JP2002190002A - Terminal unit for moving body identification system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a terminal unit for a moving body identification system that can realize sufficiently high resonance sharpness Q even in the case of using a bare chip as an IC chip to which antenna coils are connected, and composing the antenna coils of a wire. SOLUTION: This terminal unit 1 constitutes the moving body identification system together with a control device and sends prestored information as a reply to the control device in response to the transmission of a signal from the control device. The terminal unit 1 is provided with a base material 2; the IC chip 5 provided on the base material 2; the antenna coils 8, 9 provided on the base material 2 and electrically connected to the IC chip 5. The antenna coils 8, 9 are composed of the wire formed by integrating a plurality of single wires 10, and only a part of a plurality of single wires 10 is jointed to antenna coil connecting terminals 6, 7 of the IC chip 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal device that constitutes a mobile object identification system together with a control device, and more particularly to a terminal device in which an antenna coil is formed of a wire rod formed by integrating a plurality of single wires.

[0002]

2. Description of the Related Art A moving object identification system includes a control device called a reader / writer and a terminal device called a wireless tag or a non-contact IC card. A reader / writer transmits and receives radio waves of a predetermined frequency, while a wireless tag or a contactless IC card receives a signal transmitted from the reader / writer and returns predetermined information such as an ID number to the reader / writer. I do. In the moving object identification system, the moving object can be identified by such a method.

[0003] There are various types of terminal devices used in the above-described mobile object identification system. Although they differ in the frequency band and shape to be used, they are all provided with an IC chip and an antenna coil on a base material,
It has a structure in which the C chip and the antenna coil are electrically connected. Hereinafter, a method of connecting the antenna coil to the IC chip will be described with reference to FIGS.

FIG. 14 is a plan view schematically showing an example of a method of connecting an antenna coil to an IC chip. FIG.
1 illustrates a non-contact IC card 101 as a terminal device. The non-contact IC card has a structure in which an IC chip module 103 and an antenna coil are mounted on a card base 102. The IC chip module 103 includes a sealed bare chip 105 and antenna coil connection terminals 106 and 107 drawn from the bare chip 105, respectively. Both ends 108 and 109 of the wire constituting the antenna coil are connected to antenna coil connection terminals 106 and 107 by solders 111 and 112, respectively. Thus, I
When the C chip is provided as the IC chip module 103, the connection of the antenna coil to the IC chip can be performed by soldering.

The IC chip is an IC chip module 103
, The antenna coil can be connected to the IC chip using other methods. FIG.
FIG. 9 is a plan view schematically showing another example of a method of connecting an antenna coil to an IC chip. Unlike FIG. 14, FIG.
In 5, the antenna coil is formed by printing a conductive paste. That is, the antenna coil and the antenna coil connection terminals 106 and 107 are
Both ends 108 and 109 of the antenna coil are respectively
The connection is made by applying a conductive paste so as to be located on the antenna coil connection terminals 106 and 107.

FIG. 16 is a plan view schematically showing still another example of a method of connecting an antenna coil to an IC chip. In FIG. 16, as in FIG. 15, the antenna coil is formed by printing a conductive paste. However, unlike FIG. 14 and FIG. 15, the IC chip in FIG.
03 is provided as an IC bare chip 105 instead. That is, in this case, the antenna coil is connected to the antenna coil connection terminal 10 shown in FIGS.
Electrode pad 113, which is smaller in size than 6,107
114 must be performed. Therefore, FIG.
In the connection method shown in FIG.
By narrowing the width of the electrode pads 11 and 109, the electrode pads 11
Connections to 3,114 are realized.

When an antenna coil is directly connected to an IC bare chip, a method described in Japanese Patent Application Laid-Open No. 10-81086 can be used. That is,
First, an IC bare chip is placed in a recess provided in a card base material. Next, an insulating film is attached on the card base material. Note that a metal foil is formed on the exposed surface of the insulating film. Next, a conductor pattern used as an antenna coil is formed by patterning the metal foil using an etching method. Further, the antenna coil and the insulating film are opened at positions corresponding to the electrode pads of the IC bare chip. Then, by performing ball bonding at the position of the hole, the antenna coil and I
It can be connected to the electrode pads of the C chip.

[0008] Among the connection methods described above, the method of connecting the antenna coil to the IC chip module is disadvantageous in size and cost as compared with the method of directly connecting the antenna coil to the IC bare chip. Further, if the antenna coil is formed of a conductive paste instead of a wire, the electrical resistance increases and the sharpness (Q) of resonance of the antenna coil decreases, which is disadvantageous in terms of communication distance. Therefore, it is desired to connect the antenna coil directly to the IC bare chip and to configure the antenna coil with a wire.

[0009] However, as described above, when an IC bare chip is used instead of an IC chip module,
The connection of the antenna coil must be made to an electrode pad smaller in size than the antenna coil connection terminal. For this reason, in this case, the wire that can be used as the antenna coil is limited to a thin wire. When the diameter of the wire is small, the electrical resistance increases and the sharpness (Q) of resonance decreases as a matter of course. That is, in the related art, when the antenna coil is directly connected to the IC bare chip, high resonance sharpness (Q) cannot be realized.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. Even when a bare chip is used as an IC chip to which an antenna coil is connected, the antenna coil has a sufficient thickness. It is an object of the present invention to provide a terminal device of a mobile object identification system that can be configured by a wire. The present invention also provides an IC to which an antenna coil is connected.
It is an object of the present invention to provide a terminal device of a mobile object identification system capable of achieving a sufficiently high resonance sharpness (Q) even when a bare chip is used as a chip and an antenna coil is made of a wire.

[0011]

In order to solve the above-mentioned problems, the present invention constitutes a moving object identification system together with a control device, and stores information stored in advance in response to a signal transmitted from the control device. A terminal device for returning to the control device, the base material, an IC chip provided on the base material,
An antenna coil provided on the base material and electrically connected to the IC chip, wherein the antenna coil is configured by a wire material obtained by integrating a plurality of single wires, Only a part is joined to the antenna coil connection terminal of the IC chip.

In the terminal device of the present invention, each of the plurality of single wires may be a bare wire or a covered wire covered with an electrically insulating coating. When each of the single wires is covered with an insulating coating, the one joined to the plurality of single wire antenna coil connection terminals and at least a part of the remaining plurality of single wires are separated from the antenna coil connection terminal. It is preferable that they are electrically connected to each other at the different positions. Further, it is possible that the one joined to the plurality of single-wire antenna coil connection terminals and all of the remaining plurality of single wires are electrically connected to each other at a position apart from the antenna coil connection terminal. More preferred.

Further, when each of the single wires is covered with an insulating film, the antenna coil is arranged so that both ends thereof extend toward one side of the IC chip on the base material and the side of the IC chip. It is preferable to dispose both ends so that the distance from the antenna coil to one end of the antenna coil is different from the distance to the other end. In this case, it is possible to prevent the conductors exposed on the cut surface of the single wire from coming into contact with each other between the ends of the antenna coil. Further, when a short-circuit portion is provided at each of both ends of the antenna coil for short-circuiting the single wire joined to the antenna coil connection terminal and the single wire not joined, the short-circuit portions are prevented from contacting each other. be able to.

In the terminal device of the present invention, for example, a stranded wire formed by twisting a plurality of single wires with each other can be used as the wire material. Further, in the terminal device of the present invention, it is preferable that the IC chip is a bare chip and the antenna coil connection terminal is an electrode pad of the bare chip.

In the manufacture of the terminal device of the present invention, for example, a fusion device having a heating surface equal to or smaller than the antenna coil connection terminal can be used. That is, the wire is placed on the antenna coil connection terminals on the IC chip, the heated surface of the fusion device is pressed against these terminals, and the temperature is adjusted to a temperature suitable for fusing the wire to the antenna coil connection terminals. By heating up to this, the antenna coil can be joined to the IC chip.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail with reference to the drawings. In each of the drawings, the same or similar components are denoted by the same reference numerals, and redundant description will be omitted.

FIG. 1 is a plan view schematically showing a terminal device of the mobile object identification system according to the first embodiment of the present invention. The terminal device 1 shown in FIG. 1 is a non-contact IC card,
It has a card substrate 2 as a substrate. An IC bare chip 5 is mounted on the card base 2 as an IC chip. An antenna coil 4 made of a wire is mounted on the card base 2. In addition, IC
The bare chip 5 and the antenna coil 4 are electrically connected.

According to the non-contact IC card 1, a signal radiated by the reader / writer is received by the antenna coil 4 and input to the IC bare chip 5. IC bare chip 5
Extracts operating power from the received signal,
Information such as an ID number stored in advance in the C bare chip 5 is returned via the antenna coil 4. According to the moving object identification system using the non-contact IC card shown in FIG. 1, personal authentication and the like can be performed by the above method.

FIG. 2 is an enlarged plan view showing a part of the non-contact IC card 1 shown in FIG. As shown in FIG.
In the present embodiment, the wire constituting the antenna coil 4 is a stranded wire formed by twisting a plurality of single wires 10 with each other. Each of the single wires 10 is a covered electric wire covered with an electrically insulating film (not shown).

Single wires 10a, 10b are drawn out from both ends 8, 9 of the wire constituting the antenna coil 4.
These single wires 10a and 10b are respectively connected to electrode pads 6 serving as antenna coil connection terminals of the IC bare chip 5.
7. That is, in the non-contact IC card 1 according to the present embodiment, the antenna coil 4
The single wire 10 is used to connect the IC bare chip 5
a and 10b only.

Since the single wires 10a and 10b are much thinner than the wires constituting the antenna coil 4, the single wires 10a and 10b are
If a wire having a diameter equal to or smaller than the size of the electrode pads 6 and 7 is used as 10b, a short circuit between both end portions 8 and 9 of the wire constituting the antenna coil 4 and a short circuit between the electrode pads 6 and 7 are prevented. The antenna coil 4 and the IC bare chip 5 can be connected without occurrence.

In this embodiment, the connection of the single wires 10a and 10b to the electrode pads 6 and 7 can be performed, for example, by the following method. That is, first, the single wires 10a, 1a are connected from both ends 8, 9 of the wire constituting the antenna coil 4.
Pull out 0b. Next, the extracted portions of the single wires 10a and 10b are placed on the electrode pads 6 and 7, respectively. Thereafter, the single wires 10a and 10b are bonded to the electrode pads 6 and 7, respectively. Most of the portions of the single wires 10a and 10b that do not contribute to the bonding with the electrode pads 6 and 7 are covered with an insulating film. As described above, the single wires 10a and 10b can be connected to the electrode pads 6 and 7.

Next, a second embodiment of the present invention will be described. FIG. 3 is a plan view showing a part of the non-contact IC card 1 according to the second embodiment of the present invention. The contactless IC card 1 shown in FIG. 3 is different from the contactless IC card shown in FIG. 2 in that the distance to the IC bare chip 5 is different between the end 8 and the end 9 of the wire constituting the antenna coil 4. It has almost the same structure as the card 1. In FIG. 3, reference numerals 13 and 14 indicate short-circuit portions. These short-circuit portions 13 and 14 will be described in detail in the fourth to eighth embodiments.

When the structure shown in FIG. 3 is employed, the contact between the portion of the single wire 10a from which the insulating film has been removed and the portion of the single wire 10b from which the insulating film has been removed is more effective than the structure shown in FIG. Can be prevented. That is, in this case, an operation failure due to electrical contact between the single wires 10a and 10b near the electrode pads 6 and 7 can be effectively avoided. Further, malfunctions due to contact between the conductors exposed on the cut surfaces of the end portions 8 and 9 can be effectively avoided. In addition, operation failure due to contact between the short-circuit portions 13 and 14 can be effectively avoided.

Next, a third embodiment of the present invention will be described. FIG. 4 is a plan view showing a part of the non-contact IC card 1 according to the third embodiment of the present invention. In the non-contact IC card 1 shown in FIG. 4, the single wires 10a and 10b are not drawn out from both ends 8 and 9 of the wire constituting the antenna coil 4, and the ends 8 and 9 themselves are the electrode pads 6 and 9.
7. However, in the present embodiment, both ends 8, 9 of the wire constituting the antenna coil 4 are respectively
Only a part thereof is arranged so as to be located on electrode pads 6 and 7. That is, also in the present embodiment, not all of the single wire 10 is joined to the electrode pads 6 and 7, but only a part of the single wire 10 is joined to the electrode pads 6 and 7.

According to such a configuration, unlike the first and second embodiments, since it is not necessary to draw out the single wires 10a and 10b, the antenna coil 4 can be connected to the IC bare chip 5 in a smaller number of steps. Can be. In addition, the portion of the single wire 10 from which the insulating film is removed is replaced with the electrode pad 6.
When only the vicinity of the electrode pad 7 is provided, it is possible to effectively avoid an operation failure due to electrical contact between the single wires 10 near the electrode pads 6 and 7.

FIG. 5 is a sectional view schematically showing a connection method usable for manufacturing the non-contact IC card 1 shown in FIG. In the third embodiment, the connection of the single wire 10 to the electrode pads 6 and 7 can be performed by, for example, the following method. That is, first, both ends 8, 9 of the wire constituting the antenna coil 4 are placed on the electrode pads 6, 7, respectively. Thereafter, a bonding pad 20 for bonding is pressed against the portion of the single wire 10 placed on the electrode pads 6 and 7. The heating surface of the fusion pad 20 is the electrode pad 6, 7
Single-wire 1
Only the portions mounted on the zero electrode pads 6 and 7 can be fused to the electrode pads 6 and 7. In addition, the single wire 10 is covered with an insulating film except for the joints with the electrode pads 6 and 7. Therefore, if the end portions 8 and 9 come into contact with each other in the vicinity of the electrode pads 6 and 7 as long as the portions are covered with the insulating film, no problem occurs in the operation.

Next, a fourth embodiment of the present invention will be described. FIG. 6 is a plan view showing a part of the non-contact IC card 1 according to the fourth embodiment of the present invention. The non-contact IC card 1 shown in FIG.
The contactless IC card 1 shown in FIG. 2 has the same structure as the contactless IC card 1 shown in FIG. 2 except that the single wires 10 are electrically connected to each other by the short-circuit portions 13 and 14. That is, in the present embodiment, the single wires 10a,
Other than 10b, they are electrically connected to the electrode pads 6, 7 via the single wires 10a, 10b.

Therefore, in the non-contact IC card 1 according to the present embodiment, the electric resistance of the antenna coil 4 can be kept low, that is, the sharpness (Q) of its resonance can be kept high. Therefore, the non-contact IC card 1 according to the present embodiment is also excellent in the communication distance.

In the present embodiment, the connection of the single wires 10a and 10b to the electrode pads 6 and 7 and the connection of the single wires 10 can be performed by, for example, the following method. That is, first, the single wires 10a, 10b are pulled out from both ends 8, 9 of the wire constituting the antenna coil 4. Next, the extracted portions of the single wires 10a and 10b are placed on the electrode pads 6 and 7, respectively. Thereafter, the single wires 10a, 1
0b is bonded to the electrode pads 6 and 7. further,
The short-circuit portions 13 and 1 are formed by soldering or fusing near the ends 8 and 9 of the wire constituting the antenna coil 4.
4 is formed. As described above, the connection of the single wires 10a and 10b to the electrode pads 6 and 7 and the connection of the single wires 10 can be performed.

In the present embodiment, the connection of the single wires 10a and 10b to the electrode pads 6 and 7 and the connection between the single wires 10 can be performed by other methods. FIG.
FIG. 7 is a plan view schematically showing a connection method usable for manufacturing the non-contact IC card 1 shown in FIG. 6. As shown in FIG.
First, the short-circuit portion 1 is formed by soldering or fusing near the ends 8 and 9 of the wire constituting the antenna coil 4.
3 and 14 may be formed, and then the single wires 10 a and 10 b drawn from the ends 8 and 9 may be joined to the electrode pads 6 and 7.

When the single wire 10 is not a covered wire,
In other words, in the case of a bare electric wire having no insulating coating, if a structure capable of preventing a wire constituting the antenna coil 4 from being short-circuited at the intersection 30 shown in FIG. 1 is adopted, The short circuits 13 and 14 may not be provided. That is, in this case, the sharpness (Q) of the resonance of the antenna coil 4 can be maintained high even with the structures described in the first to third embodiments.

The short-circuit portions 13 and 14 described above may be employed in the structure described in the third embodiment. FIG. 8 is a plan view showing a part of the non-contact IC card 1 according to the fifth embodiment of the present invention. The non-contact IC card 1 shown in FIG. 8 is provided with short-circuit portions 13 and 14 near the end portions 8 and 9 except that the single wires 10 are electrically connected to each other at the short-circuit portions 13 and 14. It has the same structure as the non-contact IC card 1 shown in FIG. That is, in the present embodiment,
Except for the single wires 10a and 10b, the single wire 10
a, and are electrically connected to the electrode pads 6, 7 through 10b.

Therefore, in the non-contact IC card 1 according to the present embodiment, the electric resistance of the antenna coil 4 can be kept low, that is, the sharpness (Q) of its resonance can be kept high. Therefore, the non-contact IC card 1 according to the present embodiment is also excellent in the communication distance.

Next, a sixth embodiment of the present invention will be described. FIG. 9 is a plan view showing a part of the non-contact IC card 1 according to the sixth embodiment of the present invention. In the non-contact IC card 1 shown in FIG.
The contactless IC card shown in FIG. 8 except that the end 9 of the wire constituting the antenna coil 4 is located on the electrode pad 7. It has the same structure as 1.

According to such a structure, the electrode pad 6 and the electrode pad 7 can be sufficiently separated from each other.
It is possible to more effectively prevent an electrical short circuit between the ends 8 and 9 of the wire constituting the antenna coil 4, that is, it is possible to effectively avoid a malfunction.

In the fourth to sixth embodiments described above,
The short-circuit portions 13 and 14 are preferably formed by the following method. FIG. 10 is a sectional view schematically showing an example of a method of forming the short-circuit portions 13 and 14 that can be used in the fourth to sixth embodiments of the present invention. In forming the short-circuit portions 13 and 14,
First, as shown in FIG. 10, a saucer 15 having two grooves is provided on the base material 2. The saucer portion 15 is made of the base material 2
And may be formed integrally with the base material 2 or separately from the base material 2. Next, a wire constituting the antenna coil 4 is arranged in each of the two grooves of the receiving portion 15 such that the ends 8 and 9 thereof are located on the electrode pads 6 and 7 of the IC bare chip 5. Next, the end portions 8 and 9 are joined to the electrode pads 6 and 7. After that, the head 21 whose tip is heated to a predetermined temperature is pressed against the wire arranged in the groove of the tray 15. As a result, the single wires 10 constituting the wire are fused together at the position of the groove of the tray portion 15. In addition, it is preferable that cream-like solder is applied in advance to the wire arranged in the groove of the tray portion 15. In this case, since the single wires 10 can be soldered to each other, an electrical short circuit between the single wires 10 can be further ensured.

The short-circuit portions 13 and 14 may be formed by other methods. FIG. 11 is a sectional view schematically showing another example of a method of forming the short-circuit portions 13 and 14 that can be used in the fourth to sixth embodiments of the present invention. As shown in FIG.
The ends 8 and 9 of the wire constituting the antenna coil 4 may be soldered by using the solder 24. The short-circuit portions 13 and 14 can be formed by such a method.

Next, a seventh embodiment of the present invention will be described. In the first to sixth embodiments described above, the single wire 10
The antenna coil 4 and the IC bare chip 5 were connected by joining a part of the above to the electrode pads 6 and 7 of the IC bare chip 5. On the other hand, in the seventh embodiment, an auxiliary wire is used to connect the antenna coil 4 and the IC bare chip 5, and a non-contact IC having a structure similar to that shown in FIG.
The C card 1 is realized.

FIG. 12 is a plan view schematically showing a connection method usable for manufacturing the non-contact IC card 1 according to the seventh embodiment of the present invention. As shown in FIG. 12, first, bondable auxiliary wires 17a and 17b are prepared, and one end of each of the auxiliary wires 17a and 17b is connected to the IC bare chip 5.
Are bonded to the electrode pads 6 and 7, respectively. Next, both ends 8, 9 of the wire constituting the antenna coil 4 are arranged on the other ends of the auxiliary wires 17a, 17b, respectively.
Thereafter, short-circuit portions 13 and 14 are formed at the overlapping portions of the ends 8 and 9 of the wires and the auxiliary wires 17a and 17b by the method described with reference to FIGS.
As a result, the single wires 10 are joined to each other at the ends 8 and 9, and the ends 8 and 9 and the auxiliary wire 17 are joined.
a and 17b can be joined.

Next, an eighth embodiment of the present invention will be described. In the above-described seventh embodiment, the auxiliary wire 17
After joining a and 17b to the electrode pads 6 and 7 of the IC bare chip 5, both ends 8, 9 of the wire constituting the antenna coil 4 were joined to the auxiliary wires 17a and 17b, respectively. On the other hand, in the eighth embodiment, both ends 8, 9 of the wire constituting the antenna coil 4 and the auxiliary wires 17a, 1
7b, and the auxiliary wires 17a, 17
b to the electrode pads 6 and 7 of the IC bare chip 5,
A non-contact IC card 1 having a structure similar to that shown in FIG. 6 is realized.

FIG. 13 is a plan view schematically showing a connection method usable for manufacturing the non-contact IC card 1 according to the eighth embodiment of the present invention. As shown in FIG. 13, first, auxiliary wires 17a and 17b that can be bonded are prepared, and when the single wires 10 are joined to each other at the ends 8 and 9 of the wires constituting the antenna coil 4, the ends 8 and 17 are connected. 9 is bonded to one end of each of the auxiliary wires 17a and 17b. Next, the other ends of the auxiliary wires 17a and 17b are connected to ICs.
The bonding is performed to the electrode pads 6 and 7 of the bare chip 5, respectively. As described above, the antenna coil 4 and the IC bare chip 5 can be connected. The auxiliary wires 17a, 17a used in the seventh and eighth embodiments described above.
7b constitutes a part of a wire forming the antenna coil 4.

In the first, second, and fourth embodiments described above, a single wire 1
Although the antenna coil 4 and the IC bare chip 5 are connected using the single wires 10a and 10b, a plurality of single wires 10 may be used for the connection. However, in this case, the number of the single wires 10 drawn from the wire is smaller than the number of the single wires 10 constituting the wire, and
It is necessary that the bonding of the bare chip 5 to the electrode pads 6 and 7 has a value that can be realized without causing a malfunction.

In the above-described seventh and eighth embodiments, single wires are used as the auxiliary wires 17a and 17b used to connect the antenna coil 4 and the IC bare chip 5, but a plurality of single wires can be used. It is. However, also in this case, the number of single wires constituting the auxiliary wires 17a and 17b is
The number of the single wires 10 constituting the wire used for the antenna coil 4 is smaller than the number of the single wires 10 and the electrode pads 6 and 7 of the IC bare chip 5
It is necessary to make the bonding with a value feasible without causing an operation failure.

In the first to eighth embodiments described above, when the card base material 2 is used as the base material,
Although the case where the terminal device is the non-contact IC card 1 has been described, the terminal device does not necessarily have to be card-shaped.

Further, in the above-described first to eighth embodiments, the IC bare chip 5 is used as the IC chip.
It is also possible to use an IC chip module as the IC chip. For example, when the antenna coil connection terminal of the IC chip module is small, the same effects as described above can be obtained by applying the techniques described in the first to eighth embodiments.

[0047]

As described above, according to the present invention, the antenna coil of the terminal device constituting the moving object identification system together with the control device is constituted by a wire material obtained by integrating a plurality of single wires, Only a part is joined to the antenna coil connection terminal of the IC chip. Therefore, even when a bare chip is used as an IC chip to which the antenna coil is connected, the antenna coil can be made of a wire having a sufficient thickness, and by short-circuiting the single wires, a sufficiently high resonance sharpness (Q ) Can be realized.

That is, according to the present invention, even when a bare chip is used as an IC chip to which an antenna coil is connected, there is provided a terminal device of a moving object identification system in which the antenna coil can be formed of a sufficiently thick wire. You.
Also, according to the present invention, I
Even when a bare chip is used as a C chip and an antenna coil is made of a wire, a terminal device of a moving object identification system capable of realizing sufficiently high resonance sharpness (Q) is provided.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing a terminal device of a mobile object identification system according to a first embodiment of the present invention.

FIG. 2 is an enlarged plan view showing a part of the terminal device shown in FIG. 1;

FIG. 3 is an exemplary plan view showing a part of a terminal device according to a second embodiment of the present invention;

FIG. 4 is an exemplary plan view showing a part of a terminal device according to a third embodiment of the present invention;

FIG. 5 is a sectional view schematically showing a connection method usable for manufacturing the terminal device shown in FIG. 4;

FIG. 6 is a plan view showing a part of a terminal device according to a fourth embodiment of the present invention.

FIG. 7 is a plan view schematically showing a connection method usable for manufacturing the terminal device shown in FIG. 6;

FIG. 8 is a plan view showing a part of a terminal device according to a fifth embodiment of the present invention.

FIG. 9 is a plan view showing a part of a terminal device according to a sixth embodiment of the present invention.

FIG. 10 is a sectional view schematically showing an example of a method of forming a short-circuit portion usable in the fourth to sixth embodiments of the present invention.

FIG. 11 is a cross-sectional view schematically showing another example of a method of forming a short-circuit portion usable in the fourth to sixth embodiments of the present invention.

FIG. 12 is a plan view schematically showing a connection method usable for manufacturing a terminal device according to a seventh embodiment of the present invention.

FIG. 13 is a plan view schematically showing a connection method that can be used for manufacturing a terminal device according to the eighth embodiment of the present invention.

FIG. 14 is a plan view schematically showing an example of a method for connecting an antenna coil to an IC chip according to the related art.

FIG. 15 is a plan view schematically showing another example of a method of connecting an antenna coil to an IC chip according to the related art.

FIG. 16 is a plan view schematically showing still another example of a method of connecting an antenna coil to an IC chip according to the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Terminal device 2 ... Base material 4 ... Antenna coil 5 ... IC bare chip 6, 7 ... Electrode pad 8, 9 ... End of wire 10, 10a, 10b ... Single wire 13, 14 ... Short circuit part 15 ... Receiving part 17a, 17b ... Auxiliary wire 20 ... Fusing pad 21 ... Head 23 ... Soldering iron 24 ... Solder 30 ... Intersection 101 ... Non-contact IC card 102 ... Card base material 103 ... IC chip module 105 ... IC bare chip 106,107 ... Antenna coil connection Terminals 108, 109: Ends of wire 111, 112: Solder 113, 114: Electrode pad

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H04B 5/02 G06K 19/00 K (72) Inventor Junichi Ishizuka 2-6-1 Marunouchi, Chiyoda-ku, Tokyo F term (reference) in Furukawa Electric Co., Ltd. 2C005 MA16 MA18 MA31 MA40 NA09 NB10 5B035 AA07 BA03 BB09 BC00 CA01 CA23 5J046 AA07 AA10 AB11 PA06 PA07 5K012 AA05 AA06 AB05 AC06

Claims (6)

[Claims] 1. A terminal device which constitutes a mobile object identification system together with a control device and returns information stored in advance to the control device in response to transmission of a signal from the control device, comprising: a base material; An IC chip provided on the base material, and an antenna coil provided on the base material and electrically connected to the IC chip, wherein the antenna coil is formed by integrating a plurality of single wires. A part of the plurality of single wires is the IC.
A terminal device joined to an antenna coil connection terminal of a chip. 2. The terminal device according to claim 1, wherein each of the plurality of single wires is covered with an electrically insulating film. 3. The one of the plurality of single wires joined to the antenna coil connection terminal and at least a part of the remaining of the plurality of single wires are electrically connected to each other at a position apart from the antenna coil connection terminal. The terminal device according to claim 2, wherein the terminal device is connected. 4. The antenna coil such that both ends extend toward one side surface of the IC chip on the base material, and a distance from the side surface of the IC chip to one end of the antenna coil. The terminal device according to claim 2, wherein the terminal portions are arranged so as to be shifted so that a distance to the other end is different. 5. The terminal device according to claim 1, wherein the wire is a stranded wire formed by twisting the plurality of single wires with each other. 6. The terminal device according to claim 1, wherein the IC chip is a bare chip, and the antenna coil connection terminal is an electrode pad of the bare chip.