JP2002164253A5 - - Google Patents

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Publication number
JP2002164253A5
JP2002164253A5 JP2001250322A JP2001250322A JP2002164253A5 JP 2002164253 A5 JP2002164253 A5 JP 2002164253A5 JP 2001250322 A JP2001250322 A JP 2001250322A JP 2001250322 A JP2001250322 A JP 2001250322A JP 2002164253 A5 JP2002164253 A5 JP 2002164253A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001250322A
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JP2002164253A (ja
Filing date
Publication date
Priority claimed from US09/644,959 external-priority patent/US6657849B1/en
Application filed filed Critical
Publication of JP2002164253A publication Critical patent/JP2002164253A/ja
Publication of JP2002164253A5 publication Critical patent/JP2002164253A5/ja
Pending legal-status Critical Current

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JP2001250322A 2000-08-24 2001-08-21 電子部品に埋設するキャパシタ層を形成するために用いる薄い誘電層を備えたキャパシタ材料及びその製造方法 Pending JP2002164253A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/644959 2000-08-24
US09/644,959 US6657849B1 (en) 2000-08-24 2000-08-24 Formation of an embedded capacitor plane using a thin dielectric

Publications (2)

Publication Number Publication Date
JP2002164253A JP2002164253A (ja) 2002-06-07
JP2002164253A5 true JP2002164253A5 (ja) 2006-08-31

Family

ID=24587071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001250322A Pending JP2002164253A (ja) 2000-08-24 2001-08-21 電子部品に埋設するキャパシタ層を形成するために用いる薄い誘電層を備えたキャパシタ材料及びその製造方法

Country Status (9)

Country Link
US (1) US6657849B1 (ja)
EP (1) EP1191555A3 (ja)
JP (1) JP2002164253A (ja)
KR (1) KR100816626B1 (ja)
CN (1) CN1374666A (ja)
CA (1) CA2354753C (ja)
MY (1) MY134733A (ja)
SG (1) SG115394A1 (ja)
TW (1) TW557463B (ja)

Families Citing this family (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0116365D0 (en) * 2001-07-04 2001-08-29 Mantock Paul L A power controller
JP4079699B2 (ja) * 2001-09-28 2008-04-23 富士通株式会社 多層配線回路基板
US6819540B2 (en) * 2001-11-26 2004-11-16 Shipley Company, L.L.C. Dielectric structure
US20030191505A1 (en) * 2002-04-09 2003-10-09 Mark Gryzwa Magnetic structure for feedthrough filter assembly
JP4080799B2 (ja) * 2002-06-28 2008-04-23 三井金属鉱業株式会社 金属材表面への誘電体フィラー含有ポリイミド被膜の形成方法並びにプリント配線板用のキャパシタ層形成用の銅張積層板の製造方法及びその製造方法で得られた銅張積層板
US7719854B2 (en) * 2003-07-31 2010-05-18 Cardiac Pacemakers, Inc. Integrated electromagnetic interference filters and feedthroughs
US7190016B2 (en) * 2004-10-08 2007-03-13 Rohm And Haas Electronic Materials Llc Capacitor structure
US7382627B2 (en) * 2004-10-18 2008-06-03 E.I. Du Pont De Nemours And Company Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
US8323802B2 (en) * 2004-10-20 2012-12-04 E I Du Pont De Nemours And Company Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto
JP2006165400A (ja) * 2004-12-09 2006-06-22 Mitsui Mining & Smelting Co Ltd キャパシタ層形成材の製造方法及びその製造方法で得られたキャパシタ層形成材
US7495887B2 (en) * 2004-12-21 2009-02-24 E.I. Du Pont De Nemours And Company Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof
KR100576882B1 (ko) * 2005-02-15 2006-05-10 삼성전기주식회사 Ｔｃｃ 특성이 우수한 커패시터용 수지 조성물 및 폴리머/세라믹 복합체
KR100649633B1 (ko) * 2005-02-15 2006-11-27 삼성전기주식회사 접착력, 내열성 및 난연성이 우수한 임베디드 커패시터용수지 조성물
US7596842B2 (en) * 2005-02-22 2009-10-06 Oak-Mitsui Inc. Method of making multilayered construction for use in resistors and capacitors
US7192654B2 (en) * 2005-02-22 2007-03-20 Oak-Mitsui Inc. Multilayered construction for resistor and capacitor formation
US7547849B2 (en) * 2005-06-15 2009-06-16 E.I. Du Pont De Nemours And Company Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
US7504150B2 (en) * 2005-06-15 2009-03-17 E.I. Du Pont De Nemours & Company Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto
TWI270901B (en) * 2005-09-16 2007-01-11 Ctech Technology Corp Solid capacitor and fabrication method thereof
KR100665261B1 (ko) * 2005-10-13 2007-01-09 삼성전기주식회사 온도변화에 따른 정전용량변화가 작은 복합 유전체 조성물및 이를 이용한 시그널 매칭용 임베디드 캐패시터
JP5006613B2 (ja) * 2006-02-09 2012-08-22 日本特殊陶業株式会社 多層配線基板内蔵用コンデンサ及びそのコンデンサを内蔵した多層配線基板
US20080213605A1 (en) * 2006-12-07 2008-09-04 Briney Gary C Multi-functional circuitry substrates and compositions and methods relating thereto
US7804678B2 (en) * 2007-04-25 2010-09-28 Industrial Technology Research Institute Capacitor devices
US8475924B2 (en) 2007-07-09 2013-07-02 E.I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
US7886414B2 (en) * 2007-07-23 2011-02-15 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing capacitor-embedded PCB
US7672113B2 (en) * 2007-09-14 2010-03-02 Oak-Mitsui, Inc. Polymer-ceramic composites with excellent TCC
TWI382433B (zh) * 2007-10-16 2013-01-11 Ind Tech Res Inst 提升自振頻率之電容結構
US20090156715A1 (en) * 2007-12-14 2009-06-18 Thomas Eugene Dueber Epoxy compositions comprising at least one elastomer and methods relating thereto
TWI447155B (zh) * 2007-12-28 2014-08-01 Ind Tech Res Inst 撓曲性、低介電損失組成物及其製造方法
KR100966638B1 (ko) * 2008-03-25 2010-06-29 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조방법
US8470680B2 (en) * 2008-07-28 2013-06-25 Kemet Electronics Corporation Substrate with embedded patterned capacitance
KR101010361B1 (ko) 2008-11-11 2011-01-25 삼성전기주식회사 캐패시터
US8866018B2 (en) * 2009-01-12 2014-10-21 Oak-Mitsui Technologies Llc Passive electrical devices and methods of fabricating passive electrical devices
US8616323B1 (en) 2009-03-11 2013-12-31 Echogen Power Systems Hybrid power systems
US9014791B2 (en) 2009-04-17 2015-04-21 Echogen Power Systems, Llc System and method for managing thermal issues in gas turbine engines
KR101111623B1 (ko) 2009-04-22 2012-02-14 삼성전기주식회사 유전체 및 유전체의 제조방법
CN102461347B (zh) 2009-05-01 2016-03-16 3M创新有限公司 无源电制品
WO2010137522A1 (ja) * 2009-05-29 2010-12-02 三洋電機株式会社 積層構造体及びその製造方法
TWI394189B (zh) * 2009-06-04 2013-04-21 Ind Tech Res Inst 電容基板結構
JP5681711B2 (ja) 2009-06-22 2015-03-11 エコージェン パワー システムズ インコーポレイテッドＥｃｈｏｇｅｎ Ｐｏｗｅｒ Ｓｙｓｔｅｍｓ Ｉｎｃ． １または２以上の工業プロセスでの熱流出物処理方法および装置
CN101964254B (zh) * 2009-07-23 2013-04-17 财团法人工业技术研究院 电容基板结构
WO2011017476A1 (en) 2009-08-04 2011-02-10 Echogen Power Systems Inc. Heat pump with integral solar collector
US8613195B2 (en) 2009-09-17 2013-12-24 Echogen Power Systems, Llc Heat engine and heat to electricity systems and methods with working fluid mass management control
US8813497B2 (en) 2009-09-17 2014-08-26 Echogen Power Systems, Llc Automated mass management control
US8869531B2 (en) 2009-09-17 2014-10-28 Echogen Power Systems, Llc Heat engines with cascade cycles
US8794002B2 (en) 2009-09-17 2014-08-05 Echogen Power Systems Thermal energy conversion method
US8802230B2 (en) * 2009-12-18 2014-08-12 GM Global Technology Operations LLC Electrically-insulative coating, coating system and method
CN101944434B (zh) * 2010-07-16 2012-05-09 清华大学 聚合物复合材料嵌入式微电容及其制备方法
US8783034B2 (en) 2011-11-07 2014-07-22 Echogen Power Systems, Llc Hot day cycle
US8616001B2 (en) 2010-11-29 2013-12-31 Echogen Power Systems, Llc Driven starter pump and start sequence
US8857186B2 (en) 2010-11-29 2014-10-14 Echogen Power Systems, L.L.C. Heat engine cycles for high ambient conditions
CN102568820A (zh) * 2010-12-31 2012-07-11 深南电路有限公司 一种共面式内置电容及其制造方法
US9062898B2 (en) 2011-10-03 2015-06-23 Echogen Power Systems, Llc Carbon dioxide refrigeration cycle
CN103578747A (zh) * 2012-08-09 2014-02-12 深南电路有限公司 一种内置电容及其制备方法
BR112015003646A2 (pt) 2012-08-20 2017-07-04 Echogen Power Systems Llc circuito de fluido de trabalho supercrítico com uma bomba de turbo e uma bomba de arranque em séries de configuração
US9118226B2 (en) 2012-10-12 2015-08-25 Echogen Power Systems, Llc Heat engine system with a supercritical working fluid and processes thereof
US9341084B2 (en) 2012-10-12 2016-05-17 Echogen Power Systems, Llc Supercritical carbon dioxide power cycle for waste heat recovery
US9638065B2 (en) 2013-01-28 2017-05-02 Echogen Power Systems, Llc Methods for reducing wear on components of a heat engine system at startup
KR20150122665A (ko) 2013-01-28 2015-11-02 에코진 파워 시스템스, 엘엘씨 초임계 이산화탄소 랭킨 사이클 중에 동력 터빈 스로틀 밸브를 제어하기 위한 프로세스
BR112015021396A2 (pt) 2013-03-04 2017-08-22 Echogen Power Systems Llc Sistemas de motor de calor com circuitos de dióxido de carbono supercrítico de alto potência útil
CN103337362A (zh) * 2013-04-24 2013-10-02 清华大学 纳米电容器及其制备方法
CN103402311B (zh) * 2013-07-19 2016-09-07 广东生益科技股份有限公司 一种埋容材料、制备方法及其用途
CN103996539B (zh) * 2014-06-06 2017-04-05 刘明媚 大容量无级可变电容器及其设置方法
CN104036957B (zh) * 2014-06-24 2017-06-06 中国海洋大学 石墨纸‑钛酸钡/聚酰亚胺一体化复合薄膜电容器
JP2016086114A (ja) * 2014-10-28 2016-05-19 トヨタ自動車株式会社 フィルムコンデンサ
US10570777B2 (en) 2014-11-03 2020-02-25 Echogen Power Systems, Llc Active thrust management of a turbopump within a supercritical working fluid circuit in a heat engine system
JP6565201B2 (ja) * 2015-02-12 2019-08-28 味の素株式会社 シート状積層材料、多層配線板および多層配線板の製造方法
CN105047411A (zh) * 2015-08-12 2015-11-11 深圳市槟城电子有限公司 一种电阻和电容串连的组件及其制作方法
US20170233528A1 (en) * 2016-02-12 2017-08-17 Capacitor Sciences Incorporated Sharp polymer and capacitor
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
CN106783223B (zh) * 2016-12-30 2019-01-22 胡英 一种卷绕型全固态超级电容器及制备方法
US10883388B2 (en) 2018-06-27 2021-01-05 Echogen Power Systems Llc Systems and methods for generating electricity via a pumped thermal energy storage system
US10546916B2 (en) * 2018-06-29 2020-01-28 Intel Corporation Package-integrated vertical capacitors and methods of assembling same
CN111312518B (zh) * 2018-12-12 2022-06-03 深圳先进技术研究院 三维柔性电容材料及其制备方法和应用
US10964476B2 (en) * 2018-12-27 2021-03-30 Industrial Technology Research Institute Capacitor with multiple dielectric layers having dielectric powder and polyimide
CN110010365A (zh) * 2019-03-20 2019-07-12 华东师范大学 一种具有柔性与压缩特性的基于共聚酯制备的电容
CN111029156B (zh) * 2019-12-12 2022-04-19 益阳市万京源电子有限公司 一种机械性能好的固态铝电解电容器及其制备方法
US11435120B2 (en) 2020-05-05 2022-09-06 Echogen Power Systems (Delaware), Inc. Split expansion heat pump cycle
AU2021397292A1 (en) 2020-12-09 2023-07-06 Supercritical Storage Company, Inc. Three reservoir electric thermal energy storage system
CN112992550A (zh) * 2021-03-17 2021-06-18 广东海洋大学 一种电容材料的工业化生产方法
CN113284885A (zh) * 2021-05-14 2021-08-20 广州天极电子科技股份有限公司 一种在薄膜电路中集成薄膜电容器的方法
KR102518510B1 (ko) * 2021-06-01 2023-04-05 (주)휴켐 Ecm용 박막 필름, 그 제조 방법, 및 이를 이용하여 제조된 임베디드 커패시터
CN113658800B (zh) * 2021-07-12 2024-02-27 深圳市峰泳科技有限公司 平面电容的制作方法及系统和平面电容

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3638086A (en) 1970-03-05 1972-01-25 Illinois Tool Works Wound film capacitor
US3806775A (en) * 1971-10-19 1974-04-23 Du Pont Polyolefin capacitor construction
US4731695A (en) 1987-02-17 1988-03-15 General Electric Company Capacitor and method for making same with high yield
JPS645999A (en) * 1987-06-29 1989-01-10 Nippon Telegraph & Telephone Production of thin film of ferroelectric single crystal
JP2605739B2 (ja) * 1987-10-02 1997-04-30 富士通株式会社 強誘電薄膜の形成方法
JPH02117118A (ja) 1988-10-27 1990-05-01 Matsushita Electric Ind Co Ltd 積層磁器コンデンサ用グリーンシート
US4901199A (en) * 1989-04-20 1990-02-13 The United States Of America As Represented By The Department Of Energy Extended foil capacitor with radially spoked electrodes
US5155655A (en) 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5161086A (en) 1989-08-23 1992-11-03 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5079069A (en) 1989-08-23 1992-01-07 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5031029A (en) * 1990-04-04 1991-07-09 International Business Machines Corporation Copper device and use thereof with semiconductor devices
JPH0462715A (ja) * 1990-06-30 1992-02-27 Toshiba Corp 薄膜誘電体材料
US5800575A (en) * 1992-04-06 1998-09-01 Zycon Corporation In situ method of forming a bypass capacitor element internally within a capacitive PCB
US5185689A (en) * 1992-04-29 1993-02-09 Motorola Inc. Capacitor having a ruthenate electrode and method of formation
US5403672A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Co., Ltd. Metal foil for printed wiring board and production thereof
US5390072A (en) * 1992-09-17 1995-02-14 Research Foundation Of State University Of New York Thin film capacitors
US5636100A (en) * 1993-10-12 1997-06-03 The United States Of America As Represented By The Secretary Of The Army Capacitor having an enhanced dielectric breakdown strength
US5589284A (en) * 1994-08-01 1996-12-31 Texas Instruments Incorporated Electrodes comprising conductive perovskite-seed layers for perovskite dielectrics
JPH08124797A (ja) 1994-10-28 1996-05-17 Matsushita Electric Ind Co Ltd 誘電体薄膜及びその製造方法及びコンデンサ
US5655209A (en) * 1995-03-28 1997-08-05 International Business Machines Corporation Multilayer ceramic substrates having internal capacitor, and process for producing same
US5745334A (en) * 1996-03-25 1998-04-28 International Business Machines Corporation Capacitor formed within printed circuit board
US5796587A (en) 1996-06-12 1998-08-18 International Business Machines Corporation Printed circut board with embedded decoupling capacitance and method for producing same
US5742471A (en) * 1996-11-25 1998-04-21 The Regents Of The University Of California Nanostructure multilayer dielectric materials for capacitors and insulators
JP3823476B2 (ja) * 1997-08-13 2006-09-20 日新電機株式会社 セラミックコンデンサ
JPH11154734A (ja) 1997-11-21 1999-06-08 Advantest Corp 薄膜コンデンサの形成方法
US6068782A (en) 1998-02-11 2000-05-30 Ormet Corporation Individual embedded capacitors for laminated printed circuit boards
TW400647B (en) 1998-09-01 2000-08-01 Vanguard Int Semiconduct Corp The DRAM capacitor with double layer dielectric structure
JP2000114095A (ja) * 1998-10-09 2000-04-21 Toray Ind Inc コンデンサー用金属化積層ポリエステルフィルム
US6215649B1 (en) * 1998-11-05 2001-04-10 International Business Machines Corporation Printed circuit board capacitor structure and method
CA2289239C (en) * 1998-11-23 2010-07-20 Micro Coating Technologies Formation of thin film capacitors
JP2000208945A (ja) * 1999-01-18 2000-07-28 Ngk Spark Plug Co Ltd コンデンサ内蔵配線基板及びその製造方法
TW418529B (en) 1999-08-02 2001-01-11 Taiwan Semiconductor Mfg Method of fabricating DRAM capacitor
JP2001177008A (ja) * 1999-12-21 2001-06-29 Hitachi Ltd キャパシタを内蔵した回路基板とそれを用いた半導体装置

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