JP2000144072A - Elctronic part double-side adhesive film, semiconductor mounting organic substrate and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prepare a low elastic electronic part double-side adhesive film for bonding materials having remarkable different thermal expansion coefficients such as semiconductor chips and semiconductor mounting substrates, and a semiconductor mounting substrate and a semiconductor device using the same. SOLUTION: An electronic part double-side adhesive film 1 is obtained by forming adhesive layers 11 of an uncured thermosetting resin composition on both sides of a core material 12 of a cured product of a thermosetting resin composition, respectively. It is preferred that the storage elastic moduli at 25 deg.C, measured by dynamic viscoelasticity measuring equipment, of the cured product of the adhesive layers and the core material are 10-2,000 MPa and, simultaneously, those at 260 deg.C are 3-50 MPa.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided adhesive film for an electronic component, an organic substrate for mounting a semiconductor, and a semiconductor device using the same, which are preferably used for manufacturing a semiconductor device.

[0002]

2. Description of the Related Art When a semiconductor chip is mounted on an organic substrate for mounting a semiconductor, an epoxy or polyimide adhesive called a die bonding paste is used.
However, a thermal stress is generated due to a mismatch in expansion coefficient between the semiconductor chip and the organic substrate for mounting the semiconductor, and furthermore, the motherboard on which the semiconductor device comprising the semiconductor chip is mounted. It causes defects such as cracks in the soldered part. To alleviate such thermal stress, a low elasticity adhesive is effective.

The thickness of the adhesive for relieving thermal stress must be an appropriate thickness designed by simulation or the like, and a film-like adhesive is used to secure the thickness accuracy. ing. In the assembly process of a semiconductor device, a film-like adhesive is used because of its easy handling and a dry process.

When an adhesive film is attached to an organic substrate for mounting a semiconductor, it is necessary to embed a step between a wiring on the substrate and a substrate. If the embedding is insufficient, voids are generated at the bonding interface, which causes a decrease in the heat resistance and humidity resistance of the assembled semiconductor device. For this reason, a thermosetting resin composition that can flow sufficiently at the time of sticking and can embed the step is used.

[0005] As a composition of such a low elasticity adhesive film, a system containing acrylonitrile-butadiene rubber as a main component is often used. However, there are drawbacks such as a large decrease in adhesive strength after long-time treatment at a high temperature and inferior electric corrosion resistance. In particular, when a moisture resistance test is performed under severe conditions such as a PCT (pressure cooker test) process used in reliability evaluation of semiconductor-related components, deterioration is large. Furthermore, since the acrylonitrile-butadiene rubber system has a high melt viscosity, it is difficult to embed wiring steps on the substrate when sticking to an organic substrate for mounting semiconductors, and voids are easily generated.

[0006]

In the case of an adhesive having improved fluidity so that wiring steps can be easily embedded, the resin flows to unnecessary portions at the time of application and is connected in a subsequent step such as lead or wire bonding. Failure may occur. In addition, the thickness accuracy cannot be ensured, for example, the thickness is reduced by the amount of the resin that has flowed out, or the thickness is uneven. In order to make it easier to control the fluidity of such a resin, Japanese Patent Application Laid-Open No. 9-321084 and
It is effective to provide an adhesive layer on both surfaces of a core material having no fluidity as in Japanese Patent Application Laid-Open No. 0-22325 to form a three-layer structure.

The performance required for such a three-layered core material includes heat resistance, adhesion to an adhesive layer, low elasticity, thickness accuracy, and the like. Generally, heat resistance is regarded as important. Therefore, a heat-resistant thermoplastic resin film is used. (Super) engineering plastics such as polyimide, polyester, and polytetrafluoroethylene are generally used as heat-resistant thermoplastic resins. Decreases stress relaxation effect.

Further, depending on the material of the core material, there is a possibility that the adhesive strength between the core material and the adhesive layer is not sufficient. For example, polyimide or polytetrafluoroethylene is a resin having low polarity, so that the adhesive strength to the adhesive layer tends to decrease.
When the adhesive strength is reduced, the absorbed moisture easily accumulates at the interface between the core material and the adhesive layer, which causes a so-called reflow crack that expands due to the vapor pressure of the absorbed moisture during solder reflow. In addition, if the core material and the adhesive layer have different coefficients of thermal expansion, thermal stress is generated, which, together with the decrease in the adhesive strength, causes the interface material between the core material and the adhesive layer to peel off.

The present invention relates to a low-elastic double-sided adhesive film for electronic components for bonding a semiconductor chip and an organic substrate for mounting semiconductors having significantly different coefficients of thermal expansion, an organic substrate for mounting semiconductor using the same, and In providing a semiconductor device, an object is to improve adhesiveness and reliability such as temperature cycle resistance and reflow resistance. Specifically, in a double-sided adhesive film for an electronic component comprising a core material and an adhesive layer, the elasticity of the core material is reduced and the adhesive strength between the core material and the adhesive layer is improved. It is an object of the present invention to match the thermal expansion coefficients of the two.

[0010]

The present invention relates to a double-sided adhesive film for electronic parts having an adhesive layer formed on both surfaces of a core material, wherein the adhesive layer is an uncured thermosetting resin composition. A double-sided adhesive film for electronic parts, wherein the core material is a cured product of a thermosetting resin composition.

The storage elastic modulus at 25 ° C. measured by a dynamic viscoelasticity measuring device for the cured product of the adhesive layer and the core material is 10 to 2
The storage elastic modulus at 2,000 MPa and 260 ° C. is 3 to 5
It is preferably 0 MPa.

As the thermosetting resin composition forming the adhesive layer and the core material, (1) epoxy resin and its curing agent 10
0 parts by weight, (2) epoxy equivalent of 2000 to 15000
100 to 300 parts by weight of an epoxy group-containing acrylic copolymer having a glass transition temperature of −10 ° C. or more and a weight average molecular weight of 800,000 or more in g / mol, and (3) a curing accelerator of 0.1 to 5 parts by weight. Are preferred.

The present invention is an organic substrate for mounting a semiconductor, comprising the above-mentioned double-sided adhesive film for electronic parts.

The present invention is also a semiconductor device in which a semiconductor chip and an organic substrate for mounting a semiconductor are bonded via the double-sided adhesive film for electronic components.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION The double-sided adhesive film for an electronic component of the present invention is characterized in that the adhesive layer is an uncured thermosetting resin composition and the core material is a cured thermosetting resin composition. An adhesive layer is formed on both sides.

The thermosetting resin composition forming the core layer with the adhesive layer may be the same or different between the adhesive layer and the core material. And the coefficient of thermal expansion must be matched. Generally, it is preferable that they are the same, but the present invention is not limited to this.

The cured product of the thermosetting resin composition, that is, the cured product of the adhesive layer and the core material has a storage elastic modulus measured by a dynamic viscoelasticity measuring device of 10 to 2,000 MPa at 25 ° C. and 3 at 260 ° C. Preferably it is ５０50 MPa. Storage elastic modulus exceeding 2,000 MPa at 25 ° C. and 2
When the temperature exceeds 60 MPa at 60 ° C., the effect of relieving the thermal stress generated due to the difference in the thermal expansion coefficient between the semiconductor chip and the organic substrate for mounting a semiconductor becomes small, and there is a possibility that peeling or cracking may occur. On the other hand, the storage elastic modulus is 25 ° C
If the pressure is less than 10 MPa, the handleability of the double-sided adhesive film for electronic parts and the thickness accuracy of the adhesive layer are deteriorated.
If it is less than Pa, reflow cracks are likely to occur.

Such a thermosetting resin composition includes:
A composition comprising an epoxy resin and its curing agent, an epoxy group-containing acrylic copolymer, and a curing accelerator is suitable.

The epoxy resin may be any resin as long as it hardens and exhibits an adhesive action. An epoxy resin having two or more functional groups, preferably having a molecular weight of less than 5,000, more preferably less than 3,000 can be used. Examples of the bifunctional epoxy resin include a bisphenol A type or bisphenol F type resin. The bisphenol A type or bisphenol F type liquid resin is commercially available from Yuka Shell Epoxy Co., Ltd. under the trade names of Epikote 807, Epikote 827 and Epikote 828. In addition, Dow Chemical Japan Co., Ltd. E. FIG. R. 330, D.I. E. FIG. R. 33
1, D. E. FIG. R. 361. Further, YD8125, Y
It is marketed under the trade name DF8170. As the epoxy resin, a polyfunctional epoxy resin may be added for the purpose of increasing the Tg. Examples of the polyfunctional epoxy resin include a phenol novolak epoxy resin and a cresol novolak epoxy resin. Phenol novolak type epoxy resin is available from Nippon Kayaku Co., Ltd.
It is marketed under the trade name 01. Cresol novolak type epoxy resin is available from Sumitomo Chemical Co., Ltd.
It is commercially available under the trade names SCN-190 and ESCN-195. In addition, EOC from Nippon Kayaku Co., Ltd.
It is commercially available under the trade names N1012, EOCN1025, and EOCN1027. Further, YDCN701, YDCN702, YDCN
703 and YDCN704.

As the curing agent, those usually used as curing agents for epoxy resins can be used, and two or more amines, polyamides, acid anhydrides, polysulfides, boron trifluoride and phenolic hydroxyl groups per molecule are used. And bisphenol A, bisphenol F, bisphenol S, and the like. In particular, it is preferable to use a phenol resin such as a phenol novolak resin, a bisphenol novolak resin, or a cresol novolak resin because of excellent electric corrosion resistance during moisture absorption. Such preferred curing agents are available from Dainippon Ink and Chemicals, Inc., phenolite LF2882, phenolite LF2822,
Phenolite TD-2090, Phenolite TD-21
49, phenolite VH4150, phenolite VH4
It is marketed under the trade name of 170. The mixing amount is preferably a logical equivalent ratio according to the epoxy equivalent of the epoxy resin, but is not limited thereto.

It is preferable to use a curing accelerator together with the curing agent, and it is preferable to use various imidazoles as the curing accelerator. Examples of imidazole include 2-methylimidazole, 2-ethyl-4-methylimidazole,
Examples thereof include 1-cyanoethyl-2-phenylimidazole and 1-cyanoethyl-2-phenylimidazolium trimellitate. Imidazoles were obtained from Shikoku Chemicals Corporation, 2E4MZ, 2PZ-CN, 2PZ-CN.
It is marketed under the trade name S. The blending amount needs to be adjusted to control the curing speed and the B-stage state, but is preferably 0.1 to 5 parts by weight based on 100 parts by weight of the epoxy resin and its curing agent.

The epoxy group-containing acrylic copolymer has an epoxy equivalent of 2000 to 15000 g / mol and a Tg of-
A copolymer having a temperature of 10 ° C. or more and a weight average molecular weight of 800,000 or more is preferable. In a copolymer containing a carboxylic acid group or a hydroxyl group, a crosslinking reaction when the adhesive composition is formed is apt to proceed, and problems such as a decrease in the fluidity of the adhesive layer and a decrease in the adhesive force are likely to occur. . The composition for the core material is not limited to this. Epoxy equivalent is 2000-
A range of 15000 g / mol is preferred, and 2000 g / mol
If the amount is less than 1 mol, the copolymer is likely to gel, and it is 1500
If it exceeds 0 g / mol, the adhesive strength decreases. The method for introducing an epoxy group is not particularly limited. For example, a method of copolymerizing a monomer having an epoxy group such as glycidyl (meth) acrylate, a method of copolymerizing a monomer having a hydroxyl group and then adding epichlorohydrin And a method of copolymerizing a monomer having a hydroxyl group and then adding glycidol using diisocyanate. The remainder of the copolymer is ethyl (meth) acrylate or butyl (meth)
Acrylate, acrylonitrile or a mixture thereof can be used, but the mixing ratio can be determined in consideration of the Tg of the copolymer. Known methods such as pearl polymerization and solution polymerization can be used as a polymerization method for obtaining a copolymer from these monomers. If the Tg of the epoxy group-containing acrylic copolymer is lower than −10 ° C., the tackiness of the adhesive layer in the B-stage state may increase, and the handleability may deteriorate. Further, the weight average molecular weight is preferably 800,000 or more, and a good composition can be obtained in terms of the strength, flexibility, tackiness and the like of the adhesive layer. Such an epoxy group-containing acrylic copolymer is commercially available from Teikoku Chemical Industry Co., Ltd. under the trade name of HTR-860P-3. The addition amount of the epoxy group-containing acrylic copolymer is 100 to 300 parts by weight based on 100 parts by weight of the epoxy resin and its curing agent in consideration of the storage elastic modulus of the adhesive layer and the core material, the fluidity at the time of adhesion, and the adhesiveness. Parts are preferred.

An inorganic filler can be added for the purpose of improving the handleability of the adhesive layer and the core material, improving the thermal conductivity, adjusting the melt viscosity, imparting thixotropic properties, and the like. As inorganic fillers, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate,
Calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, alumina, aluminum nitride,
Examples include aluminum borate whiskers, boron nitride, crystalline silica, amorphous silica, and the like. For improving the thermal conductivity, alumina, aluminum nitride, boron nitride, crystalline silica, amorphous silica and the like are preferable. For the purpose of adjusting melt viscosity and imparting thixotropic properties, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, alumina, crystalline silica, Crystalline silica and the like are preferred.

In order to improve the interfacial bonding between different kinds of materials, a coupling agent can be blended, and a silane coupling agent is particularly preferable. As the silane coupling agent, γ-glycidoxypropyltrimethoxysilane, γ
-Mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-ureidopropyltriethoxysilane, N-β-aminoethyl-γ-aminopropyltrimethoxysilane and the like. γ-glycidoxypropyltrimethoxysilane is NUCA-18
7. γ-mercaptopropyltrimethoxysilane is NU
CA-189, γ-aminopropyltriethoxysilane is NUC A-1100, γ-ureidopropyltriethoxysilane is NUC A-1160, N-β-aminoethyl-γ-aminopropyltrimethoxysilane is N
All are commercially available from Nippon Unicar Ltd. under the trade name UC A-1120.

Further, an ion scavenger can be blended for the purpose of adsorbing ionic impurities and improving insulation reliability during moisture absorption. Examples of the ion scavenger include compounds known as copper damage inhibitors for preventing copper from being ionized and dissolved, such as triazine thiol compounds and bisphenol-based reducing agents. As the bisphenol-based reducing agent, 2,2′-methylene-bis (4-methyl-6-third
-Butylphenol), 4,4'-thio-bis (3-methyl-6-tert-butylphenol) and the like.
Examples of the inorganic ion adsorbent include a zirconium compound, an antimony bismuth compound, and a magnesium / aluminum compound. A copper damage inhibitor containing a triazine thiol compound as a component is commercially available from Sankyo Pharmaceutical Co., Ltd. under the trade name Disnet DB. A copper damage inhibitor containing a bisphenol-based reducing agent as a component is commercially available from Yoshitomi Pharmaceutical Co., Ltd. under the trade name Yoshinox BB. Various inorganic ion adsorbents are commercially available from Toa Gosei Chemical Industry Co., Ltd. under the trade name IXE.

The method for forming the adhesive layers on both sides of the core material is not particularly limited. For example, it can be formed by a known method such as lamination, coating, and dipping. Preferred methods are lamination and coating, and it is possible to precisely control the thickness of the double-sided adhesive film for electronic components. In particular, the laminate is excellent in mass productivity because only the adhesive layer can be formed in advance. The thicknesses of the core material and the adhesive layer at this time are not particularly limited, but the total thickness of the double-sided adhesive film for an electronic component combining these is 10 to 500 μm.
Is preferred. If it is less than 10 μm, the effect of relaxing the thermal stress becomes small, and there is a possibility that peeling or cracking may occur. 500 μm
If the number exceeds the limit, lead or wire bonding becomes difficult, and the thickness of the semiconductor device increases. More preferably, it is 50 to 250 μm.

When the adhesive layer is formed by laminating an adhesive layer on both sides of the core material, the components of the adhesive composition are dissolved or dispersed in a solvent in advance to form a varnish, which is coated on a carrier film and heated. Obtained by removing the solvent. As the carrier film, a polytetrafluoroethylene film, a polyethylene terephthalate film, a release-treated polyethylene terephthalate film, a polyethylene film, a polypropylene film,
Plastic films such as a polymethylpentene film and a polyimide film can be used. The carrier film may be peeled before lamination to the core material, or may be laminated to the core material together with the carrier film and peeled at the time of use. As an example of the carrier film, a polyimide film is commercially available from Dupont Toray under the trade name Kapton and from Kanegafuchi Chemical Co., Ltd. under the trade name Apical. Polyethylene terephthalate film is commercially available from Toray DuPont under the trade name Lumirror and from Teijin Limited under the trade name Purex.

Solvents for varnishing include relatively low boiling point methyl ethyl ketone, acetone, methyl isobutyl ketone,
It is preferable to use 2-ethoxyethanol, toluene, butyl cellosolve, methanol, ethanol, 2-methoxyethanol and the like. Further, a high boiling point solvent may be added for the purpose of improving the coating properties. Examples of the high boiling point solvent include dimethylacetamide, dimethylformamide, methylpyrrolidone, cyclohexanone and the like. The production of the varnish can be carried out by a mill, a three-roll mill, a bead mill or the like, or a combination thereof, in consideration of the dispersion of the inorganic filler.
By mixing the filler and the low molecular weight material in advance and then blending the high molecular weight material, the time required for mixing can also be reduced. After the varnish is formed, it is preferable to remove bubbles in the varnish by vacuum degassing. When an adhesive layer is formed on both surfaces of the core material by coating, the varnish can be used as it is.

The core material is prepared by dissolving or dispersing each component of the core material composition in a solvent to form a varnish in the same manner as the above-mentioned method for forming the adhesive layer, applying the mixture on a carrier film, heating and removing the solvent. can get. The core material needs to be cured so that it does not flow even when heated, and this curing treatment may be performed simultaneously with the solvent removal step, or may be left separately in a constant temperature bath. The degree of hardening is not particularly limited, and for the purpose of the present invention, it is sufficient that it does not flow due to heating at the time of sticking to an organic substrate for mounting a semiconductor and at the time of mounting a semiconductor chip.

The organic substrate for mounting a semiconductor according to the present invention includes:
FR-4 board with glass cloth impregnated with epoxy resin, BT with bismaleimide-triazine resin impregnated
A substrate, or a polyimide film substrate using a polyimide film as a base material can be used. The shape of the wiring may be any of single-sided wiring, double-sided wiring, and multi-layered wiring, and a through hole or a non-through hole electrically connected may be provided as necessary. When the wiring appears on the outer surface of the semiconductor device, a protective resin layer may be provided.
As a method of attaching the double-sided adhesive film for electronic components to the organic substrate for mounting semiconductors, a method is generally used in which the double-sided adhesive film for electronic components is cut into a predetermined shape and thermocompression-bonded to a desired position on the organic substrate for mounting semiconductors. However, the present invention is not limited to this.

The semiconductor device of the present invention has a semiconductor chip mounted on an organic substrate for mounting a semiconductor via the above-mentioned double-sided adhesive film for electronic components. The method of mounting the semiconductor chip may be either face-down or face-up. As a method of mounting a semiconductor chip on an organic substrate for mounting a semiconductor, a double-sided adhesive film for an electronic component is cut into a predetermined shape, and is thermally bonded to a desired position on the organic substrate for mounting a semiconductor and is permanently bonded or temporarily bonded, Further, a method of thermocompression bonding a semiconductor chip is generally used, but the method is not limited to this. A double-sided adhesive film for an electronic component may be bonded to a semiconductor chip first, and then bonded to an organic substrate for mounting a semiconductor. The curing treatment of the adhesive layer may be performed at the time of the thermocompression bonding, or may be performed by a separate heat treatment, or may be performed in another step, for example, a sealing step or a soldering step.

[0032]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be specifically described below.

Example 1 45 parts by weight of bisphenol A type epoxy resin (Epicoat 828, trade name of Yuka Shell Epoxy Co., Ltd.) and 15 parts by weight of cresol novolak type epoxy resin (ESCN195, trade name of Sumitomo Chemical Co., Ltd.) Parts, 40 parts by weight of phenol novolak resin (Plyofen LF2882, trade name of Dainippon Ink and Chemicals, Inc.), epoxy group-containing acrylic rubber (HTR-860P-3, trade name of Teikoku Chemical Industry Co., Ltd., molecular weight 1,000,000, Tg-7 ° C) 150 parts by weight, curing accelerator 1-cyanoethyl-2-phenylimidazole (Curesol 2PZ-CN, trade name of Shikoku Chemicals Co., Ltd.) 0.5 part by weight, γ-glycidoxypropyltrimethoxysilane (NUC A-187, trade name, manufactured by Nippon Unicar Co., Ltd.) 0.7 The amount unit, and an adhesive varnish dissolved with stirring by adding methyl ethyl ketone. The adhesive varnish was applied on a release-treated polyethylene terephthalate film having a thickness of 75 μm, and dried by heating at 140 ° C. for 5 minutes to form a coating film having a thickness of 50 μm, thereby producing an adhesive film. The adhesive film was cured by heating at 170 ° C. for 1 hour. The storage elastic modulus was measured using a dynamic viscoelasticity measuring device (DVE-V4, manufactured by Rheology) (sample size: length 20 mm, width 4 mm, film thickness 50 μm). , Heating rate 5
(° C./min, tensile mode, 10 Hz, automatic static load), the result was 360 MPa at 25 ° C. and 4 MPa at 260 ° C. A coating film having a thickness of 100 μm was prepared in the same manner as the adhesive film, and was heat-treated at 170 ° C. for 1 hour to be cured to obtain a core material. The storage modulus of the core material was equal to the storage modulus of the adhesive film. The adhesive film was heat-laminated at 80 ° C. and 0.3 MPa on both sides of the core material as an adhesive layer to obtain a double-sided adhesive film for electronic parts.

Comparative Example 1 Double-sided bonding for electronic parts in the same manner as in Example 1 except that an uncured adhesive film having the same composition as the adhesive layer of Example 1 and a thickness of 100 μm was used as the core material. A film was obtained.

(Comparative Example 2) Thickness of 100 μm as core material
A double-sided adhesive film for electronic parts was obtained in the same manner as in Example 1 except that the polyimide film (UPILEX S, trade name of Ube Industries, Ltd.) was used.

A method of assembling a semiconductor device using the obtained double-sided adhesive film for electronic parts will be described with reference to FIG. 1 as an example, but the present invention is not limited to this. The double-sided adhesive film for electronic parts (1) comprises an adhesive layer (11) and a core material (12). First, a double-sided adhesive film (1) for an electronic component cut out to a predetermined size is placed on the wiring side of the polyimide film substrate (3) on which the wiring (4) is formed.
Thermocompression bonding was performed at a temperature of 0.5 ° C. and a pressure of 0.5 MPa for 5 seconds. Next, the semiconductor chip (2) was thermocompression-bonded to the opposite side of the substrate of the double-sided adhesive film for electronic components at 170 ° C., 1 MPa, and 5 seconds. At this time, the amount of deformation of the double-sided adhesive film for electronic components in the plane direction was measured and defined as the amount of protrusion. This is 170 ° C,
After heating for one hour to cure the adhesive layer of the double-sided adhesive film for electronic components, the pads of the semiconductor chip and the wiring on the substrate are connected by bonding wires (51) in FIG. In b), the semiconductor device was obtained by bonding the inner lead (52) of the substrate to the pad of the semiconductor chip. This semiconductor device is generally mounted on a substrate via solder balls (6).

Using the obtained semiconductor device, adhesion, temperature cycle resistance, and reflow resistance were examined. The adhesion was measured by measuring the 90-degree peel strength when the semiconductor chip was fixed and the polyimide film substrate was pulled. The temperature cycle resistance is such that the semiconductor device is left in an atmosphere of -55 ° C. for 30 minutes and then left in an atmosphere of 125 ° C. for 30 minutes as one cycle, and the interface peeling between the core material and the adhesive layer after 1000 cycles is exceeded. Observation was carried out with an ultrasonic flaw detector, and the case where peeling did not occur was evaluated as ○, and the case where peeling occurred was evaluated as ×. The reflow resistance is determined by using an ultrasonic flaw detector to inspect the interface separation between the core material and the adhesive layer after passing the semiconductor device which has been absorbed at 85 ° C. and 85% RH for 168 hours through an IR reflow furnace at 240 ° C. for 20 seconds. The sample was observed as “○”, and the sample without peeling was evaluated as “○”, and the sample with peeling was evaluated as “X”. Table 1 shows the results.

[0038]

[Table 1] * The elastic modulus and expansion coefficient of the adhesive layer and core material are the values for cured products.

As is clear from Table 1, in the examples, the amount of protrusion at the time of sticking was small, the adhesion between the core material and the adhesive layer was good, and the temperature cycle resistance and the reflow resistance were excellent. In contrast, in Comparative Example 1 in which the double-sided adhesive film for an electronic component was entirely made of an uncured thermosetting resin composition,
Although it was excellent in temperature cycle resistance and reflow resistance, the double-sided adhesive film for electronic parts had a large amount of protrusion, so that it flowed out at the time of bonding and caused defects in wire or lead bonding. In Comparative Example 2 in which polyimide was used as the core material, the adhesiveness between the adhesive layer and the core material was inferior and the thermal expansion coefficients were different, so that failures occurred in the temperature cycle resistance and the reflow resistance.

[0040]

As described above, a semiconductor device in which a semiconductor chip and an organic substrate for mounting a semiconductor are bonded using the double-sided adhesive film for an electronic component of the present invention, the core material and the adhesive layer of the double-sided adhesive film for an electronic component are provided. Has excellent adhesiveness, and is excellent in temperature cycle resistance and reflow resistance in order to reduce thermal stress generated from the difference in coefficient of thermal expansion between the semiconductor chip and the organic substrate. Therefore, a semiconductor device with excellent reliability can be obtained by using the double-sided adhesive film for electronic components of the present invention.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a semiconductor device using a double-sided adhesive film for an electronic component according to the present invention, wherein (a) shows a semiconductor device in which pads of a semiconductor chip and wiring on a substrate are connected by bonding wires; FIG. 2 shows a cross-sectional view of a semiconductor device in which inner leads of a substrate are bonded to pads of a semiconductor chip.

[Explanation of symbols]

 1. 10. Double-sided adhesive film for electronic parts Adhesive layer 12. Core material 2. Semiconductor chip 3. 3. Polyimide substrate Wiring 51. Bonding wire 52. Inner lead 6. Solder ball

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Yuko Tanaka 1500 Oji Ogawa, Shimodate City, Ibaraki Pref.Hitachi Chemical Industry Co., Ltd. F-term in Shimodate Research Laboratory (Reference) 4J004 AA01 AA13 AA17 AB05 CA06 CC02 EA05 FA05 4J040 DF041 DF042 DF051 DF052 EB032 EC061 EC062 EC071 EC072 EC201 EC202 EC231 EC232 EG002 GA11 HA326 HB38 HB47 HC01 HC20 LA08 NA09 AA17 BA23 BA35 BA51 BB03 BB16

Claims (5)

[Claims] 1. A double-sided adhesive film for electronic parts having an adhesive layer formed on both sides of a core material, wherein the adhesive layer is an uncured thermosetting resin composition, and the core material is a thermosetting resin. A double-sided adhesive film for electronic parts, which is a cured product of the composition. 2. The storage elastic modulus at 25 ° C. of a cured product of an adhesive layer and a core material measured at 25 ° C. by a dynamic viscoelasticity measuring device is 10 to 10.
The storage elastic modulus at 2000 MPa and 260 ° C. is 3 to 50.
2. The double-sided adhesive film for electronic components according to claim 1, wherein the adhesive film is MPa. 3. A thermosetting resin composition comprising (1) 100 parts by weight of an epoxy resin and a curing agent thereof, (2) an epoxy equivalent of 2000 to 15000 g / mol and a glass transition temperature of-
3. The composition according to claim 1, comprising 100 to 300 parts by weight of an epoxy group-containing acrylic copolymer having a temperature of 10 ° C. or more and a weight average molecular weight of 800,000 or more, and (3) 0.1 to 5 parts by weight of a curing accelerator. The double-sided adhesive film for electronic components according to 1. 4. An organic substrate for mounting a semiconductor, comprising a double-sided adhesive film for an electronic component according to claim 1 in a chip mounting portion. 5. A semiconductor device wherein a semiconductor chip and an organic substrate for mounting a semiconductor are bonded via the double-sided adhesive film for electronic components according to claim 1.