JP2002156520A - Color filter and method for manufacturing the same, liquid crystal element using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a color filter provided with a coloring part having no mixed color nor blank and excellent in surface flatness with an inkjet method via a simple process. SOLUTION: A photosensitive resin composition layer is formed on a transparent substrate, is pattern exposed, is developed, subsequently is photoset with more irradiating light quantity than that in the pattern exposure and heat treated so as to form partition walls. The coloring part is formed by imparting ink to opening parts of the partition walls.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a color filter as a component of a color liquid crystal element used in a color television, a personal computer, and a pachinko game console, a method of manufacturing the same, and a liquid crystal element using the color filter. About.

[0002]

2. Description of the Related Art In recent years, the development of personal computers,
In particular, with the development of portable personal computers, the demand for liquid crystal displays, especially color liquid crystal displays, tends to increase. However, cost reduction is necessary for further popularization, and in particular, there is an increasing demand for cost reduction of color filters having a high specific gravity.

Conventionally, various methods have been tried to satisfy the above requirements while satisfying the required characteristics of the color filter, but no method has yet been established which satisfies all the required characteristics. The respective methods will be described below.

[0004] The first method is a dyeing method. In the dyeing method, first, a water-soluble polymer material layer, which is a material for dyeing, is formed on a transparent substrate, and this is patterned into a desired shape by a photolithography process, and the obtained pattern is immersed in a dye bath. To obtain a colored pattern. By repeating this process three times, R (red), G (green), B
Three colored portions (colored pixels) of (blue) are formed.

[0005] The second method is a pigment dispersion method, which has been most frequently used in recent years. According to this method, first, a photo-curable resin in which a pigment is dispersed is formed on a transparent substrate, and this is patterned to obtain a monochromatic pattern. This process is repeated three times to form colored portions of three colors of R, G, and B.

A third method is an electrodeposition method. In this method, a transparent electrode is first patterned on a transparent substrate, and immersed in an electrodeposition coating solution containing a pigment, a resin, an electrolytic solution, and the like to electrodeposit a first color. This process is repeated three times, and R, G,
The three colored portions B are formed and finally baked.

As a fourth method, a pigment is dispersed in a thermosetting resin and printing is repeated three times to obtain R, G,
After separately applying B, by thermosetting the resin,
It forms three colored portions of R, G and B.

[0008] These methods have in common that R,
The same process is performed to form three colored portions of G and B.
It has to be repeated a number of times, resulting in high costs. There is also a problem that the yield decreases as the number of steps increases. Further, in the electrodeposition method, since the pattern shape that can be formed is limited, it is difficult to apply the current technology to the configuration of a TFT type (TFT, that is, an active matrix driving method using a thin film transistor as a switching element) liquid crystal element. It is. Further, since the printing method has poor resolution, it is not suitable for forming a fine pitch pattern.

In order to compensate for the above-mentioned drawbacks, in recent years, a method of manufacturing a color filter using an ink jet system has been actively studied. The method using the inkjet method has an advantage that the manufacturing process is simple and the cost is low.

[0010]

However, a method of manufacturing a color filter using an ink jet system has a problem of "mixed colors" and "white spots".

"Color mixing" is an obstacle that occurs when ink is mixed between adjacent colored portions of different colors. Generally, in the production of a color filter by an ink-jet method, the volume of the opening is several times larger.
It is necessary to apply an ink having a volume several tens of times. When the solid content concentration of the coloring agent and the curing component contained in the ink is high, that is, when the volume of the applied ink is relatively small, the ink can be held in the opening, so that the applied ink is It does not climb over the partition and reach the adjacent colored portion of a different color. However, when the solid concentration in the ink is low, that is, when a large amount of ink needs to be applied, the ink overflows beyond the partition walls, and color mixing occurs between adjacent colored portions. To prevent this, Japanese Patent Laid-Open No. 6-347
As disclosed in Japanese Unexamined Patent Publication No. 637, there is a method of making the partition walls ink-repellent.

On the other hand, "white spots" are caused by missing colored portions in a region surrounded by partition walls. When white spots occur, color unevenness in the colored portion, reduced contrast,
It causes display defects such as white bright spots. In particular, when ink repellency is imparted to the partition walls, the ink is easily repelled to the side surfaces of the partition walls, and white spots are likely to occur on the side surfaces of the partition walls.

As described above, if the partition walls are simply made ink-repellent, color mixing can be prevented, but white spots tend to occur.

Japanese Patent Application Laid-Open No. 9-127327 discloses a method for simultaneously realizing the prevention of "color mixture" and "white spots". Discloses a method of performing an ink-repellent treatment only on the upper surface of a partition wall by patterning with an ink. Also, JP-A-9-203803, JP-A-9-230127, JP-A-9-23
Japanese Patent Application No. 0129 discloses a method in which, after a partition material is applied, a treatment with an ink-repellent treatment agent is performed, patterning is performed by a photolithography process, and a concave portion formed in the partition is subjected to ink-philic treatment.

However, these methods include a developing step, an etching treatment with a strong alkali such as sodium hydroxide or hydrofluoric acid, and an irradiation treatment with energy rays such as ultraviolet rays after the upper surface of the partition wall is made ink-repellent. Since the process of the inking process is performed, it is difficult to make the ink-philic without lowering the ink repellency of the upper surface of the partition wall at all.

Japanese Patent Application Laid-Open No. 11-271753 discloses a method of improving the flatness in a pixel region by forming a partition into a multilayer structure in which a layer having an affinity for ink and a layer having a non-affinity are stacked. Used.

However, in this method, the barrier ribs are multi-layered, and the photolithography step needs to be performed a plurality of times. Therefore, there is a problem that the process becomes complicated, the cost increases, and the yield decreases.

An object of the present invention is to provide a color filter having good display quality without color mixture and white spots without using a complicated process when a color filter is manufactured by using an ink jet method. Another object of the present invention is to provide a liquid crystal element having excellent color display characteristics at a lower cost by using a color filter obtained by the manufacturing method.

[0019]

Means for Solving the Problems A first aspect of the present invention is a color filter having at least a plurality of colored portions on a transparent substrate and a partition located between adjacent colored portions. An ink applied by an ink-jet method is cured in an opening of a partition made of a resin composition formed on a transparent substrate. The cross section in the thickness direction of the partition has a height of 80% of the maximum thickness of the partition. When the line width of the partition wall is L ₁ , the line width of the partition wall in contact with the transparent substrate is L ₂ , and 80% of the maximum thickness of the partition wall is T ₈₀ , the following formula (1) is satisfied. It is a color filter.

| L ₂ −L ₁ | / 2 ≦ T ₈₀ (1) In the present invention, the following configuration is included as a preferred embodiment. In the above-mentioned colored portion, at least a portion is in contact with the side surface of the partition wall adjacent to the entire peripheral portion. The partition satisfies the following formula (2), and in each colored portion, the entire peripheral portion is in contact with the side surface of the adjacent partition.

| L ₂ −L ₁ | ≦ T ₈₀ (2) The partition wall is a light-shielding layer. A protective layer is provided on the colored portion. A transparent conductive film is provided on the surface.

The second aspect of the present invention is the above-mentioned method for producing a color filter of the present invention, which comprises forming a photosensitive resin composition layer on a transparent substrate, patternwise exposing and developing to form a partition pattern. Irradiating the partition pattern with light to perform photo-curing; applying heat treatment to the photo-cured partition pattern to perform full-curing; forming a partition; and ink in an area surrounded by the partition by an inkjet method. And forming at least a pixel by applying

In the above manufacturing method, the following configuration is included as a preferred embodiment. In the photo-curing step of the partition pattern, light is irradiated at least from the side of the transparent substrate on which the partition pattern is formed. The light irradiation amount in the photo-curing step of the partition pattern is larger than the exposure amount at the time of pattern exposure of the photosensitive resin composition layer. The transparent substrate temperature in the photo-curing step of the partition pattern is controlled to less than 160 ° C. Prior to the colored portion forming step, the partition walls are subjected to a plasma treatment of introducing a gas containing at least a fluorine atom and performing plasma irradiation. The gas introduced in the plasma processing is CF ₄ , CHF ₃ , C ₂ F ₆ , SF ₆ , C ₃ F
₈ , and at least one halogen gas selected from C ₅ F ₈ . The gas introduced in the plasma processing is CF ₄ ,
It is a mixed gas of at least one halogen gas selected from SF ₆ , CHF ₃ , C ₂ F ₆ , C ₃ F ₈ and C ₅ F ₈ and an O ₂ gas. Prior to the plasma treatment, the partition is subjected to dry etching treatment in which plasma irradiation is performed under at least one gas atmosphere selected from oxygen, argon, and helium. The surface of the partition wall after the plasma treatment is treated so that the surface roughness (Ra) becomes 3 nm to 50 nm. After the plasma treatment, the contact angle of the partition wall surface with pure water is 90 ° or more, and the contact angle of the transparent substrate surface with pure water is 20 °.
° or less. The partition is formed of a black resin composition. The ink contains at least a colorant, a curing component, water, and an organic solvent.

A third aspect of the present invention is a liquid crystal element characterized in that liquid crystal is sandwiched between a pair of substrates, and one of the substrates is formed using the color filter of the present invention.

[0025]

BEST MODE FOR CARRYING OUT THE INVENTION The present inventors have proposed a colored portion (colored pixel) of a color filter obtained by an ink jet method.
As a result of closely observing the partition and the partition, it was found that there were conditions under which white spots were likely to occur depending on the side shape of the partition.
In general, in a method of manufacturing a color filter by an ink jet method, a partition wall for separating inks of different colors is formed of a resin composition, particularly a photosensitive resin composition because patterning is easy. In the partition wall forming step using the photosensitive resin composition, a photosensitive resin composition layer is formed on a transparent substrate, and after pattern exposure and development to form a partition pattern, the partition pattern is subjected to a heat treatment. To cure to form a partition. In this heat treatment step of the partition pattern, the partition pattern hardens and the remaining solvent evaporates and shrinks at the same time. However, since the bottom surface in contact with the transparent substrate adheres to the transparent substrate, it hardly shrinks compared to the upper surface. As a result, the shape of the partition after heat curing is more likely to be distorted than the partition pattern after pattern exposure, and the cross section in the film thickness direction is less likely to be rectangular. Then, it was found that when the upper surface side was significantly shrunk compared to the transparent substrate side in the cross section in the film thickness direction of the partition wall, white spots in the color filter were likely to occur. The same applies to the case where the partition walls are composed of a plurality of layers. In other words, when the difference in the degree of shrinkage between the top side and the bottom side of the partition is small, white spots are unlikely to occur, and by forming the partition with such a cross-sectional shape, white spots of the color filter can be prevented, The inventors have also found that the surface flatness of the obtained colored portion is good, and have achieved the present invention.

The relationship between the cross-sectional shape of the partition wall, white spots, and flatness will be described below with reference to FIGS. 3 and 4, 1 is a transparent substrate, 5 is a partition, 6 is ink, and 7 is a colored portion after heat curing. In FIG. 4, (a-1)
(C-1) shows the state where the ink 6 is applied, (a-2)
(C-1) to (c-2) are schematic cross-sectional views in a state where the ink 6 of (a-1) to (c-1) is dried and heat-cured to form a colored portion 7.

Here, as shown in FIG. 3, in the cross section in the thickness direction of the partition 5, the maximum thickness of the partition 5 is 80%.
The line width of the partition wall 5 at a height of L ₁ is L ₁ , the line width of the partition wall 5 in contact with the transparent substrate 1 is L ₂ , 80% of the maximum thickness of the partition wall 5 is T ₈₀ , and a and b are side walls of the partition wall.

FIGS. 4C-1 and 4C-2 show the case where the sectional shape of the partition wall 5 is (L ₂ −L ₁ ) / 2> T ₈₀ .
As described above, the ink 6 does not easily adhere to the side surfaces of the partition walls 5 whose upper surfaces are significantly shrunk. The ink 6 shrinks due to drying and heat curing. However, if the ink 6 is dried and heated and cured in a state where the ink 6 is not attached to the side surface of the partition wall 5 as described above, the colored portion 7 having a significantly thinner film thickness at the peripheral portion is formed. And white spots are formed. In addition, due to the surface tension of the ink 6, the surface of the colored portion 7 has a convex shape with a raised center, and the film thickness is non-uniform as a whole and color unevenness occurs in the colored portion.

FIGS. 4 (b-1) and 4 (b-2) show the case where the sectional shape of the partition wall 5 is (L ₂ -L ₁ ) / 2 ≦ T ₈₀ .
As described above, when there is no large difference in the degree of shrinkage between the top surface and the bottom surface of the partition wall 5 and the cross-sectional shape of the partition wall 5 is nearly rectangular,
When the ink 6 easily adheres to the side surface of the partition wall 5 and the ink 6 is dried and heated and cured in this state, the surface of the ink 6 is pulled by the side surface of the partition wall 5 and the surface is flattened, and coloring after being heated and cured. The portion 7 has sufficient contact with the side surface of the partition wall 5 at the peripheral edge, and has a flat surface and a uniform film thickness.

FIGS. 4 (a-1) and 4 (a-2) show a case where the sectional shape of the partition wall 5 is (L ₂ -L ₁ ) ≦ T ₈₀ . In this way, by making the cross-sectional shape of the partition 5 closer to a rectangle, the colored portion 7 having good surface flatness can be obtained.

When L ₁ > L _2, that is, when the partition has an inversely tapered shape, the ink easily reaches the upper portion of the partition, so that no white spot occurs, but (L ₁ −L ₂ ) / 2>
When the T _80, since easily applied and generated on the upper surface of the partition walls,
It is necessary that (L ₁ −L ₂ ) / 2 ≦ T ₈₀ . When the light is applied, the light of the backlight cannot be sufficiently blocked, and the display quality may be degraded.

In the present invention, T ₈₀ ,
As a method of actually measuring L ₁ and L ₂ , a profile measurement of a surface shape by a stylus method, a laser microscope, an atomic force microscope (AFM), a scanning electron microscope (SEM),
Examples include a cross-sectional photograph by a transmission electron microscope (TEM). When measuring the profile of the surface shape by the stylus method,
Due to the diameter of the needle point, the measurement accuracy is insufficient to measure the distance between L ₁ and L ₂ . In the case of measurement by AFM, SEM, and TEM, the measurement accuracy is sufficient, but there are restrictions on the sample shape and the like. For this reason, cross-sectional profile measurement using a laser microscope that can perform simpler and more accurate measurement is preferably used.

According to the present invention, the partition having a specific cross-sectional shape is obtained by forming a partition pattern by patternwise exposing and developing the photosensitive resin composition layer, further irradiating the pattern with light, and photo-curing. It can be easily formed by heat curing (main curing). In particular, at the time of light irradiation of the partition pattern, by irradiating light from the upper surface side of the partition pattern, it is possible to more preferably suppress shrinkage of the upper surface side in the subsequent heat curing step, and form a partition having a cross section that is nearly rectangular. Can be.

FIG. 5 schematically shows a cross section of an embodiment of the color filter of the present invention. In the figure, 51 is a transparent substrate, 5
2 is a black matrix also serving as a partition, 53 is a colored portion,
Reference numeral 54 denotes a protective layer formed as needed. When configuring a liquid crystal element using the color filter of the present invention,
A transparent conductive film made of a transparent conductive material such as ITO (Indium Tin Oxide) for driving liquid crystal is provided on the colored portion 53 or on the protective layer 54 formed on the colored portion 53 and further provided thereon. It may be done.

FIG. 6 is a schematic cross-sectional view of one embodiment of the liquid crystal element of the present invention constituted by using the color filter of FIG. In the figure, 57 is a common electrode (transparent conductive film), 58 is an alignment film, 59 is a liquid crystal, 61 is a counter substrate, 62 is a pixel electrode, 63 is an alignment film, and the same members as those in FIG. And the description is omitted.

In general, a color liquid crystal element is formed by combining a substrate 51 on the color filter side and a counter substrate 61 to form a liquid crystal 5.
9 is formed. TFTs (not shown) and pixel electrodes 62 are formed in a matrix inside one substrate 61 of the liquid crystal element. A colored portion 53 of a color filter is formed inside the substrate 51 on the color filter side at a position facing the pixel electrode 62 so that R, G, and B are arranged, and a transparent common electrode is formed thereon. 57 are formed. Further, alignment films 58 and 63 are provided in the plane of both substrates.
Are formed, and the liquid crystal molecules are arranged in a certain direction. These substrates are arranged to face each other via a spacer (not shown), are bonded to each other with a sealing material (not shown), and a gap therebetween is filled with a liquid crystal 59.

In the case of the transmissive liquid crystal device, the substrate 61 and the pixel electrode 62 are formed of a transparent material, a polarizing plate is bonded to the outside of each substrate, and a fluorescent lamp and a scattering plate are generally combined. The display is performed by using a liquid crystal compound that functions as an optical shutter that changes the light transmittance of the backlight. In the case of the reflective type, the substrate 61 or the pixel electrode 62 is formed of a material having a reflective function, or a reflective layer is provided on the substrate 61, a polarizing plate is provided outside the transparent substrate 51, and a color plate is provided. Display is performed by reflecting light incident from the filter side.

Hereinafter, an example of a method for manufacturing a color filter of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 are process diagrams schematically showing a method for manufacturing a color filter of the present invention. Hereinafter, each step will be described. The following steps (a) to (h) are shown in FIG.
This corresponds to (a) to (h) of FIG. 1 and 2, (a-1) to (h-1) on the left side of the paper are schematic plan views viewed from above, and (a-2) to (h-) on the right side of the paper.
2) is a schematic cross-sectional view taken along the line AB of (a-1) to (h-1). In the figure, 1 is a transparent substrate, 2 is a photosensitive resin composition layer, 3
Is a partition pattern, 4 is an opening of the partition 3, 5 is a partition, 6 is ink, and 7 is a colored portion.

Step (a) A transparent substrate 1 is prepared. Generally, a glass substrate is used as the transparent substrate 1. However, for the purpose of forming a liquid crystal element, a plastic substrate or the like can be used as long as it has required characteristics such as desired transparency and mechanical strength. . The substrate may be subjected to a surface treatment such as a plasma treatment, a UV treatment, and a coupling treatment on the surface.

Step (b) The photosensitive resin composition layer 2 for forming the partition walls 5 is formed on the transparent substrate 1. The partition 5 is preferably a light-shielding layer for shielding light between adjacent colored portions as shown by 52 in FIG. 5, and in this case, either a black matrix or a black stripe may be used.

In the present invention, the photosensitive resin composition used to form the partition walls 5 includes an epoxy resin, an acrylic resin, a polyimide resin containing polyamideimide, a urethane resin, a polyester resin, and a polyvinyl resin. A photocurable resin material such as a resin is used. 250
It is preferable to have a heat resistance of at least ℃, and from that point,
Epoxy resins, acrylic resins, and polyimide resins are preferably used.

When the partition wall 5 is used as a light shielding layer, a black photosensitive resin composition in which a light shielding agent is dispersed in the above photosensitive resin composition is used. As the light shielding agent,
As will be described later, it is desirable to use carbon black in order to obtain high ink repellency and an appropriate surface roughness of the partition wall 5, and the carbon black may be a contact black called a channel black, a roller black, or a disk black. Using the method manufactured by the gas method, the method manufactured by the furnace method called gas furnace black or oil furnace black, the method manufactured by the thermal method called thermal black or acetylene black, etc. Among them, channel black, gas furnace black, and oil furnace black are particularly preferable. Further, if necessary, R, G,
A mixture of the B pigment may be added. A commercially available black resist can also be used. If necessary, a light-shielding layer having a high resistance may be used.

The photosensitive resin composition layer 2 is formed by spin coating,
It can be formed by a method such as roll coating, bar coating, spray coating, dip coating, film transfer method, and printing method. The method of easily controlling the film thickness is a method using spin coating, which is currently generally performed. A bar coat is effective for reducing the amount of the coating solution used, and a film transfer method is effective for reducing equipment costs.

After the application, a heat treatment (pre-bake) is performed if necessary. In this heat treatment, the set temperature is 80
C. to 140.degree. If the temperature is lower than 80 ° C., the adhesion between the transparent substrate 1 and the photosensitive resin composition layer 2 is poor, and
If the temperature exceeds 0 ° C., a residual film after development may be generated.

Step (c) The photosensitive resin composition layer 2 on the transparent substrate 1 is subjected to pattern exposure through a photomask and developed to form a partition pattern 3 having a plurality of openings 4. As a light source used for exposure, a light source having a wavelength range in which the photosensitive resin composition layer 2 can be cured is used. An ultra-high pressure mercury lamp or a Deep-UV lamp, which is a high-intensity light source including an ultraviolet wavelength, is suitably used. As the partition after development, | L ₂ −L ₁ | / 2 <T ₈₀
If the relationship is not such, the relationship such as | L ₂ −L ₁ | / 2 ≦ T ₈₀ cannot be obtained by the heat curing treatment described later. Therefore, it is desirable to perform sufficient development processing in this step.

Step (d) Light is applied to at least the region of the transparent substrate 1 where the partition pattern 3 is formed to promote photo-curing. At this time, light irradiation is preferably performed from the side on which the partition pattern 3 is formed to suppress thermal shrinkage of the upper surface of the partition pattern 3 in the heat treatment in the step (e). More preferably, light irradiation is performed from both surfaces of the transparent substrate 1. To suppress the shrinkage of the entire partition pattern 3.

The amount of light irradiation needs to be at least larger than the amount of light at the time of exposure in the previous step (c) in order to sufficiently cure the light. The larger the irradiation light amount, the smaller the heat shrinkage in the thermosetting treatment described later.

The light to be irradiated at this time is preferably a light source used at the time of exposure, but any light having a wavelength range capable of curing the photocurable resin may be used, and a light source having a wavelength in the range of 200 to 550 nm. I just need. For example, a high-pressure mercury lamp, a low-pressure mercury lamp, an argon laser beam, an excimer laser beam, or the like used in a UV cleaning device may be used.

If the substrate temperature during light irradiation exceeds the heating temperature in step (e), heat shrinkage occurs before photocuring is not sufficiently promoted, and wrinkles may occur. . As a result, the linearity of the partition walls and the uniformity of the film thickness are impaired. Therefore, the substrate temperature during light irradiation in this step is preferably set to less than 160 ° C.

Step (e) The partition wall pattern 3 that has been photocured in the step (d) is subjected to a heat treatment, and is finally cured to obtain the partition wall 5. In the present invention, since the photocuring is performed in the step (d), the partition pattern 3
In particular, the heat shrinkage on the upper surface thereof is small, and the sectional shape of the obtained partition wall 5 is almost rectangular.

Step (f) The partition walls 5 are preferably subjected to a dry etching process and a plasma process. The dry etching process is a process in which a gas containing at least one selected from oxygen, argon, and helium is introduced, and plasma is applied to the transparent substrate 1 under a reduced pressure atmosphere or an atmospheric pressure atmosphere. By performing the dry etching process,
In the step of forming the partition 5, the surface is cleaned by removing contaminants attached to the surface of the transparent substrate 1, and the surface layer of the partition 5 is roughened.

The plasma treatment is a treatment in which plasma irradiation is performed in a gas atmosphere containing at least fluorine atoms. By this plasma treatment, fluorine or a fluorine compound in the introduced gas enters the surface of the partition walls 5 and
The ink repellency of the surface layer increases.

In particular, when the partition walls 5 are made of a resin composition containing carbon black and subjected to dry etching, very high ink repellency is exhibited. It is considered that the reason is that the carbon black is exposed on the surface of the partition wall 5 by the dry etching treatment, and that the fluorine or the fluorine compound is combined with the carbon black by the plasma treatment.

Gases containing at least fluorine atoms to be introduced in the plasma treatment include CF ₄ , CH
It is preferable to use at least one halogen gas selected from F ₃ , C ₂ F ₆ , SF ₆ , C ₃ F ₈ , and C ₅ F ₈ . In particular, C
₅ F ₈ (octafluorocyclopentene) and, at the same time ozone depletion potential is zero, atmospheric life as compared with conventional gas. (CF _4: 5 million years, C ₄ F _8: 3200 year) 0 1998 and Very short. Therefore, if the global warming potential is 90 (CO ₂ =
2 (100 years integrated value) and (C
_{F 4: 6500, C 4 F} 8: 8700) is very small, very effective in ozone layer and global environmental protection.

Further, as the introduced gas, a gas such as oxygen, argon, helium, etc. may be used in combination, if necessary.

As a method of generating plasma in the dry etching process and the plasma process, low-frequency discharge,
High-frequency discharge, microwave discharge, etc. can be used, and the pressure, gas flow rate, discharge frequency,
Conditions such as the processing time can be arbitrarily set.

The degree of ink repellency after the plasma treatment is preferably such that the contact angle measured with pure water is 110 ° or more. If the contact angle is less than 110 °, color mixing is likely to occur, and a large amount of ink cannot be applied. As described above, if the partition walls 5 are made of a resin composition containing carbon black, the ink repellency of the surface of the partition walls 5 can be easily increased by one.
It is possible to make it 10 ° or more.

Further, regarding the ink-philicity of the surface of the transparent substrate 1, the contact angle measured with pure water is preferably 20 ° or less. By setting the contact angle with pure water to 20 ° or less, the ink easily spreads well on the surface of the transparent substrate 1.

Further, the flatness of the colored portion 7 can be further improved by performing the dry etching process and the plasma process. The reason is that a step (h) described later
When the surface roughness of the surface of the partition 5 is large (coarse) during drying and curing of the ink 6 in the above, the contact area between the ink 6 and the partition 5 is large, so that the contact state can be easily maintained. As a result, the contact portion between the partition wall 5 and the colored portion 7 is increased, and the colored portion 7 is easily flattened.

For these reasons, it is desirable that the surface of the partition wall 5 has an average roughness (Ra) of 3 nm or more. On the other hand, if the average roughness (Ra) exceeds 50 nm, the linearity of the pattern is affected, and the size of the opening is varied, so that the aperture ratio cannot be increased. Therefore,
The average roughness (Ra) of the surface of the partition 5 is 3 nm to 50 n
When m is desirably set to 4 nm to 20 nm, white spots are prevented without affecting the pattern shape of the partition walls 5 and the surface of the colored portion is flattened.

Further, after this step, a process for improving the ink spreading property of the opening 4 may be performed so as not to deteriorate the ink repellency of the surface of the partition 5. Thus, even when a small amount of ink is applied, the ink sufficiently spreads to the opening. As an example of the ink spreading property improving process, there is a method in which the plasma-treated transparent substrate 1 is brought into contact with water. At this time, the ink repellency of the partition walls 5 does not decrease.

Step (g) Using an ink jet recording apparatus, R, G, and B inks 6 are applied to an area (opening 4) surrounded by the partition 5 from an ink jet head (not shown). As the ink jet, a bubble jet type using an electrothermal converter as an energy generating element, a piezo jet type using a piezoelectric element, or the like can be used. In addition, ink 6
It is preferable that at least a colorant, a curing component, and a solvent of each color are formed so as to form R, G, and B colored portions after curing. Hereinafter, the composition of the ink used in the present invention will be described in more detail.

[1] Colorant As the colorant to be contained in the ink in the present invention, both a dye and a pigment can be used. When a pigment is used, it is necessary to disperse the pigment uniformly in the ink. A dye-based coloring agent is preferably used because it is necessary to separately add a dispersing agent and the ratio of the coloring agent in the total solid content becomes low. Further, the amount of the coloring agent to be added is preferably equal to or less than the amount of the curing component described later.

[2] Curing component In consideration of the process resistance, reliability, and the like in the post-process, a component that cures by a treatment such as heat treatment or light irradiation and fixes the colorant, ie, a crosslinkable monomer or polymer, etc. It is preferable to contain components. In particular, in consideration of heat resistance, water resistance, and the like in a later step, it is preferable to use a curable resin composition. Specifically, for example, as a base resin, an acrylic resin or a silicone resin having a substituent such as a hydroxyl group, a carboxyl group, an alkoxy group, or an amide group; or a cellulose derivative such as hydroxypropyl cellulose, hydroxyethyl cellulose, methyl cellulose, carboxymethyl cellulose or Modified products thereof; and vinyl polymers such as polyvinylpyrrolidone, polyvinyl alcohol, and polyvinyl acetal. Further, a crosslinking agent and a photoinitiator for curing these base resins by light irradiation or heat treatment can be used. Specifically, melamine derivatives such as methylolated melamine are used as crosslinking agents, and dichromates, bisazide compounds, radical initiators, cationic initiators, anionic initiators, etc. are used as photoinitiators. It is possible. Further, these photoinitiators can be used as a mixture of plural kinds thereof or in combination with other sensitizers.

[3] Solvent As the ink medium used in the present invention, a mixed solvent of water and an organic solvent is preferably used. As the water, it is preferable to use ion-exchanged water (deionized water) instead of general water containing various ions.

Examples of the organic solvent include those having 1 carbon atom such as methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, sec-butyl alcohol and tert-butyl alcohol.
To 4 alkyl alcohols; dimethylformamide,
Amides such as dimethylacetamide; ketones or keto alcohols such as acetone and diacetone alcohol;
Ethers such as tetrahydrofuran and dioxane; polyalkylene glycols such as polyethylene glycol and polypropylene glycol; alkylene groups such as ethylene glycol, propylene glycol, butylene glycol, triethylene glycol, thiodiglycol, hexylene glycol and diethylene glycol having 2 to 4 Glycerins; lower alkyl ethers of polyhydric alcohols such as ethylene glycol monomethyl ether, diethylene glycol methyl ether, and triethylene glycol monomethyl ether; N-methyl-2-pyrrolidone, 2-pyrrolidone, etc. It is preferable to select from the following.

In addition to the above components, two or more kinds of organic solvents having different boiling points may be used in combination to form an ink having desired physical properties, if necessary. Preservatives and the like may be added.

Step (h) The colored portion 7 is formed by performing necessary processing such as heat treatment and light irradiation, and removing and curing the solvent component in the ink 6. At this time, if the cross-sectional shape of the partition wall 5 satisfies the above-described condition of the partition wall 5 in (b-1) of FIG. 4, the colored portion 7 with good flatness can be obtained.

Further, if necessary, a protective layer and a transparent conductive film are formed to obtain the color filter of the present invention. As the protective layer, a resin material of a photo-curing type, a thermosetting type, or a curable type combined with light and heat, or an inorganic film formed by vapor deposition, sputtering, or the like can be used. Any material can be used as long as it can withstand the subsequent transparent conductive film forming process, alignment film forming process, and the like. Further, the transparent conductive film may be formed directly on the colored portion without using the protective layer.

[0071]

EXAMPLES (Example 1) [Formation of black matrix (partition)] 360 mm × 4
65mm size glass substrate (Corning “173”
7 "), a black resist containing carbon black (" CK-S171 resist "manufactured by FUJIFILM Aurin) was applied using a spinner, and heated and dried (prebaked) on a hot plate at 110 ° C for 2 minutes. . Thereafter, exposure (Dee) through a predetermined photomask
p-UV, exposure amount 200 mJ / cm ² ) and development were performed to obtain a black matrix pattern. As a developing solution, a 10% diluting solution of "CD" manufactured by Fujifilm Aurin was used, and shower development was performed for 110 seconds.

[0072] The formed surface of the black matrix pattern of the glass substrate and the surface, the surface and the back surface of the glass ^{substrate, 1600mJ / cm 2, 2000mJ /} cm 2, 2
^{200mJ / cm 2, 2400mJ / cm} 2, 3200m
Five samples which were subjected to an overall exposure process at J / cm ² were prepared.
The temperature on the glass substrate during light irradiation was all 25 ° C.
Thereafter, heat curing was performed in an oven at 230 ° C. for 60 minutes to form a black matrix having a rectangular opening of 75 μm × 225 μm.

[0073] using a KEYENCE made ultra deep surface shape measuring microscope "VK-8510", was measured L _1, L _2, T ₈₀ of the black matrix pattern, after development,
L ₁ = 22.50 μm, L ₂ = 23.10 μm, T ₈₀ =
1.87 μm, and (L ₂ −L ₁ ) /2=0.30 μm
Met.

The post-baked black matrix is a black matrix having a light irradiation amount of 1600 mJ / cm ² , L ₁ = 19.10 μm and L ₂ = 22.50 μm.
m, T _{8 0} = 1.70μm _{next, (L 2 -L 1) /} 2 =
1.70 μm, black matrix of 2000 mJ / cm ² , L ₁ = 20.31 μm, L ₂ = 22.53 μm,
T ₈₀ = 1.70 μm, (L ₂ −L ₁ ) /2=1.11 μ
m, 2200 mJ / cm ² , L ₁
= 20.82 μm, L ₂ = 22.52 μm, T ₈₀ = 1.
A black matrix of 70 μm, (L ₂ −L ₁ ) /2=0.85 μm 2400 mJ / cm ² has L ₁ = 2
1.00 μm, L ₂ = 22.56 μm, T ₈₀ = 1.69
μm, (L ₂ −L ₁ ) /2=0.78 μm, 3200 mJ
/ Cm ² , L ₁ = 21.30 μm
m, L ₂ = 22.55 μm, T ₈₀ = 1.69 μm, (L ₂
−L ₁ ) /2=0.625 μm.

[Preparation of Ink] R, G, and B inks were prepared with the following compositions using an acrylic copolymer having the following composition as a thermosetting component. Curing component Methyl methacrylate 50 parts by weight Hydroxyethyl methacrylate 30 parts by weight N-methylol acrylamide 20 parts by weight

R ink C.I. I. Acid Orange 148 3.5 parts by weight C.I. I. Acid Red 289 0.5 parts by weight Diethylene glycol 30 parts by weight Ethylene glycol 20 parts by weight Deionized water 40 parts by weight 6 parts by weight of the above curing component

G ink C.I. I. Acid Yellow 23 2 parts by weight Zinc phthalocyanine sulfonamide 2 parts by weight Diethylene glycol 30 parts by weight Ethylene glycol 20 parts by weight Deionized water 40 parts by weight 6 parts by weight of the above curing component

B ink C.I. I. Direct Blue 199 4 parts by weight Diethylene glycol 30 parts by weight Ethylene glycol 20 parts by weight Deionized water 40 parts by weight 6 parts by weight of the above curing component

[Dry Etching Treatment] The glass substrate (black matrix substrate) on which the black matrix was formed was subjected to plasma etching using the cathode coupling type parallel plate type plasma treatment apparatus under the following conditions to perform dry etching treatment. Was given.

Gas used: O ₂ gas flow rate: 80 sccm Pressure: 8 Pa RF power: 150 W Processing time: 30 sec

[Plasma Treatment] After the completion of the dry etching treatment, a plasma treatment was performed on the black matrix substrate in the same apparatus under the following conditions.

Gas used: CF ₄ gas flow rate: 80 sccm Pressure: 50 Pa RF power: 150 W Processing time: 30 sec

[Evaluation of Ink Repellency] Using a liquid crystal glass cleaning / processing inspection apparatus “LCD-400S” manufactured by Kyowa Interface Co., Ltd., the contact angle of the black matrix substrate after the above plasma treatment to pure water was measured. With respect to the surface of the black matrix, the measurement was performed on a frame having a width of 5 mm provided around the fine pattern. On the surface of the glass substrate, the measurement was performed at a portion outside the frame, where the black matrix was not provided. The contact angle with respect to each pure water was 5 ° on the glass substrate surface and 128 ° on the black matrix surface.

[Evaluation of Surface Roughness] The surface roughness of the black matrix was evaluated using a stylus type surface roughness meter “FP-20” manufactured by Tecnor Co., Ltd.
The average roughness (Ra) was measured on a mm frame. As a result, the average roughness (Ra) of the black matrix surface was 1
0.3 nm.

[Ink Spreading Improvement Processing] The ink spreading property improving processing was performed on the black matrix substrate after the plasma processing. The black matrix substrate was immersed in an ultrasonic pure water bath. The processing conditions were as follows.

Pure water temperature: 54 ° C. Ultrasonic frequency: 40 kHz Processing time: 5 min

[Evaluation of Ink Repellency] In order to confirm whether or not the ink repellency on the surface of the black matrix has been impaired by the ink spreading property improving process, the black matrix substrate after the ink spreading property was treated with pure water. The contact angle was measured. The measurement location was the same as the location measured before the ink spreading property improvement processing. The contact angle with respect to each pure water was 7 ° on the glass substrate surface and 124 ° on the black matrix surface. In order to evaluate the ink spreading property of the black matrix substrate after the plasma treatment, the ink was applied to the opening in the 20 pl fine pattern from the ink head and observed with an optical microscope. It was difficult to find the edge of the droplet spreading wet.

[Preparation of Colored Portion] Using an ink jet recording apparatus equipped with an ink jet head of a discharge amount of 20 pl, the above R, G, B inks were applied to the opening 1 of a black matrix substrate which had been subjected to an ink spreading property improving process. The amount was changed every 100 pl in the range of 200 to 800 pl per piece. Next, a heat treatment was performed at 90 ° C. for 10 minutes and then at 230 ° C. for 30 minutes to dry and cure the ink to form colored portions, thereby producing seven types of color filters having different amounts of applied ink.

[Evaluation of Flatness of Colored Part Surface] In all the color filters, there was no color filter in which flatness such as white spots was significantly impaired.

The flatness was evaluated by using the above laser microscope for a color filter to which 300 pl of ink was applied per opening.

FIG. 7 is a diagram showing the state of flatness evaluation in this example. In the figure, 71 is a glass substrate, 72 is a black matrix, 73 is a colored portion, and 74 is an effective area of the colored portion. FIG. 7A is a schematic plan view of the colored portion as viewed from above, and FIG. 7B is a schematic sectional view of the colored portion.

As shown in FIG. 7, the effective area 74 is a colored area.
73, and its area is in the plane shape of (a).
And occupies 80% of the colored portion 73. Evaluation of flatness
Is the thickness d of the colored portion at the center of the colored portion 73_cWhen,
The thickness d of the colored portion at the periphery of the effective region 74_eDifference with
(D_c-D_e) Was measured. Evaluation is -0.5 μm
≤ (d_c-D_e) ≦ 0.5 μm, flat (d)_c−
d_e) <−0.5 μm, concave shape, (d_c-D_e)>
If it was 0.5 μm, the shape was convex. As a result, black
In the photo-curing process of the matrix pattern,
1600mJ / cm^Two, 2000mJ / cm^TwoThe color
The filter is (d_c-D_e) Is 0.5 μm or less and the flatness is good
It was good. Also, at this time, the colored part is partially
Was in contact with Light irradiation amount is 2200mJ / cm^Two, 24
00mJ / cm^Two, 3200mJ / cm ^TwoColor fill
Is (d_c-D_e) Is very good flatness of 0.3 μm or less
Gender.

(Example 2) The developing time was set to 102 seconds.
From the front and back surfaces of the glass substrate obtained after development, 24
A color filter was prepared in the same manner as in Example 1 except that the entire surface was exposed at 00 mJ / cm ² .

L of the black matrix pattern after development
₁, L_Two, T₈₀Was measured, L ₁= 22.40μ
m, L_Two= 23.50 μm, T₈₀= 1.87 μm
(L_Two-L₁) /2=0.55 μm. Also,
The black matrix after post-baking is L₁= 20.
80 μm, L_Two= 22.70 μm, T₈₀= 1.72 μm
And (L_Two-L₁) /2=0.95 μm.

In all the obtained color filters,
There was no color filter with markedly impaired flatness such as white spots. When the flatness of the colored portion of the color filter to which 300 pl of ink was applied per one opening was measured, the colored portion was flat.

Example 3 Exposure (Deep UV, exposure amount 200 mJ / cm ² ) through a predetermined photomask and shower development for 110 seconds using a 10% diluent of Fujifilm Aurin “CD” A color filter was produced in the same manner as in Example 1 except that the glass substrate obtained after the development was passed through a UV cleaning apparatus using a low-pressure mercury lamp for 1 minute. Similarly, a color filter passed through a UV cleaning device for 5 minutes was also produced. In the UV cleaning device, the temperature of the glass substrate was 60 ° C. for 1 minute and 110 ° C. for 5 minutes.

L of black matrix after post-baking
₁ , L ₂ and T ₈₀ were measured, and when UV irradiation was 1 minute,
L ₁ = 21.28 μm, L ₂ = 22.60 μm, T ₈₀ =
1.69 μm, and (L ₂ −L ₁ ) /2=0.66 μm.

When UV irradiation is performed for 5 minutes, L ₁ = 2
1.00 μm, L ₂ = 22.55 μm, T ₈₀ = 1.69
μm, (L ₂ −L ₁ ) /2=0.775 μm.

In all of the obtained color filters, there was no color filter with markedly impaired flatness such as white spots. When the flatness of the colored portion of the color filter to which 300 pl of ink was applied per one opening was measured, it was 0.3 μm or less, which was very good.

Example 4 A black resist containing carbon black (“V-259BKIS resist” manufactured by Nippon Steel Chemical Co., Ltd.) was coated on a 360 mm × 465 mm glass substrate (“1737” manufactured by Corning) using a spinner. After applying, heat treatment is performed for 2 minutes on a hot plate at 90 ° C., and then exposure (De) is performed through a predetermined photomask.
ep-UV, exposure amount 800 mJ / cm ² ) and development. As a developing solution, a 10% diluting solution of "V-2401ID" manufactured by Nippon Steel Chemical Co., Ltd. was used, and shower development was performed for 60 seconds.

From the front and back surfaces of the obtained glass substrate,
We were prepared two samples were overall exposed treated with ^{800mJ / cm 2, 1600mJ / cm} 2. The temperature on the glass substrate during light irradiation was 25 ° C. in both cases. After that, a heat curing treatment is performed for 30 minutes in an oven at 220 ° C.
A black matrix having a rectangular opening of μm was formed.

Thereafter, a color filter was manufactured in the same manner as in Example 1.

After the development, the black matrix pattern
L₁, L_Two, T₈₀Was measured, L₁= 21.20μ
m, L_Two= 22.11 μm, T = 1.85 μm,
(L_Two-L ₁) /2=0.455 μm.

Also, the black matrix after post-baking is used.
The light irradiation amount is 800 mJ / cm ^TwoIs L₁= 1
8.40 μm, L_Two= 21.41 μm, T₈₀= 1.69
μm, (L_Two-L₁) /2=1.505 μm, light irradiation amount
1600mJ / cm^TwoIs L₁= 20.10 μm,
L_Two= 21.41 μm, T₈₀= 1.69 μm, (L_Two-L
₁) /2=0.655 μm.

The average roughness (Ra) of the black matrix surface after the plasma treatment was 4.4 nm, and the contact angle of the black matrix substrate with pure water after the ink spreading property improvement treatment was: glass substrate surface: 4 ° Black matrix surface: 125 °.

In all of the obtained color filters, there was no color filter with markedly impaired flatness such as white spots. When the flatness of the colored portion was measured for a color filter to which 300 pl of ink was applied per one opening, the flatness was 0.5 μm or less at 800 mJ / cm ² . At this time, the colored portion was partially in contact with the side wall of the partition. 0.3 μm at 1600 mJ / cm ²
Very good flatness below. At this time, the colored portion was entirely in contact with the side wall of the partition.

(Example 5) A polyethylene terephthalate temporary support, a thermoplastic resin layer having the following formulation, an intermediate layer having the following formulation, and carbon black were provided on a glass substrate (manufactured by Corning "1737") having a size of 360 mm x 465 mm. A film resist composed of a photocurable resin to be bonded was pressed and heated (130 ° C.) using a laminator and bonded.

[Thermoplastic resin layer] Methyl methacrylate / 2-ethylhexyl acrylate / benzyl methacrylate / methacrylic acid copolymer (copolymer composition ratio (molar ratio) = 55 / 11.7 / 14.5 / 28. 8, weight average molecular weight = 80000) 15 parts by weight "BPE-500" manufactured by Shin-Nakamura Chemical Co., Ltd. 7 parts by weight Fluorinated surfactant, "F177P" manufactured by Dainippon Ink Co., Ltd. 0.26 parts by weight Methyl ethyl ketone 18.6 parts by weight methanol 30.6 parts by weight 1-methoxy-2-propanol 9.3 parts by weight

[Intermediate layer] Polyvinyl alcohol 13 parts by weight Polyvinyl pyrrolidone 6 parts by weight Methanol 173 parts by weight Water 211.4 parts by weight

Subsequently, the temporary support was peeled off at the interface between the temporary support and the thermoplastic resin layer, and the temporary support was removed. Next, exposure is performed through a predetermined photomask (Deep UV, exposure amount 300 mJ).
/ Cm ² ), followed by development. In the development, first, the intermediate layer was removed with a 1% solution of triethanolamine, and then shower development was performed for 25 seconds using a 10% diluted solution of “CD” manufactured by Fujifilm Aurin. Thereafter, the formed image surface was rubbed with a nylon fiber roll brush in a developing residual film removing liquid, and then washed with water.

From the front and back surfaces of the obtained glass substrate,
Two samples were prepared which were subjected to an overall exposure process at 1600 mJ / cm ² and 2400 mJ / cm ² . The temperature on the glass substrate during light irradiation was 25 ° C. in both cases. After that, heat curing treatment was performed for 60 minutes on a hot plate at 220 ° C., and 75 μm
A black matrix having a rectangular opening of × 225 μm was formed.

Thereafter, a color filter was manufactured in the same manner as in Example 1.

L of black matrix pattern after development
₁, L_Two, T₈₀Was measured, L ₁= 22.30μ
m, L_Two= 23.10 μm, T₈₀= 1.90 μm
(L_Two-L₁) /2=0.40 μm. Also,
The post-baked black matrix has a light irradiation amount of 1
600mJ / cm^TwoOf the black matrix is L₁= 1
9.50 μm, L_Two= 22.80 μm, T₈₀= 1.72
μm, (L_Two-L₁) /2=1.65 μm, 2400 mJ
/ Cm^TwoOf the black matrix is L₁= 21.36μ
m, L_Two= 22.81 μm, T₈₀= 1.72 μm, (L_Two
-L₁) /2=0.725 μm.

The average roughness (Ra) of the black matrix surface after the plasma treatment was 8.5 nm, and the contact angle of the black matrix substrate with pure water after the ink spreading property improvement treatment was: glass substrate surface: 4 ° Black matrix surface: 125 °.

In all of the obtained color filters, there was no color filter with markedly impaired flatness such as white spots. When the flatness of the colored portion was measured for a color filter to which 300 pl of ink was applied per one opening, the flatness was 0.5 μm or less at 1600 mJ / cm ² . At this time, the colored portion was partially in contact with the side wall of the partition. 0.3μ at 2400mJ / cm ²
m and very good flatness. At this time, the colored portion was entirely in contact with the side wall of the partition.

Comparative Example 1 A color filter was produced in the same manner as in Example 1 except that no light irradiation treatment was performed after the development of the black matrix pattern. As a result, wrinkles were generated in a part of the black matrix.

(Comparative Example 2) After development of the black matrix pattern, 1200 m from the front and back surfaces of the glass substrate
A color filter was produced in the same manner as in Example 1 except that the entire surface was exposed at J / cm ² .

L of black matrix after post-baking
₁, L_Two, T₈₀Was measured, L ₁= 17.61μ
m, L_Two= 22.55 μm, T₈₀= 1.70 μm
(L_Two-L₁) /2=2.47 μm. Obtained
In all the color filters, white spots occurred.

Comparative Example 3 A color filter was manufactured in the same manner as in Example 2 except that the developing time was changed to 96 seconds.

L of the black matrix pattern after development
₁, L_Two, T₈₀Was measured, L ₁= 20.70μ
m, L_Two= 24.70 μm, T₈₀= 1.87 μm
(L_Two-L₁) /2=2.00 μm. Also,
The black matrix after post-baking is L₁= 19.
80 μm, L_Two= 23.80 μm, T₈₀= 1.72 μm
And (L_Two-L₁) /2=2.00 μm. Profit
White spots have occurred on all the color filters
Was.

Comparative Example 4 A color filter was produced in the same manner as in Example 3 except that the black matrix pattern substrate after development was passed through a UV cleaning apparatus using a low-pressure mercury lamp for 7 minutes. At this time, the temperature of the glass substrate was 160 ° C. in the UV cleaning device. Thereafter, when a heat curing treatment was performed in an oven at 230 ° C. for 60 minutes, wrinkles occurred in a part of the black matrix.

(Comparative Example 5) A color filter was produced in the same manner as in Example 4 except that the light irradiation treatment was not performed on the developed black matrix pattern. As a result, wrinkles were generated in a part of the black matrix.

(Comparative Example 6) After the black matrix pattern was developed, 200 mJ was measured from the front and back surfaces of the glass substrate.
A color filter was produced in the same manner as in Example 4 except that the entire surface was exposed at / cm ² .

L of black matrix after post-baking
₁, L_Two, T₈₀Was measured, L ₁= 17.50μ
m, L_Two= 21.40 μm, T₈₀= 1.68 μm
(L_Two-L₁) /2=1.95 μm. Obtained
In all the color filters, white spots occurred.

Comparative Example 7 A color filter was produced in the same manner as in Example 5, except that the black matrix pattern after development was not irradiated with light.

L of black matrix after post-baking
₁, L_Two, T₈₀Was measured, L ₁= 16.10μ
m, L_Two= 22.79 μm, T₈₀= 1.730 μm
(L _Two-L₁) /2=3.345 μm. Get
White spots occurred in all of the color filters that were obtained.

The results of the above Examples and Comparative Examples are shown in Table 1 below.

[0128]

[Table 1]

[0129]

As described above, according to the present invention,
A color filter having good flatness and a colored portion without white spots and color mixture can be manufactured with a high yield by a simple process using an inkjet method. This makes it possible to provide a color filter having no color unevenness in the colored portion and the color filter at a lower cost, and to provide a liquid crystal element having excellent color display characteristics at a lower cost using the color filter. it can.

[Brief description of the drawings]

FIG. 1 is a process chart of one embodiment of a method for manufacturing a color filter of the present invention.

FIG. 2 is a process chart of one embodiment of a method for manufacturing a color filter of the present invention.

FIG. 3 is an explanatory view of a sectional shape of a partition wall according to the present invention.

FIG. 4 is an explanatory diagram showing a relationship between a cross-sectional shape of a partition wall and a shape of a colored portion according to the present invention.

FIG. 5 is a schematic sectional view of an embodiment of the color filter of the present invention.

FIG. 6 is a schematic sectional view of one embodiment of the liquid crystal element of the present invention.

FIG. 7 is an explanatory diagram of a method for evaluating the flatness of a colored portion in the example of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transparent substrate 2 Photosensitive resin composition layer 3 Partition pattern 4 Opening 5 Partition 6 Ink 7 Coloring part 51 Transparent substrate 52 Black matrix 53 Coloring part 54 Protective layer 57 Common electrode 58, 63 Alignment film 59 Liquid crystal 61 Counter substrate 62 Pixel Electrode 71 Transparent substrate 72 Black matrix 73 Colored part 74 Effective area

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shoji Shiba 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Ken Okada 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon (72) Inventor Hiroshi Taniuchi 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Noboru Kunimine 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. F-term (reference) 2C056 EA24 FA03 FB01 2H048 BA11 BA43 BA45 BA48 BA60 BA64 BB01 BB23 BB37 BB44 2H091 FA02Y FA35Y FB04 FC12 FC23 FC26 FC27 FD04 LA12 LA15 2H096 AA30 BA06 HA01 HA03

Claims (19)

[Claims] 1. A color filter having at least a plurality of colored portions on a transparent substrate and a partition located between adjacent colored portions, wherein the colored portion is formed of a resin composition formed on the transparent substrate. The ink applied by an inkjet method is cured in the opening of the partition wall, and the line width of the partition wall at a height of 80% of the maximum thickness of the partition wall is L ₁ in the cross section in the thickness direction of the partition wall. The line width of the partition in contact with the transparent substrate is L ₂ , and 80% of the maximum thickness of the partition is T
A color filter characterized by satisfying the following expression (1) when it is ₈₀ . | L ₂ −L ₁ | / 2 ≦ T ₈₀ (1) 2. The color filter according to claim 1, wherein in the colored portion, the entire peripheral portion is at least partially in contact with the side surface of the adjacent partition wall. 3. The color filter according to claim 2, wherein the partition satisfies the following expression (2), and in each colored portion, the entire peripheral portion is in contact with the side surface of the adjacent partition. | L ₂ −L ₁ | ≦ T ₈₀ (2) 4. The color filter according to claim 1, wherein said partition is a light-shielding layer. 5. The method according to claim 1, wherein a protective layer is provided on the colored portion.
5. The color filter according to any one of items 1 to 4. 6. A transparent conductive film on the surface.
The color filter according to any one of the above. 7. The method for producing a color filter according to claim 1, wherein a photosensitive resin composition layer is formed on a transparent substrate, and pattern exposure and development are performed to form a partition pattern. A step of irradiating the pattern with light and curing, applying a heat treatment to the light-cured partition wall pattern, fully curing it, and forming a partition wall, and applying ink to an area surrounded by the above-described partition wall by an inkjet method. Forming a pixel by using a color filter. 8. The method for manufacturing a color filter according to claim 7, wherein in the step of photo-curing the partition pattern, light is irradiated from at least the side of the transparent substrate on which the partition pattern is formed. 9. The method for producing a color filter according to claim 7, wherein an amount of light irradiation in the photo-curing step of the partition pattern is larger than an amount of exposure at the time of pattern exposure of the photosensitive resin composition layer. 10. The transparent substrate temperature in the step of photo-curing the partition pattern is controlled to less than 160 ° C.
The method for producing a color filter according to any one of the above. 11. A plasma treatment in which a gas containing at least a fluorine atom is introduced and plasma irradiation is performed on the partition walls prior to the step of forming a colored portion.
0. The method for producing a color filter according to any one of the above items. 12. The gas introduced in the plasma processing is C
The halogen gas is at least one selected from the group consisting of F ₄ , CHF ₃ , C ₂ F ₆ , SF ₆ , C ₃ F ₈ , and C ₅ F _8.
2. The method for producing a color filter according to 1. 13. The gas introduced in the plasma processing is C
F_Four, SF₆, CHF _Three, C_TwoF₆, C_ThreeF₈, C_FiveF₈Choose from
At least one selected halogen gas and O_TwoWith gas
The color filter according to claim 11, which is a mixed gas.
Construction method. 14. Prior to the plasma treatment, oxygen,
The method for producing a color filter according to any one of claims 11 to 13, wherein the partition is subjected to dry etching treatment in which plasma irradiation is performed in an atmosphere of at least one kind of gas selected from argon and helium. 15. The method for producing a color filter according to claim 11, wherein the surface of the partition wall after the plasma treatment is treated to have a surface roughness (Ra) of 3 nm to 50 nm. 16. The treatment is performed so that the contact angle of the partition wall surface after the plasma treatment with pure water is 90 ° or more and the contact angle of the transparent substrate surface with pure water is 20 ° or less.
16. The method for producing a color filter according to any one of the above items 15. 17. The method for producing a color filter according to claim 7, wherein the partition walls are formed of a black resin composition. 18. The method according to claim 7, wherein the ink contains at least a coloring agent, a curing component, water, and an organic solvent. 19. A liquid crystal sandwiched between a pair of substrates,
A liquid crystal device, wherein one of the substrates is formed using the color filter according to claim 1.