JP2002212525A - Adhesive film for semiconductor, substrate for mounting semiconductor chip and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an adhesive film capable of preventing peeling of a cover film from an adhesive layer during blanking and bringing the cover film to be easily removed after adhesion and provide a substrate for mounting semiconductor chips to which the film is adhered and a semiconductor device produced by using the film. SOLUTION: This adhesive film for semiconductor is equipped with a cover film on at least one side face of an adhesive layer and has 1-100 N/m peel force between the adhesive layer and the cover film.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an adhesive film for a semiconductor, a semiconductor chip mounting substrate provided with the adhesive film, and a semiconductor device using the same.

[0002]

2. Description of the Related Art In recent years, with the miniaturization of electronic devices, semiconductor packages have been required to be mounted at high density on substrates. As miniaturization and weight reduction progress, CSP (chip size package) and μBGA (ball grid array)
The development of a small package called a "small package" is underway.

[0003] Reliability is one of the important characteristics of a mounting board on which various electronic components are mounted, and particularly, connection reliability is a very important item because it directly relates to the quality of equipment using the mounting board. ing. As a cause of reducing the connection reliability, a thermal stress caused by a difference in thermal expansion coefficient between a semiconductor chip and a substrate on which electronic components are mounted can be cited. This is because the thermal expansion coefficient of a semiconductor chip is as small as about 4 ppm / ° C., while the thermal expansion coefficient of a wiring board on which electronic components are mounted is 15 ppm.
Since the stress is as high as ppm / ° C. or more, when a strain caused by a thermal shock occurs, the strain generates a thermal stress. For example, in bare chip mounting, thermal stress concentrates on a solder ball portion connecting an electrode of a semiconductor chip and a wiring pad of a wiring board, thereby reducing connection reliability. It has been found that injecting a resin called underfill between the chip and the wiring board is effective in dispersing the thermal stress, but this has caused an increase in the number of mounting steps and an increase in cost.

[0004] As countermeasures against these, CSP and μBGA
Many structures have been proposed. For example, in μBGA, a low-elastic insulating adhesive is provided between a semiconductor chip and a wiring board called an interposer so as to reduce thermal stress caused by a difference in thermal expansion coefficient between the semiconductor chip and a wiring substrate. Is used. In recent years, as an insulating adhesive suitable for such a field, there has been reported that a low elasticity adhesive film has good workability and high connection reliability (Japanese Patent Application Laid-Open No. 8-266460). Physical properties required of the low elasticity adhesive film include adhesion, temperature cycling, moisture resistance and the like, in addition to reduction of thermal stress of the chip and the wiring board. Further, in recent years, there has been an increasing demand for improving the storage stability of the adhesive and the productivity at the time of chip bonding.

As a method of attaching an adhesive film to a wiring board, as described in Japanese Patent Application Laid-Open No. 8-266460, an adhesive film is punched from a cover film side with a mold while a cover film is attached to one surface. ,
A general method is to perform a thermocompression treatment called final compression after performing a temporary compression bonding to a wiring board, and peel off a cover film and then attach a chip. However, if the cover film is easily peeled off from the adhesive layer, there is a problem that the cover film and the adhesive layer are peeled off at the time of punching the adhesive film, thereby causing a void to be involved. On the other hand, if the cover film is not easily peeled off from the adhesive layer, it becomes difficult to peel off the cover film after the final pressure bonding, which causes problems such as occurrence of peeling failure and deterioration of workability.

[Problems to be solved by the invention]

According to the present invention, the peeling force between the cover film and the adhesive layer of the adhesive film used for the above-mentioned application is from 1 to 10
By adjusting the thickness to 0 N / m, it is possible to provide an adhesive film that prevents peeling of the cover film from the adhesive layer at the time of punching and that facilitates removal of the cover film after the final compression bonding. The present invention provides a semiconductor chip mounting substrate and a semiconductor device manufactured using the film.

[0007]

Means for Solving the Problems The present inventors use a cover film having a suitable adhesiveness and adjust the peeling force between the cover film and the adhesive layer within the range of 1 to 100 N / m to obtain the above-mentioned. The inventors have solved the problem and found that an adhesive film having excellent heat resistance, corrosion resistance, and moisture resistance, and also excellent in handling and workability can be obtained, and based on this finding, completed the present invention.

The present invention relates to a semiconductor adhesive film having a cover film on at least one side of an adhesive layer and having a peeling force between the adhesive layer and the cover film of 1 to 100 N / m.

In the present invention, the cover film may be made of polyethylene terephthalate, polyethylene naphthalate,
The present invention relates to the above adhesive film for a semiconductor, which is a film made of polyether sulfone or polyolefin.

The present invention also relates to the above adhesive film for semiconductor, wherein the cover film is a film whose surface has been subjected to a release treatment.

[0011] In the present invention, the adhesive layer may be a layer made of at least one resin selected from the group consisting of epoxy, acrylic, silicone, polyimide, polyamide and polyamideimide. The present invention relates to an adhesive film for a semiconductor.

According to the present invention, the adhesive layer comprises (1) 100 parts by weight of an epoxy resin and its curing agent, (2) a Tg (glass transition temperature) of -20 to 30 ° C. and a weight average molecular weight of 30. 50 to 300 parts by weight of an acrylic copolymer having a carboxyl group, a hydroxyl group, an acid anhydride group, an amide group or an epoxy group of 2,000 to 1,000,000, and (3) a curing accelerator of 0.01 to 10 The present invention relates to the above-mentioned adhesive film for a semiconductor, which is a layer comprising a resin composition containing 0.01 to 10 parts by weight of a coupling agent and (4) a coupling agent.

The present invention also relates to the above-mentioned adhesive film for semiconductor, wherein the adhesive layer is a layer further comprising (5) a resin composition containing 0.1 to 20 parts by weight of a phenoxy resin.

The present invention also relates to the above adhesive film for a semiconductor, wherein the adhesive layer is a layer further comprising (6) a resin composition containing 100 parts by weight or less of an inorganic filler.

In the present invention, the adhesive layer has a Tg of 20.
The present invention relates to the above-mentioned adhesive film for semiconductor, which is a layer in which a layer made of the above resin composition is formed on both sides of a heat-resistant film at 0 ° C. or higher.

The present invention also relates to a semiconductor chip mounting substrate obtained by bonding any one of the above adhesive films.

The present invention also relates to a semiconductor device manufactured using the above-mentioned adhesive film.

[0018]

FIG. 1 is a sectional view of an adhesive film for a semiconductor according to the present invention. An adhesive layer 2 is provided on both surfaces of a substrate 3 and a cover film 1 is provided thereon. FIG. 2 is a cross-sectional view of the wiring board for mounting a semiconductor according to one embodiment of the present invention during the assembling process. FIG. 2 shows that the adhesive film for a semiconductor of the present invention is punched out from the cover film side by a mold while the cover film 1 is stuck on one side, and the wiring 4 is formed.
Is press-fitted to the wiring board 5 having. FIG. 3 is a sectional view of a semiconductor mounting substrate according to one embodiment of the present invention. The semiconductor chip 6 is adhered to the wiring board for mounting a semiconductor provided with the adhesive film for semiconductor of the present invention on the semiconductor chip mounting surface of the wiring board 5, and a part of the wiring is connected to a bonding pad of the semiconductor chip as a semiconductor chip connecting member 7. Then, the periphery of the semiconductor chip is sealed with the sealing agent 8 and the solder balls 9 are provided.

The peeling force between the adhesive layer and the cover film in the semiconductor adhesive film of the present invention is 1 to 100 N / m.
, Preferably 3 to 50 N / m, more preferably 5 to 30 N / m. When the peeling force is less than 1 N / m, the cover film and the adhesive layer are peeled off at the time of punching the adhesive film to cause void entrainment. On the other hand, when the peeling force is more than 100 N / m, It becomes difficult to peel off the cover film.

The material of the cover film can be preferably selected from polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyether sulfone (PES), and polyolefin. Among them, PET and polyolefin are more preferable in terms of heat resistance and cost.

The thickness of the cover film varies somewhat depending on the thickness of the adhesive layer, but is generally from 10 to 500 μm, preferably from 20 to 300 μm, and more preferably from 20 to 100 μm. When the thickness exceeds 500 μm, burrs at the time of punching and workability tend to decrease, and when the thickness is less than 10 μm, the strength of the adhesive film itself tends to decrease and handling tends to be difficult.

Due to the adhesiveness between the adhesive and the cover film,
When the peeling force exceeds the range of 1 to 100 N / m, the peeling force can be adjusted by subjecting one or both surfaces of the cover film to a surface treatment. Examples of such surface treatment include a chemical surface treatment such as a mold release treatment, a coupling agent treatment, and an etching treatment, and a physical surface treatment such as etching, vapor deposition, and sputtering. Of these, a release treatment in which a release agent is applied is the most common, and a release agent such as a silicone-based, fatty acid ester-based, phosphate ester-based, alcohol-based, or fluorine-based release agent can be used.

Examples of the silicone release agent include dimethyl silicone oil, dimethyl silicone rubber, silicone resin, and organically modified silicone resin. Fatty acid ester-based release agents include ethylene glycol fatty acid esters, sorbitol fatty acid esters, and polyoxyethylene fatty acid stells. Examples of the phosphate release agent include polyoxyalkylene phosphate. Examples of the alcohol-based release agent include polyoxyalkylene glycols, glycols, and polyoxyethylene higher alcohol ethers. Examples of the fluorine release agent include polytetrafluoroethylene. When using these release agents, only one type or a combination of two or more types can be used, and the release layer can be used as it is or by dissolving it in an appropriate solvent and applying it to the cover film surface. Can be formed.

The adhesive layer in the adhesive film for a semiconductor of the present invention is an adhesive composed of at least one resin selected from the group consisting of epoxy, acrylic, silicone, polyimide, polyamide and polyamideimide. Layers can be used. Of these,
A composition comprising a mixture of an epoxy resin and an acrylic resin is particularly preferred.

The epoxy resin may be any resin as long as it cures and exhibits an adhesive action, and bifunctional and / or polyfunctional epoxy resins can be used. The bifunctional epoxy resin includes a liquid and a solid at room temperature, such as a bisphenol A epoxy resin, and these resins can be easily obtained from the market. For example, Epicoat 8
27, 828, 834, 1001, 1004, 100
7, 1009, 1010 (Yukaka Epoxy Co., Ltd.)
Made), Araldite GY252, 250, 260, 28
0, 6099 (manufactured by Ciba Geigy), D.I. E. FIG. R
330, 331, 336, 337, 668, 669 (manufactured by Dow Chemical Co., Ltd.), YD8125, YDF170
(Manufactured by Toto Kasei Co., Ltd.). As polyfunctional epoxy resin, phenol novolak type epoxy resin,
There are cresol novolak type epoxy resin, bisphenol A novolak epoxy resin, α-naphthol novolak epoxy resin, brominated novolak epoxy resin, and the like, and these resins can be easily obtained from the market. For example, phenol novolak epoxy resin: DE
N-431, 438, 439 (Dow Chemical Co., Ltd.)
Epicoat 152, 154 (made by Yuka Shell Epoxy Co., Ltd.), EPPN-201, 202 (made by Nippon Kayaku Co., Ltd.), cresol novolak epoxy resin: EO
CN-102S, 103S, 104S, 1020, 10
25, 1027 (manufactured by Nippon Kayaku Co., Ltd.), ESCN-0
01, 195X, 200S, 220 (manufactured by Sumitomo Chemical Co., Ltd.), YDCN-703 (Toto Kasei Co., Ltd.)
Made), bisphenol A novolak epoxy resin: N-
865, N-880 (Dainippon Ink Chemical Industry Co., Ltd.)
), Α-naphthol novolak epoxy resin: EXB
-4300 (manufactured by Dainippon Ink and Chemicals, Inc.), brominated phenol novolak epoxy resin: BREN-S
(Manufactured by Nippon Kayaku Co., Ltd.).

The epoxy resin in the present invention may be used alone or in combination of two or more. Assuming that the total amount of the epoxy resin and the curing agent in the present invention is 100 parts by weight, the epoxy resin is preferably 40 to 90 parts by weight, more preferably 50 to 80 parts by weight, and particularly preferably 50 to 70 parts by weight. It is. If the amount of the epoxy resin is too small, the adhesiveness tends to be insufficient, and if it is too large, the heat resistance tends to be insufficient.

The curing agent in the present invention is not particularly limited as long as it can be cured by reacting with the epoxy resin, and those usually used as curing agents for epoxy resins can be used. Examples include amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, and polyhydric phenol compounds.

Of these, polyhydric phenol compounds which are particularly excellent in corrosion resistance during moisture absorption are preferred, and phenol novolak resins, cresol novolak resins, bisphenol A novolak resins, bisphenol A, bisphenol F, bisphenol S, brominated bisphenol A, bromine Bisphenol F, etc., and can be easily obtained from the market. For example, novolak resins: phenolite LF2882, LF2822, TD-2090, T
D-2149, VH4150, VH4170 (Dainippon Ink & Chemicals, Inc.), PSM-4300 (Gunei Chemical Co., Ltd.), H-100 (Meiwa Kasei Co., Ltd.), brominated bisphenol A: Fireguard FG2000 ( Teijin Chemicals Ltd.).

In the present invention, (2) the Tg (glass transition temperature) is -20 ° C. to 30 ° C. and the weight average molecular weight is 3
Acrylic copolymers having a carboxyl group, a hydroxyl group, an acid anhydride group, an amide group or an epoxy group having a molecular weight of from 000 to 1,000,000 include non-functional monomers and functional monomers as shown below. What is obtained by copolymerizing is preferably used.

Non-functional monomers include, for example,
Methyl acrylate, ethyl acrylate, butyl acrylate
Acrylates such as 2-ethylhexyl acrylate
Kill ester, norbornyl acrylate, acrylate
Rubornyl methyl, adamantyl acrylate, acrylic
Tricyclo acid [5.2.1.0]^2,6] Decane-8-a
, Tricycloacrylate [5.2.1.0^2,6] Big
-3 (or 4) -ylmethyl, bornyl acrylate,
Isobornyl acrylate, methylcyclohexyl acrylate
Acrylic acid cycloalkyl ester such as sill, acrylic
Aromatic acrylates such as phenyl acrylate and benzyl acrylate
Esters, methyl methacrylate, ethyl methacrylate,
Butyl methacrylate, 2-ethylhexyl methacrylate
Methacrylic acid alkyl esters such as methacrylic acid nor
Bornyl, norbornylmethyl methacrylate, methacrylic acid
Adamantyl acrylate, tricyclomethacrylate [5.2.
1.0 ^2,6] Decan-8-yl, tricyclyl methacrylate
B [5.2.1.0^2,6] Decane-3 (or 4) -yl
Methyl, bornyl methacrylate, isobol methacrylate
Nil, methylcyclohexyl methacrylate, methacryl
Cycloalkyles such as cyclohexyl acrylate
Ter, phenyl methacrylate, benzyl methacrylate, etc.
Methacrylic acid aromatic ester, styrene or α-methyl
Α-substituted polystyrene such as styrene and α-ethylstyrene
, Chlorostyrene, vinyltoluene, t-butylstyrene
Nuclear-substituted styrene such as len, N-methylmaleimide, N-
Ethyl maleimide, N-propyl maleimide, N-butyl
N-alkyl group-substituted maleimides such as lumaleimide, N-
N-cycloalkyl group such as cyclohexylmaleimide
N-ary such as substituted maleimide and N-phenylmaleimide
Group-substituted maleimide, acrylonitrile, methacrylonitrile
Selected from the group consisting of vinyl cyanide compounds such as tolyl
At least one compound can be used. Non
The functional monomer has a Tg of the copolymer of −20 ° C. to 30 ° C.
It is preferable to select -10 ° C. to 20
C. is more preferable. If Tg is too low, B
The tackiness of the adhesive film in the
There is a tendency for the handleability to deteriorate.
Tend to be minutes.

Examples of the functional monomer include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, and itaconic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, and 2-hydroxyacrylate. Propyl, 2-hydroxypropyl methacrylate, N-methylolacrylamide, N-
Hydroxyl group-containing monomers such as methylol methacrylamide, (o-, m-, p-) hydroxystyrene, acid anhydride group-containing monomers such as maleic anhydride, amide group-containing monomers such as acrylamide and methacrylamide, and glycidyl acrylate; Glycidyl methacrylate, α-
Glycidyl ethyl acrylate, glycidyl α-n-propyl acrylate, glycidyl α-n-butyl acrylate, 3,4-epoxybutyl acrylate, 3,4-epoxybutyl methacrylate, -4,5-acrylic acid Epoxypentyl, methacrylic acid-4,5-epoxypentyl, acrylate-6,7-epoxyheptyl, methacrylic acid-6,7-epoxyheptyl, α-ethylacrylate-6,7-epoxyheptyl, acrylic acid-3 -Methyl-3,4-epoxybutyl, 3-methyl-3,4-epoxybutyl methacrylate, 4-methyl-4,5-epoxypentyl acrylate, 4-methyl-4,5-epoxy methacrylate Pentyl, 5-methyl-5,6-epoxyhexyl acrylate, 5-methacrylic acid
Methyl-5,6-epoxyhexyl, acrylic acid-β-
Methyl glycidyl, β-methyl glycidyl methacrylate, β-methyl glycidyl α-ethyl acrylate, 3-methyl-3,4-epoxybutyl acrylate, 3-methyl-3,4-epoxybutyl methacrylate, 4-methyl-4,5-epoxypentyl acrylate, 4-methyl-4,5-epoxypentyl methacrylate, 5-methyl-5,6-epoxyhexyl acrylate, 5-methyl-5 methacrylate At least one compound selected from the group consisting of epoxy group-containing monomers such as 2,6-epoxyhexyl can be used. Among these, an epoxy group-containing monomer is preferable in terms of storage stability, and glycidyl methacrylate is more preferable.

The copolymerization ratio of the non-functional monomer and the functional monomer is 90 /
It is in the range of 10 to 99.9 / 0.1 parts by weight, preferably in the range of 93/7 to 99.5 / 0.5, and more preferably in the range of 95/5 to 99/1. If the amount of the functional monomer is too large, gelation tends to occur during copolymerization, and if the amount is too small, adhesiveness tends to be insufficient. Examples of the polymerization method for obtaining these acrylic copolymers include bulk polymerization, pearl polymerization, emulsion polymerization, and solution polymerization. The molecular weight of these acrylic copolymers is preferably a weight average molecular weight (Mw).
Is 30,000 to 1,000,000, and more preferably 50,000 to 800,000. If the molecular weight is too large, gelation tends to occur during copolymerization, and if it is too small, adhesiveness tends to be insufficient.

(2) In the present invention, Tg (glass transition temperature) is -20 ° C. to 30 ° C. and the weight average molecular weight is 3
The amount of the acryl-based copolymer having a carboxyl group, a hydroxyl group, an acid anhydride group, an amide group or an epoxy group, which is from 000 to 1,000,000, is 100 parts by weight of the total amount of the epoxy resin and the curing agent. If you do, 50-
The amount is 300 parts by weight, preferably 80 to 300 parts by weight, more preferably 100 to 300 parts by weight. If the amount of the acrylic copolymer is too small, the adhesiveness tends to decrease, and if it is too large, the tackiness tends to be too high to make it difficult to handle.

Further, in the present invention, it is preferable to use (3) a curing accelerator to such an extent that storage stability is not impaired. As the curing accelerator, those usually used for curing an epoxy resin can be used as they are. Specifically, inorganic acids such as hydrochloric acid, organic acids such as acetic acid and oxalic acid, tertiary amines such as triethylamine and benzyldimethylamine, 1-benzyl-2-methylimidazole, 2-ethyl-4-methylimidazole , 1-cyanoethyl-2
- ethyl-4-methylimidazole, imidazoles such as 1-cyanoethyl-2-phenylimidazole, phosphines such as triphenylphosphine, mention may be made of Lewis acid or Lewis acid salts such as BF _3, etc., stability Ya storage From the viewpoint of heat resistance and the like, imidazoles are preferably used. Imidazoles can be easily obtained from the market. For example, 2E4MZ, 1B2MZ, 2E4MZ
-CN, 2PZ-CN, 2PZ-CNS (manufactured by Shikoku Chemicals Co., Ltd.) and the like. The amount of the curing accelerator, when the total amount of the epoxy resin and the curing agent is 100 parts by weight,
0.01 to 10 parts by weight, particularly preferably 0.1 to 10 parts by weight
5 parts by weight. If the amount of the curing accelerator is too large, storage stability and adhesion tend to decrease.

Further, in the present invention, (4) a coupling agent may be blended in order to improve the interfacial bonding between different materials. As the coupling agent, a silane coupling agent is preferable. As the silane coupling agent, γ-glycidoxypropyltrimethoxysilane, γ
-Mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-ureidopropyltriethoxysilane, N-β-aminoethyl-γ-aminopropyltrimethoxysilane and the like.

The above-mentioned silane coupling agent can be easily obtained from the market. For example, NUC A-
187, A-189, A-1160, A-1120 (manufactured by Nippon Unicar Co., Ltd.), SH6040, SH6062,
SH6020 (manufactured by Dow Corning Toray Silicone Co., Ltd.). The compounding amount of the coupling agent is 0.01 to 10 parts by weight, more preferably 0.1 to 5 parts by weight, when the total amount of the epoxy resin and the curing agent is 100 parts by weight.
It is preferred to add parts by weight. If the amount is too small, the adhesion tends not to be sufficiently improved, and if it is too large, the heat resistance tends to decrease.

Further, other components can be mixed and used in the adhesive composition of the present invention to the extent that the effects of the present invention are not impaired. Such components include (5)
Phenoxy resin, (6) inorganic filler, (7) antimony oxide and the like.

The phenoxy resin can be mixed for the purpose of reducing tackiness in the B stage, imparting flexibility to the cured adhesive, and the like. Phenoxy resins can be easily obtained from the market. For example, Phenothote YP-40, YP-50, YP-60 (manufactured by Toto Kasei Co., Ltd.) and the like are available. The amount of the phenoxy resin, when the total amount of the epoxy resin and the curing agent is 100 parts by weight,
It is preferable to mix in the range of 0.1 to 20 parts by weight, more preferably 1 to 10 parts by weight. If the mixing amount is too small, the flexibility is not sufficient, and if the mixing amount is too large, the heat resistance tends to decrease.

The inorganic filler can be mixed for the purpose of imparting thermal conductivity, flame retardancy, thixotropy and the like. As inorganic fillers, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate,
Calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, alumina, aluminum nitride,
Examples include aluminum borate whiskers, boron nitride, crystalline silica, silicon carbide, antimony oxide and the like.

In order to improve thermal conductivity, alumina,
Aluminum nitride, boron nitride, crystalline silica, amorphous silica, silicon carbide and the like are particularly preferred. Among them, alumina is suitable because it has good heat dissipation properties and good heat resistance and insulation properties. In addition, crystalline silica or amorphous silica is inferior to alumina in terms of heat dissipation, but has less ionic impurities, so it has high insulation after PCT treatment, and corrodes copper foil, aluminum wire, aluminum plate, etc. It is suitable in that it has few points. Also,
In order to impart flame retardancy, aluminum hydroxide, magnesium hydroxide, antimony oxide and the like are preferable. Further, for the purpose of imparting thixotropic properties, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate,
Preferred are calcium oxide, magnesium oxide, alumina, crystalline silica, amorphous silica and the like. These inorganic fillers are 100 parts by weight or less, more preferably 0.1 parts by weight when the total amount of the epoxy resin and the curing agent is 100 parts by weight.
６０60 parts by weight, more preferably 1-40 parts by weight. When the mixing amount is too large, the storage elastic modulus of the adhesive tends to increase and the adhesiveness tends to decrease.

The adhesive composition of the present invention can be used in the form of a film by using a varnish in which each component is dissolved and dispersed in a solvent as it is, or by applying a varnish on a substrate and heating to remove the solvent. It is possible. Solvents for varnishing are relatively low boiling point methyl ethyl ketone, acetone, methyl isobutyl ketone, 2-ethoxyethanol, toluene,
It is preferable to use butyl cellosolve, methanol, ethanol, 2-methoxyethanol and the like. Further, a high boiling point solvent may be added for the purpose of improving the coating properties.
Examples of the high boiling point solvent include dimethylacetamide, dimethylformamide, methylpyrrolidone, cyclohexanone and the like. The production of the varnish is not particularly limited as long as it is a device capable of dissolving the components of the present invention in the above-mentioned solvent, and is performed using a dissolving tank equipped with a stirrer or the like.
The dissolution is carried out at room temperature to 150 ° C, preferably at room temperature to 120 ° C, usually for about 1 hour to 50 hours. If the dissolution temperature is too high, epoxy groups and the like react during dissolution, and the adhesiveness tends to decrease.

After forming the varnish, it is preferable to remove bubbles in the varnish by vacuum degassing. As the substrate, a polyester film, a polyethylene film, a polypropylene film, a polyimide film, or the like, a film obtained by subjecting them to a release treatment, or the like can be used. The coating method is not particularly limited, and examples thereof include a roll coat, a reverse roll coat, a gravure coat, and a bar coat. Further, an adhesive film having an adhesive layer on both surfaces of a substrate is obtained by applying an adhesive to each surface of the substrate and removing the solvent by heating. Also T
It can be obtained by laminating an adhesive layer applied on a heat-resistant film having a g of 200 ° C. or more to both surfaces of a substrate by lamination. At this time, it is preferable to perform the lamination at a pressure that does not cause deformation of the adhesive film. When the adhesive layers are formed on both surfaces, the thickness of the adhesive on one surface may be different from the thickness of the adhesive on the other surface.

As the heat-resistant film having a Tg of 200 ° C. or higher in the present invention, polyimide, polyethersulfone, polyamideimide, polyetherimide, wholly aromatic polyester and the like are used as the polymer.
When using a heat-resistant film having a Tg of less than 200 ° C.,
Plastic deformation may occur at high temperatures such as during solder reflow.

The adhesive film according to the present invention has a function of reducing the stress generated by the difference in the thermal expansion coefficient of the adherend by the adhesive layer due to the above composition. After the silicon chip is pressed onto the semiconductor chip mounting substrate to which the adhesive film according to the present invention is adhered, a sealing agent is injected and the film and the sealing agent are cured to obtain a semiconductor device. Hereinafter, the adhesive composition according to the present invention, an adhesive film using the same, and a semiconductor device using the adhesive film will be specifically described with reference to examples.

[0045]

EXAMPLE 1 A 50 μm mold release treated with a silicone release agent
m, a bisphenol A type epoxy resin (epoxy equivalent: 200, trade name, manufactured by Toto Kasei Co., Ltd., YD-8125) 46 parts by weight, cresol novolak type epoxy resin (epoxy equivalent 220, trade name, manufactured by Toto Kasei Co., Ltd., YDCN-70)
3) 15 parts by weight, phenol novolak resin as a curing agent for epoxy resin (Dainippon Ink Chemical Industry Co., Ltd.)
39 parts by weight of phenolite LF2882 manufactured by Epson Group Inc., 150 weight parts of an epoxy-containing acrylic rubber (molecular weight: 10,000, trade name: HTR-860P-3 manufactured by Teikoku Chemical Industry Co., Ltd.) Part, 1-cyanoethyl-2-phenylimidazole (trade name, manufactured by Shikoku Chemical Industry Co., Ltd., Curezol 2) as a curing accelerator
0.8 parts by weight of PZ-CN), 0.8 parts by weight of γ-mercaptopropyltrimethoxysilane (trade name, manufactured by Nippon Unicar, NUC A-189) as a silane coupling agent, 0.8 parts by weight, γ-ureido Provir trimethoxysilane (trade name, manufactured by Nippon Unicar, NUC A-
1,160 parts by weight of cyclohexanone was added to 0.8 parts by weight of the resin composition, and the mixture was stirred and mixed.
A varnish obtained by vacuum degassing was applied and dried at 150 ° C. for 5 minutes to produce a 75-μm-thick B-stage adhesive film. The adhesive layer of this adhesive film and PET
As a result of measuring the peeling force of the film with a 90 ° peel strength measuring device manufactured by Tester Sangyo Co., Ltd., the peeling force was 2 N / m.

Example 2 An adhesive film was prepared in the same manner as in Example 1 except that a PET film in which the peeling force between the adhesive layer and the PET film was adjusted to 15 N / m by the amount of the silicone release agent was used. did.

Example 3 An adhesive film was prepared in the same manner as in Example 1, except that a PET film in which the peeling force between the adhesive layer and the PET film was adjusted to 40 N / m by the amount of the silicone release agent was used. did.

Example 4 An adhesive film was prepared in the same manner as in Example 1, except that a PET film in which the peeling force between the adhesive layer and the PET film was adjusted to 70 N / m by the amount of the silicone release agent was used. did.

Comparative Example 1 An adhesive film was produced in the same manner as in Example 1 except that a PET film in which the peeling force between the adhesive layer and the PET film was adjusted to 0.5 N / m by the amount of the silicone release agent was used. Was prepared.

Comparative Example 2 An adhesive film was prepared in the same manner as in Example 1, except that a PET film in which the peeling force between the adhesive layer and the PET film was adjusted to 150 N / m by the amount of the silicone release agent was used. did.

Using the obtained adhesive film, while the PET film was adhered to one side of the adhesive film, the state of peeling of the PET film when the PET film was punched out from the PET film side was observed. The exfoliation of PET at the time of punching causes voids to be involved when the PET is pressed against the wiring board. The number of samples from which PET was peeled at the time of punching was 10 samples
Out of 0 pieces, 0 to 1 pieces of the adhesive film were evaluated as 、, and more adhesive films were evaluated as ×. In addition, the state of peeling when the PET film was peeled off with an adhesive tape before chip attachment was observed. Adhesive tape has an adhesive strength of 100 N / m
Was used. The number of samples in which the PET film was difficult to peel off and had defects and unpeeled was 100 samples
In each of the pieces, 0 to 10 pieces of the adhesive films were evaluated as ○, and more adhesive films were evaluated as ×. The results are shown in Table 1.

[0052]

[Table 1]

Example 5 A 25 μm thick polyimide film (UPILEX SGA-25 manufactured by Ube Industries, Ltd.) was laminated on both surfaces of the adhesive films of Examples 1 to 4 at a temperature of 85 ° C. and a pressure of 2.5 MPa, respectively. The film was attached using a hot roll laminator at a speed of 1.0 m / min to produce an adhesive film having an adhesive layer on both sides of a polyimide film. Using the obtained adhesive film, PET with a mold while the PET film is stuck on one side of the adhesive film.
The peeled state of the PET film when punched from the film side and the state when the PET film was peeled off with an adhesive tape before chip attachment were observed. As a result, there was no peeling of the cover film and the adhesive layer at the time of punching with a mold, and the cover film could be easily removed by the adhesive tape before the chip was pressed.

[0054]

As described above, the adhesive film of the present invention suppresses peeling of the cover film and the adhesive layer when punching the adhesive film by defining the peeling force between the cover film and the adhesive layer. Moreover, the cover film can be easily removed by the adhesive tape before the chip is pressed. Therefore, productivity in the chip assembling stage can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view of an adhesive film for a semiconductor of the present invention.

FIG. 2 is a cross-sectional view of the wiring board for mounting a semiconductor according to one embodiment of the present invention during an assembling process.

FIG. 3 is a sectional view of a semiconductor mounting substrate according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cover film 2 Adhesive layer 3 Base material 4 Wiring 5 Semiconductor wiring board 6 Semiconductor chip 7 Semiconductor chip connecting member 8 Sealing material 9 Solder ball

Continuation of the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) C09J 201/00 C09J 201/00 H01L 21/52 H01L 21/52 E 21/60 311 21/60 311R 23/12 501 23 / 12 501V 501Z 23/14 23/14 R (72) Inventor Michio Uruno 14 Goi-minamikaigan, Ichihara-shi, Chiba Pref.Hitachi Kasei Kogyo Co., Ltd. Address Hitachi Chemical Co., Ltd. Goi Works F-term (reference) 4F100 AA01A AH06A AH06G AK03B AK25A AK25G AK33 AK42B AK46A AK46G AK49A AK49G AK53 JAKA JA14A14A02A04A02A04A05A14A02A04A04A05A14A14 AA13 AA16 AA18 AB05 CC02 DA02 DA03 DB02 EA05 FA05 4J040 DF001 DF002 EC001 EC061 EC071 EC151 EE062 EH031 EK031 GA05 GA07 GA11 GA12 GA22 HA136 HA156 HA196 HA206 HA306 HA316 HA326 HD30 JB02 KA16 KA17 KA42 KA04 LA03 5 05

Claims (10)

[Claims] An adhesive layer is provided with a cover film on at least one side thereof, and a peeling force between the adhesive layer and the cover film is one.
An adhesive film for a semiconductor having a thickness of 100 N / m. 2. The adhesive film for a semiconductor according to claim 1, wherein the cover film is a film made of polyethylene terephthalate, polyethylene naphthalate, polyether sulfone or polyolefin. 3. The adhesive film for a semiconductor according to claim 1, wherein the cover film is a film having a surface subjected to a release treatment. 4. The method according to claim 1, wherein the adhesive layer is an epoxy-based, acrylic-based,
The adhesive film for a semiconductor according to any one of claims 1 to 3, wherein the adhesive film is a layer made of at least one resin selected from the group consisting of silicone, polyimide, polyamide, and polyamideimide. 5. An adhesive layer comprising: (1) 100 parts by weight of an epoxy resin and a curing agent thereof, and (2) Tg (glass transition temperature).
Has a weight average molecular weight of -30 ° C.
50 to 300 parts by weight of an acrylic copolymer having a carboxyl group, a hydroxyl group, an acid anhydride group, an amide group or an epoxy group of 0 to 1,000,000, and (3) a curing accelerator of 0.01 to 10 parts by weight. The adhesive film for a semiconductor according to any one of claims 1 to 4, wherein the adhesive film is a layer composed of a resin composition containing at least one component and (4) 0.01 to 10 parts by weight of a coupling agent. 6. The adhesive film for a semiconductor according to claim 5, wherein the adhesive layer is a layer further comprising (5) a resin composition containing 0.1 to 20 parts by weight of a phenoxy resin. 7. The adhesive film for a semiconductor according to claim 5, wherein the adhesive layer is a layer further comprising (6) a resin composition containing 100 parts by weight or less of an inorganic filler. 8. The adhesive layer is a layer in which a layer composed of the resin composition according to any one of claims 4 to 7 is formed on both sides of a heat-resistant film having a Tg of 200 ° C. or higher. 7
The adhesive film for a semiconductor according to any one of the above. 9. A semiconductor chip mounting substrate obtained by bonding the adhesive film according to claim 1. 10. A semiconductor device manufactured using the adhesive film according to claim 1.