JP2002192500A - Manufacturing method for article having micro surface structure - Google Patents
Manufacturing method for article having micro surface structureInfo
- Publication number
- JP2002192500A JP2002192500A JP2000391400A JP2000391400A JP2002192500A JP 2002192500 A JP2002192500 A JP 2002192500A JP 2000391400 A JP2000391400 A JP 2000391400A JP 2000391400 A JP2000391400 A JP 2000391400A JP 2002192500 A JP2002192500 A JP 2002192500A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- target product
- shape
- product material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Surface Treatment Of Glass (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- Micromachines (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、表面に微細加工を
施すことによって、光学的機能、機械的機能又は物理的
機能を発現する製品の製造や加工に関するものである。
このような微細加工は、例えばＭＬＡ（マイクロレンズ
アレイ）、回折光学素子、偏向光学素子、屈折光学系素
子、複屈折光学素子、光ファイバー系光学素子、ビーム
スプリッター等の光学素子の製造に利用されており、特
に概略寸法が１０ｍｍ以下の光学素子の製造で利用され
ている。また、この方法は、マイクロマシニング、機械
摺動部品（自動車用エンジン、エアコン用コンプレッサ
ーなど）の表面処理方法など、幅広い産業分野に応用・
利用可能である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture and processing of products that exhibit optical, mechanical or physical functions by subjecting a surface to fine processing.
Such fine processing is used for manufacturing optical elements such as MLA (micro lens array), diffractive optical element, deflecting optical element, refractive optical element, birefringent optical element, optical fiber optical element, and beam splitter. In particular, it is used in the production of optical elements having a schematic size of 10 mm or less. In addition, this method is applied to a wide range of industrial fields such as micromachining and surface treatment methods for mechanical sliding parts (automobile engines, air conditioner compressors, etc.).
Available.
【０００２】[0002]
【従来の技術】Ａ）リソグラフィ技術を用いてマルチレ
ベル素子の作製方法として、Ｍ枚のマスクを使って（Ｍ
−１）回のプロセスでＮ＝２Mレベルのステップ状の位
相分布を持つ素子を作製する方法が提案されている
（「光技術コンタクト」Vol.38, No.5 (2000) P.42〜5
1、特にそのP.45参照）。Ｂ）電子ビーム、レーザービ
ームやイオンブーム等を用いた直接描画法と光リソグラ
フィーとドライエッチング技術を組み合わせた方法も提
案されている（「応用物理」第６８巻第6号(1999) P.63
3〜638参照）。2. Description of the Related Art A) As a method of manufacturing a multi-level device using lithography, M masks are used (M
-1) A method of fabricating an element having a step-like phase distribution of N = 2 M level in one process has been proposed (“Optical Technology Contact” Vol. 38, No. 5 (2000) P. 42- Five
1, especially on page 45). B) A method that combines a direct writing method using an electron beam, a laser beam, an ion boom, or the like, optical lithography, and a dry etching technique has also been proposed ("Applied Physics" Vol. 68, No. 6, (1999) P.63).
3-638).
【０００３】[0003]
【発明が解決しようとする課題】Ａの方法では、マスク
枚数が多く必要であること、アライメント回数が多くこ
の誤差が無視できないこと、深さ方向のエッチング誤差
が無視できないこと、最小ライン幅は１μｍ程度が限界
であること、等が問題である。Ｂの方法では、高精度な
制御技術を有する装置が必要で、装置が高価であるこ
と、描画に時間が非常にかかり（５００μｍ×５００μ
ｍの正方形で１０〜１５時間程度）、量産性が全くな
い、再現性に乏しい、等の問題があり、実用化された例
はない。上記Ａ，Ｂのいずれの方法においても、製品対
象材料の形状は、全て平面基板.材料である。曲面（球
面を含む）形状の基板.に対する製作は提案されていな
い。In the method A, the number of masks is required to be large, the number of alignments is so large that this error cannot be ignored, the etching error in the depth direction cannot be ignored, and the minimum line width is 1 μm. The problem is that the degree is the limit. In the method B, a device having a high-precision control technique is required, the device is expensive, and it takes a long time to draw (500 μm × 500 μm).
m for about 10 to 15 hours), there is no mass productivity, poor reproducibility, etc., and there is no practical example. In any of the above methods A and B, the shape of the material to be manufactured is all planar substrate material. Fabrication of a substrate having a curved surface (including a spherical surface) has not been proposed.
【０００４】本発明は、生産の工程を簡素化して高精度
の表面3次元構造を再現性よく、安価に製造する為の方
法を提供することを目的とするものである。本発明はま
た、金型の寿命を長くし、かつ転写性を向上させ、剥離
を容易にすることも目的としている。An object of the present invention is to provide a method for manufacturing a high-precision surface three-dimensional structure with good reproducibility and at low cost by simplifying the production process. Another object of the present invention is to extend the life of the mold, improve transferability, and facilitate peeling.
【０００５】[0005]
【課題を解決するための手段】本発明は、以下の工程
（Ａ）から（Ｅ）を備えて微細表面構造をもつ物品を製
造する製造方法である。 （Ａ）表面に微細形状をもつ金型の表面に離型処理を施
す工程、（Ｂ）離型処理の施された金型表面に硬化可能
な樹脂を介して目的製品材料を押し当てて、金型の表面
形状の反転形状をその樹脂に転写する工程、（Ｃ）その
樹脂を硬化させる工程、（Ｄ）その樹脂を目的製品材料
に接合させた状態でその樹脂を金型から剥離させる工
程、及び（Ｅ）その樹脂に転写された形状をドライエッ
チング法によって目的製品材料に転写する工程。本発明
では、金型表面を離型処理するので、樹脂が容易に金型
から剥離する。また、これにより、金型の寿命が伸び、
かつ転写性が向上する。The present invention is a method for producing an article having a fine surface structure, comprising the following steps (A) to (E). (A) a step of performing a mold release treatment on the surface of a mold having a fine shape on the surface, and (B) pressing a target product material through a curable resin on the mold surface subjected to the mold release treatment, Transferring the inverted shape of the surface of the mold to the resin; (C) curing the resin; and (D) removing the resin from the mold with the resin bonded to the target product material. And (E) a step of transferring the shape transferred to the resin to a target product material by a dry etching method. In the present invention, since the mold surface is subjected to the release treatment, the resin is easily separated from the mold. This also extends the life of the mold,
In addition, transferability is improved.
【０００６】[0006]
【発明の実施の形態】金型の表面形状の反転形状を転写
する樹脂としては、紫外線硬化型樹脂や熱硬化型樹脂を
用いることができる。その樹脂として紫外線硬化型樹脂
を用いる場合には、次のような利点がある。 常温での硬化が可能である。液体状で塗布できるの
で、流動性がよく、泡などの発生を防ぐことができる。
紫外光を均一に照射して硬化させることができるの
で、均一に硬化させることができる。短時間に硬化さ
せることができる。その結果、金型表面形状を正確に容
易に転写することができるようになる。BEST MODE FOR CARRYING OUT THE INVENTION As a resin for transferring an inverted shape of the surface shape of a mold, an ultraviolet curable resin or a thermosetting resin can be used. The use of an ultraviolet curable resin as the resin has the following advantages. Curing at room temperature is possible. Since it can be applied in liquid form, it has good fluidity and can prevent generation of bubbles and the like.
Since curing can be performed by uniformly irradiating ultraviolet light, uniform curing can be achieved. Can be cured in a short time. As a result, the mold surface shape can be easily and accurately transferred.
【０００７】その樹脂として熱硬化型樹脂を用いる場合
でも、均一に硬化させることによって、紫外線硬化型樹
脂と同様に金型表面形状を正確に転写することができ
る。熱硬化型樹脂としては、プラスチック眼鏡レンズ
や、コンタクトレンズの製造に使用されている樹脂を用
いることができる。そのような熱硬化型樹脂を用いた成
型方法は注型法と呼ばれており、金型に液体状の熱硬化
型樹脂を流し込み、徐々に加熱して２４時間程度の時間
をかけて硬化させる。[0007] Even when a thermosetting resin is used as the resin, it is possible to accurately transfer the mold surface shape as in the case of the ultraviolet curable resin by curing the resin uniformly. As the thermosetting resin, a resin used for manufacturing a plastic spectacle lens or a contact lens can be used. A molding method using such a thermosetting resin is called a casting method, in which a liquid thermosetting resin is poured into a mold, gradually heated, and cured for about 24 hours. .
【０００８】金型表面の微細形状は、以下の工程（ａ）
から（ｃ）により形成することが好ましい。 （ａ）前記微細形状を形成しようとする金型母材料表面
上に感光性材料を塗布する工程、（ｂ）電子線（ＥＢ）
又はレーザービームによりその感光性材料に所望の形状
を描画し、次いで現像してその感光性材料に所望形状を
形成する工程、及び（ｃ）その感光性材料の形状をドラ
イエッチング法によって金型母材料に転写する工程。電
子線又はレーザービームにより所望の形状を描画するこ
とにより、１度のプロセスで所望の形状を高精度で作製
できる。[0008] The fine shape of the mold surface is determined by the following step (a).
To (c). (A) a step of applying a photosensitive material on the surface of a mold base material for forming the fine shape; (b) an electron beam (EB)
Or a step of drawing a desired shape on the photosensitive material by a laser beam, followed by development to form a desired shape on the photosensitive material; and (c) shaping the shape of the photosensitive material by a dry etching method. The process of transferring to a material. By drawing a desired shape with an electron beam or a laser beam, a desired shape can be produced with high accuracy in one process.
【０００９】また、感光性材料の形状をドライエッチン
グ法によって金型母材料に転写するようにすれば、軟質
材料であるレジスト形状を硬質金型材料に転写できる。
この場合、金型母材料はドライエッチング可能な材料で
あることが必要であり、そのような材料として金属材
料、ガラス材料、セラミックス材料、プラスチック材料
及び硬質ゴム材料からなる群から選ばれた１種を用いる
ことができる。If the shape of the photosensitive material is transferred to the mold base material by dry etching, the resist shape, which is a soft material, can be transferred to the hard mold material.
In this case, the mold base material needs to be a material that can be dry-etched, and such a material is selected from the group consisting of a metal material, a glass material, a ceramic material, a plastic material, and a hard rubber material. Can be used.
【００１０】一般には、金型母材は平面基板.であり、
その平面上の表面に微細形状を形成する。金型を作る際
に金型母材料表面に感光性材料パターンを形成するため
に電子線描画用感光性材料を使用する場合は、その電子
線描画用感光性材料はポジ型レジストであることが好ま
しい。このように、微細構造製造方法として、ポジレジ
ストを塗布し電子線描画方法で描画することにより、描
画の再現性が良く、電子の漏れ等の制御が容易で制御し
易いという利点がある。レーザービームで描画する場合
は、使用するレーザー光の波長に感度をもつ感光性材料
を使用する。Generally, the mold base material is a flat substrate.
A fine shape is formed on the surface on the plane. When using a photosensitive material for electron beam lithography to form a photosensitive material pattern on the surface of the mold base material when making a mold, the photosensitive material for electron beam lithography may be a positive resist. preferable. As described above, by applying a positive resist and drawing by an electron beam drawing method as a fine structure manufacturing method, there is an advantage that reproducibility of drawing is good, control of electron leakage and the like is easy and control is easy. When drawing with a laser beam, a photosensitive material sensitive to the wavelength of the laser beam to be used is used.
【００１１】金型を製作する際、感光性材料の形状をド
ライエッチング法によって金型母材料に転写する工程に
おけるドライエッチング工程で、所望の形状を転写する
ために、選択比を段階的又は連続的に変化させることが
好ましい。このように、選択比を段階的又は連続的に変
化させることにより、転写時に所望の形状を得ることが
できるようになる。In manufacturing a mold, in a dry etching step in a step of transferring a shape of a photosensitive material to a mold base material by a dry etching method, a stepwise or continuous selection ratio is selected in order to transfer a desired shape. It is preferable to change the temperature. Thus, by changing the selection ratio stepwise or continuously, a desired shape can be obtained at the time of transfer.
【００１２】金型表面の離型処理の一例は、金型表面に
金属薄膜を成膜することであり、その金属薄膜はＮｉ，
Ｃｒ，Ｆｅ，Ａｌ，Ｃｏ，Ｃｕ，Ｍｏ，Ｐｔ，Ａｕ，Ｎ
ｂ及びＴｉからなる群から選ばれた単一金属又は複合材
料からなるものとすることができる。この離型処理によ
り、金型の形状転写性が飛躍的に増し、正確な転写が行
なえると同時に、剥離性が容易となり金型の寿命が飛躍
的に向上する。One example of the mold release treatment of the mold surface is to form a metal thin film on the mold surface.
Cr, Fe, Al, Co, Cu, Mo, Pt, Au, N
It may be made of a single metal or a composite material selected from the group consisting of b and Ti. By this release treatment, the shape transferability of the mold is remarkably increased, and accurate transfer can be performed, and at the same time, the releasability is facilitated and the life of the mold is dramatically improved.
【００１３】離型処理として、さらにその金属薄膜上に
微細な構造のフッ素樹脂を含む層によって表面処理を施
すことが好ましい。この表面処理はフッ素樹脂を含む層
をメッキ方法や蒸着方法によって形成することにより行
なうことができる。金型表面の他の離型処理方法とし
て、金型表面にフッ素官能基を有する有機化合物層を形
成する方法も好ましい。[0013] As a mold release treatment, it is preferable to further perform a surface treatment on the metal thin film with a layer containing a fluororesin having a fine structure. This surface treatment can be performed by forming a layer containing a fluorine resin by a plating method or a vapor deposition method. As another release treatment method of the mold surface, a method of forming an organic compound layer having a fluorine functional group on the mold surface is also preferable.
【００１４】金型の表面形状の反転形状を転写する樹脂
として紫外線硬化型樹脂を使用する場合、紫外線硬化型
樹脂を硬化させる方法として、金型と目的製品材料のう
ち少なくとも一方は紫外線透過材料からなるものを選択
しておき、紫外線硬化型樹脂の硬化工程では、紫外線透
過材料の金型もしくは目的製品材料、又は両方を通して
紫外線硬化型樹脂に紫外線を照射してその紫外線硬化型
樹脂を均一に硬化させるようにするのが好ましい。紫外
線硬化型樹脂を均一に硬化させることにより、金型の形
状転写性が飛躍的に増し、正確な転写が行なえる。金型
の表面形状の反転形状を転写する樹脂として熱硬化型樹
脂を使用する場合、熱硬化型樹脂を硬化させる方法とし
て、金型と目的製品材料を位置決めした状態で固定し、
樹脂注入口を別途設ける。熱硬化型樹脂の硬化工程では
徐々に加熱しながら金型全体に均一に熱が行きわたるよ
うにして加熱硬化させるのが望ましい。When an ultraviolet-curable resin is used as the resin for transferring the inverted shape of the surface shape of the mold, at least one of the mold and the target product material is formed from an ultraviolet-transmissive material as a method of curing the ultraviolet-curable resin. In the curing step of the UV-curable resin, the UV-curable resin is irradiated with ultraviolet rays through the mold of the UV-transmitting material or the target product material, or both, to cure the UV-curable resin uniformly. It is preferable to make it possible. By uniformly curing the ultraviolet curable resin, the shape transferability of the mold is dramatically increased, and accurate transfer can be performed. When a thermosetting resin is used as the resin for transferring the inverted shape of the surface shape of the mold, as a method of curing the thermosetting resin, the mold and the target product material are fixed in a positioned state,
Separate resin injection port is provided. In the curing step of the thermosetting resin, it is desirable to heat and cure the resin while gradually heating so that the heat is uniformly distributed to the entire mold.
【００１５】一般に、樹脂は硬化の際に収縮するもので
ある。そこで、その収縮量を予め求めておき、感光性材
料のドライエッチングによる金型母材料への形状転写工
程では、その収縮量部分を見込んで金型母材料の形状が
深くなるように補正して加工するのが好ましい。これに
より、硬化収縮量の補正が可能となる。Generally, a resin shrinks during curing. Therefore, the shrinkage amount is obtained in advance, and in the shape transfer step to the mold base material by dry etching of the photosensitive material, the shape of the mold base material is corrected to be deeper in consideration of the shrinkage amount portion. Processing is preferred. This makes it possible to correct the curing shrinkage amount.
【００１６】離型処理の施された金型表面に樹脂を介し
て目的製品材料を押し当てる際、樹脂と目的製品材料表
面との間に両者の密着性を向上させるためのプライマー
表面処理を施しておくことが好ましい。これにより、剥
離工程で金型側から選択的に剥離が行われ、樹脂のクワ
レ（剥離の際に樹脂の一部が金型に残ること）が急激に
減少する。 その結果、次工程での形状転写性が向上す
る。When the target product material is pressed against the mold surface subjected to the mold release treatment via a resin, a primer surface treatment for improving the adhesion between the resin and the target product material surface is performed. It is preferable to keep it. Thereby, in the peeling step, the peeling is selectively performed from the mold side, and the resin cracking (a part of the resin remains in the mold at the time of peeling) is sharply reduced. As a result, shape transferability in the next step is improved.
【００１７】樹脂に転写された形状をドライエッチング
法によって目的製品材料に転写する際、目的製品材料に
所望の形状を形成するためにそのドライエッチングにお
ける樹脂と目的製品材料とのエッチングの選択比を段階
的又は連続的に変化させることが好ましい。この選択比
の調整により形状の補正が可能となり、所望の形状に転
写できるようになる。When the shape transferred to the resin is transferred to the target product material by the dry etching method, the etching selectivity between the resin and the target product material in the dry etching is set to form a desired shape in the target product material. It is preferable to change it stepwise or continuously. By adjusting the selection ratio, the shape can be corrected, and the image can be transferred to a desired shape.
【００１８】目的製品材料の曲面状表面に微細形状を形
成するために、金型をプラスチック材料で形成したり、
金属薄膜上に形成したりすることにより、金型に可撓性
をもたせ、金型表面に樹脂を介して目的製品材料を押し
当ててその目的製品材料表面の曲面に応じて金型を湾曲
させた状態で、その金型の表面形状の反転形状をその樹
脂に転写することが好ましい。金型に可撓性をもたせる
ことにより、以下のような利点を発揮することができ
る。 例えば、図１（Ａ）に示されるように、金型をＸ軸方
向に変形させると、金型をシリンダー形状とすることが
できる。 また、例えば、図１（Ｂ）に示されるように、金型を
Ｚ軸方向に均一な圧力を加えて変形させると、金型を球
面形状とすることができる。これらの形状を利用するこ
とにより、製作する面の形状は平面に限るものではな
く、球面形状、非球面、シリンダー面などに微細形状を
製作することができる。このように、曲面基板上の微細
構造製作が可能となる。In order to form a fine shape on the curved surface of the target product material, a mold is formed of a plastic material,
By forming it on a metal thin film, the mold is given flexibility, the target product material is pressed against the mold surface via resin, and the mold is curved according to the curved surface of the target product material surface. In this state, it is preferable to transfer an inverted shape of the surface shape of the mold to the resin. By imparting flexibility to the mold, the following advantages can be exhibited. For example, as shown in FIG. 1A, when the mold is deformed in the X-axis direction, the mold can have a cylindrical shape. Further, for example, as shown in FIG. 1B, when the mold is deformed by applying a uniform pressure in the Z-axis direction, the mold can be formed into a spherical shape. By using these shapes, the shape of the surface to be manufactured is not limited to a flat surface, and a fine shape can be manufactured on a spherical surface, an aspheric surface, a cylinder surface, or the like. In this way, it is possible to manufacture a fine structure on a curved substrate.
【００１９】[0019]
【実施例】（実施例１）図２に示す回折光学素子を製作
した。この回折光学素子は合成石英材に形成された直径
が約１０ｍｍのもので、同心円状に鋸歯形状を配列した
ものである。その輪帯数は約９００、ピッチは約１５０
μm〜３μm、高さは約０.６μmである。(Example 1) A diffractive optical element shown in FIG. 2 was manufactured. This diffractive optical element has a diameter of about 10 mm formed in a synthetic quartz material, and has a sawtooth shape arranged concentrically. The number of ring zones is about 900 and the pitch is about 150
μm to 3 μm, and the height is about 0.6 μm.
【００２０】以下に、図３，４を参照してこの回折光学
素子の製作手順を示す。 （Ａ）金型母材料２として直径が４インチ、厚さが２.
０ｍｍの合成石英基板を用意した。この金型母材料２の
表面上に電子線描画用感光性材料（レジスト）（東京応
化社製：ＯＥＢＲ−１０００）４をスピンナーにて、５
００ｒｐｍで５秒間、続いて４０００ｒｐｍで３０秒間
塗布した。その後、１７０℃で２０分間のプリベークを
行なった後、急冷却した。この時のレジスト膜厚は、
０.５μｍであった。The procedure for manufacturing this diffractive optical element will be described below with reference to FIGS. (A) The mold base material 2 has a diameter of 4 inches and a thickness of 2.
A 0 mm synthetic quartz substrate was prepared. A photosensitive material (resist) for electron beam lithography (OEBR-1000: OEBR-1000) 4 is coated on the surface of the mold base material 2 with a spinner 5.
The coating was performed at 00 rpm for 5 seconds, and then at 4000 rpm for 30 seconds. After that, prebaking was performed at 170 ° C. for 20 minutes, followed by rapid cooling. The resist film thickness at this time is
It was 0.5 μm.
【００２１】次に、第２図に示す形状を得る為に、別途
ＣＡＤソフトを使用してＥＢ照射ビームがなぞる領域分
割、経路及びビーム径、ドーズ量、描画時間等を入力し
ておく。本実施例の場合には、丸形状を１０８０角形と
近似して描画全領域を５００μm×５００μｍの正方形
の領域に分割して描画プログラムを作成した。尚、本件
では最終製品形状と描画形状とは、反転した関係であ
る。予め、反転形状でプログラムを製作するのは当然で
ある。Next, in order to obtain the shape shown in FIG. 2, separately, CAD software is used to input a region division, a path and a beam diameter, a dose, a writing time, etc., which the EB irradiation beam traces. In the case of the present embodiment, a drawing program was created by dividing the entire drawing area into square areas of 500 μm × 500 μm by approximating the round shape to a 1080 square. In this case, the final product shape and the drawing shape are in an inverted relationship. It is natural that a program is produced in an inverted shape in advance.
【００２２】（Ｂ）そのレジスト４を塗布した金型母材
料２を電子線描画装置にセットし、所定の真空度まで排
気する。次いで、ＣＡＤデータを描画装置の制御装置に
転送し、描画を開始する。本件の場合には、Ｘ−Ｙステ
ージを移動させながら描画し、描画に１３５時間を要し
た。描画後、現像液（ＯＥＢＲ−１０００現像液）を使
用して２５℃で３分間現像した。リンスは行なわず、窒
素ブロアーとスピンナー回転にて直ぐに乾燥させた。ま
た、ポストベークも行なわなかった。(B) The mold base material 2 coated with the resist 4 is set in an electron beam lithography apparatus and evacuated to a predetermined degree of vacuum. Next, the CAD data is transferred to the control device of the drawing apparatus, and drawing is started. In this case, drawing was performed while moving the XY stage, and drawing required 135 hours. After drawing, development was performed at 25 ° C. for 3 minutes using a developer (OEBR-1000 developer). Rinsing was not performed, and drying was immediately performed using a nitrogen blower and spinner rotation. Also, no post bake was performed.
【００２３】（Ｃ）次に、描画後のレジスト４のパター
ン４ａをドライエッチング法によって金型母材料２に転
写した。このときのドライエッチングは、ＴＣＰ（誘導
結合型プラズマ）エッチング装置を用い、ＣＨＦ3：１
５.０ｓｃｃｍ、ＣＦ4：２ｓｃｃｍのガスを導入しなが
ら、基板.バイアス電圧：５００Ｗ、上部電極パワー：
１２５０Ｗ、真空度１.５×１０-3Ｔｏｏｒ（すなわち
１.５ｍＴｏｏｒ）で３分間エッチングを行なった。こ
のときのエッチング速度は、０.２６μｍ／分であっ
た。僅かに（０.１μｍ程）オーバーエッチングで終了
させた。エッチングの選択比（金型母材料２のエッチン
グ速度／レジスト４のエッチング速度）は１.５でエッ
チング後の金型２ａの形状高さは、０.７５μｍであっ
た。表面粗さは、Ｒａ＝０.００１μｍ以下で良好であ
った。この形状高さは、次工程での樹脂の収縮を１０％
と見込んで設定した。(C) Next, the pattern 4a of the resist 4 after drawing is transferred to the mold base material 2 by a dry etching method. At this time, dry etching is performed using a TCP (inductively coupled plasma) etching apparatus and CHF 3 : 1
While introducing a gas of 5.0 sccm and CF 4 : 2 sccm, the substrate. Bias voltage: 500 W, upper electrode power:
Etching was performed at 1250 W and a degree of vacuum of 1.5 × 10 −3 Toor (that is, 1.5 mTorr) for 3 minutes. At this time, the etching rate was 0.26 μm / min. The etching was finished slightly (about 0.1 μm) by over-etching. The etching selectivity (etching rate of the mold base material 2 / etching rate of the resist 4) was 1.5, and the shape height of the mold 2a after the etching was 0.75 μm. The surface roughness was good with Ra = 0.001 μm or less. This shape height reduces the shrinkage of the resin in the next process by 10%.
It was set in anticipation.
【００２４】この時の金型２ａの形状は、描画時の形状
４ａに比較して、ピッチ一定で、高さだけが１.５倍に
なっていた。この金型２ａの表面を離型処理するため
に、金型表面に金属Ｎｉ薄膜をスパッタリング法で９×
１０-1Ｐａの真空度で５００Å成膜した。比較的高圧で
成膜したため、まわり込みが十分に行なわれ、金型表面
に均一に成膜された。At this time, the shape of the mold 2a was constant in pitch and only 1.5 times as high as the shape 4a at the time of drawing. In order to release the surface of the mold 2a, a metal Ni thin film is formed on the surface of the mold by a sputtering method.
The film was formed at a degree of vacuum of 10 -1 Pa at 500 °. Since the film was formed at a relatively high pressure, the wraparound was sufficiently performed and the film was uniformly formed on the mold surface.
【００２５】次に、Ｎｉ表面を、フッ素官能基を有する
トリアジンチオール有機化合物で表面処理した。これ
は、有機鍍金法と言われる方法で行なった。具体的に
は、フッ素化SFTT（スーパーファイントリアジンチオー
ル）を溶媒に溶かした溶液中で電解重合処理（有機鍍
金）して、金型表面にフッ素系の有機薄膜を形成した。
フッ素化SFTTは、有機硫黄化合物の１つであるトリアジ
ンチオールの側鎖をフッ素化したものである。フッ素分
子の数ｎは、ｎ＝７が最も撥水効果（剥型効果）が高か
ったので、この条件で１０００Å成膜した。ただし、Ｎ
ｉスパッタリングを実施しなくてもシラノール基を有す
るトリアジンチオールを用いれば、同様の撥水効果は得
られる。Next, the Ni surface was surface-treated with a triazinethiol organic compound having a fluorine functional group. This was performed by a method called organic plating. Specifically, electrolytic polymerization treatment (organic plating) was performed in a solution of fluorinated SFTT (super fine triazine thiol) dissolved in a solvent to form a fluorine-based organic thin film on the surface of the mold.
The fluorinated SFTT is obtained by fluorinating a side chain of triazine thiol, which is one of organic sulfur compounds. As for the number n of the fluorine molecules, n = 7 had the highest water-repellent effect (stripping effect). Where N
Even if i-sputtering is not performed, a similar water-repellent effect can be obtained by using a triazine thiol having a silanol group.
【００２６】（Ｄ）次に、離型処理した金型２ａを下に
セットして、この上に紫外線硬化型樹脂６としてアクリ
ル系樹脂（大日本インキ社製：ＧＲＡＮＤＩＣ ＲＣ−
８７２０）を３ｃｃ塗布した。(D) Next, the mold 2a which has been subjected to the mold release treatment is set below, and an acrylic resin (manufactured by Dainippon Ink Inc .: GRANDIC RC-
8720) was applied in an amount of 3 cc.
【００２７】（Ｅ）この金型２ａを専用の接合機にセッ
トし、予め別の工程でシランカップリング処理（密着性
向上処理）を施した目的製品材料の平面基板８（信越石
英社製：合成石英スプラシルＰ−２０）をゆっくりと押
し当てる。この時紫外線硬化型樹脂６の中に泡が発生し
ないように降下速度を制御した自動接合機で接合した。(E) This mold 2a is set in a dedicated bonding machine, and a flat substrate 8 (product made by Shin-Etsu Quartz Co., Ltd.) of the target product material which has been subjected to a silane coupling treatment (adhesion improving treatment) in another step in advance. Gently press synthetic quartz suprasil P-20). At this time, bonding was performed by an automatic bonding machine in which the descending speed was controlled so that bubbles were not generated in the ultraviolet curable resin 6.
【００２８】次に、金型２ａ側からゆっくりと目的製品
材料基板.８側に押し上げて、形状転写時に余分となる
紫外線硬化型樹脂６を除去した。更に、目的製品材料基
板.８の裏面側から均一な紫外線光を３０００ｍＪ照射
して紫外線硬化型樹脂層６を硬化させた。この時の紫外
線硬化型樹脂層６の厚さ（紫外線硬化型樹脂層６の３次
元構造のトップとスプラシル目的製品材料基板８間の距
離）は、０.１μｍ以下であった。当然、紫外線硬化型
樹脂層６の最大厚さは、「パターン深さ：０.７５」＋
「０.１」＝０.８５μｍである。Next, the resin was slowly pushed up from the mold 2a side to the target product material substrate 0.8 side to remove the unnecessary ultraviolet curing resin 6 at the time of shape transfer. Further, the ultraviolet curable resin layer 6 was cured by irradiating 3000 mJ of uniform ultraviolet light from the back side of the target product material substrate 0.8. At this time, the thickness of the ultraviolet-curable resin layer 6 (the distance between the top of the three-dimensional structure of the ultraviolet-curable resin layer 6 and the substrate 8 for the product material for the sprasil) was 0.1 μm or less. Naturally, the maximum thickness of the ultraviolet curable resin layer 6 is “pattern depth: 0.75” +
“0.1” = 0.85 μm.
【００２９】（Ｆ）次に、紫外線硬化型樹脂層６ａを目
的製品材料基板.８に接合したまま金型表面から剥離す
るために、治具を使って、薄い方の目的製品材料基板８
をやや凸形状に変形させながら剥離させた。次に、目的
製品材料基板８の表面上の樹脂層６ａの転写形状を測定
したところ、光学素子部の高さは、０.６７μｍに小さ
くなっていた。これは、樹脂層６ａが硬化収縮した為で
あり、その硬化収縮率は平均で約１１％であった。従っ
て、初期の見込み量よりも収縮量が大きかった為、僅か
に低い値となった。これは、樹脂層６ａの収縮率が底部
と上部（光学素子の先端部）では異なるため、先端部が
僅かに高さが低くなり、球形状を有していたことによ
る。(F) Next, in order to peel off the ultraviolet curable resin layer 6a from the die surface while being bonded to the target product material substrate 0.8, a thinner target product material substrate 8 is used by using a jig.
Was peeled off while being deformed into a slightly convex shape. Next, when the transfer shape of the resin layer 6a on the surface of the target product material substrate 8 was measured, the height of the optical element portion was reduced to 0.67 μm. This is because the resin layer 6a was cured and shrunk, and the curing shrinkage was about 11% on average. Therefore, the contraction amount was larger than the initial expected amount, and thus the value was slightly lower. This is because the shrinkage of the resin layer 6a is different between the bottom part and the upper part (the tip of the optical element), so that the tip is slightly lower in height and has a spherical shape.
【００３０】（Ｇ）次に目的製品材料基板８上の樹脂層
６ａの転写形状を上記と同様に転写した。ドライエッチ
ング条件は、ＴＣＰエッチング装置を用い、ＣＨＦ3：
１２.０ｓｃｃｍ、ＣＦ4：４ｓｃｃｍのガスを導入しな
がら基盤バイアス電圧：５００Ｗ、上部電極パワー：１
２５０Ｗ、真空度１.５×１０-3Ｔｏｏｒ（すなわち１.
５ｍＴｏｏｒ）で３.５分間エッチングを行なった。こ
の時のエッチング速度は、０.２５μｍ／分であった。(G) Next, the transfer shape of the resin layer 6a on the target product material substrate 8 was transferred in the same manner as described above. Dry etching conditions were as follows: using a TCP etching apparatus, CHF 3 :
While introducing a gas of 12.0 sccm and CF 4 : 4 sccm, a substrate bias voltage: 500 W and an upper electrode power: 1
250 W, degree of vacuum 1.5 × 10 −3 Toor (that is, 1.
Etching was performed at 3.5 mTorr for 3.5 minutes. The etching rate at this time was 0.25 μm / min.
【００３１】先に延べたように、樹脂層６ａの収縮率が
底部と上部先端部で僅かに異なり、高さが低くなってい
たので、エッチングの後半ではＣＨＦ3ガス量を２.０ｓ
ｃｃｍ増加させて選択比を若干大きくしてエッチングし
た。選択比を段階的に変更することによって、転写時に
所望の形状を得ることができた。エッチングの選択比
（目的製品材料基板８のエッチング速度／樹脂層8のエ
ッチング速度）は平均で１.０３であり、エッチング後
の形状８ａの高さは、０.６９μｍであった。表面粗さ
は、Ｒａ＝０.００１μｍ以下で良好であった。尚、光
学面は直線形状を有していた。As described above, since the shrinkage ratio of the resin layer 6a is slightly different between the bottom portion and the top end portion and the height is low, the CHF 3 gas amount is set to 2.0 s in the latter half of the etching.
The etching was performed with the selectivity increased slightly by increasing ccm. By changing the selection ratio stepwise, a desired shape could be obtained at the time of transfer. The etching selectivity (the etching rate of the target product material substrate 8 / the etching rate of the resin layer 8) was 1.03 on average, and the height of the etched shape 8a was 0.69 μm. The surface roughness was good with Ra = 0.001 μm or less. The optical surface had a linear shape.
【００３２】（実施例２）微細構造の製造方法におい
て、金型を可撓性を有するプラスチック材料に形成し、
これに樹脂層を塗布して形状を転写し、その形状転写し
た樹脂層を湾曲させて目的材料表面に転写する実施例
を、図５，６を参照して説明する。Example 2 In a method for manufacturing a microstructure, a mold is formed of a flexible plastic material,
An example in which a resin layer is applied to this to transfer the shape, and the shape-transferred resin layer is curved and transferred to the surface of the target material will be described with reference to FIGS.
【００３３】（Ａ）金型母材料１２として直径４イン
チ、厚さ１.０ｍｍのアクリルシートを用意した。金型
を形成するまでは金型母材料１２を平坦に保つために、
これを厚さ２.０ｍｍの裏打ち用合成石英基板１３上に
ワックスで平行に貼りつけた。(A) As a mold base material 12, an acrylic sheet having a diameter of 4 inches and a thickness of 1.0 mm was prepared. Until the mold is formed, in order to keep the mold base material 12 flat,
This was adhered in parallel with wax on a synthetic quartz substrate 13 for lining having a thickness of 2.0 mm.
【００３４】（Ｂ）これを基板として実施例１と同様の
形状を同様の方法で描画し電子線描画用レジスト４をパ
ターン化した。４ａはその表面形状である。(B) Using this as a substrate, the same shape as in Example 1 was drawn by the same method to pattern the electron beam drawing resist 4. 4a is the surface shape.
【００３５】（Ｃ）実施例１と同様にしてレジスト４の
パターンをドライエッチング法により金型母材料１２に
転写して金型１２ａを形成した。その金型１２ａの表面
に、実施例1とは異なり、Ｎｉ表面処理を施さないで、
シラノール基又はチオール基をもつフッ素系トリアジン
で表面処理して離型処理を施した。その後、ワックスを
加熱してアクリルシートの金型１２ａを裏打ち用合成石
英基板から剥離した。(C) In the same manner as in Example 1, the pattern of the resist 4 was transferred to the mold base material 12 by dry etching to form a mold 12a. Unlike the first embodiment, the surface of the mold 12a is not subjected to Ni surface treatment,
The surface was treated with a fluorine-based triazine having a silanol group or a thiol group to perform a release treatment. Thereafter, the wax was heated to release the acrylic sheet mold 12a from the backing synthetic quartz substrate.
【００３６】（Ｄ）次いで、別途用意してある湾曲面を
有する金属製形状転写用成形型１４にワックスで接合す
る。アクリルシートの金型１２ａは可撓性があるので金
属製成形型１４に倣って湾曲面を形成する。これを成形
用金型として使用する。(D) Then, it is bonded to a metal shape transfer mold 14 having a curved surface, which is prepared separately, with wax. Since the acrylic sheet mold 12a is flexible, it forms a curved surface following the metal mold 14. This is used as a molding die.
【００３７】（Ｅ）次に、実施例１と同様の操作を実施
する。まず、接合機にこの金型１２ａを下にして設置す
る。この金型１２ａの上に紫外線硬化型樹脂６を１０ｃ
ｃ塗布する。別途用意してあるシリンダー曲面を有する
ガラスレンズ１６を上方向から押し当て、金型12aの形
状を紫外線硬化型樹脂６に転写する。ガラスレンズ16と
しては紫外線光を透過するものを使用する。その後、ガ
ラスレンズ１６側から紫外線１７を照射して形状転写し
た紫外線硬化型樹脂層６ａを硬化させる。(E) Next, the same operation as in the first embodiment is performed. First, the mold 12a is placed on the joining machine with the mold 12a facing down. The ultraviolet curable resin 6 is placed on the mold 12a by 10c.
c Apply. A separately prepared glass lens 16 having a cylinder curved surface is pressed from above to transfer the shape of the mold 12 a to the ultraviolet-curable resin 6. A glass lens 16 that transmits ultraviolet light is used. Thereafter, ultraviolet rays 17 are irradiated from the glass lens 16 side to cure the ultraviolet-curable resin layer 6a whose shape has been transferred.
【００３８】（Ｆ）紫外線硬化型樹脂層６ａの硬化後、
紫外線硬化型樹脂層６ａから金型12aを剥離する。(F) After the curing of the ultraviolet-curable resin layer 6a,
The mold 12a is peeled off from the ultraviolet curable resin layer 6a.
【００３９】（Ｇ）紫外線硬化型樹脂層６ａを接合した
ガラスレンズ１６をドライエッチング装置に設置して、
実施例１と同様に、紫外線硬化型樹脂層６ａの形状をガ
ラスレンズ１６に転写する。１６ａは形状転写後のガラ
スレンズである。この方法によって、曲面基板上に微細
構造の製作が可能となる。(G) The glass lens 16 to which the ultraviolet-curable resin layer 6a is bonded is placed in a dry etching apparatus,
The shape of the ultraviolet-curable resin layer 6a is transferred to the glass lens 16 as in the first embodiment. 16a is a glass lens after shape transfer. By this method, it is possible to produce a fine structure on a curved substrate.
【００４０】（実施例３）潤滑性を有するポリゴンモー
ター用回転軸を製作した。製作手順を図７，８を参照し
て説明する。 （Ａ）金型母材料２２として直径４インチ、厚さ１.０
ｍｍのシリコンシートを用意した。金型を形成するまで
は金型母材料２２を平坦に保つために、これを厚さ２.
０ｍｍの裏打ち用合成石英基板２３上にワックスで平行
に貼りつけた。Example 3 A rotary shaft for a polygon motor having lubricity was manufactured. The manufacturing procedure will be described with reference to FIGS. (A) The mold base material 22 has a diameter of 4 inches and a thickness of 1.0.
mm silicon sheet was prepared. To keep the mold base material 22 flat until the mold is formed, it is reduced to a thickness of 2.
It was stuck on a synthetic quartz substrate 23 for backing of 0 mm in parallel with wax.
【００４１】この金型母材料２２の表面上に電子線描画
用レジスト（東京応化社製：ＯＥＢＲ−１０００）４を
スピンナーにて、５００ｒｐｍで５秒間、続いて４００
０ｒｐｍで３０秒間塗布した。その後、１７０℃で２０
分間のプリベークを行なった後、急冷却した。この時の
レジスト膜厚は、０.５μｍであった。An electron beam lithography resist (OEBR-1000, manufactured by Tokyo Ohka Co., Ltd.) 4 is applied on the surface of the mold base material 22 with a spinner at 500 rpm for 5 seconds, and then for 400 seconds.
The coating was performed at 0 rpm for 30 seconds. Then, at 170 ° C for 20
After pre-baking for a minute, it was rapidly cooled. At this time, the resist film thickness was 0.5 μm.
【００４２】次に、（Ｆ）に示す微細形状を得る為に、
別途ＣＡＤソフトを使用してＥＢ照射ビームがなぞる領
域分割、経路及びビーム径、ドーズ量、描画時間等を入
力しておく。描画全領域を５００μm×５００μｍの正
方形の領域に分割して描画プログラムを作成した。最終
製品形状と描画形状とは、反転した関係である。実施例
１と同様に描画した。本実施例の場合もＸ−Ｙステージ
を移動させながら描画し、描画に１時間を要した。Next, in order to obtain the fine shape shown in FIG.
Separately, CAD software is used to input the area division, the path and the beam diameter, the dose, the drawing time, etc., which the EB irradiation beam traces. The entire drawing area was divided into 500 μm × 500 μm square areas to create a drawing program. The final product shape and the drawing shape are in an inverted relationship. Drawing was performed in the same manner as in Example 1. Also in the case of the present embodiment, drawing was performed while moving the XY stage, and drawing required one hour.
【００４３】（Ｂ）描画後、実施例１と同様に現像を行
なってレジストパターン４ａを得た。(B) After drawing, development was performed in the same manner as in Example 1 to obtain a resist pattern 4a.
【００４４】（Ｃ）次に、描画後のレジストパターン４
ａをドライエッチング法によって金型母材料２２に転写
して金型２２ａを形成した。ドライエッチングは、ＴＣ
Ｐエッチング装置を用い、ＣＨＦ3：１０.０ｓｃｃｍ、
ＣＦ4：０.５ｓｃｃｍのガスを導入しながら、基板.バ
イアス電圧：５００Ｗ、上部電極パワー：１２５０Ｗ、
真空度１.５×１０-3Ｔｏｏｒで１分間エッチングを行
なった。この時のエッチング速度は、０.５０μｍ／分
であった。エッチングの選択比は１.０で、エッチング
後の形状高さは０.５μｍであった。次に、合成石英基
板２３を加熱して金型２２aを合成石英基板２３から剥
離した。(C) Next, resist pattern 4 after drawing
a was transferred to the mold base material 22 by a dry etching method to form a mold 22a. Dry etching is TC
Using a P etching apparatus, CHF 3 : 10.0 sccm,
While introducing a gas of CF 4 : 0.5 sccm, the substrate. Bias voltage: 500 W, upper electrode power: 1250 W,
Etching was performed at a degree of vacuum of 1.5 × 10 −3 Tool for 1 minute. At this time, the etching rate was 0.50 μm / min. The etching selectivity was 1.0, and the shape height after etching was 0.5 μm. Next, the synthetic quartz substrate 23 was heated to separate the mold 22a from the synthetic quartz substrate 23.
【００４５】（Ｄ）この金型２２aの表面を離型処理す
るために、金型表面に金属Ｃｒ薄膜をスパッタリング法
により９×１０-1Ｐａで５００Å成膜した。比較的高圧
で成膜したためまわり込みが十分に行なわれ、金型２２
aの表面に均一に成膜された。次に、離型処理したその
金型２２aを下にセットして、その上に紫外線硬化型樹
脂としてアクリル系樹脂（大日本インキ社製：ＧＲＡＮ
ＤＩＣ ＲＣ−８７２０）６を１０ｃｃ塗布した。これ
をスピンナーで回転させて余分な樹脂を除去した。(D) In order to release the surface of the mold 22a, a metal Cr thin film was formed on the surface of the mold by sputtering at 9 × 10 −1 Pa at 500 °. Since the film was formed at a relatively high pressure, the wraparound was sufficiently performed, and the mold 22
A film was uniformly formed on the surface of a. Next, the mold 22a subjected to the release treatment is set below, and an acrylic resin (GRAN, manufactured by Dainippon Ink Inc .: GRAN) as an ultraviolet-curable resin is placed thereon.
DIC RC-8720) 6 was applied in an amount of 10 cc. This was rotated with a spinner to remove excess resin.
【００４６】この金型２２ａ.を専用台にセットし、予
め別の工程でシランカップリング処理（密着性向上処
理）を施した目的製品材料（ポリゴンモーター用金属
軸）２６を円柱状形状のまま回転させながら平面状の金
型２２ａ.上をゆっくりと回転させた。この操作によっ
て、目的製品材料２６の表面上に紫外線硬化型樹脂層６
が印刷され、金型２２aが目的製品材料２６の表面に印
刷されたような状態となる。The mold 22a is set on a dedicated table, and the target product material (metal shaft for polygon motor) 26 which has been subjected to a silane coupling treatment (adhesion improving treatment) in a separate step in advance is kept in a cylindrical shape. While rotating, it was slowly rotated on the flat mold 22a. By this operation, the ultraviolet curable resin layer 6 is formed on the surface of the target product material 26.
Is printed, so that the mold 22a is printed on the surface of the target product material 26.
【００４７】（Ｅ）次に、目的製品材料２６の表面側か
ら均一な紫外線光を３０００ｍＪ照射した。この時の紫
外線硬化型樹脂層６の厚さ（金型２２ａの３次元構造の
トップと目的製品材料２６の表面との間の距離）は、
０.１μｍ以下であった。次に、金型２２ａを剥離し、
目的製品材料２６の表面上の樹脂転写形状６ａを測定し
たところ、上記凹凸部の高さは０.４４μｍに小さくな
っていた。(E) Next, 3000 mJ of uniform ultraviolet light was irradiated from the surface side of the target product material 26. At this time, the thickness of the ultraviolet curable resin layer 6 (the distance between the top of the three-dimensional structure of the mold 22a and the surface of the target product material 26) is
It was less than 0.1 μm. Next, the mold 22a is peeled off,
When the resin transfer shape 6a on the surface of the target product material 26 was measured, the height of the uneven portion was reduced to 0.44 μm.
【００４８】（Ｆ）次に、目的製品材料２６を回転させ
ながら、実施例１と同様にドライエッチング法により樹
脂転写形状６ａを目的製品材料２６に転写した。この時
のドライエッチング条件は、ＲＩＥ（反応性イオンエッ
チング）エッチング装置を用い、ＣＨＦ3：１２.０ｓｃ
ｃｍ、ＣＦ4：４ｓｃｃｍのガスを導入しながら、上部
電極パワー：１０００Ｗ、真空度１.５×１０-3Ｔｏｏ
ｒで２０分間エッチングを行なった。この時のエッチン
グ速度は０.０２μｍ／分であった。エッチングの選択
比（目的製品材料２６のエッチング速度／紫外線硬化型
樹脂層６のエッチング速度）は平均で０.５で、エッチ
ング後の形状高さは、０.２２μｍであった。表面粗さ
は、Ｒａ＝０.００１μｍ以下で良好であった。凹凸面
（シリンダー状の溝形状）は直線形状である。(F) Next, while rotating the target product material 26, the resin transfer shape 6a was transferred to the target product material 26 by the dry etching method as in the first embodiment. The dry etching conditions at this time were as follows: CHF 3 : 12.0 sc using an RIE (reactive ion etching) etching apparatus.
cm, CF 4 : 4 sccm while introducing gas, upper electrode power: 1000 W, degree of vacuum 1.5 × 10 −3 Too
Etching was performed for 20 minutes at r. The etching rate at this time was 0.02 μm / min. The etching selectivity (etching rate of the target product material 26 / etching rate of the ultraviolet curable resin layer 6) was 0.5 on average, and the shape height after etching was 0.22 μm. The surface roughness was good with Ra = 0.001 μm or less. The uneven surface (cylindrical groove shape) is linear.
【００４９】[0049]
【発明の効果】本発明では、表面に微細形状をもつ金型
の表面に離型処理を施し、その金型表面に硬化可能な樹
脂を介して目的製品材料を押し当てて、金型の表面形状
の反転形状をその樹脂に転写し、その樹脂を硬化させ、
その樹脂を目的製品材料に接合させた状態で金型を剥離
した後、その樹脂に転写された形状をドライエッチング
法によって目的製品材料に転写することにより、微細表
面構造をもつ物品を製造する製造するようにしたので、
微細構造（高精度の表面3次元構造）を高精度で、量産
製品を大量に生産可能となった。生産の工程を簡素化し
て再現性あるかつ容易な製造工程とし、低コスト化を実
現できた。また、金型表面に離型処理を施したので、金
型の寿命を長くし、かつ転写性を向上させ、剥離を容易
にすることが可能となった。金型として可撓性をもつ材
料を使用すれば、従来工法では全く実現できなかった、
曲面基板上の超微細構造製作が可能となる。According to the present invention, the surface of a mold having a fine shape on its surface is subjected to a release treatment, and the target product material is pressed against the surface of the mold via a curable resin. Transfer the inverted shape to the resin, cure the resin,
Manufacturing that manufactures an article with a fine surface structure by removing the mold with the resin bonded to the target product material and then transferring the shape transferred to the resin to the target product material by dry etching. I decided to
High-precision fine structure (high-precision surface three-dimensional structure) enables mass production of mass-produced products. The production process was simplified to make it a reproducible and easy manufacturing process, and the cost was reduced. Further, since the mold surface is subjected to the release treatment, it is possible to prolong the life of the mold, improve the transferability, and facilitate the peeling. If a flexible material is used for the mold, it could not be realized by the conventional method at all.
It becomes possible to manufacture an ultrafine structure on a curved substrate.
【図１】 可撓性をもつ材料で金型を製作し、変形させ
て得られる形状の例を示す図であり、（Ａ）はシリンダ
ー局面を示す斜視図、（Ｂ）は球面形状を示す断面図で
ある。FIG. 1 is a diagram showing an example of a shape obtained by manufacturing and deforming a mold with a flexible material, (A) is a perspective view showing a cylinder aspect, and (B) is a spherical shape. It is sectional drawing.
【図２】 第１の実施例で製作する回折光学素子を示す
断面図である。FIG. 2 is a cross-sectional view illustrating a diffractive optical element manufactured in the first embodiment.
【図３】 第１の実施例の前半部を示す工程断面図であ
る。FIG. 3 is a process sectional view showing a first half of the first embodiment.
【図４】 第１の実施例の後半部を示す工程断面図であ
る。FIG. 4 is a process sectional view showing a latter half of the first embodiment.
【図５】 第２の実施例の前半部を示す工程断面図であ
る。FIG. 5 is a process sectional view showing the first half of the second embodiment.
【図６】 第２の実施例の後半部を示す工程断面図であ
る。FIG. 6 is a process sectional view showing the latter half of the second embodiment.
【図７】 第３の実施例の前半部を示す工程断面図であ
る。FIG. 7 is a process sectional view showing the first half of the third embodiment.
【図８】 第３の実施例の後半部を示す工程断面図であ
る。FIG. 8 is a process sectional view showing the latter half of the third embodiment.
２，１２，２２ 金型母材料 ２ａ，１２ａ，２２ａ 金型 ４ レジスト ４ａ レジストパターン ６ 紫外線硬化型樹脂 ６ａ 紫外線硬化型樹脂パターン ８，１６，２６ 目的製品材料 ８ａ，１６ａ，２６ａ エッチング後の目的製品材料の
表面形状2,12,22 Mold base material 2a, 12a, 22a Mold 4 Resist 4a Resist pattern 6 UV curable resin 6a UV curable resin pattern 8,16,26 Target product material 8a, 16a, 26a Target product after etching Material surface shape
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｇ０２Ｂ 3/00 Ｇ０２Ｂ 3/00 Ｚ Ａ 5/18 5/18 Ｇ０３Ｆ 7/20 ５０１ Ｇ０３Ｆ 7/20 ５０１ ５０４ ５０４ ５０５ ５０５ 7/24 7/24 Ｚ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) G02B 3/00 G02B 3/00 Z A 5/18 5/18 G03F 7/20 501 G03F 7/20 501 504 504 505 505 7/24 7/24 Z
Claims (15)
細表面構造をもつ物品を製造する製造方法。 （Ａ）表面に微細形状をもつ金型の表面に離型処理を施
す工程、 （Ｂ）離型処理の施された前記金型表面に硬化可能な樹
脂を介して目的製品材料を押し当てて、前記金型の表面
形状の反転形状を前記樹脂に転写する工程、 （Ｃ）前記樹脂を硬化させる工程、 （Ｄ）前記樹脂を前記目的製品材料に接合させた状態で
その樹脂を前記金型から剥離させる工程、及び （Ｅ）前記樹脂に転写された形状をドライエッチング法
によって前記目的製品材料に転写する工程。1. A method for producing an article having a fine surface structure comprising the following steps (A) to (E). (A) a step of performing a release treatment on a surface of a mold having a fine shape on the surface; (B) pressing a target product material through a curable resin on the mold surface subjected to the release treatment; (C) a step of curing the resin, (D) a step of curing the resin, and (D) a step of transferring the resin in a state where the resin is bonded to the target product material. And (E) transferring the shape transferred to the resin to the target product material by dry etching.
項１に記載の製造方法。2. The method according to claim 1, wherein the resin is an ultraviolet curable resin.
（ａ）から（ｃ）により形成する請求項１又は２に記載
の製造方法。 （ａ）前記微細形状を形成しようとする金型母材料表面
上に感光性材料を塗布する工程、 （ｂ）電子線又はレーザービームにより前記感光性材料
に所望の形状を描画し、次いで現像して前記感光性材料
に所望形状を形成する工程、及び （ｃ）前記感光性材料の形状をドライエッチング法によ
って前記金型母材料に転写する工程。3. The method according to claim 1, wherein the fine shape of the mold surface is formed by the following steps (a) to (c). (A) a step of applying a photosensitive material on the surface of a mold base material in which the fine shape is to be formed; (b) drawing a desired shape on the photosensitive material by an electron beam or a laser beam; (C) transferring the shape of the photosensitive material to the mold base material by a dry etching method.
な材料であり、金属材料、ガラス材料、セラミックス材
料、プラスチック材料及び硬質ゴム材料からなる群から
選ばれた１種である請求項３に記載の製造方法。4. The mold base material according to claim 3, wherein the mold base material is a material that can be dry-etched, and is one selected from the group consisting of a metal material, a glass material, a ceramic material, a plastic material, and a hard rubber material. Manufacturing method.
平面上の表面に前記微細形状を形成する請求項３又は４
に記載の製造方法。5. The mold base material is a flat substrate, and the fine shape is formed on a surface of the flat substrate.
Production method described in 1.
子線により行なうものとし、前記金型母材料表面上に塗
布する感光性材料はポジ型レジストとする請求項３，４
又は５に記載の製造方法。6. The method according to claim 3, wherein the drawing in the step (b) is performed by an electron beam, and the photosensitive material applied on the surface of the mold base material is a positive resist.
Or the production method according to 5.
ッチング工程で所望の形状を転写するために、選択比を
段階的又は連続的に変化させる請求項３から６のいずれ
かに記載の製造方法。7. The manufacturing method according to claim 3, wherein the selectivity is changed stepwise or continuously to transfer a desired shape in the dry etching step in the step (c) of the step (c). Method.
の離型処理は、金型表面に金属薄膜を成膜することであ
り、 その金属薄膜はＮｉ，Ｃｒ，Ｆｅ，Ａｌ，Ｃｏ，Ｃｕ，
Ｍｏ，Ｐｔ，Ａｕ，Ｎｂ及びＴｉからなる群から選ばれ
た単一金属又は複合材料からなるものである請求項１か
ら７のいずれかに記載の製造方法。8. The mold release treatment of the mold surface in the step (A) of claim 1 is to form a metal thin film on the mold surface, and the metal thin film is formed of Ni, Cr, Fe, Al, Co. , Cu,
The method according to any one of claims 1 to 7, comprising a single metal or a composite material selected from the group consisting of Mo, Pt, Au, Nb and Ti.
膜を成膜した後、さらに離型処理としてその金属薄膜上
に微細な構造のフッ素樹脂を含む層により表面処理を施
す請求項８に記載の製造方法。9. After forming the metal thin film for mold release treatment on the mold surface, the metal thin film is subjected to a surface treatment as a mold release treatment with a layer containing a fine structure fluororesin. 9. The production method according to 8.
面の離型処理方法として、金型表面にフッ素官能基を有
する有機化合物層を形成する請求項１から７のいずれか
に記載の製造方法。10. The method according to claim 1, wherein an organic compound layer having a fluorine functional group is formed on the mold surface as the mold release treatment method in the step (A) of claim 1. Production method.
用し、前記金型と前記目的製品材料のうち少なくとも一
方は紫外線透過材料からなるものを選択しておき、 請求項１の工程（Ｃ）における樹脂の硬化工程では、紫
外線透過材料の金型もしくは目的製品材料、又は両方を
通して紫外線硬化型樹脂に紫外線を照射してその紫外線
硬化型樹脂を均一に硬化させる請求項２から１０のいず
れかに記載の製造方法。11. An ultraviolet-curable resin is used as the resin, and at least one of the mold and the target product material is selected from an ultraviolet-transmissive material. The resin curing step according to any one of claims 2 to 10, wherein the ultraviolet curing resin is irradiated with ultraviolet rays through a mold or a target product material of an ultraviolet transmitting material, or both to uniformly cure the ultraviolet curing resin. Manufacturing method.
硬化の際の収縮量を予め求めておき、 請求項３の工程（ｃ）における感光性材料のドライエッ
チングによる金型母材料への形状転写工程では、その収
縮量部分を見込んで金型母材料を深く加工する請求項３
から１１のいずれかに記載の製造方法。12. The amount of shrinkage during curing of the resin in step (C) of claim 1 is determined in advance, and the photosensitive material is dry-etched to the mold base material in step (c) of claim 3. 4. The method according to claim 3, wherein in the shape transfer step, the mold base material is deeply worked in consideration of the shrinkage amount.
12. The production method according to any one of items 1 to 11.
された金型表面に樹脂を介して目的製品材料を押し当て
る際、樹脂と目的製品材料表面との間に両者の密着性を
向上させるためのプライマー表面処理を施しておく請求
項１から１２のいずれかに記載の製造方法。13. When the target product material is pressed through the resin onto the mold surface subjected to the release treatment in the step (B) of claim 1, the two are adhered to each other between the resin and the target product material surface. The production method according to any one of claims 1 to 12, wherein a primer surface treatment is performed to improve the property.
れた形状をドライエッチング法によって目的製品材料に
転写する際、目的製品材料に所望の形状を形成するため
にそのドライエッチングにおける樹脂と目的製品材料と
のエッチングの選択比を段階的又は連続的に変化させる
請求項１から１３のいずれかに記載の製造方法。14. When the shape transferred to the resin in the step (E) of claim 1 is transferred to a target product material by a dry etching method, the resin in the dry etching is used to form a desired shape on the target product material. 14. The method according to claim 1, wherein the selectivity of etching between the material and the target product material is changed stepwise or continuously.
形状を形成するために、 前記金型に可撓性をもたせておき、 請求項１の工程（Ｂ）では前記金型表面に前記樹脂を介
して前記目的製品材料を押し当ててその目的製品材料表
面の曲面に応じて前記金型を湾曲させた状態で、その金
型の表面形状の反転形状をその樹脂に転写する請求項１
から１４のいずれかに記載の製造方法。15. In the step (B) of claim 1, the mold is provided with flexibility in order to form a fine shape on a curved surface of the target product material. 2. An inverted shape of the surface shape of the mold is transferred to the resin while the mold is curved in accordance with a curved surface of the target product material by pressing the target product material through the resin.
15. The production method according to any one of items 1 to 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000391400A JP2002192500A (en) | 2000-12-22 | 2000-12-22 | Manufacturing method for article having micro surface structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000391400A JP2002192500A (en) | 2000-12-22 | 2000-12-22 | Manufacturing method for article having micro surface structure |
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| Publication Number | Publication Date |
|---|---|
| JP2002192500A true JP2002192500A (en) | 2002-07-10 |
Family
ID=18857543
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004042206A (en) * | 2002-07-12 | 2004-02-12 | Ricoh Opt Ind Co Ltd | Method for manufacturing three-dimensional structure product, method for using the same, and product manufactured by method |
| WO2004027843A1 (en) * | 2002-09-18 | 2004-04-01 | Tokyo University Of Science | Surface processing method |
| JP2005153113A (en) * | 2003-11-28 | 2005-06-16 | Ricoh Opt Ind Co Ltd | Method for manufacturing fine three-dimensional structure by means of nano-printing and fine three-dimensional structure |
| JP2006084885A (en) * | 2004-09-17 | 2006-03-30 | Shimadzu Corp | Method for manufacturing replica grating |
| JP2006082999A (en) * | 2004-09-15 | 2006-03-30 | Olympus Corp | Method of preparing minute aciculae |
| JP2006261265A (en) * | 2005-03-16 | 2006-09-28 | Ricoh Opt Ind Co Ltd | Phase shifter optical element, manufacturing method thereof, and element obtained with the same method |
| JP2006268015A (en) * | 2005-02-25 | 2006-10-05 | Sanyo Electric Co Ltd | Optical element, optical system and methods of manufacturing the same, and optical device |
| WO2007007755A1 (en) * | 2005-07-14 | 2007-01-18 | Matsushita Electric Industrial Co., Ltd. | Forming member of reflection preventing structure and transfer material using this, and optical apparatus provided with reflection preventing structure and production method thereof |
| WO2007029810A1 (en) * | 2005-09-09 | 2007-03-15 | Tokyo University Of Science Educational Foundation Administrative Organization | Process for producing 3-dimensional mold, process for producing microfabrication product, process for producing micropattern molding, 3-dimensional mold, microfabrication product, micropattern molding and optical device |
| US7195732B2 (en) | 2002-09-18 | 2007-03-27 | Ricoh Optical Industries Co., Ltd. | Method and mold for fabricating article having fine surface structure |
| WO2008087859A1 (en) * | 2007-01-16 | 2008-07-24 | Menicon Co., Ltd. | Contact lens and process for producing the same |
| US7629596B2 (en) | 2005-02-21 | 2009-12-08 | Tokyo University Of Science Educational Foundation Administrative Organization | Method of producing 3-D mold, method of producing finely processed product, method of producing fine-pattern molded product, 3-D mold, finely processed product, fine-pattern molded product and optical component |
| CN103649823A (en) * | 2011-05-27 | 2014-03-19 | 谷歌公司 | Image relay waveguide and method of producing same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004042206A (en) * | 2002-07-12 | 2004-02-12 | Ricoh Opt Ind Co Ltd | Method for manufacturing three-dimensional structure product, method for using the same, and product manufactured by method |
| US7195732B2 (en) | 2002-09-18 | 2007-03-27 | Ricoh Optical Industries Co., Ltd. | Method and mold for fabricating article having fine surface structure |
| WO2004027843A1 (en) * | 2002-09-18 | 2004-04-01 | Tokyo University Of Science | Surface processing method |
| JP2005539393A (en) * | 2002-09-18 | 2005-12-22 | 学校法人東京理科大学 | Surface processing method |
| JP2005153113A (en) * | 2003-11-28 | 2005-06-16 | Ricoh Opt Ind Co Ltd | Method for manufacturing fine three-dimensional structure by means of nano-printing and fine three-dimensional structure |
| JP2006082999A (en) * | 2004-09-15 | 2006-03-30 | Olympus Corp | Method of preparing minute aciculae |
| JP2006084885A (en) * | 2004-09-17 | 2006-03-30 | Shimadzu Corp | Method for manufacturing replica grating |
| US7629596B2 (en) | 2005-02-21 | 2009-12-08 | Tokyo University Of Science Educational Foundation Administrative Organization | Method of producing 3-D mold, method of producing finely processed product, method of producing fine-pattern molded product, 3-D mold, finely processed product, fine-pattern molded product and optical component |
| JP2006268015A (en) * | 2005-02-25 | 2006-10-05 | Sanyo Electric Co Ltd | Optical element, optical system and methods of manufacturing the same, and optical device |
| JP2006261265A (en) * | 2005-03-16 | 2006-09-28 | Ricoh Opt Ind Co Ltd | Phase shifter optical element, manufacturing method thereof, and element obtained with the same method |
| JP4641835B2 (en) * | 2005-03-16 | 2011-03-02 | リコー光学株式会社 | Method of manufacturing phase shifter optical element and element obtained |
| WO2007007755A1 (en) * | 2005-07-14 | 2007-01-18 | Matsushita Electric Industrial Co., Ltd. | Forming member of reflection preventing structure and transfer material using this, and optical apparatus provided with reflection preventing structure and production method thereof |
| WO2007029810A1 (en) * | 2005-09-09 | 2007-03-15 | Tokyo University Of Science Educational Foundation Administrative Organization | Process for producing 3-dimensional mold, process for producing microfabrication product, process for producing micropattern molding, 3-dimensional mold, microfabrication product, micropattern molding and optical device |
| WO2008087859A1 (en) * | 2007-01-16 | 2008-07-24 | Menicon Co., Ltd. | Contact lens and process for producing the same |
| CN103649823A (en) * | 2011-05-27 | 2014-03-19 | 谷歌公司 | Image relay waveguide and method of producing same |
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