WO2010134550A1 - Method for manufacturing optical elements - Google Patents
Method for manufacturing optical elements Download PDFInfo
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- WO2010134550A1 WO2010134550A1 PCT/JP2010/058463 JP2010058463W WO2010134550A1 WO 2010134550 A1 WO2010134550 A1 WO 2010134550A1 JP 2010058463 W JP2010058463 W JP 2010058463W WO 2010134550 A1 WO2010134550 A1 WO 2010134550A1
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- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
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- 125000005520 diaryliodonium group Chemical group 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
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- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000000717 hydrazino group Chemical group [H]N([*])N([H])[H] 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
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- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001228 polyisocyanate Chemical class 0.000 description 1
- 239000005056 polyisocyanate Chemical class 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000001057 purple pigment Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
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- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003396 thiol group Chemical class [H]S* 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
- B29D11/00298—Producing lens arrays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00634—Production of filters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/09—Ink jet technology used for manufacturing optical filters
Definitions
- the photopolymerization initiator contained in the negative photosensitive resin composition is not particularly limited as long as it is a compound having a function as a photopolymerization initiator, but comprises a compound that generates radicals by light. Is preferred. Specific examples include ⁇ -diketones, acyloins, acyloin ethers, thioxanthones, acetophenones, quinones, benzophenones, aminobenzoic acids, halogen compounds, peroxides, and oxime esters.
- the polymer used as the ink repellent agent preferably has at least one acidic group selected from the group consisting of an acidic group, for example, a carboxyl group, a phenolic hydroxyl group, and a sulfonic acid group.
- an acidic group for example, a carboxyl group, a phenolic hydroxyl group, and a sulfonic acid group.
- the acid value of the polymer is preferably 10 to 400 mgKOH / g, more preferably 20 to 300 mgKOH / g.
- JP-A 2005-315984 describes the above-mentioned polymer having a fluoroalkyl group and silicone.
- JP-A 2005-300759 discloses an ink repellent agent combined with a polymer having a chain.
- the photosensitive resin composition used in the production method of the present invention includes, as appropriate, for each type of the photosensitive resin composition, in addition to the various components described above. Radical crosslinking agent and thermal crosslinking agent to increase the crosslinking density of the cured film, silane coupling agent to obtain substrate adhesion, curing accelerator, thickener, plasticizer, antifoaming agent, leveling agent, A repellency inhibitor, an ultraviolet absorber and the like can be blended.
- hexamethylol melamine and alkyl etherified hexamethylol melamine (hexamethoxymethyl melamine, butyl etherified hexamethylol melamine, etc.), partially methylolated melamine and its alkyl etherated product, tetramethylol benzoguanamine and alkyl etherified tetramethylol benzoguanamine A partially methylolated benzoguanamine and an alkyl etherated product thereof; and the like.
- C-2 An ink repellent agent or a coating liquid containing an ink repellent agent is applied onto a temporary support different from the support substrate, and dried as necessary to form a layer containing the ink repellent agent.
- the ink repellent agent or the coating liquid containing the ink repellent agent may or may not have photosensitivity. After laminating a support substrate on which a partition made of a resin composition is formed and a temporary support on which the layer containing the ink repellent agent is formed, the temporary support is peeled off to form an ink-repellent partition on the support substrate.
- the ink repellent agent used in this method can be the same ink repellent agent as used in the method (A).
- a method disclosed in Japanese Patent Application Laid-Open No. 2008-139378 is given as a more specific example of the method C-2.
- Such a value of H1 ((2) height of the partition wall after the first heating step) may be appropriately set in consideration of the type of device in which the partition wall is used, the formability of the partition wall, and the like.
- the value of H1 is generally in the range of 0.2 to 15 ⁇ m, the preferred range is 0.4 to 8 ⁇ m, the particularly preferred range is 2 to 6 ⁇ m, and the most preferred range is 2.3 to 4.5 ⁇ m. is there.
- the partition wall after the above (2) first heating step has sufficient solvent resistance, ensures sufficient ink repellency on the upper surface, and has a high film thickness and the parent of the region other than the upper layer on the side surface.
- the ink property is ensured, and it is possible to form a uniform ink layer without causing problems such as ink color mixing due to overflow in ink injection by the ink jet method.
- a portion where the ink layer is formed on the main surface of the support substrate may be subjected to an ink affinity treatment as necessary.
- the ink jet (IJ) step can be performed in the same manner as a normal method using an ink jet apparatus generally used in the ink jet method.
- the ink jet device used for forming such an ink layer is not particularly limited, but a method in which charged ink is continuously ejected and controlled by a magnetic field, and ink is ejected intermittently using a piezoelectric element.
- Ink jet apparatuses using various methods such as a method of heating and a method of heating ink and intermittently ejecting the ink by using the bubbling can be used.
- the partition wall made of a cured resin product has a width (average value) of preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less, depending on the type of optical element.
- the distance between adjacent partition walls, that is, the width (average value) of the openings (dots) is preferably 1000 ⁇ m or less, and more preferably 500 ⁇ m or less.
- the height of the partition wall, that is, the above-mentioned H2 (average value) is preferably 0.05 to 50 ⁇ m, more preferably 0.2 to 10 ⁇ m, and most preferably 0.5 to 5 ⁇ m.
- the uniformity of the pixel has the following value by the following evaluation method. That is, as shown in FIG. 2, the average film at the four portions (positions y1 to y4 shown in FIG. 2B) at the partition wall of the ink layer formed in the dots through the IJ process and the second heating process.
- the thickness (M) and the film thickness (N) at the center (position x in FIG. 2B) are measured, and the average film thickness (M) of the four portions at the partition wall relative to the film thickness (N) at the center.
- the percentage, that is, M / N ⁇ 100 is preferably 70 to 150, and more preferably 75 to 120.
- Copolymer 1 had a number average molecular weight of 25980 and a weight average molecular weight of 64,000.
- the number average molecular weight and the weight average molecular weight were measured by gel permeation chromatography using polystyrene as a standard substance.
- the number average molecular weight and the weight average molecular weight of each compound (polymer) are all measured by the same method.
- the fact that there is no overflow also contributes to increasing the degree of freedom in ink preparation. That is, as the ink applied to the opening, various types such as a composition and a solid content are selected depending on the type of the optical element. Therefore, even when an ink having a low solid content concentration is used, according to the manufacturing method of the present invention, an optical element can be manufactured without overflow of the ink.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Mechanical Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electroluminescent Light Sources (AREA)
- Materials For Photolithography (AREA)
- Optical Filters (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
しかしながら、特許文献1に示されるポスト露光工程の導入は、インク層均一性を向上させる点では有効であるものの、露光工程が増えることが生産性の低下に繋がるため、ポスト露光工程なしでインク層均一性を向上させることが求められていた。 On the other hand, in
However, although the introduction of the post-exposure process shown in Patent Document 1 is effective in improving the uniformity of the ink layer, an increase in the exposure process leads to a decrease in productivity. There was a need to improve uniformity.
本発明の光学素子の製造方法は、前記支持基板の主面上に、樹脂組成物からなり上部表面に撥インク性を有する隔壁を形成する工程と、前記隔壁を加熱して前記樹脂組成物の硬化を促進させる第1の加熱工程と、前記支持基板上の前記隔壁で仕切られた領域にインクジェット法によりインクを注入してインク層を形成する工程と、前記隔壁と前記インク層を加熱して画素を形成するとともに前記樹脂組成物の硬化を完了させる第2の加熱工程と、を順に有し、
前記隔膜形成工程の後の隔壁の高さをH0とし、前記第1の加熱工程後の隔壁の高さをH1とし、前記第2の加熱工程後の隔壁の高さをH2とした場合に、H0、H1およびH2の関係が、以下の関係にあることを特徴とする。
H0/H1で表される比が、1.05≦H0/H1≦1.18であり、
H1/H2で表される比が、1.02≦H1/H2≦1.30である。 A support substrate, a partition wall made of a cured resin formed on the main surface of the support substrate so as to partition the main surface into a plurality of compartments, and a region partitioned by the partition walls on the support substrate, respectively. In a method for manufacturing an optical element having a plurality of pixels,
The method for producing an optical element of the present invention includes a step of forming a partition made of a resin composition on the main surface of the support substrate and having ink repellency on the upper surface, and heating the partition to form the resin composition. A first heating step for promoting curing; a step of injecting ink into an area partitioned by the partition on the support substrate by an ink jet method to form an ink layer; and heating the partition and the ink layer. A second heating step for forming a pixel and completing the curing of the resin composition in order,
When the height of the partition wall after the diaphragm forming step is H0, the height of the partition wall after the first heating step is H1, and the height of the partition wall after the second heating step is H2. The relationship between H0, H1, and H2 is as follows.
The ratio represented by H0 / H1 is 1.05 ≦ H0 / H1 ≦ 1.18,
The ratio represented by H1 / H2 is 1.02 ≦ H1 / H2 ≦ 1.30.
本発明の製造方法が対象とする光学素子は、支持基板と、前記支持基板の主面上に該主面を複数の区画に仕切るように形成された樹脂硬化物からなる隔壁と、前記支持基板上の前記隔壁で仕切られた領域にそれぞれ形成された複数の画素とを有する光学素子である。
このような光学素子の製造において、本発明の製造方法は、以下の(1)~(4)の工程を順に有し、各工程後の隔壁の高さの関係について以下の特徴を有する製造方法である。 Embodiments of the present invention will be described below, but the present invention is not limited to the following embodiments.
The optical element targeted by the production method of the present invention includes a support substrate, a partition wall made of a cured resin formed on the main surface of the support substrate so as to partition the main surface into a plurality of sections, and the support substrate. It is an optical element having a plurality of pixels respectively formed in the region partitioned by the upper partition.
In the production of such an optical element, the production method of the present invention has the following steps (1) to (4) in order, and the production method having the following characteristics regarding the relationship between the heights of the partition walls after each step It is.
(2)前記隔壁を加熱して前記樹脂組成物の硬化を促進させる第1の加熱工程。なお、(2)第1の加熱工程後の隔壁の高さをH1とする。
(3)前記支持基板上の前記隔壁で仕切られた領域にインクジェット法によりインクを注入してインク層を形成する工程(以下、「インクジェット(IJ)工程」ということもある)。
(4)前記隔壁と前記インク層を加熱して前記インクを硬化させて画素を形成するとともに前記樹脂組成物の硬化を完了させる第2の加熱工程。なお、(4)第2の加熱工程後の隔壁の高さをH2とする。
[各工程後の隔壁の高さの関係]
H0/H1(すなわち、前記第1の加熱工程後の隔壁の高さに対する前記隔壁形成工程後の隔壁の高さの比)が、1.05≦H0/H1≦1.18であり、
H1/H2(すなわち、前記第2の加熱工程後の隔壁の高さに対する前記第1の加熱工程後の隔壁の高さの比)が、1.02≦H1/H2≦1.30である。 (1) A step of forming a partition made of a resin composition and having an ink repellency on the main surface of the support substrate (hereinafter also referred to as a “partition formation step”). Note that (1) the height of the partition wall after the partition wall forming step is H0.
(2) The 1st heating process which heats the said partition and accelerates | stimulates hardening of the said resin composition. Note that (2) the height of the partition wall after the first heating step is H1.
(3) A step of forming an ink layer by injecting ink into the region partitioned by the partition wall on the support substrate by an ink jet method (hereinafter also referred to as “ink jet (IJ) step”).
(4) A second heating step of heating the partition wall and the ink layer to cure the ink to form a pixel and complete the curing of the resin composition. Note that (4) the height of the partition wall after the second heating step is H2.
[Relationship of partition wall height after each process]
H0 / H1 (that is, the ratio of the partition wall height after the partition formation step to the partition wall height after the first heating step) is 1.05 ≦ H0 / H1 ≦ 1.18,
H1 / H2 (that is, the ratio of the height of the partition wall after the first heating step to the height of the partition wall after the second heating step) is 1.02 ≦ H1 / H2 ≦ 1.30.
本発明の製造方法において、支持基板の主面上に、樹脂組成物からなり上部表面に撥インク性を有する隔壁(以下、必要に応じて「撥インク性隔壁」という。)を形成する方法としては、支持基板の主面上に上記構成の隔壁、つまり撥インク性隔壁が得られる方法であれば特に制限されないが、具体的には、下記(A)~(D)の方法が挙げられる。 (1) Partition Formation Step In the production method of the present invention, a partition made of a resin composition and having an ink repellency on the main surface (hereinafter referred to as “ink-repellent partition” as necessary) is formed on the main surface of the support substrate. ) Is not particularly limited as long as the partition wall having the above-described structure, that is, the ink-repellent partition wall can be obtained on the main surface of the support substrate. Specifically, the following (A) to (D) The method is mentioned.
(B)支持基板の主面上に感光性樹脂組成物の層と撥インク剤を含む層とをこの順に形成し、フォトリソグラフィ法により撥インク性隔壁を形成する方法。
(C)フォトリソグラフィ法または印刷法により支持基板の主面上に、感光性樹脂組成物または熱硬化性樹脂組成物からなる隔壁を形成した後、隔壁の上部表面に撥インク性を付与することで撥インク性隔壁を形成する方法。
(D)支持基板の主面上に有機溶媒に可溶でアルカリ現像液に不溶な非感光性樹脂組成物、例えば、熱硬化性樹脂組成物の層と撥インク剤を含む感光性の層とをこの順に形成し、フォトリソグラフィ法、ついで有機溶媒によるエッチング処理により、撥インク性隔壁を得る方法。 (A) A method of forming a layer of a photosensitive resin composition containing an ink repellent agent on the main surface of a support substrate, and forming an ink repellent partition wall by a photolithography method.
(B) A method in which a layer of a photosensitive resin composition and a layer containing an ink repellent agent are formed in this order on the main surface of a support substrate, and an ink repellent partition is formed by a photolithography method.
(C) After forming a partition made of a photosensitive resin composition or a thermosetting resin composition on the main surface of the support substrate by a photolithography method or a printing method, ink repellency is imparted to the upper surface of the partition. A method of forming an ink-repellent partition wall with
(D) a non-photosensitive resin composition that is soluble in an organic solvent and insoluble in an alkali developer on the main surface of the support substrate, for example, a thermosetting resin composition layer and a photosensitive layer containing an ink repellent agent; Are formed in this order, and an ink-repellent partition wall is obtained by photolithography and then etching with an organic solvent.
(A)支持基板の主面上に撥インク剤を含む感光性樹脂組成物の層を形成し、フォトリソグラフィ法により撥インク性隔壁を形成する方法。 Hereinafter, the methods (A) to (D) will be described in detail.
(A) A method of forming a layer of a photosensitive resin composition containing an ink repellent agent on the main surface of a support substrate, and forming an ink repellent partition wall by a photolithography method.
本発明の製造方法に用いる支持基板としては、その材質は特に限定されるものではないが、通常、光学素子用の支持基板に用いられる材質、例えば、各種ガラス板;ポリエステル(ポリエチレンテレフタレート等)、ポリオレフィン(ポリエチレン、ポリプロピレン等)、ポリカーボネート、ポリメチルメタクリレート、ポリスルホン、ポリイミド、ポリ(メタ)アクリル樹脂等の熱可塑性プラスチックシート;エポキシ樹脂、不飽和ポリエステル等の熱硬化性プラスチックの硬化物からなるシート等を挙げることができる。また、あらかじめ上記基材にシリコンナイトライドやポリイミドなどの絶縁膜を形成させた基板を挙げることができる。特に、耐熱性の点からガラス板、ポリイミド等の耐熱性プラスチックが好ましい。 (Support substrate)
The material for the support substrate used in the production method of the present invention is not particularly limited. Usually, materials used for the support substrate for optical elements, such as various glass plates; polyester (polyethylene terephthalate, etc.), Thermoplastic plastic sheets such as polyolefin (polyethylene, polypropylene, etc.), polycarbonate, polymethyl methacrylate, polysulfone, polyimide, poly (meth) acrylic resin; sheets made of cured products of thermosetting plastics such as epoxy resin and unsaturated polyester Can be mentioned. Moreover, the board | substrate which formed the insulating film, such as a silicon nitride and a polyimide, in the said base material previously can be mentioned. In particular, a heat resistant plastic such as a glass plate or polyimide is preferable from the viewpoint of heat resistance.
(i)感光性樹脂組成物
上記感光性樹脂組成物は、ネガ型感光性樹脂組成物であっても、ポジ型感光性樹脂組成物であってもよい。ネガ型感光性樹脂組成物の場合、さらに硬化の種類により幾つかのタイプに分類され、例えばラジカル硬化型、酸硬化型等のタイプが挙げられる。ポジ型感光性樹脂組成物の場合、さらに幾つかのタイプに分類され、例えばo-ナフトキノンジアジドを含むタイプ、ブロック化された酸性基を含むタイプなどが挙げられる。
以下、感光性樹脂組成物について、ネガ型感光性樹脂組成物、ポジ型感光性樹脂組成物をタイプ別に好ましい態様を例示しながら説明するが、本発明の製造方法に用いる感光性樹脂組成物が、これらに限定されるものではない。 (Photosensitive resin composition containing ink repellent agent)
(I) Photosensitive resin composition The photosensitive resin composition may be a negative photosensitive resin composition or a positive photosensitive resin composition. In the case of a negative photosensitive resin composition, it is further classified into several types depending on the type of curing, and examples thereof include radical curable types and acid curable types. The positive photosensitive resin composition is further classified into several types, such as a type containing o-naphthoquinonediazide and a type containing a blocked acidic group.
Hereinafter, with respect to the photosensitive resin composition, the negative photosensitive resin composition and the positive photosensitive resin composition will be described by exemplifying preferable modes according to types, but the photosensitive resin composition used in the production method of the present invention is described below. However, it is not limited to these.
なお、このようなネガ型感光性樹脂組成物(ラジカル硬化型)の具体例としては、特開平8-278629、特開2000-1522、特開2002-40650、特開2002-83688、WO2008-133312に開示されているネガ型感光性樹脂組成物(ラジカル硬化型)が挙げられる。 The negative photosensitive resin composition (radical curable type) includes at least a radically polymerizable binder resin and a photopolymerization initiator and, if necessary, other components such as a crosslinking agent. A conventionally known negative photosensitive resin composition (radical curable type) can be used for forming the partition wall.
Specific examples of such a negative photosensitive resin composition (radical curable type) include JP-A-8-278629, JP-A-2000-1522, JP-A-2002-40650, JP-A-2002-83688, and WO2008-133331. Negative photosensitive resin composition (radical curable type) disclosed in JP
本発明の製造方法に用いるネガ型感光性樹脂組成物(ラジカル硬化型)における上記光重合開始剤の配合割合は、用いる光学素子の種類や用途にもよるが、上記光ラジカル重合性のバインダー樹脂に対して、2~40質量%とすることが好ましく、5~20質量%とすることがより好ましい。このような範囲であると、感光性組成物の硬化性および現像性が良好となる。 The photopolymerization initiator contained in the negative photosensitive resin composition (radical curable type) is not particularly limited as long as it is a compound having a function as a photopolymerization initiator, but comprises a compound that generates radicals by light. Is preferred. Specific examples include α-diketones, acyloins, acyloin ethers, thioxanthones, acetophenones, quinones, benzophenones, aminobenzoic acids, halogen compounds, peroxides, and oxime esters.
The blending ratio of the photopolymerization initiator in the negative photosensitive resin composition (radical curable type) used in the production method of the present invention depends on the type and use of the optical element used, but the photoradical polymerizable binder resin. The content is preferably 2 to 40% by mass, and more preferably 5 to 20% by mass. Within such a range, the curability and developability of the photosensitive composition will be good.
本発明の製造方法に用いるネガ型感光性樹脂組成物(酸硬化型)における上記アルカリ可溶のバインダー樹脂、メラミン化合物、光酸発生剤の配合割合は、用いる光学素子の種類や用途にもよるが、上記アルカリ可溶のバインダー樹脂に対して、メラミン化合物を好ましくは10~100質量%、より好ましくは20~60質量%、光酸発生剤を好ましくは0.01~30質量%、より好ましくは0.1~20質量%となるように配合した割合が挙げられる。このような範囲であると、ネガ型感光性樹脂組成物の硬化性および現像性が良好となる。 The photoacid generator contained in the negative photosensitive resin composition (acid curable type) is a compound that generates an acid by light. Examples of the photoacid generator include diaryl iodonium salts, triaryl sulfonium salts, triazine compounds, sulfonyl compounds, sulfonic acid esters, and the like.
The blending ratio of the alkali-soluble binder resin, melamine compound, and photoacid generator in the negative photosensitive resin composition (acid curable type) used in the production method of the present invention depends on the type and use of the optical element used. However, the melamine compound is preferably 10 to 100% by mass, more preferably 20 to 60% by mass, and the photoacid generator is preferably 0.01 to 30% by mass, more preferably, with respect to the alkali-soluble binder resin. Is a proportion of 0.1 to 20% by mass. Within such a range, the curability and developability of the negative photosensitive resin composition will be good.
本発明の製造方法に用いる感光性樹脂組成物は、これを用いて隔壁を形成した際に、隔壁の上部表面に撥インク性を付与する撥インク剤を含有する。ここで、撥インク性とは、インクの組成により、撥水性または撥油性、もしくは撥水性と撥油性の両方の性質をいう。より具体的には、インクに使用される水や有機溶剤等の溶剤を弾く性質をいい、一般的には、それぞれ水や適当な有機溶剤、例えば、1-メトキシ-2-アセトキシプロパンやプロピレングリコール1-モノメチルエーテル2-アセテート(PGMEA)等の通常インクジェット法で用いるインクが含有する有機溶剤の接触角で評価することができる。本発明の製造方法に用いる撥インク剤は、これを含有する感光性樹脂組成物が隔壁を形成した際に、隔壁の上部表面に、求められる撥インク性、すなわち、インクに使用される水や有機溶剤等の溶剤を弾く性質を付与することが可能な化合物である。
以下、撥インク剤について、ネガ型感光性樹脂組成物、ポジ型感光性樹脂組成物のタイプ別に、これらに対応する好ましい態様を例示しながら説明するが、本発明の製造方法に用いる撥インク剤が、これらに限定されるものではない。 (Ii) Ink Repellent Agent The photosensitive resin composition used in the production method of the present invention contains an ink repellent agent that imparts ink repellency to the upper surface of the partition when the partition is formed using the photosensitive resin composition. Here, the ink repellency means water repellency or oil repellency, or both water repellency and oil repellency, depending on the composition of the ink. More specifically, it refers to the property of repelling solvents such as water and organic solvents used in inks. Generally, water and appropriate organic solvents such as 1-methoxy-2-acetoxypropane and propylene glycol are used. It can be evaluated by a contact angle of an organic solvent contained in an ink used in a normal ink jet method such as 1-monomethyl ether 2-acetate (PGMEA). The ink repellent agent used in the production method of the present invention has a desired ink repellency on the upper surface of the partition when the photosensitive resin composition containing the partition forms the partition, that is, water used for the ink or It is a compound capable of imparting the property of repelling solvents such as organic solvents.
Hereinafter, the ink repellent agent will be described by exemplifying preferable modes corresponding to the types of the negative photosensitive resin composition and the positive photosensitive resin composition, but the ink repellent agent used in the production method of the present invention is described below. However, it is not limited to these.
上記撥インク剤の好ましい態様の一つであるフルオロアルキル基を側鎖に有するポリマーの製造方法としては、特開2000-102727、特開2002-249706等に開示されている方法を参照することが可能である。 Among such ink repellent agents, a polymer having a fluoroalkyl group in the side chain can be cited as a preferred embodiment because of its high ability to impart ink repellency.
As a method for producing a polymer having a fluoroalkyl group in the side chain, which is one of preferred embodiments of the ink repellent agent, refer to the methods disclosed in JP-A Nos. 2000-102727 and 2002-249706. Is possible.
本発明の製造方法に用いる感光性樹脂組成物には、上記各種成分の他に、上記感光性樹脂組成物のタイプごとに適宜、必要に応じて塗膜硬化物の架橋密度を増大するラジカル架橋剤や熱架橋剤、基材密着性を得るためのシランカップリング剤、硬化促進剤、増粘剤、可塑剤、消泡剤、レベリング剤、ハジキ防止剤、紫外線吸収剤等を配合することができる。 (Iii) Optional components contained in the photosensitive resin composition The photosensitive resin composition used in the production method of the present invention includes, as appropriate, for each type of the photosensitive resin composition, in addition to the various components described above. Radical crosslinking agent and thermal crosslinking agent to increase the crosslinking density of the cured film, silane coupling agent to obtain substrate adhesion, curing accelerator, thickener, plasticizer, antifoaming agent, leveling agent, A repellency inhibitor, an ultraviolet absorber and the like can be blended.
2個以上のエポキシ基を有する化合物として具体的には、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、フェノール・ノボラック型エポキシ樹脂、クレゾール・ノボラック型エポキシ樹脂、トリスフェノールメタン型エポキシ樹脂、臭素化エポキシ樹脂等のグリシジルエーテル類、3,4-エポキシシクロヘキシルメチル-3,4-エポキシシクロヘキサンカルボキシレート、ビス(2,3-エポキシシクロペンチル)エーテルなどの脂環式エポキシ樹脂、ジグリシジルヘキサヒドロフタレート、ジグリシジルテトラヒドロフタレート、ジグリシジルフタレート等のグリシジルエステル類、テトラグリシジルジアミノジフェニルメタン、トリグリシジルパラアミノフェノール等のグリシジルアミン類、トリグリシジルイソシアヌレートなどの複素環式エポキシ樹脂などが挙げられる。 Among these, the thermal crosslinking agent added to the photosensitive resin composition in the production method of the present invention is preferably an amino resin and a compound having two or more epoxy groups from the viewpoint of solvent resistance. A compound having an epoxy group is particularly preferred.
Specific examples of compounds having two or more epoxy groups include bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenol / novolak type epoxy resins, cresol / novolac type epoxy resins, trisphenol methane type epoxy resins, and bromination. Glycidyl ethers such as epoxy resins, alicyclic epoxy resins such as 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, bis (2,3-epoxycyclopentyl) ether, diglycidyl hexahydrophthalate, di Glycidyl esters such as glycidyl tetrahydrophthalate and diglycidyl phthalate, glycidyl amines such as tetraglycidyl diaminodiphenylmethane and triglycidyl paraaminophenol, triglycidyl And heterocyclic epoxy resins such as isocyanurate and the like.
上記希釈剤の添加量としては、感光性樹脂組成物全量に対して50~95質量%、好ましくは70~90質量%となる量を、感光性樹脂組成物の塗装性の観点から好ましい量として挙げることができる。
本発明において、感光性樹脂組成物は特に制限されるものではないが、感光性樹脂組成物としてネガ型感光性樹脂組成物(ラジカル硬化型)を用いる場合、アルカリ現像液に可溶性の樹脂バインダー、撥インク剤、光重合開始剤、および黒色着色剤を含む感光性樹脂組成物が好ましい。 In addition, in the photosensitive resin composition, various solvents that are not reactive with the composition component or the support substrate can be added as a diluent as necessary in order to smoothly apply to the support substrate. . Specific examples of the diluent include alcohols, ketones, cellosolves, carbitols, esters, ethers, chain hydrocarbons, cyclic saturated hydrocarbons, aromatic hydrocarbons and the like. These may be used alone or in combination of two or more.
The addition amount of the diluent is preferably 50 to 95% by mass, preferably 70 to 90% by mass, based on the total amount of the photosensitive resin composition, from the viewpoint of the paintability of the photosensitive resin composition. Can be mentioned.
In the present invention, the photosensitive resin composition is not particularly limited, but when a negative photosensitive resin composition (radical curable type) is used as the photosensitive resin composition, a resin binder soluble in an alkaline developer, A photosensitive resin composition containing an ink repellent agent, a photopolymerization initiator, and a black colorant is preferred.
支持基板の主面上に撥インク剤を含む感光性樹脂組成物の層を形成するには、支持基板に撥インク剤を含む感光性樹脂組成物または該組成物を含む塗布液を塗布する方法が挙げられる。塗布の方法としては、スピンコート法、スプレー法、スリットコート法、ロールコート法、回転塗布法、バー塗布法などが挙げられる。
また、撥インク剤を含む感光性樹脂組成物の層の膜厚、または該組成物と希釈剤を含む塗布液の場合は塗布液の膜厚は、用いる感光性樹脂の種類や、以下に説明する隔壁形成方法、塗布液の場合は塗布液中の希釈剤の量等にもよるが、最終的に得られる隔壁の高さが所望の値となるような厚さ、例えば、前記所望の値の2~20倍程度に設定される。
すなわち、本発明の製造方法により得られる光学素子においては、前記最終的に得られる隔壁の高さ、言い換えれば(4)第2の加熱工程後の隔壁の高さH2は、光学素子の種類にもよるが、0.05~50μmであることが好ましく、0.2~10μmがより好ましく、0.5~5μmが特に好ましく、2~4μmがとりわけ好ましく、2.2~4μmが最も好ましい。よって、撥インク剤を含む感光性樹脂組成物または該組成物を含む塗布液の塗布は、H2がこのような値となるように行われる。 (Formation of layer made of photosensitive resin composition on substrate)
In order to form a layer of a photosensitive resin composition containing an ink repellent agent on the main surface of a support substrate, a method of applying a photosensitive resin composition containing an ink repellent agent or a coating liquid containing the composition to a support substrate Is mentioned. Examples of the coating method include spin coating, spraying, slit coating, roll coating, spin coating, and bar coating.
The film thickness of the photosensitive resin composition layer containing the ink repellent agent, or in the case of the coating liquid containing the composition and diluent, the film thickness of the coating liquid depends on the type of photosensitive resin used and the following description. Depending on the partition wall forming method and the amount of diluent in the coating liquid, the thickness of the partition wall finally obtained is a desired value, for example, the desired value Is set to about 2 to 20 times.
In other words, in the optical element obtained by the manufacturing method of the present invention, the height of the partition wall finally obtained, in other words, (4) the height H2 of the partition wall after the second heating step depends on the type of the optical element. However, it is preferably 0.05 to 50 μm, more preferably 0.2 to 10 μm, particularly preferably 0.5 to 5 μm, particularly preferably 2 to 4 μm, and most preferably 2.2 to 4 μm. Therefore, application of the photosensitive resin composition containing the ink repellent agent or the coating liquid containing the composition is performed so that H2 has such a value.
次に、必要に応じて、支持基板の主面上に形成された撥インク剤を含む感光性樹脂組成物の層を乾燥することが好ましい。この層を乾燥することによって、感光性樹脂組成物に必要に応じて添加された希釈剤(溶剤)が揮発し、粘着性の少ない塗膜が得られる。感光性樹脂組成物に希釈剤として溶剤が添加されていない場合には、乾燥は必要でない。
ただし、感光性樹脂組成物に希釈剤として添加した溶剤の乾燥を行う場合には、真空乾燥や加熱乾燥を行うことが好ましい。また塗膜外観のムラを発生させず、効率よく乾燥させるために、真空乾燥と加熱乾燥を併用することがより好ましい。各成分の種類、配合割合などによっても異なるが、好ましくは真空乾燥は500~10Pa、10~300秒間程度、加熱乾燥は50~120℃、10~2000秒間程度を採用しうる。 (Dry)
Next, it is preferable to dry the layer of the photosensitive resin composition containing the ink repellent agent formed on the main surface of the support substrate, if necessary. By drying this layer, the diluent (solvent) added to the photosensitive resin composition as needed is volatilized, and a coating film with little tackiness is obtained. When the solvent is not added as a diluent to the photosensitive resin composition, drying is not necessary.
However, when drying the solvent added as a diluent to the photosensitive resin composition, it is preferable to perform vacuum drying or heat drying. Further, in order to efficiently dry the coating film without causing unevenness in the appearance of the coating film, it is more preferable to use both vacuum drying and heat drying. Although it varies depending on the type and blending ratio of each component, it is preferable to employ a vacuum drying of about 500 to 10 Pa for about 10 to 300 seconds, and a heat drying of about 50 to 120 ° C. for about 10 to 2000 seconds.
次に、感光性樹脂組成物の層の一部に露光を行う。露光は所定パターンのマスクを介して行うことが好ましい。照射する光としては、可視光;紫外線;遠紫外線;KrFエキシマレーザー、ArFエキシマレーザー、F2エキシマレーザー、Kr2エキシマレーザー、KrArエキシマレーザー、Ar2エキシマレーザー等のエキシマレーザー;X線;電子線等が挙げられる。波長100~600nmの電磁波が好ましく、300~500nmの範囲に分布を有する光線がより好ましく、i線(365nm)、h線(405nm)、g線(436nm)が特に好ましい。 (exposure)
Next, a part of the layer of the photosensitive resin composition is exposed. The exposure is preferably performed through a mask having a predetermined pattern. As the irradiation light, visible light; ultraviolet light; far ultraviolet light; excimer laser such as KrF excimer laser, ArF excimer laser, F 2 excimer laser, Kr 2 excimer laser, KrAr excimer laser, Ar 2 excimer laser; X-ray; Etc. An electromagnetic wave having a wavelength of 100 to 600 nm is preferable, a light ray having a distribution in the range of 300 to 500 nm is more preferable, and i-line (365 nm), h-line (405 nm), and g-line (436 nm) are particularly preferable.
なお、ポジ型においては、光が感光性樹脂組成物の層に到達した部分がアルカリ可溶となる。 FIG. 1B shows a predetermined pattern portion cut by the mask 4 by irradiating the
In the positive type, the part where the light reaches the layer of the photosensitive resin composition becomes alkali-soluble.
露光工程の後、現像液により現像し、ネガ型においては未露光部分を除去し、ポジ型においては露光部分を除去する。現像液としては、例えば、水酸化カリウム等のアルカリ金属水酸化物、炭酸カリウム等のアルカリ金属炭酸塩、アミン類、アルコールアミン類、第4級アンモニウム塩等のアルカリ類を含むアルカリ水溶液を用いることができる。 (developing)
After the exposure step, development is performed with a developer, and the unexposed portion is removed in the negative type, and the exposed portion is removed in the positive type. As the developer, for example, an alkali aqueous solution containing an alkali metal hydroxide such as potassium hydroxide, an alkali metal carbonate such as potassium carbonate, an alkali such as an amine, an alcohol amine or a quaternary ammonium salt is used. Can do.
このH0(隔壁形成工程後の隔壁の高さ)の値は、隔壁が用いられるデバイスの種類、隔壁の形成性等も考慮して適宜設定されればよい。H0の値としては、概ね0.3~20μmの範囲であり、好ましい範囲は0.5~10μmであり、特に好ましい範囲は2~8μmであり、最も好ましい範囲は2.4~5μmである。 Here, in the manufacturing method of the present invention, the height of the partition after the (1) partition formation step represented by H0 is (1) the height of the partition after the first heating step, represented by H1. 05 ≦ H0 / H1 ≦ 1.18, preferably 1.08 ≦ H0 / H1 ≦ 1.17, and further represented by H1 and H2 (4) Partition walls after the second heating step The relationship of 1.02 ≦ H1 / H2 ≦ 1.30, preferably 1.05 ≦ H1 / H2 ≦ 1.20 holds. Moreover, in the optical element obtained by the manufacturing method of the present invention, the height of the partition wall finally obtained, that is, (4) the height H2 of the partition wall after the second heating step depends on the type of the optical element. However, it is preferably 0.05 to 50 μm, more preferably 0.2 to 10 μm, particularly preferably 0.5 to 5 μm, particularly preferably 2 to 4 μm, and most preferably 2.2 to 4 μm. The value of H0 can be obtained by taking into consideration all such relationships between the preferable value of H2 and the above-mentioned H0, H1, and H2.
The value of H0 (the height of the partition after the partition formation step) may be set as appropriate in consideration of the type of device in which the partition is used, the formability of the partition, and the like. The value of H0 is generally in the range of 0.3 to 20 μm, the preferred range is 0.5 to 10 μm, the particularly preferred range is 2 to 8 μm, and the most preferred range is 2.4 to 5 μm.
この(B)の撥インク性隔壁形成方法に用いる感光性樹脂組成物としては、上記(A)の方法で説明した感光性樹脂組成物において撥インク剤の配合を必須としない以外は全く同様な感光性樹脂組成物をそのまま用いることができる。また、撥インク剤としては、上記(A)の方法で使用したのと同様の撥インク剤を用いることができる。 Next, in the production method of the present invention, (1) a layer of a photosensitive resin composition and a layer containing an ink repellent agent can be used in this order on the main surface of the support substrate, which can be used as a partition formation step. A method of forming and forming an ink-repellent partition wall by photolithography will be described.
The photosensitive resin composition used in this (B) ink repellent partition forming method is exactly the same except that the ink repellent agent is not essential in the photosensitive resin composition described in the above method (A). The photosensitive resin composition can be used as it is. As the ink repellent agent, the same ink repellent agent as that used in the method (A) can be used.
(B-1)支持基板上に感光性樹脂組成物または該組成物を含む塗布液を塗布、必要に応じて乾燥して、感光性樹脂組成物の層を形成し、該層の上に撥インク剤または撥インク剤を含む塗布液を塗布、必要に応じて乾燥して撥インク剤を含む層を形成し、露光、現像を経て撥インク性隔壁を形成する方法。 Examples of the method for forming the photosensitive resin composition layer and the ink repellent layer on the support substrate include the following methods (B-1) and (B-2).
(B-1) A photosensitive resin composition or a coating solution containing the composition is applied onto a support substrate, and dried as necessary to form a layer of the photosensitive resin composition. A method of forming a layer containing an ink repellent agent by applying a coating liquid containing an ink agent or an ink repellent agent, drying as necessary, and forming an ink repellent partition through exposure and development.
なお、このB-1の方法をより具体的に示す例として、特開平9-203803に開示されている方法が挙げられる。 The layer containing the ink repellent agent may or may not have photosensitivity. When the layer containing the ink repellent agent has photosensitivity, the layer of the photosensitive resin composition and the layer containing the ink repellent agent are both positive or negative. For the drying, exposure and development steps, the method described in (A) can be employed.
An example showing the method B-1 more specifically is the method disclosed in JP-A-9-203803.
支持基板とは別の仮支持体上に撥インク剤または撥インク剤を含む塗布液を塗布し、必要に応じて乾燥して、撥インク剤を含む層を形成する方法であり、撥インク剤を含む層は感光性を有していてもいなくてもよい。また、仮支持体には予め、撥インク剤を含む層が平滑かつ均一に形成されるような前処理が施されていてもよいし、熱可塑性樹脂組成物層や酸素遮断層などが積層されていてもよい。ただし、これらは後の現像工程などで除去される得るものである。 (B-2) A method of forming a transfer layer comprising a layer containing an ink repellent agent and a layer of a photosensitive resin composition on a temporary support different from the support substrate, and transferring the transfer layer to the support substrate.
An ink repellent agent is a method in which an ink repellent agent or a coating liquid containing an ink repellent agent is applied onto a temporary support different from the support substrate and dried as necessary to form a layer containing the ink repellent agent. The layer containing may or may not have photosensitivity. The temporary support may be pretreated in advance so that a layer containing an ink repellent agent is formed smoothly and uniformly, or a thermoplastic resin composition layer, an oxygen barrier layer, or the like is laminated. It may be. However, these can be removed in a later development step or the like.
なお、このB-2の方法をより具体的に示す例として、WO2008/078707、特開2002-139612に開示されている方法が挙げられる。 A photosensitive resin composition or a coating liquid containing the composition is applied onto the layer containing the ink repellent agent formed as described above, and dried as necessary to form a layer of the photosensitive resin composition. Moreover, you may protect the surface with a protective film as needed. When the protective film is pasted, the protective film is peeled off and laminated to the support substrate, and then the temporary support is peeled off to form a layer containing the photosensitive resin composition and the ink repellent agent on the support substrate, An ink repellent partition is formed through an exposure and development process. In addition, when the layer containing an ink repellent agent has photosensitivity, both the layer of the photosensitive resin composition and the layer containing an ink repellent agent are either a positive type or a negative type. For the drying, exposure and development steps, the method described in (A) is employed.
As an example showing the method B-2 more specifically, there are the methods disclosed in WO2008 / 078707 and JP-A-2002-139612.
一方、印刷法により隔壁を形成させる場合は、例えば、熱硬化性樹脂組成物を用いて隔壁パターンを印刷することで樹脂組成物からなる隔壁が形成可能である。 When forming the partition which consists of a layer of the photosensitive resin composition by the photolithographic method, even if it uses the negative photosensitive resin composition shown by the method of said (A), it uses a positive photosensitive resin composition. Also good. However, in the method (C), the layer containing the ink repellent agent is formed separately from the layer of the photosensitive resin composition. Therefore, in the photosensitive resin composition used in the method (C), the above ( The ink repellent agent shown in A) is not an essential component.
On the other hand, when forming a partition by a printing method, the partition consisting of a resin composition can be formed by printing a partition pattern using a thermosetting resin composition, for example.
なお、このC-1の方法をより具体的に示す例として、特開2008-165092(段落0102、実施例12)に開示されている方法が挙げられる。 (C-1) A positive photosensitive resin composition containing an ink repellent agent is coated on a transparent substrate on which black partition walls (black matrix) made of a resin composition are formed, and dried as necessary. Then, exposure is performed from the back surface of the transparent substrate, and an ink repellent partition is formed through development. In addition, also in the formation of the ink repellent partition wall by this method, the method described in (A) can be employed for the drying, exposure, and development steps. Also, the ink repellent agent used in this method can be the same ink repellent agent as used in the method (A).
An example showing the method of C-1 more specifically is the method disclosed in JP2008-165092 (paragraph 0102, Example 12).
なお、このC-2の方法をより具体的に示す例として、特開2008-139378に開示されている方法が挙げられる。 (C-2) An ink repellent agent or a coating liquid containing an ink repellent agent is applied onto a temporary support different from the support substrate, and dried as necessary to form a layer containing the ink repellent agent. The ink repellent agent or the coating liquid containing the ink repellent agent may or may not have photosensitivity. After laminating a support substrate on which a partition made of a resin composition is formed and a temporary support on which the layer containing the ink repellent agent is formed, the temporary support is peeled off to form an ink-repellent partition on the support substrate. To do. In addition, the ink repellent agent used in this method can be the same ink repellent agent as used in the method (A).
A method disclosed in Japanese Patent Application Laid-Open No. 2008-139378 is given as a more specific example of the method C-2.
なお、このC-3の方法をより具体的に示す例として、特開2002-062422、特開2003-344640、特開2003-124210、WO2006/035621に開示されている方法が挙げられる。
その他にも、グラビアコーターやインクジェットにて、隔壁表面にのみ撥インク性を付与することもできる(特開2008-76651(実施例1、実施例11)参照)。 (C-3) Plasma irradiation is performed on the support substrate on which the partition wall made of the resin composition is formed, using a fluorine compound as an introduction gas. Examples of the fluorine compound used as the introduction gas include CF 4 , C 2 F 6 , C 3 F 6 , SF 6 , and NF 3 . Further, plasma irradiation may be performed under reduced pressure, or plasma irradiation may be performed under atmospheric pressure.
Examples of the method C-3 more specifically include the methods disclosed in JP-A-2002-062422, JP-A-2003-344640, JP-A-2003-124210, and WO2006 / 035621.
In addition, ink repellency can be imparted only to the partition wall surface by a gravure coater or an ink jet (see Japanese Patent Application Laid-Open No. 2008-76651 (Examples 1 and 11)).
支持基板上に有機溶媒に可溶で、アルカリ現像液に不溶な非感光性樹脂組成物または該組成物を含む塗布液を塗布、必要に応じて乾燥して、非感光性樹脂組成物の層を形成し、該層の上に撥インク剤を含む感光性組成物または該組成物を含む塗布液を塗布、必要に応じて乾燥して、撥インク剤を含む層を形成する。 Furthermore, (1) a non-photosensitive resin composition that is soluble in an organic solvent and insoluble in an alkali developer on the main surface of the support substrate, which can be used as a partition formation step in the production method of the present invention, For example, a method for forming an ink repellent partition wall by forming a thermosetting resin composition layer and a photosensitive layer containing an ink repellent agent in this order, and then performing an etching process using an organic solvent will be described below. To do.
A non-photosensitive resin composition layer that is soluble in an organic solvent and insoluble in an alkaline developer or a coating solution containing the composition is applied onto the support substrate, and dried as necessary. A photosensitive composition containing an ink repellent agent or a coating liquid containing the composition is applied onto the layer, and dried as necessary to form a layer containing the ink repellent agent.
撥インク剤を含む層は、ポジ型でもネガ型でもよい。露光、現像を経て撥インク剤を含む層のみをパターニングする。ここで形成された撥インク剤を含む層は有機溶剤に不溶である。必要に応じて乾燥して、有機溶剤で非感光性樹脂組成物の層をエッチングして撥インク性隔壁を形成する。乾燥、露光、現像工程は(A)で記載した方法を採用することができる。また、この方法に用いる撥インク剤についても、上記(A)の方法で使用したのと同様の撥インク剤を用いることができる。
なお、この(D)の方法をより具体的に示す例として、特開2008-165092(段落0079、実施例1)に開示されている方法が挙げられる。 A non-photosensitive resin composition that is soluble in an organic solvent and insoluble in an alkaline developer can be used as long as the resin composition does not have an acidic group and has a weight average molecular weight of 100,000 or less. Furthermore, it is preferable that it is a thermosetting resin composition. For example, an epoxy resin, an acrylic copolymer, etc. are mentioned.
The layer containing the ink repellent agent may be a positive type or a negative type. Only the layer containing the ink repellent agent is patterned through exposure and development. The layer containing the ink repellent agent formed here is insoluble in the organic solvent. If necessary, it is dried, and the layer of the non-photosensitive resin composition is etched with an organic solvent to form an ink repellent partition. For the drying, exposure and development steps, the method described in (A) can be employed. Also, the ink repellent agent used in this method can be the same ink repellent agent as used in the method (A).
As a more specific example of the method (D), there is a method disclosed in Japanese Unexamined Patent Application Publication No. 2008-165092 (paragraph 0079, Example 1).
また、本発明の製造方法において、上記隔壁の加熱を一度に行わず、加熱による樹脂組成物の硬化を(3)インクジェット工程の前後の2段階に分けて行うことの効果については、隔壁の高さの変化とともに以下の各工程に関する記載において説明する。 That is, in the method for producing an optical element of the present invention, the details will be described below without irradiating the obtained partition wall with electromagnetic waves of 250 nm to 450 nm after the above (1) partition formation step (2) First The method of sequentially performing the heating step, (3) the ink layer forming step, and (4) the second heating step is a preferable production method.
Further, in the production method of the present invention, the effect of performing the curing of the resin composition by heating in two stages before and after the ink jet process without heating the partition wall at one time is as follows. This will be described in the following description regarding each process.
本発明の光学素子の製造方法における(2)第1の加熱工程は、上記(1)隔壁形成工程により支持基板上に形成された前記隔壁を加熱して前記樹脂組成物の硬化を促進させることにより、隔壁形成工程後の隔壁の高さをH0とし、第1の加熱工程後の隔壁の高さをH1とした時の、第1の加熱工程後の隔壁の高さに対する隔壁形成工程後の隔壁の高さの比であるH0/H1を、1.05≦H0/H1≦1.18の関係となるようにする工程である。なお、本発明の製造方法において好ましくは、前記H0/H1の関係が、1.08≦H0/H1≦1.17となるように(2)第1の加熱工程が行われる。 (2) First heating step (2) The first heating step in the method of manufacturing an optical element of the present invention includes the step (1) of heating the partition walls formed on the support substrate in the partition wall formation step to heat the resin. By promoting the curing of the composition, the height of the partition wall after the partition wall forming step is set to H0, and the height of the partition wall after the first heating step is set to H1, the partition wall after the first heating step is In this step, H0 / H1, which is the ratio of the height of the barrier ribs after the barrier rib forming step, is set to satisfy a relationship of 1.05 ≦ H0 / H1 ≦ 1.18. In the production method of the present invention, preferably, (2) the first heating step is performed so that the relationship of H0 / H1 satisfies 1.08 ≦ H0 / H1 ≦ 1.17.
このような加熱条件で(1)隔壁形成工程により支持基板上に形成された前記隔壁を加熱することにより、(2)第1の加熱工程後の隔壁の高さを、上記H0/H1が、1.05≦H0/H1≦1.18の関係が成り立つような高さとすることができる。 The ratio of the partition wall height after the partition wall formation step to the partition wall height after the first heating step, and the heating conditions such that H0 / H1 is 1.05 ≦ H0 / H1 ≦ 1.18, Although it depends on the resin composition to be used, specifically, a temperature condition of 150 ° C. to 215 ° C. can be mentioned as a preferable condition. Examples of the heating method include a method in which the partition wall is heat-treated for 5 to 90 minutes with a heating device such as a hot plate or an oven together with the support substrate. Further, it is preferable to heat at a normal oxygen concentration of 20 to 21% without reducing the pressure during heating. The heating temperature in the first heating step is preferably 185 to 210 ° C.
Under such heating conditions, (1) by heating the partition formed on the support substrate in the partition formation step, (2) the height of the partition after the first heating step is set to the above H0 / H1. The height can satisfy the relationship of 1.05 ≦ H0 / H1 ≦ 1.18.
なお、実際の光学素子の隔壁の幅は、通常100μm以下であり、隔壁の上面の接触角を測定することは困難である。この場合は、実際の光学素子の隔壁の形成方法と同様の方法によって、幅が5mm以上である膜を形成して、その上面の接触角を測定するとよい。 In general, the ink repellency includes water repellency and oil repellency, but water and oil components such as 1-methoxy-2-acetoxypropane, propylene glycol 1-monomethyl ether 2-acetate (PGMEA), respectively. The contact angle can be evaluated. In order to smoothly perform the (3) IJ step described below, the upper surface of the partition wall after the first heating step according to the manufacturing method of the present invention preferably has a water contact angle of 90 ° or more. 95 ° or more is more preferable. Further, on the upper surface of the partition wall, the contact angle of propylene glycol 1-monomethyl ether 2-acetate is preferably 20 ° or more, and more preferably 25 ° or more.
Note that the width of the partition wall of an actual optical element is usually 100 μm or less, and it is difficult to measure the contact angle of the upper surface of the partition wall. In this case, it is preferable to form a film having a width of 5 mm or more and measure the contact angle on the upper surface by a method similar to the method for forming the partition walls of the actual optical element.
本発明の製造方法においては、上記(2)第1の加熱工程終了後、前記支持基板の主面上の前記隔壁で仕切られた領域(ドット)にインクジェット法によりインクを注入してインク層を形成する(3)インクジェット(IJ)工程が行われる。なお、図1(d)は、本発明の製造方法におけるIJ工程の一例を模式的に示す断面図である。上に説明した、図1(a)~(c)に示される模式図を例とした本発明の製造方法における(1)隔壁形成工程の後、上記(2)第1の加熱工程(図示せず)を経て、行われる図1(d)に示される(3)IJ工程の一例では、支持基板1上の隔壁6に囲まれた領域、ドット7にインクジェット装置(図示せず)のインク供給ノズル9からインク10が供給され、インク層11が形成される。 (3) Inkjet (IJ) Step In the manufacturing method of the present invention, after the above (2) first heating step, the region (dots) partitioned by the partition on the main surface of the support substrate is subjected to the inkjet method. (3) An ink jet (IJ) process is performed in which ink is injected to form an ink layer. In addition, FIG.1 (d) is sectional drawing which shows typically an example of the IJ process in the manufacturing method of this invention. The above-described (2) first heating step (not shown) after the (1) partition formation step in the manufacturing method of the present invention taking the schematic diagrams shown in FIGS. 1 (a) to 1 (c) as examples. In the example of the (3) IJ process shown in FIG. 1 (d), the ink supply of the ink jet device (not shown) to the region surrounded by the
インクが溶剤を含む場合、インク層は、隔壁に囲まれた開口部にインクを注入し、溶剤を乾燥により除去して形成される。インクが硬化性のバインダー樹脂成分などの硬化性化合物を含む場合、溶剤を除去した後、硬化性化合物を硬化させる。
乾燥後のインクまたは乾燥後硬化させたインクを含む1つの開口部が、光学的、電気的機能を有する区分を表す1つの「画素」となる。 In this specification, “ink” means, for example, an optically and electrically functional substance (may be a precursor that becomes the substance by a reaction such as curing) or a composition (curing) containing the substance. And the like, and a composition of a non-curable substance and the like, which are in a liquid state or a liquid composition containing a solvent. The “ink” in the present specification includes a mixture of a coloring substance such as a dye or a pigment, a binder and a solvent, a mixture of a coloring substance, a curable binder and a solvent, a mixture of a coloring substance and a liquid curable binder, It is not limited to the coloring ink used conventionally.
When the ink contains a solvent, the ink layer is formed by injecting ink into an opening surrounded by the partition and removing the solvent by drying. When the ink contains a curable compound such as a curable binder resin component, the curable compound is cured after removing the solvent.
One opening containing the ink after drying or the ink cured after drying becomes one “pixel” representing a section having an optical and electrical function.
1/10×V<L<3/2×V Here, regarding the amount of ink injected into the dots by the ink jet method, for example, in the case of manufacturing a color filter, the ink volume (L) after the end of the second heating step (4) described later is the dot volume (V ) Is preferably within the following range.
1/10 × V <L <3/2 × V
本発明の製造方法においては、上記(3)インクジェット(IJ)工程終了後、前記隔壁と前記インク層をさらに加熱して画素を形成するとともに前記樹脂組成物の硬化を完了させるために、上記(2)第1の加熱工程後の隔壁の高さをH1とし、(4)第2の加熱工程後の隔壁の高さをH2とした時に、第2の加熱工程後の隔壁の高さに対する第1の加熱工程後の隔壁の高さの比であるH1/H2が、1.02≦H1/H2≦1.30の関係となるように(4)第2の加熱工程を行う。なお、本発明の製造方法において好ましくは、前記H1/H2の関係が、1.05≦H1/H2≦1.20となるように(4)第2の加熱工程が行われる。
カラーフィルタの製造に使用されるインクとしては、硬化性のインクが好ましい。硬化性のインクとしては、染料や顔料などの着色物質と硬化性のバインダー樹脂成分と溶剤を含むインクが好ましい。バインダー樹脂成分としては硬化性の化合物や組成物(エチレン性二重結合を有する重合性化合物と重合開始剤の組み合わせ、エポキシ基を2以上有するポリエポキシドと硬化剤の組み合わせ、など)が好ましい。硬化性のインクが使用される場合、上記第2の加熱工程において硬化性のインクが硬化される。
なお、本発明の光学素子の製造方法において、この第2の加熱工程は、隔壁やインク層の耐熱性を高め、発生ガスを抑制し、信頼性の高い光学素子を得るための最終的な加熱工程である。また、本発明の製造方法においては、上記第1の加熱工程および第2の加熱工程のそれぞれ加熱において、隔壁の高さの関係を上記関係となるように維持することで、隔壁を構成する樹脂組成物の硬化の度合いを適正な状態に調整するものである。 (4) Second heating step In the production method of the present invention, after the (3) inkjet (IJ) step, the partition wall and the ink layer are further heated to form pixels and the resin composition is cured. (2) When the height of the partition wall after the first heating step is H1, and (4) the height of the partition wall after the second heating step is H2, the second heating step (4) the second so that H1 / H2, which is the ratio of the height of the partition wall after the first heating step to the height of the subsequent partition wall, satisfies 1.02 ≦ H1 / H2 ≦ 1.30. A heating process is performed. In the production method of the present invention, preferably, (4) the second heating step is performed so that the relationship of H1 / H2 satisfies 1.05 ≦ H1 / H2 ≦ 1.20.
As the ink used for manufacturing the color filter, a curable ink is preferable. As the curable ink, an ink containing a coloring substance such as a dye or a pigment, a curable binder resin component, and a solvent is preferable. The binder resin component is preferably a curable compound or composition (a combination of a polymerizable compound having an ethylenic double bond and a polymerization initiator, a combination of a polyepoxide having two or more epoxy groups and a curing agent, etc.). When the curable ink is used, the curable ink is cured in the second heating step.
In the method for manufacturing an optical element of the present invention, the second heating step increases the heat resistance of the partition walls and the ink layer, suppresses generated gas, and finally heats to obtain a highly reliable optical element. It is a process. Moreover, in the manufacturing method of this invention, the resin which comprises a partition is maintained by maintaining the relationship of the height of a partition so that it may become the said relationship in each heating of the said 1st heating process and a 2nd heating process. The degree of curing of the composition is adjusted to an appropriate state.
インクジェット法に使用するインクの固形分は、通常10~30質量%であり、大量の溶剤を含む場合が多い。したがって、隔壁の高さが高い場合、インクジェット法により吐出されるインクは、隔壁の上面を基準面として仮想的に形成される面から大きく盛り上がるように開口部に充填される。その結果、インクがオーバーフローしやすくなる。特にカラーフィルタの場合、隔壁の上面とインク層の上面とは略面一の構成とすることが好ましい。開口部の面積を同一として議論すると、隔壁の高さが高くなるにつれて充填されるインクの量も多くなり、開口部からのインク盛り上がりが顕著になる傾向がある。このように隔壁の高さが高い場合(特にH2(平均値)が、2.2μm以上の場合)は、本発明の製造方法が有効であり、オーバーフローを抑制する効果が大きい。 In the optical element obtained by the production method of the present invention, the partition wall made of a cured resin product has a width (average value) of preferably 100 μm or less, more preferably 50 μm or less, depending on the type of optical element. Further, the distance between adjacent partition walls, that is, the width (average value) of the openings (dots) is preferably 1000 μm or less, and more preferably 500 μm or less. Further, the height of the partition wall, that is, the above-mentioned H2 (average value) is preferably 0.05 to 50 μm, more preferably 0.2 to 10 μm, and most preferably 0.5 to 5 μm. In particular, in the so-called COA (color filter on array) or BOA (black matrix on array) method for creating a color filter on the TFT array side, 2.2 to 4 μm is optimal.
The solid content of the ink used in the ink jet method is usually 10 to 30% by mass and often contains a large amount of solvent. Therefore, when the height of the partition is high, the ink ejected by the ink jet method is filled in the opening so as to rise significantly from the surface virtually formed with the upper surface of the partition as the reference surface. As a result, the ink tends to overflow. In particular, in the case of a color filter, the upper surface of the partition wall and the upper surface of the ink layer are preferably substantially flush with each other. If the areas of the openings are the same, the amount of ink to be filled increases as the height of the partition wall increases, and the ink swells from the openings tends to become significant. Thus, when the height of the partition is high (particularly when H2 (average value) is 2.2 μm or more), the production method of the present invention is effective, and the effect of suppressing overflow is great.
さらに、前記のように隔壁の上面とインク層の上面とが略面一になる構成においては、開口部におけるインクの盛り上がりは、隔壁の高さが高い場合に顕著になるため、本発明の製造方法は、隔壁の高さが高い場合(特にH2(平均値)が、2.2μm以上の場合)に、より一層有効である。 The solid content of the ink used in the ink jet method is usually 10 to 30% by mass and often contains a large amount of solvent. Therefore, when the area of the opening is small or the volume of the opening is small, the ink ejected by the ink jet method opens so as to rise significantly from the surface virtually formed with the upper surface of the partition wall as the reference surface. The part is filled. As a result, the ink tends to overflow. Therefore, when the area of the opening is small (especially 75,000 μm 2 or less) or the volume of the opening is small (especially 300,000 μm 3 or less), the production method of the present invention is effective and the ink overflows. The effect of suppressing is great.
Further, in the configuration in which the upper surface of the partition wall and the upper surface of the ink layer are substantially flush as described above, the bulge of ink in the opening becomes noticeable when the height of the partition wall is high. The method is even more effective when the height of the partition walls is high (particularly when H2 (average value) is 2.2 μm or more).
カラーフィルタにおいては、上記隔壁は、好ましくはブラックマトリックス(BM)と呼ばれる遮光層である。また、カラーフィルタの隔壁がBMである場合、高遮光性が求められ、その遮光性を示す値、OD(Optical Density)値は、通常1.5~6の範囲となるように設計される。なお、OD値の調整は、上記(1)の隔膜形成工程に記載した黒色着色剤の種類、配合量等を適宜選択することで行われる。ブラックマトリックス(BM)がネガ型感光性樹脂組成物を原料として作製される場合、特に(1)隔壁形成工程の露光ではネガ型感光性樹脂組成物の硬化が不十分であり、本発明の製造方法による(2)第1の加熱工程および(4)第2の加熱工程がネガ型感光性樹脂組成物の硬化に対して有効に作用する。
カラーフィルタにおいて、形成される画素の形状は、ストライプ型、モザイク型、トライアングル型、4画素配置型等の公知のいずれの配列とすることも可能である。 [Manufacture of color filters]
In the color filter, the partition is preferably a light shielding layer called a black matrix (BM). Further, when the color filter partition is BM, high light shielding properties are required, and the value indicating the light shielding properties, OD (Optical Density) value, is usually designed to be in the range of 1.5-6. In addition, adjustment of OD value is performed by selecting suitably the kind, compounding quantity, etc. of the black colorant described in the diaphragm formation process of said (1). When the black matrix (BM) is produced using a negative photosensitive resin composition as a raw material, the curing of the negative photosensitive resin composition is insufficient particularly in the exposure in the (1) partition forming step, and the production of the present invention. According to the method, (2) the first heating step and (4) the second heating step effectively act on the curing of the negative photosensitive resin composition.
In the color filter, the shape of the pixel to be formed can be any known arrangement such as a stripe type, a mosaic type, a triangle type, or a four-pixel arrangement type.
隔壁を形成する前に、ガラス等の透明基材に酸化インジウム錫(ITO)等の透明電極をスパッタ法等によって製膜し、必要に応じて所望のパターンに透明電極をエッチングする。次に、本発明の製造方法により、隔壁を形成し、上記に説明した第1の加熱を行った後、インクジェット法を用いてドットに正孔輸送材料、発光材料の溶液を順次塗布、乾燥後、さらに、上記に説明した本発明の製造方法による第2の加熱処理を施して、正孔輸送層、発光層を形成する。その後アルミニウム等の電極を蒸着法等によって形成することによって、有機EL表示素子の画素が得られる。 [Manufacture of organic EL display elements]
Before forming the partition walls, a transparent electrode such as indium tin oxide (ITO) is formed on a transparent substrate such as glass by sputtering or the like, and the transparent electrode is etched into a desired pattern as necessary. Next, after the partition wall is formed by the manufacturing method of the present invention and the first heating described above is performed, a solution of a hole transport material and a light emitting material is sequentially applied to the dots using an inkjet method, and then dried. Further, the second heat treatment according to the production method of the present invention described above is performed to form a hole transport layer and a light emitting layer. Then, an organic EL display element pixel is obtained by forming an electrode such as aluminum by vapor deposition or the like.
有機TFTアレイは、通常、以下の(ア)~(ウ)の工程により製造される。
(ア)ガラス等の透明基材に隔壁を形成する。インクジェット法を用いてドットにゲート電極材料の溶液を塗布しゲート電極を形成する。
(イ)ゲート電極を形成させた後、その上にゲート絶縁膜を形成させる。ゲート絶縁膜上に隔壁を形成し、インクジェット法を用いてドットにソース・ドレイン電極材料の溶液を塗布しソース・ドレイン電極を形成する。
(ウ)ソース・ドレイン電極を形成させた後、一対のソース・ドレイン電極を含む領域を囲むように隔壁を形成し、インクジェット法を用いてドットに有機半導体の溶液を塗布し有機半導体層をソース・ドレイン電極間に形成させる。 [Manufacture of organic TFT array]
An organic TFT array is usually manufactured by the following steps (a) to (c).
(A) A partition wall is formed on a transparent substrate such as glass. A gate electrode material is formed by applying a solution of a gate electrode material to dots using an inkjet method.
(A) After forming the gate electrode, a gate insulating film is formed thereon. A partition wall is formed on the gate insulating film, and a source / drain electrode material solution is applied to the dots using an inkjet method to form source / drain electrodes.
(C) After forming the source / drain electrodes, partition walls are formed so as to surround the region including the pair of source / drain electrodes, and the organic semiconductor solution is applied to the dots by applying an organic semiconductor solution to the dots using an inkjet method. -It is formed between the drain electrodes.
<化合物の略号>
(i)撥インク剤の調製に用いた化合物
X-8201:ジメチルシリコーン鎖含有メタクリレート(商品名X-24-8201:信越化学工業社製)
C6FMA:CH2=C(CH3)COOCH2CH2(CF2)6F
MAA:メタクリル酸
IBMA:メタクリル酸イソブチル
CHMA:メタクリル酸シクロヘキシル
2-HEMA:2-ヒドロキシエチルメタクリレート
V-70:V-70(商品名、和光純薬社製、2,2’-アゾビス(4-メトキシ-2,4-ジメチルバレロニトリル))
AOI:カレンズAOI(商品名、昭和電工社製、2-アクリロイルオキシエチルイソシアネート)
BEI:カレンズBEI(商品名、昭和電工社製、1,1-ビス(アクリロイルオキシメチル)エチルイソシアネート)
DBTDL:ジブチル錫ジラウレート
BHT:2,6-ジ-t-ブチル-p-クレゾール
MEK:2-ブタノン First, the abbreviations of the compounds used in the following examples and comparative examples are shown below.
<Abbreviation of compound>
(I) Compound used for preparation of ink repellent agent X-8201: Dimethyl silicone chain-containing methacrylate (trade name X-24-8201: manufactured by Shin-Etsu Chemical Co., Ltd.)
C6FMA: CH 2 = C (CH 3)
MAA: methacrylic acid IBMA: isobutyl methacrylate CHMA: cyclohexyl methacrylate 2-HEMA: 2-hydroxyethyl methacrylate V-70: V-70 (trade name, manufactured by Wako Pure Chemical Industries, 2,2′-azobis (4-methoxy) -2,4-dimethylvaleronitrile)))
AOI: Karenz AOI (trade name, manufactured by Showa Denko KK, 2-acryloyloxyethyl isocyanate)
BEI: Karenz BEI (trade name, manufactured by Showa Denko KK, 1,1-bis (acryloyloxymethyl) ethyl isocyanate)
DBTDL: Dibutyltin dilaurate BHT: 2,6-di-t-butyl-p-cresol MEK: 2-butanone
(光重合開始剤)
OXE02:OXE02(商品名、チバスペシャルティケミカルズ社製、エタノン 1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾイル-3-イル]-1-(O-アセチルオキシム))
(増粘剤)
BOT:2-メルカプトベンゾオキサゾール
(感光性樹脂)
EX1010:EX-1010(商品名、ナガセケムテックス社製、エポキシ樹脂にエチレン性二重結合と酸性基とを導入した樹脂の溶液;固形分70%、重量平均分子量3020)
ZCR1569:ZCR-1569(商品名、日本化薬社製、ビフェニル骨格を有するエポキシ樹脂にエチレン性二重結合と酸性基とを導入した樹脂の溶液;固形分70%、重量平均分子量4710)
(ラジカル架橋剤)
DPHA:KAYARAD DPHA(商品名、日本化薬社製、ジペンタエリスリトールペンタアクリレートとジペンタエリスリトールヘキサアクリレートの混合物)
A9300:NKエステル A-9300(商品名、新中村化学工業社製、エトキシ化イソシアヌル酸トリアクリレート)
(希釈剤)
PGMEA:プロピレングリコール1-モノメチルエーテル2-アセテート
(着色剤・微粒子)
CB:カーボンブラック分散液(平均2次粒径120nm、分散媒PGMEA、カーボンブラック20%、アミン価が18mgKOH/gのポリウレタン系高分子分散剤5%) シリカ:シリカ分散液(平均粒径20nm、分散媒PGMEA、固形分30%、シリカは負帯電)
(熱架橋剤)
NC3000H:NC-3000-H(商品名、日本化薬社製、ビフェニル骨格を有するエポキシ樹脂、軟化点69℃)
(シランカップリング剤)
KBM503:KBM-503(商品名、信越化学社製、3-メタクリロキシプロピルトリメトキシシラン)
KBM403:KBM-403(商品名、信越化学社製、3-グリシドキシプロピルトリメトキシシラン) (Ii) Components used for preparing the photosensitive resin composition coating solution (photopolymerization initiator)
OXE02: OXE02 (trade name, manufactured by Ciba Specialty Chemicals, Etanone 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazoyl-3-yl] -1- (O-acetyloxime))
(Thickener)
BOT: 2-mercaptobenzoxazole (photosensitive resin)
EX1010: EX-1010 (trade name, manufactured by Nagase ChemteX Corporation, a solution of a resin in which an ethylenic double bond and an acidic group are introduced into an epoxy resin; solid content 70%, weight average molecular weight 3020)
ZCR1569: ZCR-1569 (trade name, manufactured by Nippon Kayaku Co., Ltd., a resin solution in which an ethylenic double bond and an acidic group are introduced into an epoxy resin having a biphenyl skeleton; solid content: 70%, weight average molecular weight: 4710)
(Radical crosslinking agent)
DPHA: KAYARAD DPHA (trade name, manufactured by Nippon Kayaku Co., Ltd., a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate)
A9300: NK ester A-9300 (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd., ethoxylated isocyanuric acid triacrylate)
(Diluent)
PGMEA: Propylene glycol 1-monomethyl ether 2-acetate (colorant / fine particles)
CB: carbon black dispersion (average secondary particle size 120 nm, dispersion medium PGMEA, carbon black 20%, polyurethane polymer dispersant 5% with an amine value of 18 mg KOH / g) Silica: silica dispersion (average particle size 20 nm, Dispersion medium PGMEA, solid content 30%, silica is negatively charged)
(Thermal crosslinking agent)
NC3000H: NC-3000-H (trade name, manufactured by Nippon Kayaku Co., Ltd., epoxy resin having biphenyl skeleton, softening point 69 ° C.)
(Silane coupling agent)
KBM503: KBM-503 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd., 3-methacryloxypropyltrimethoxysilane)
KBM403: KBM-403 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd., 3-glycidoxypropyltrimethoxysilane)
[撥インク剤:化合物(A-1)の合成]
撹拌機を備えた内容積1Lのオートクレーブに、MEK(420.0g)、X-8201(27.0g)、C6FMA(66.6g)、MAA(14.4g)、2-HEMA(72.0g)および重合開始剤V-70(1.4g)を仕込み、窒素雰囲気下で撹拌しながら、30℃で24時間重合させ、粗共重合体を合成した。得られた粗共重合体の溶液にヘプタンを加えて再沈精製した後、真空乾燥し、共重合体1(148.7g)を得た。共重合体1は、数平均分子量が25980、重量平均分子量が64000であった。なお、数平均分子量および重量平均分子量は、ゲルパーミエーションクロマトグラフィー法により、ポリスチレンを標準物質として測定した。なお、以下、各化合物(重合体)の数平均分子量および重量平均分子量は、全て同様の方法で測定したものである。 First, the synthesis of the ink repellent used in the following examples and comparative examples will be described below.
[Ink Repellent Agent: Synthesis of Compound (A-1)]
To an autoclave with an internal volume of 1 L equipped with a stirrer, MEK (420.0 g), X-8201 (27.0 g), C6FMA (66.6 g), MAA (14.4 g), 2-HEMA (72.0 g) Then, a polymerization initiator V-70 (1.4 g) was charged and polymerized at 30 ° C. for 24 hours with stirring under a nitrogen atmosphere to synthesize a crude copolymer. Heptane was added to the resulting crude copolymer solution for purification by reprecipitation, followed by vacuum drying to obtain copolymer 1 (148.7 g). Copolymer 1 had a number average molecular weight of 25980 and a weight average molecular weight of 64,000. The number average molecular weight and the weight average molecular weight were measured by gel permeation chromatography using polystyrene as a standard substance. Hereinafter, the number average molecular weight and the weight average molecular weight of each compound (polymer) are all measured by the same method.
撹拌機を備えた内容積1Lのオートクレーブに、MEK(420.0g)、C6FMA(81.0g)、MAA(18.0g)、2-HEMA(72.0g)、IBMA(9.0g)および重合開始剤V-70(2.9g)を仕込み、窒素雰囲気下で撹拌しながら、30℃で24時間重合させ、粗共重合体を合成した。得られた粗共重合体の溶液にヘプタンを加えて再沈精製した後、真空乾燥し、共重合体2(160.0g)を得た。共重合体2は、数平均分子量が18560、重量平均分子量が47080であった。 [Ink Repellent Agent: Synthesis of Compound (A-2)]
MEK (420.0 g), C6FMA (81.0 g), MAA (18.0 g), 2-HEMA (72.0 g), IBMA (9.0 g) and polymerization in an autoclave with an internal volume of 1 L equipped with a stirrer Initiator V-70 (2.9 g) was charged and polymerized at 30 ° C. for 24 hours with stirring under a nitrogen atmosphere to synthesize a crude copolymer. Heptane was added to the resulting crude copolymer solution for purification by reprecipitation, followed by vacuum drying to obtain copolymer 2 (160.0 g).
[撥インク剤:化合物(A-3)の合成]
撹拌機を備えた内容積1Lのオートクレーブに、MEK(420.0g)、C6FMA(68.0g)、MAA(18.0g)、2-HEMA(72.0g)、CHMA(22.0g)および重合開始剤V-70(2.9g)を仕込み、窒素雰囲気下で撹拌しながら、30℃で24時間重合させ、粗共重合体を合成した。得られた粗共重合体の溶液にヘプタンを加えて再沈精製した後、真空乾燥し、共重合体3(160.5g)を得た。共重合体3は、数平均分子量が19030、重量平均分子量が49200であった。 To a 300 mL glass flask equipped with a thermometer, stirrer, and heating device, copolymer 2 (50.0 g), AOI (21.7 g), DBTDL (0.087 g), BHT (1.1 g) And MEK (128.1 g) were charged, and the mixture was allowed to react at 40 ° C. for 48 hours with stirring to synthesize a crude polymer. Heptane was added to the resulting crude polymer solution for purification by reprecipitation, followed by vacuum drying to obtain compound (A-2) (63.8 g). The compound (A-2) had a number average molecular weight of 27690 and a weight average molecular weight of 61110.
[Ink Repellent Agent: Synthesis of Compound (A-3)]
MEK (420.0 g), C6FMA (68.0 g), MAA (18.0 g), 2-HEMA (72.0 g), CHMA (22.0 g) and polymerization in an autoclave with an internal volume of 1 L equipped with a stirrer Initiator V-70 (2.9 g) was charged and polymerized at 30 ° C. for 24 hours with stirring under a nitrogen atmosphere to synthesize a crude copolymer. Heptane was added to the resulting crude copolymer solution for purification by reprecipitation, followed by vacuum drying to obtain copolymer 3 (160.5 g). Copolymer 3 had a number average molecular weight of 19030 and a weight average molecular weight of 49200.
(ネガ型感光性樹脂組成物塗布液の調製)
上記で得られた撥インク剤としての化合物(A-1)(0.10部)、光重合開始剤としてのOXE02(2.0部)、感光性樹脂の溶液としてのEX1010(12.5部)、黒色着色剤の分散液としてのCB(48.0部)、ラジカル架橋剤としてのDPHA(3.5部)、熱架橋剤/エポキシ樹脂としてのNC3000H(1.65部)、シランカップリング剤としてKBM503(2.0部)および溶剤としてのPGMEA(30.25部)を混合して、ネガ型感光性樹脂組成物の塗布液を得た。ネガ型感光性樹脂組成物塗布液の全固形分に対する撥インク剤の含有量、言い換えればネガ型感光性樹脂組成物中の撥インク剤すなわち化合物(A-1)の含有量は、0.33%であった。 [Example 1]
(Preparation of negative photosensitive resin composition coating solution)
Compound (A-1) (0.10 parts) as an ink repellent agent obtained above, OXE02 (2.0 parts) as a photopolymerization initiator, EX1010 (12.5 parts) as a solution of a photosensitive resin ), CB (48.0 parts) as a black colorant dispersion, DPHA (3.5 parts) as a radical crosslinking agent, NC3000H (1.65 parts) as a thermal crosslinking agent / epoxy resin, silane coupling KBM503 (2.0 parts) as an agent and PGMEA (30.25 parts) as a solvent were mixed to obtain a coating solution of a negative photosensitive resin composition. The content of the ink repellent agent relative to the total solid content of the negative photosensitive resin composition coating solution, in other words, the content of the ink repellent agent, that is, the compound (A-1) in the negative photosensitive resin composition is 0.33. %Met.
スピンナーを用いて、支持基板となるガラス基板AN100(旭硝子製、100mm×100mm、0.7mm厚)上に、上記で調製したネガ型感光性樹脂組成物の塗布液を塗布した後、ホットプレート上で、100℃で2分間乾燥させ、膜厚が2.4μmのネガ型感光性樹脂組成物の塗膜を形成した。 (1) Partition formation step Using a spinner, the negative type photosensitive resin composition coating solution prepared above was applied onto a glass substrate AN100 (Asahi Glass, 100 mm × 100 mm, 0.7 mm thickness) serving as a support substrate. Then, it was dried at 100 ° C. for 2 minutes on a hot plate to form a coating film of a negative photosensitive resin composition having a film thickness of 2.4 μm.
上記で得られた上部表面に撥インク性を有する感光性樹脂組成物からなる隔壁付きガラス基板を、ホットプレート上に設置し、160℃で20分間加熱した。この第1の加熱後の隔壁の膜厚(H1)は、2.25μmであった。 (2) 1st heating process The glass substrate with a partition which consists of the photosensitive resin composition which has ink repellency on the upper surface obtained above was installed on the hotplate, and it heated at 160 degreeC for 20 minutes. The partition wall thickness (H1) after the first heating was 2.25 μm.
次に、以下の方法でカラーフィルタ試験用インク(顔料は未配合であるが、粘度、固形分、表面張力を実際のカラーフィルタ用インクと同様に調整した試験用のインク)を調製し、これをインクジェット法により上記第1の加熱工程後のガラス基板上の開口部に注入しインク層を形成させた。 (3) Inkjet (IJ) Step Next, a color filter test ink (pigment is not blended, but the viscosity, solid content, and surface tension are adjusted in the same manner as the actual color filter ink by the following method. And an ink layer was formed by injecting the ink into the opening on the glass substrate after the first heating step.
上記基板上の隔壁で仕切られた各領域にインク層が形成されたガラス基板を、ホットプレート上で、240℃で20分間加熱した。この第2の加熱処理後、隔壁の膜厚(H2)を測定したところ、2.00μmであった。この光学素子は、隔壁上面とインク層上面とが略面一になる構成であり、以下の例においても同様である。 (4) 2nd heating process The glass substrate in which the ink layer was formed in each area | region partitioned off with the partition on the said board | substrate was heated at 240 degreeC for 20 minute (s) on the hotplate. After the second heat treatment, the partition wall thickness (H2) was measured and found to be 2.00 μm. This optical element has a configuration in which the upper surface of the partition wall and the upper surface of the ink layer are substantially flush, and the same applies to the following examples.
また、上記(3)インクジェット工程において各開口部に塗布するインクの量を約240pL(開口部の体積の6倍量)に変更する実験も行った。 In this way, a test optical element having a partition made of a cured resin that partitions the glass substrate into a plurality of compartments and a pixel made up of a plurality of ink layers formed in a region partitioned by the partition on the substrate. Got.
In addition, an experiment was performed in which the amount of ink applied to each opening in the (3) inkjet process was changed to about 240 pL (6 times the volume of the opening).
ネガ型感光性樹脂組成物塗布液が含有する各成分の配合を表1に示すように変更し、上記(2)第1の加熱工程および/または(4)第2の加熱工程における加熱温度を本発明の好ましい範囲内で表1に示すように変更した以外は、実施例1と同様にして、ガラス基板上を複数の区画に仕切る樹脂硬化物からなる隔壁と、基板上の前記隔壁で仕切られた領域に形成された複数のインク層からなる画素を有する試験用の光学素子を得た。 [Examples 2 and 3]
The composition of each component contained in the negative photosensitive resin composition coating solution is changed as shown in Table 1, and the heating temperature in the (2) first heating step and / or (4) second heating step is changed. Except for the changes shown in Table 1 within the preferable range of the present invention, a partition made of a cured resin product that partitions the glass substrate into a plurality of sections is partitioned by the partition on the substrate in the same manner as in Example 1. A test optical element having pixels composed of a plurality of ink layers formed in the formed region was obtained.
ネガ型感光性樹脂組成物塗布液が含有する各成分の配合を表1に示すように変更し、上記(2)第1の加熱工程または(4)第2の加熱工程における加熱温度を、表1に示すように、本発明の好ましい範囲以外となる条件に変更した他は、実施例1と同様にして、ガラス基板上を複数の区画に仕切る樹脂硬化物からなる隔壁と、基板上の前記隔壁で仕切られた領域に形成された複数のインク層からなる画素を有する試験用の光学素子を得た。 [Comparative Examples 1 and 2]
The composition of each component contained in the negative photosensitive resin composition coating solution is changed as shown in Table 1, and the heating temperature in the above (2) first heating step or (4) second heating step is shown in Table 1. As shown in FIG. 1, the partition wall made of a cured resin material that partitions the glass substrate into a plurality of compartments in the same manner as in Example 1 except that the conditions are changed to a range other than the preferred range of the present invention, and the above-mentioned on the substrate. A test optical element having a pixel composed of a plurality of ink layers formed in a region partitioned by a partition wall was obtained.
表2に示す配合のネガ型感光性樹脂組成物塗布液を用いて、以下のように隔壁を作製した。なお、各例における、HO、H1、H2の値、開口部の体積も表2に示す。
(1)隔壁形成工程
実施例1と同様にして、ガラス基板AN100上に、膜厚が2.4μmのネガ型感光性樹脂組成物の塗膜を形成した。上記で得られたガラス基板上のネガ型感光性樹脂組成物の塗膜に、超高圧水銀灯を用いて、露光量がi線(365nm)基準で30mW/cm2の光を、マスクを通して、1.7秒間、照射し、50mJ/cm2を露光した。なお、マスクは、遮光部が150μm×300μm、光透過部が20μmの格子状パターンであり、ガラス基板上に形成される隔壁で仕切られた領域すなわち開口部(ドット)の体積が約90pLとなる設計であった。
露光後の塗膜付きガラス基板を、無機アルカリタイプ現像液セミクリーンDL-A4(商品名、横浜油脂工業社製)の10倍希釈水溶液にてシャワー現像し、未露光部を除去した後、水でリンスした。さらに常温で乾燥させて、上部表面に撥インク性を有する膜厚(H0)2.4μmの隔壁が形成されたガラス基板を得た。
(2)第1の加熱工程
上記で得られた上部表面に撥インク性を有する感光性樹脂組成物からなる隔壁付きガラス基板を、ホットプレート上に設置し、180℃で20分間加熱した。この第1の加熱後の隔壁の膜厚(H1)は、2.2μmであった。
(3)インクジェット(IJ)工程
実施例1と同様にして、ガラス基板上の開口部にインク層を形成させた。インクの注入量は、開口部の体積の4倍量、6倍量の両方について実験した。
(4)第2の加熱工程
上記基板上の隔壁で仕切られた各領域にインク層が形成されたガラス基板を、ホットプレート上で、230℃で20分間加熱した。この第2の加熱処理後、隔壁の膜厚(H2)を測定したところ、2μmであった。
このようにして、ガラス基板上を複数の区画に仕切る樹脂硬化物からなる隔壁と、基板上の前記隔壁で仕切られた領域に形成された複数のインク層からなる画素を有する試験用の光学素子を得た。 [Examples 4 to 7, Comparative Example 3]
Using the negative photosensitive resin composition coating liquid having the composition shown in Table 2, partition walls were prepared as follows. Table 2 also shows the values of HO, H1, and H2 and the volume of the opening in each example.
(1) Partition Formation Step In the same manner as in Example 1, a negative photosensitive resin composition coating film having a thickness of 2.4 μm was formed on the glass substrate AN100. Using a super high pressure mercury lamp, a light of 30 mW / cm 2 on the basis of i-line (365 nm) is applied to the coating film of the negative photosensitive resin composition on the glass substrate obtained above through a mask. Irradiated for 7 seconds to expose 50 mJ / cm 2 . The mask has a lattice pattern with a light shielding part of 150 μm × 300 μm and a light transmission part of 20 μm, and the volume of the region partitioned by the partition formed on the glass substrate, that is, the opening (dot) is about 90 pL. It was a design.
The glass substrate with the coated film after exposure is shower-developed with a 10-fold diluted aqueous solution of an inorganic alkali type developer semi-clean DL-A4 (trade name, manufactured by Yokohama Oil & Fats Co., Ltd.) to remove unexposed portions, and then water. Rinse with. Further, the glass substrate was dried at room temperature to obtain a glass substrate having a partition wall having a film thickness (H0) of 2.4 μm having ink repellency on the upper surface.
(2) 1st heating process The glass substrate with a partition which consists of a photosensitive resin composition which has ink repellency on the upper surface obtained above was installed on the hotplate, and was heated at 180 degreeC for 20 minutes. The partition wall thickness (H1) after the first heating was 2.2 μm.
(3) Inkjet (IJ) process In the same manner as in Example 1, an ink layer was formed in the opening on the glass substrate. The amount of ink injected was tested for both 4 and 6 times the volume of the opening.
(4) 2nd heating process The glass substrate in which the ink layer was formed in each area | region divided by the partition on the said board | substrate was heated at 230 degreeC for 20 minute (s) on the hotplate. After the second heat treatment, the partition wall thickness (H2) was measured and found to be 2 μm.
In this way, a test optical element having a partition made of a cured resin that partitions the glass substrate into a plurality of compartments and a pixel made up of a plurality of ink layers formed in a region partitioned by the partition on the substrate. Got.
上記各実施例および各比較例で得られた試験用光学素子を用いて、白抜け、オーバーフロー、良セル率(%)、耐溶剤性、隔壁形成工程後の隔壁膜厚(H0)、第1の加熱工程後の隔壁膜厚(H1)、第2の加熱工程後の隔壁膜厚(H2)、H0/H1、H1/H2、インク層隔壁際膜厚、インク層中央膜厚、インク層均一性を以下に示す方法で評価した。評価結果を表1の下欄に示す。 <Evaluation method and evaluation results>
Using the test optical elements obtained in the above Examples and Comparative Examples, white spots, overflow, good cell rate (%), solvent resistance, partition wall thickness (H0) after partition formation step, first The partition wall thickness (H1) after the heating step, the partition wall thickness (H2) after the second heating step, H0 / H1, H1 / H2, the ink layer partition wall thickness, the ink layer central thickness, and the ink layer uniformity The property was evaluated by the following method. The evaluation results are shown in the lower column of Table 1.
各試験用光学素子の白抜けの有無を、超深度形状測定顕微鏡VK-8500(キーエンス社製、以下同じ)を用いて観察した。試験用光学素子の縦1cm×横1cmの領域を代表サンプルとし観察し、白抜けが全くない場合を○、白抜けが1箇所でもあるものを×として判定した。 [Outline]
The presence or absence of white spots in each test optical element was observed using an ultradeep shape measuring microscope VK-8500 (manufactured by Keyence Corporation, the same shall apply hereinafter). A region of 1 cm in length and 1 cm in width of the test optical element was observed as a representative sample.
各試験用光学素子におけるインクのオーバーフローの状態を、超深度形状測定顕微鏡を用いて観察した。試験用光学素子の縦1cm×横1cmの領域を代表サンプルとし観察し、隔壁上にインクが乗り上げている箇所が全くないものを○、隔壁上にインクが乗り上げている箇所が1箇所でもあるものを×として判定した。
[良セル率(%)]
第1の加熱工程終了後、インクジェット法により、実施例1と同様にして得られたインクを各開口部に塗布した。インクの塗布量を変え、開口部の体積の4倍量、6倍量を塗布する実験を行った。この実験では、わざとインクの液滴が開口部の中央でなく隔壁寄りの場所に着弾するように調整を行った。塗布後、第2の加熱工程を経て、隔壁が形成されたガラス基板を得た。このガラス基板について、オーバーフローなくインクが開口部内に注入されたセル数を、全セル数で除した値を良品率(%)として評価した。 [overflow]
The state of ink overflow in each test optical element was observed using an ultradeep shape measuring microscope. Observe as a representative sample the area of 1cm x 1cm of the optical element for testing, where there is no ink on the partition wall, and at least one place where the ink is on the partition wall Was determined as x.
[Good cell rate (%)]
After completion of the first heating step, ink obtained in the same manner as in Example 1 was applied to each opening by an inkjet method. An experiment was conducted in which the amount of ink applied was changed, and the volume of the opening was applied 4 to 6 times. In this experiment, an adjustment was made so that the ink droplets landed not on the center of the opening but on the place near the partition. After the application, a glass substrate on which partition walls were formed was obtained through a second heating step. With respect to this glass substrate, a value obtained by dividing the number of cells in which ink was injected into the opening without overflow by the total number of cells was evaluated as a non-defective product rate (%).
各試験用光学素子における隔壁のインクによる浸食状況を、超深度形状測定顕微鏡を用いて観察した。隔壁がインクにより侵食されず、隔壁上が荒れていないものを○、隔壁がインクにより若干侵食されていて、隔壁上が若干荒れているものを△、隔壁がインクにより侵食され、隔壁上が荒れているものを×として、判定した。
[隔壁形成工程後の隔壁膜厚(H0)]
隔壁形成工程後の隔壁膜厚(H0)を、超深度形状測定顕微鏡を用いて測定した。なお、膜厚の測定は隔壁の5箇所で行った平均の値である。 [Solvent resistance]
The state of erosion of the partition walls by ink in each test optical element was observed using an ultra-deep shape measuring microscope. When the partition wall is not eroded by the ink and the partition wall is not rough, ◯, when the partition wall is slightly eroded by the ink, and the partition wall is slightly rough △, the partition wall is eroded by the ink and the partition wall is rough Judgment was made as x.
[Particle thickness after partition formation step (H0)]
The partition wall thickness (H0) after the partition formation step was measured using an ultradeep shape measuring microscope. In addition, the measurement of a film thickness is the average value performed in five places of a partition.
第1の加熱工程後の隔壁膜厚(H1)を、超深度形状測定顕微鏡を用いて測定した。なお、膜厚の測定は隔壁の5箇所で行った平均の値である。 [Particle thickness after first heating step (H1)]
The partition wall thickness (H1) after the first heating step was measured using an ultradeep shape measuring microscope. In addition, the measurement of a film thickness is the average value performed in five places of a partition.
第2の加熱工程後の隔壁膜厚(H2)を、超深度形状測定顕微鏡を用いて測定した。なお、膜厚の測定は隔壁の5箇所で行った平均の値である。 [Partition wall thickness after second heating step (H2)]
The partition wall thickness (H2) after the second heating step was measured using an ultradeep shape measuring microscope. In addition, the measurement of a film thickness is the average value performed in five places of a partition.
上記で測定したH0およびH1の値から算出した値である。
[H1/H2]
上記で測定したH1およびH2の値から算出した値である。 [H0 / H1]
It is a value calculated from the values of H0 and H1 measured above.
[H1 / H2]
It is a value calculated from the values of H1 and H2 measured above.
[インク層隔壁際膜厚(Mave)]
各試験用光学素子の3箇所の画素すなわちインク層で、隔壁際の部分の膜厚を、超深度形状測定顕微鏡VK-8500(キーエンス社製)を用いて測定した。測定箇所は、各画素について図2(a)および(b)に示すとおり各辺の中央部隔壁際の4点、すなわち図2(b)に示すy1~y4の箇所であり、これらの平均値をもってその画素におけるインク層隔壁際膜厚(M)とし、さらに測定した3箇所の画素の平均値をインク層隔壁際膜厚(Mave)とした。 The following evaluation was performed when the amount of ink applied was four times the volume of the opening.
[Ink layer partition wall thickness (Mave)]
The film thickness at the partition wall of three pixels of each test optical element, ie, the ink layer, was measured using an ultradeep shape measuring microscope VK-8500 (manufactured by Keyence Corporation). As shown in FIGS. 2 (a) and 2 (b), the measurement points are four points on the central partition wall of each side, that is, the points y1 to y4 shown in FIG. 2 (b). The thickness at the ink layer partition wall (M) in the pixel was determined, and the measured average value of the three pixels was defined as the ink layer partition wall thickness (Mave).
各試験用光学素子の3箇所の画素すなわちインク層で、中央の膜厚を、超深度形状測定顕微鏡VK-8500(キーエンス社製)を用いて測定した。測定箇所は、各画素について図2(a)および(b)に示すとおりであり、該測定値をその画素におけるインク層中央、図2(b)に示すxの位置の膜厚(N)とした。さらに測定した3箇所の画素の平均値をインク層隔壁際膜厚(Nave)とした。 [Ink layer center film thickness (Nave)]
The film thickness at the center of each of the three test optical elements, that is, the ink layers, was measured using an ultradeep shape measuring microscope VK-8500 (manufactured by Keyence Corporation). The measurement location is as shown in FIGS. 2A and 2B for each pixel, and the measured value is measured at the center of the ink layer in that pixel, the film thickness (N) at the position x shown in FIG. did. Further, the average value of the three pixels measured was defined as the ink layer partition wall thickness (Nave).
上記で得られたMaveおよびNaveの値から以下の計算式で算出した値である。
Mave/Nave×100 [Ink layer uniformity]
It is a value calculated by the following calculation formula from the Mave and Nave values obtained above.
Mave / Nave × 100
比較例2では、各工程後の隔壁の高さの関係において、H0/H1が1.18を越えており、またH1/H2が1.02未満であって、本発明の製造方法の範囲外であるため、得られた試験用光学素子には、白抜けが発生し、インク層均一性が低かった。
比較例3では、H1/H2が1.02未満であって、本発明の製造方法の範囲外であるため、得られた試験用光学素子は、インク層均一性が低かった。さらに、インクの塗布量を開口部体積の6倍とした場合は、インクがオーバーフローした。なお、比較例3で白抜けが良好な結果であったことについては、以下のように推察される。隔壁の高さが高くなるにつれてインク層の高さも高くなるため、光を遮る距離が大きくなることによって白抜けが起こりにくくなる傾向がある。このことが、本発明の製造方法の範囲外であることによる白抜け発生の可能性を上回ったものと推察される。
以上のように、各工程後の隔壁の高さの関係が本発明の製造方法の範囲であれば、インクのオーバーフローを抑制できる。さらに、インクの塗布量を多くした場合においても、オーバーフローがないということは、インク調製の自由度を高めることにも寄与する。すなわち、開口部に塗布するインクは、光学素子の種類によって組成・固形分など種々のものが選択される。よって、固形分濃度が小さいインクを用いる場合であっても、本発明の製造方法によれば、インクのオーバーフローなく光学素子を製造できる。 On the other hand, in Comparative Example 1, H0 / H1 is less than 1.05 in the relationship between the heights of the partition walls after each step, which is outside the scope of the manufacturing method of the present invention. Overflow was observed and the solvent resistance was insufficient.
In Comparative Example 2, H0 / H1 exceeded 1.18 and H1 / H2 was less than 1.02 in relation to the height of the partition walls after each step, which is outside the scope of the manufacturing method of the present invention. Therefore, white spots were generated in the obtained test optical element, and the uniformity of the ink layer was low.
In Comparative Example 3, H1 / H2 was less than 1.02, which was outside the range of the production method of the present invention, and thus the obtained test optical element had low ink layer uniformity. Furthermore, when the amount of ink applied was 6 times the volume of the opening, the ink overflowed. In addition, it is guessed as follows about the white blank having a favorable result in the comparative example 3. As the height of the partition wall increases, the height of the ink layer also increases. Therefore, white distance tends to be less likely to occur due to an increase in the light blocking distance. This is surmised to exceed the possibility of white spots due to being outside the scope of the production method of the present invention.
As described above, if the relationship between the heights of the partition walls after each step is within the range of the production method of the present invention, ink overflow can be suppressed. Furthermore, even when the amount of ink applied is increased, the fact that there is no overflow also contributes to increasing the degree of freedom in ink preparation. That is, as the ink applied to the opening, various types such as a composition and a solid content are selected depending on the type of the optical element. Therefore, even when an ink having a low solid content concentration is used, according to the manufacturing method of the present invention, an optical element can be manufactured without overflow of the ink.
なお、2009年5月20日に出願された日本特許出願2009-122149号の明細書、特許請求の範囲、図面及び要約書の全内容をここに引用し、本発明の明細書の開示として、取り入れるものである。 The manufacturing method of the present invention can be suitably used for manufacturing optical elements such as color filters, organic EL display elements, and organic TFT arrays.
It should be noted that the entire content of the specification, claims, drawings and abstract of Japanese Patent Application No. 2009-122149 filed on May 20, 2009 is cited herein as the disclosure of the specification of the present invention. Incorporated.
Claims (10)
- 支持基板と、前記支持基板の主面上に該主面を複数の区画に仕切るように形成された樹脂硬化物からなる隔壁と、前記支持基板上の前記隔壁で仕切られた領域にそれぞれ形成された複数の画素とを有する光学素子の製造方法において、
前記支持基板の主面上に、樹脂組成物からなり上部表面に撥インク性を有する隔壁を形成する工程と、前記隔壁を加熱して前記樹脂組成物の硬化を促進させる第1の加熱工程と、前記支持基板上の前記隔壁で仕切られた領域にインクジェット法によりインクを注入してインク層を形成する工程と、前記隔壁と前記インク層を加熱して画素を形成するとともに前記樹脂組成物の硬化を完了させる第2の加熱工程と、を順に有し、
前記隔膜形成工程の後の隔壁の高さをH0とし、前記第1の加熱工程後の隔壁の高さをH1とし、前記第2の加熱工程後の隔壁の高さをH2とした場合に、H0、H1およびH2が、以下の関係にあることを特徴とする光学素子の製造方法。
H0/H1で表される比が、1.05≦H0/H1≦1.18であり、
H1/H2で表される比が、1.02≦H1/H2≦1.30である。 A support substrate, a partition wall made of a cured resin formed on the main surface of the support substrate so as to partition the main surface into a plurality of compartments, and a region partitioned by the partition walls on the support substrate, respectively. In a method for manufacturing an optical element having a plurality of pixels,
A step of forming a partition made of a resin composition on the main surface of the support substrate and having ink repellency on the upper surface; and a first heating step of heating the partition to promote curing of the resin composition; A step of injecting ink into an area partitioned by the partition wall on the support substrate by an ink jet method to form an ink layer; heating the partition wall and the ink layer to form a pixel; and forming the resin composition A second heating step for completing the curing, in order,
When the height of the partition wall after the diaphragm forming step is H0, the height of the partition wall after the first heating step is H1, and the height of the partition wall after the second heating step is H2. A method for manufacturing an optical element, wherein H0, H1, and H2 are in the following relationship.
The ratio represented by H0 / H1 is 1.05 ≦ H0 / H1 ≦ 1.18,
The ratio represented by H1 / H2 is 1.02 ≦ H1 / H2 ≦ 1.30. - 前記第2の加熱工程後の隔壁の高さH2が0.05μm~50μmである請求項1記載の光学素子の製造方法。 2. The method for manufacturing an optical element according to claim 1, wherein a height H2 of the partition wall after the second heating step is 0.05 μm to 50 μm.
- 前記第1の加熱工程における加熱温度が150℃~215℃であり、前記第2の加熱工程における加熱温度が220℃~250℃である請求項1または2記載の光学素子の製造方法。 3. The method of manufacturing an optical element according to claim 1, wherein the heating temperature in the first heating step is 150 ° C. to 215 ° C., and the heating temperature in the second heating step is 220 ° C. to 250 ° C.
- 前記隔壁形成工程後、前記隔壁に250nm~450nmの電磁波を照射することなく、前記第1の加熱工程、前記インク層形成工程および前記第2の加熱工程を順に行うことを特徴とする請求項1~3のいずれかに記載の光学素子の製造方法。 The first heating step, the ink layer forming step, and the second heating step are sequentially performed after the partition forming step without irradiating the partition with electromagnetic waves of 250 nm to 450 nm. 4. A method for producing an optical element according to any one of items 1 to 3.
- 前記樹脂組成物が感光性樹脂組成物であって、前記隔壁形成工程が、支持基板上への感光性樹脂組成物の層形成、露光および現像の操作を順に行うことからなる請求項1~4のいずれか1項に記載の光学素子の製造方法。 The resin composition is a photosensitive resin composition, and the partition forming step comprises sequentially performing operations of layer formation of the photosensitive resin composition on a support substrate, exposure and development. The manufacturing method of the optical element of any one of these.
- 前記感光性樹脂組成物がネガ型感光性樹脂組成物である請求項5に記載の光学素子の製造方法。 The method for producing an optical element according to claim 5, wherein the photosensitive resin composition is a negative photosensitive resin composition.
- 前記感光性樹脂組成物が熱架橋剤を含有する請求項5または6に記載の光学素子の製造方法。 The method for producing an optical element according to claim 5 or 6, wherein the photosensitive resin composition contains a thermal crosslinking agent.
- 前記隔壁形成工程において、隔壁上部表面に撥インク性を付与する手段が含フッ素撥インク剤の使用を含む請求項1~7のいずれか1項に記載の光学素子の製造方法。 The method for producing an optical element according to any one of claims 1 to 7, wherein in the partition forming step, the means for imparting ink repellency to the upper surface of the partition includes the use of a fluorine-containing ink repellent.
- 前記隔壁が遮光性を有する遮光層である請求項1~8のいずれか1項に記載の光学素子の製造方法。 The method for manufacturing an optical element according to any one of claims 1 to 8, wherein the partition is a light shielding layer having a light shielding property.
- 前記光学素子がカラーフィルタ、有機EL表示素子または有機TFTアレイである請求項1~9のいずれか1項に記載の光学素子の製造方法。 The method for manufacturing an optical element according to any one of claims 1 to 9, wherein the optical element is a color filter, an organic EL display element, or an organic TFT array.
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