JP2002200555A - 研磨工具および該研磨工具を具備したポリッシング装置 - Google Patents

研磨工具および該研磨工具を具備したポリッシング装置

Info

Publication number
JP2002200555A
JP2002200555A JP2000402031A JP2000402031A JP2002200555A JP 2002200555 A JP2002200555 A JP 2002200555A JP 2000402031 A JP2000402031 A JP 2000402031A JP 2000402031 A JP2000402031 A JP 2000402031A JP 2002200555 A JP2002200555 A JP 2002200555A
Authority
JP
Japan
Prior art keywords
polishing
polishing tool
semiconductor wafer
tool
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000402031A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002200555A5 (enExample
Inventor
Hiroo Suzuki
啓夫 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2000402031A priority Critical patent/JP2002200555A/ja
Priority to US10/028,717 priority patent/US20020083577A1/en
Publication of JP2002200555A publication Critical patent/JP2002200555A/ja
Publication of JP2002200555A5 publication Critical patent/JP2002200555A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y10T29/49048—Machining magnetic material [e.g., grinding, etching, polishing]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000402031A 2000-12-28 2000-12-28 研磨工具および該研磨工具を具備したポリッシング装置 Pending JP2002200555A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000402031A JP2002200555A (ja) 2000-12-28 2000-12-28 研磨工具および該研磨工具を具備したポリッシング装置
US10/028,717 US20020083577A1 (en) 2000-12-28 2001-12-28 Polishing member and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000402031A JP2002200555A (ja) 2000-12-28 2000-12-28 研磨工具および該研磨工具を具備したポリッシング装置

Publications (2)

Publication Number Publication Date
JP2002200555A true JP2002200555A (ja) 2002-07-16
JP2002200555A5 JP2002200555A5 (enExample) 2004-12-09

Family

ID=18866384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000402031A Pending JP2002200555A (ja) 2000-12-28 2000-12-28 研磨工具および該研磨工具を具備したポリッシング装置

Country Status (2)

Country Link
US (1) US20020083577A1 (enExample)
JP (1) JP2002200555A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004351561A (ja) * 2003-05-29 2004-12-16 Nippei Toyama Corp 砥石工具のドレッシング装置およびそのドレッシング方法
WO2006003697A1 (ja) * 2004-06-30 2006-01-12 Toho Engineering Kabushiki Kaisha 研磨パッドおよびその製造方法
JP2006332585A (ja) * 2005-05-24 2006-12-07 Hynix Semiconductor Inc 研磨パッド及びこれを採用した化学的機械的研磨装置
JP2008068394A (ja) * 2006-08-30 2008-03-27 Rohm & Haas Electronic Materials Cmp Holdings Inc 重複する面積一定のらせん溝を有するｃｍｐパッド
JP2008290197A (ja) * 2007-05-25 2008-12-04 Nihon Micro Coating Co Ltd 研磨パッド及び方法
US7591713B2 (en) 2003-09-26 2009-09-22 Shin-Etsu Handotai Co., Ltd. Polishing pad, method for processing polishing pad, and method for producing substrate using it
JP2014008577A (ja) * 2012-06-29 2014-01-20 Fujibo Holdings Inc 研磨パッド及びその製造方法
WO2014156840A1 (ja) * 2013-03-29 2014-10-02 富士紡ホールディングス株式会社 研磨パッド及び研磨方法
JP2014195840A (ja) * 2013-03-29 2014-10-16 富士紡ホールディングス株式会社 研磨パッド

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6802761B1 (en) 2003-03-20 2004-10-12 Hitachi Global Storage Technologies Netherlands B.V. Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication
US6955587B2 (en) * 2004-01-30 2005-10-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Grooved polishing pad and method
US7059949B1 (en) 2004-12-14 2006-06-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having an overlapping stepped groove arrangement
US7059950B1 (en) * 2004-12-14 2006-06-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad having grooves arranged to improve polishing medium utilization
US20140024299A1 (en) * 2012-07-19 2014-01-23 Wen-Chiang Tu Polishing Pad and Multi-Head Polishing System
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
KR102436416B1 (ko) 2014-10-17 2022-08-26 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
CN106853610B (zh) * 2015-12-08 2019-11-01 中芯国际集成电路制造(北京)有限公司 抛光垫及其监测方法和监测系统
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US11260495B2 (en) * 2018-07-27 2022-03-01 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and methods for chemical mechanical polishing
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN115106931B (zh) * 2022-06-23 2024-08-20 万华化学集团电子材料有限公司 具有迷宫形凹槽的化学机械抛光垫及其应用
DE102024109581A1 (de) * 2024-04-05 2025-10-09 Lapmaster Wolters Gmbh Läppscheibe für eine Läppmaschine, Läppmaschine und Verfahren zum Läppen eines Werkstücks mit einer Läppmaschine

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5650039A (en) * 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
US5690540A (en) * 1996-02-23 1997-11-25 Micron Technology, Inc. Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers
US6090475A (en) * 1996-05-24 2000-07-18 Micron Technology Inc. Polishing pad, methods of manufacturing and use
US5733176A (en) * 1996-05-24 1998-03-31 Micron Technology, Inc. Polishing pad and method of use
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6001001A (en) * 1997-06-10 1999-12-14 Texas Instruments Incorporated Apparatus and method for chemical mechanical polishing of a wafer
US5913713A (en) * 1997-07-31 1999-06-22 International Business Machines Corporation CMP polishing pad backside modifications for advantageous polishing results
US5888121A (en) * 1997-09-23 1999-03-30 Lsi Logic Corporation Controlling groove dimensions for enhanced slurry flow
JP3076291B2 (ja) * 1997-12-02 2000-08-14 日本電気株式会社 研磨装置
US6106661A (en) * 1998-05-08 2000-08-22 Advanced Micro Devices, Inc. Polishing pad having a wear level indicator and system using the same
GB2345255B (en) * 1998-12-29 2000-12-27 United Microelectronics Corp Chemical-Mechanical Polishing Pad
US6261168B1 (en) * 1999-05-21 2001-07-17 Lam Research Corporation Chemical mechanical planarization or polishing pad with sections having varied groove patterns
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
US6340325B1 (en) * 2000-06-29 2002-01-22 International Business Machines Corporation Polishing pad grooving method and apparatus

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004351561A (ja) * 2003-05-29 2004-12-16 Nippei Toyama Corp 砥石工具のドレッシング装置およびそのドレッシング方法
US7591713B2 (en) 2003-09-26 2009-09-22 Shin-Etsu Handotai Co., Ltd. Polishing pad, method for processing polishing pad, and method for producing substrate using it
US7677957B2 (en) 2003-09-26 2010-03-16 Shin-Etsu Handotai Co., Ltd. Polishing apparatus, method for providing and mounting a polishing pad in a polishing apparatus, and method for producing a substrate using the polishing apparatus
WO2006003697A1 (ja) * 2004-06-30 2006-01-12 Toho Engineering Kabushiki Kaisha 研磨パッドおよびその製造方法
JP2006332585A (ja) * 2005-05-24 2006-12-07 Hynix Semiconductor Inc 研磨パッド及びこれを採用した化学的機械的研磨装置
JP2008068394A (ja) * 2006-08-30 2008-03-27 Rohm & Haas Electronic Materials Cmp Holdings Inc 重複する面積一定のらせん溝を有するｃｍｐパッド
JP2008290197A (ja) * 2007-05-25 2008-12-04 Nihon Micro Coating Co Ltd 研磨パッド及び方法
JP2014008577A (ja) * 2012-06-29 2014-01-20 Fujibo Holdings Inc 研磨パッド及びその製造方法
WO2014156840A1 (ja) * 2013-03-29 2014-10-02 富士紡ホールディングス株式会社 研磨パッド及び研磨方法
JP2014195840A (ja) * 2013-03-29 2014-10-16 富士紡ホールディングス株式会社 研磨パッド

Also Published As

Publication number Publication date
US20020083577A1 (en) 2002-07-04

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