxy resin include a phenol novolac type brominated epoxy resin, which is commercially available from Nippon Kayaku Co., Ltd. under the trade name BREN-S. Are brominated compounds of bisphenol A and bisphenol F, and are commercially available from Teijin Chemicals Limited under the trade name Fireguard. As antimony oxide,
Antimony trioxide and antimony pentoxide can be used. Antimony trioxide is commercially available from Nippon Seimitsu Co., Ltd. under the trade names PATOX-U and PATOX-HS. The amount of antimony oxide to be added is preferably 5 to 30 parts by weight based on 100 parts by weight of the epoxy resin and its curing agent from the viewpoint of securing flame retardancy and production cost.

As a substrate of the adhesive member used in the present invention, it is preferable to use an insulating polyimide film, and UPILEX 25SGA manufactured by Ube Industries, Ltd.
50 SGA, 75 SPA and the like. The thickness of the substrate is preferably 20 to 100 μm.

The production of the adhesive member of the present invention can be obtained by laminating the adhesive layers B and C on both surfaces of the substrate A, preferably by thermocompression bonding. At this time, it is desirable to perform the lamination at a pressure that does not cause deformation of the adhesive film. The thickness ratio of the base material A to the adhesive layers B and C is (B +
C) / A can be freely combined in the range of 0.5 to 6.0, and the thickness may be different for each adhesive layer to be bonded to both surfaces.

The substrate used for the wiring board for mounting a semiconductor of the present invention can be used irrespective of the material of the substrate such as a ceramic or an organic substrate. As the shape of the wiring,
Any structure of single-sided, double-sided, or multi-layer wiring may be used, and if necessary, a through-hole or a non-through-hole electrically connected may be provided. Further, when the wiring appears on the outer surface of the semiconductor device, it is desirable to provide a protective resin layer. The method of applying the adhesive to the substrate is generally a method of thermocompression bonding an adhesive cut into a predetermined shape according to a package shape to a desired position on a wiring board, but is not limited thereto. .

In a semiconductor device in which a semiconductor chip and a tape-shaped wiring board are bonded by using the bonding member of the present invention, the rigidity of the bonding member prevents, in particular, warpage of the substrate to which the bonding member is attached, and stabilizes the PKG structure. In addition to this, it is possible to secure good chip sticking properties.

[0032]

EXAMPLES The present invention will be described in more detail with reference to the following Examples, but it should not be construed that the present invention is limited thereto. (Example 1) Upilex 50SGA as the base material A
(Polyimide resin, manufactured by Ube Industries, Ltd./50 μm thick
10 parts by weight of a bisphenol A type epoxy resin (epoxy equivalent: 175, YD-8125 manufactured by Toto Kasei Co., Ltd.) as an epoxy resin on both sides of the product, a cresol novolac type epoxy resin (epoxy equivalent: 220, manufactured by Toto Kasei Co., Ltd.) 30 parts by weight of YDCN-703), 25 parts by weight of a phenol novolak resin (using LF2882 manufactured by Dainippon Ink and Chemicals, Inc.) as a curing agent, an acrylic copolymer containing an epoxy group (HTR- manufactured by Teikoku Chemical Industry Co., Ltd. 860-P3) 150 parts by weight, 1-cyanoethyl-2-phenylimidazole (Curesol 2PZ-CN manufactured by Shikoku Chemicals Co., Ltd.) as a curing accelerator
0.5 parts by weight, γ-glycidoxypropyltrimethoxysilane (using NUC A-189 manufactured by Nippon Unicar Co., Ltd.) as a coupling agent 1 part by weight, γ-
Adhesive layers B and C consisting of 1 part by weight of ureidopropyltriethoxysilane (using NCU A-1160 manufactured by Nippon Unicar Co., Ltd.) and having a thickness of 50 μm are thermally laminated under a pressure condition in which the thickness of the adhesive layer does not change. A member was manufactured.

(Example 2) Bisphenol A type epoxy resin (epoxy equivalent: 175, Toto Kasei Co., Ltd.) as an epoxy resin on both surfaces of UPILEX 75 SPA (polyimide resin, manufactured by Ube Industries, Ltd./75 μm thick product) as a base material A 10 parts by weight of cresol novolak type epoxy resin (using an epoxy equivalent of 22)
0, using YDCN-703 manufactured by Toto Kasei Co., Ltd.) 3
0 parts by weight, phenol novolak resin as curing agent (using LF2882 manufactured by Dainippon Ink and Chemicals, Inc.) 2
5 parts by weight, epoxy group-containing acrylic copolymer (using HTR-860-P3 manufactured by Teikoku Chemical Industry Co., Ltd.) 150
Parts by weight, 0.5 parts by weight of 1-cyanoethyl-2-phenylimidazole (Curesol 2PZ-CN manufactured by Shikoku Chemicals Co., Ltd.) as a curing accelerator, and γ-glycidoxypropyltrimethoxysilane (Nippon Unicar) as a coupling agent (Use NUC A-189 manufactured by Co., Ltd.) 1
Parts by weight, γ-ureidopropyltriethoxysilane (using NCU A-1160 manufactured by Nippon Unicar Co., Ltd.)
1 part by weight of an adhesive layer B having a thickness of 50 μm and a thickness of 75
An adhesive member was prepared by thermally laminating an adhesive layer C having a thickness of μm under a pressure condition in which the thickness of the adhesive layer did not change.

(Example 3) Bisphenol A type epoxy resin (epoxy equivalent: 175, manufactured by Toto Kasei Co., Ltd.) was used as an epoxy resin on both surfaces of Upilex 75 SPA (polyimide resin, manufactured by Ube Industries, Ltd./75 μm thick) as base material A. 10 parts by weight of YD-8125), a cresol novolak type epoxy resin (epoxy equivalent: 22)
0, using YDCN-703 manufactured by Toto Kasei Co., Ltd.) 3
0 parts by weight, phenol novolak resin as curing agent (using LF2882 manufactured by Dainippon Ink and Chemicals, Inc.) 2
5 parts by weight, epoxy group-containing acrylic copolymer (using HTR-860-P3 manufactured by Teikoku Chemical Industry Co., Ltd.) 150
Parts by weight, 0.5 parts by weight of 1-cyanoethyl-2-phenylimidazole (Curesol 2PZ-CN manufactured by Shikoku Chemicals Co., Ltd.) as a curing accelerator, and γ-glycidoxypropyltrimethoxysilane (Nippon Unicar) as a coupling agent (Use NUC A-189 manufactured by Co., Ltd.) 1
Parts by weight, γ-ureidopropyltriethoxysilane (using NCU A-1160 manufactured by Nippon Unicar Co., Ltd.)
An adhesive member was prepared by thermally laminating adhesive layers B and C each consisting of 1 part by weight and each having a thickness of 35 μm under a pressure condition in which the thickness of the adhesive layer did not change.

Example 4 Bisphenol A type epoxy resin (epoxy equivalent: 175, manufactured by Tohto Kasei Co., Ltd.) was used as an epoxy resin on both sides of Upilex 50SGA (polyimide resin, product of Ube Industries, Ltd./50 μm thickness) as a base material A 20 parts by weight of YD-8125), a cresol novolak type epoxy resin (epoxy equivalent: 22)
0, using YDCN-703 manufactured by Toto Kasei Co., Ltd.) 1
0 parts by weight, phenol novolak resin as curing agent (using LF2882 manufactured by Dainippon Ink and Chemicals, Inc.) 2
0 parts by weight, epoxy group-containing acrylic copolymer (using HTR-860-P3 manufactured by Teikoku Chemical Industry Co., Ltd.) 120
Parts by weight, 0.5 parts by weight of 1-cyanoethyl-2-phenylimidazole (Curesol 2PZ-CN manufactured by Shikoku Chemicals Co., Ltd.) as a curing accelerator, and γ-glycidoxypropyltrimethoxysilane (Nippon Unicar) as a coupling agent (Use NUC A-189 manufactured by Co., Ltd.) 1
Parts by weight, γ-ureidopropyltriethoxysilane (using NCU A-1160 manufactured by Nippon Unicar Co., Ltd.)
1 part by weight of an adhesive layer B having a thickness of 50 μm and a thickness of 75
An adhesive member was prepared by thermally laminating an adhesive layer C having a thickness of μm under a pressure condition in which the thickness of the adhesive layer did not change.

(Example 5) Bisphenol A type epoxy resin (epoxy equivalent: 175, manufactured by Toto Kasei Co., Ltd.) was used as an epoxy resin on both surfaces of Upilex 50SGA (polyimide resin, manufactured by Ube Industries, Ltd./50 μm thick) as a base material A 10 parts by weight of YD-8125), a cresol novolak type epoxy resin (epoxy equivalent: 22)
0, using YDCN-703 manufactured by Toto Kasei Co., Ltd.) 3
0 parts by weight, phenol novolak resin as curing agent (using LF2882 manufactured by Dainippon Ink and Chemicals, Inc.) 2
5 parts by weight, epoxy group-containing acrylic copolymer (using HTR-860-P3 manufactured by Teikoku Chemical Industry Co., Ltd.) 150
Parts by weight, 0.5 parts by weight of 1-cyanoethyl-2-phenylimidazole (Curesol 2PZ-CN manufactured by Shikoku Chemicals Co., Ltd.) as a curing accelerator, and γ-glycidoxypropyltrimethoxysilane (Nippon Unicar) as a coupling agent (Use NUC A-189 manufactured by Co., Ltd.) 1
Parts by weight, γ-ureidopropyltriethoxysilane (using NCU A-1160 manufactured by Nippon Unicar Co., Ltd.)
An adhesive layer B having a thickness of 50 μm and an adhesive layer C having a thickness of 75 μm consisting of 1 part by weight and 10 parts by weight of a silica filler (R972V manufactured by Nippon Aerosil Co., Ltd.) was used as an inorganic filler. An adhesive member thermally laminated under the conditions was produced.

Example 6 A phenol novolak type brominated epoxy resin (manufactured by Nippon Kayaku Co., Ltd.) was used as an epoxy resin on both sides of Upilex 75 SPA (polyimide resin, manufactured by Ube Industries, Ltd./75 μm thick) as a base material A. (BREN-S) 55 parts by weight, brominated bisphenol compound (FG200 manufactured by Teijin Chemicals Limited) as a curing agent
0) 40 parts by weight and phenol novolak resin (using LF2882 manufactured by Dainippon Ink and Chemicals, Inc.) 1
0 parts by weight, 15 parts by weight of diantimony trioxide (using PATOX-U manufactured by Nippon Seiko) as an antimony oxide,
150 parts by weight of an epoxy group-containing acrylic copolymer (using HTR-860-P3 manufactured by Teikoku Chemical Industry Co., Ltd.) and 1-cyanoethyl-2-phenylimidazole as a curing accelerator (Curesol 2PZ-C manufactured by Shikoku Chemicals Co., Ltd.)
N), 0.5 part by weight, γ-glycidoxypropyltrimethoxysilane (using NUC A-189 manufactured by Nippon Unicar Co., Ltd.) as a coupling agent, 1 part by weight, γ
-An adhesive layer B having a thickness of 50 μm and an adhesive layer C having a thickness of 75 μm of a flame-retardant thermosetting resin component consisting of 1 part by weight of ureidopropyltriethoxysilane (using NCU A-1160 manufactured by Nippon Unicar Co., Ltd.) An adhesive member thermally laminated under a pressure condition in which the thickness of the adhesive layer does not change was produced.

Comparative Example 1 10 parts by weight of a bisphenol A type epoxy resin (epoxy equivalent: 175, YD-8125 manufactured by Toto Kasei Co., Ltd.) was used as an epoxy resin, and a cresol novolac type epoxy resin (epoxy equivalent: 22)
0, using YDCN-703 manufactured by Toto Kasei Co., Ltd.) 3
0 parts by weight, phenol novolak resin as curing agent (using LF2882 manufactured by Dainippon Ink and Chemicals, Inc.) 2
5 parts by weight, epoxy group-containing acrylic copolymer (using HTR-860-P3 manufactured by Teikoku Chemical Industry Co., Ltd.) 150
Parts by weight, 0.5 parts by weight of 1-cyanoethyl-2-phenylimidazole (Curesol 2PZ-CN manufactured by Shikoku Chemicals Co., Ltd.) as a curing accelerator, and γ-glycidoxypropyltrimethoxysilane (Nippon Unicar) as a coupling agent (Use NUC A-189 manufactured by Co., Ltd.) 1
Parts by weight, γ-ureidopropyltriethoxysilane (using NCU A-1160 manufactured by Nippon Unicar Co., Ltd.)
An adhesive single-layer film consisting of 1 part by weight and having a thickness of 75 μm was prepared.

Comparative Example 2 Upilex 2 as a substrate
10 parts by weight of bisphenol A type epoxy resin (epoxy equivalent: 175, YD-8125 manufactured by Toto Kasei Co., Ltd.) as epoxy resin on both sides of 0SGA (polyimide resin, manufactured by Ube Industries, Ltd./25 μm product), cresol novolac type Epoxy resin (epoxy equivalent 22
0, using YDCN-703 manufactured by Toto Kasei Co., Ltd.) 3
0 parts by weight, phenol novolak resin as curing agent (using LF2882 manufactured by Dainippon Ink and Chemicals, Inc.) 2
5 parts by weight, epoxy group-containing acrylic copolymer (using HTR-860-P3 manufactured by Teikoku Chemical Industry Co., Ltd.) 150
Parts by weight, 0.5 parts by weight of 1-cyanoethyl-2-phenylimidazole (Curesol 2PZ-CN manufactured by Shikoku Chemicals Co., Ltd.) as a curing accelerator, and γ-glycidoxypropyltrimethoxysilane (Nippon Unicar) as a coupling agent (Use NUC A-189 manufactured by Co., Ltd.) 1
Parts by weight, γ-ureidopropyltriethoxysilane (using NCU A-1160 manufactured by Nippon Unicar Co., Ltd.)
An adhesive member was prepared by thermally laminating adhesive layers B and C each consisting of 1 part by weight and having a thickness of 75 μm under a pressure condition in which the thickness of the adhesive layer did not change.

Using the adhesive members obtained in Examples 1 to 6, Comparative Example 1 (this adhesive member is a single layer) and Comparative Example 2, a semiconductor chip and a polyimide film (thickness: (25 μm) was evaluated for the amount of warpage of the polyimide substrate and chip attachability when the adhesive member was bonded to the wiring substrate used as the wiring substrate base material. The size of the adhesive member is 7.5 mm x 10 mm square, and the chip size is 8
mm * 11 mm square, and adhesion was performed with a thermocompression bonding machine manufactured by Tester Sangyo Co., Ltd. under the conditions of 1.5 MPa, 150 ° C. and 1 second for attaching the adhesive member and the chip to the wiring board. The warpage of the substrate was measured by measuring the amount of warpage in the width direction of 10 mm at the center point of the adhesive member with a surface roughness meter.
m or less was rated as 、, and 15 μm or more was rated as x. Table 1 shows the results.

[0041]

[Table 1]

In Comparative Examples 1 and 2, there is a problem in the occurrence of warpage. In Examples 1 to 6, the adhesive member has a three-layer structure, and by adjusting the balance between the thickness of the base material A and the adhesive layers B and C, the rigidity of the adhesive member is improved to reduce the warpage of the substrate. I have. Since the warpage of the substrate is small,
Since the flatness of the chip attachment surface is maintained, the chip attachment property is also good.

Using the adhesive members obtained in Examples 1 to 6, Comparative Example 1 (this adhesive member is a single layer) and Comparative Example 2, a semiconductor chip and a polyimide film (thickness: (25 μm) was used as the wiring substrate base material, and the amount of warpage of the polyimide substrate and the chip adhesion were evaluated when the adhesive member was bonded to the wiring substrate in which the copper wiring pattern was cut (wiring unevenness: about 20 μm). The size of the adhesive member is 7.5 mm x 10 mm square, and the chip size is 8 mm *
The bonding member and the chip were attached to a wiring board under conditions of 1.5 MPa, 150 ° C. and 1 second with a thermocompression bonding machine manufactured by Tester Sangyo Co., Ltd.
The warpage of the substrate was measured by measuring the amount of warpage in the width direction of 10 mm at the center point of the adhesive member with a surface roughness meter. Regarding the chip sticking property, the peeling of the interface between the chip and the adhesive layer was observed using a SAT observation machine. With respect to the embedding property of the wiring pattern, the embedding state of the wiring portion was observed with a microscope. Table 2 shows the results. However,
In Examples 2, 4, 5, and 6, the adhesive layer C side (thickness 7
(5 μm) on the wiring board side.

[0044]

[Table 2] From the results shown in Table 2, the thickness of the adhesive layer is required to secure the embedding property of the wiring pattern. On the other hand, since the chip side has a smooth surface, it is effective to prevent the warpage, not the thickness of the adhesive layer, to secure the sticking property. When the wiring pattern is cut on the adhesive bonding surface of the substrate, the adhesive layer on the substrate bonding surface is set to be thick as in Examples 2, 4, 5, and 6, and the thickness on the chip bonding side having smoothness is set. The method of thinning is effective.

[0045]

The adhesive member of the present invention has a rigid base material A
Since the adhesive layers B and C are provided on both surfaces of the substrate, the rigidity of the adhesive member is increased by changing the thickness of the base material A, and the amount of warpage generated when the adhesive member is attached to the organic substrate is reduced. At the same time, the chip sticking property can be secured. Further, by changing the thickness of the adhesive layers B and C, it is possible to provide an adhesive member which is excellent in the embedding property of the wiring pattern of the substrate.

[Brief description of the drawings]

FIG. 1 is a sectional view of an adhesive member of the present invention.

FIG. 2 is a cross-sectional view of a semiconductor device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base material 2 Adhesive layer 3 Wiring 4 Semiconductor wiring board 5 Semiconductor chip 6 Semiconductor chip connecting member 7 Sealing material 8 Solder ball

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C09J 171/10 C09J 171/10 H01L 21/52 H01L 21/52 E 23/14 23/14 R F term ( reference) 4F100 AK01B AK01C AK25B AK25C AK25G AK33 AK49 AK53B AK53C AK53G AK54B AK54C AK54G AL05B AL05C AL05G AL06B AL06C AL06G AT00A BA03 BA06 BA07 CA02 CA02B CA02C CA02G CB02B CB02C CB02G GB41 JB13B JB13C JK01A JL04 JL11 JL11B JL11C YY00B YY00C YY00G 4J004 AA10 AA11 AA13 AA17 AA18 AB05 CA06 CC02 EA05 FA05 4J040 EB022 EC061 EC062 EC071 EC072 EC151 EC231 EC232 EE062 EG002 HA136 HA326 HB22 HB40 HC01 HC14 HC24 HD30 JB02 KA16 KA17 KA36 KA42 LA01 MA04 MA10 MB03 NA20 PA23 PA30 5F047 AA17 BA

Claims (9)

[Claims] 1. An adhesive member having a multilayer structure, and an adhesive layer B made of a thermosetting resin component on both surfaces of a rigid base material A.
And an adhesive member having an adhesive layer C, wherein the ratio of the thickness of the base material A to the total thickness of the adhesive layers B and C is (B + C) / A =
An adhesive member having a range of 0.5 to 6.0. 2. A thermosetting resin component comprising: (g) Tg containing 2 to 6% by weight of glycidyl (meth) acrylate unit based on (1) 100 parts by weight of an epoxy resin and its curing agent.
100 to 300 parts by weight of an epoxy group-containing acrylic copolymer having a (glass transition temperature) of −10 ° C. or more and a weight average molecular weight of 800,000 or more; (3) 0.1 to 5 parts by weight of a curing accelerator; (4) Coupling agent 0.1
The adhesive member according to claim 1, which is a resin composition containing from 10 to 10 parts by weight. 3. The adhesive member according to claim 2, wherein the adhesive layer further comprises (5) a thermosetting resin component containing 10 to 40 parts by weight of a phenoxy resin. 4. The adhesive member according to claim 1, wherein the adhesive layer further comprises (6) a thermosetting resin component containing 5 to 50 parts by weight of an inorganic filler. 5. The method according to claim 1, wherein at least one of the adhesive layers comprises:
(1) 25 to 75 parts by weight of a brominated epoxy resin and 75 to 25 parts by weight of a curing agent, and 100 parts by weight of (2) glycidyl (meth) acrylate units 2 to 6
50 to 300 parts by weight of an epoxy group-containing acrylic copolymer having a Tg (glass transition temperature) of -10 ° C or more and a weight average molecular weight of 800,000 or more, containing
From (3) a flame retardant thermosetting resin component containing 0.1 to 10 parts by weight of a curing accelerator, (4) 0.1 to 10 parts by weight of a coupling agent, and (5) 5 to 30 parts by weight of antimony oxide. The adhesive member according to claim 1, wherein the adhesive member comprises: 6. The adhesive member according to claim 1, wherein the adhesive layers B and C have different thicknesses. 7. The method according to claim 1, wherein both sides of the rigid base material A are provided.
A method for producing an adhesive member, comprising bonding an adhesive layer B and an adhesive layer C made of any one of the thermosetting resin components by thermocompression bonding. 8. A wiring board for mounting a semiconductor, comprising the adhesive member according to claim 1 on a semiconductor chip mounting surface of the wiring board. 9. A semiconductor device in which a semiconductor chip and a wiring board are bonded using the bonding member according to claim 1.