CN103941482A - Photo spacer manufacturing device and method, substrate and display device - Google Patents

Photo spacer manufacturing device and method, substrate and display device Download PDF

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Publication number
CN103941482A
CN103941482A CN201410158640.5A CN201410158640A CN103941482A CN 103941482 A CN103941482 A CN 103941482A CN 201410158640 A CN201410158640 A CN 201410158640A CN 103941482 A CN103941482 A CN 103941482A
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CN
China
Prior art keywords
chock insulator
insulator matter
raw material
mould plate
die
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Application number
CN201410158640.5A
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Chinese (zh)
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CN103941482B (en
Inventor
肖宇
吴洪江
黎敏
姜晶晶
李晓光
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BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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Priority to CN201410158640.5A priority Critical patent/CN103941482B/en
Publication of CN103941482A publication Critical patent/CN103941482A/en
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Publication of CN103941482B publication Critical patent/CN103941482B/en
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Abstract

The invention relates to the field of machinery and display and provides a photo spacer manufacturing device and method, a substrate and a display device. The photo spacer manufacturing device comprises a photo spacer raw material tank, a partition board and a photo spacer mould plate, wherein the tank bottom of the photo spacer raw material tank, the photo spacer mould plate and the partition board are respectively provided with multiple through holes, and the through holes correspond to the sizes and positions of photo spacers needing to be manufactured. The partition board is located between the tank bottom of the photo spacer raw material tank and the upper surface of the photo spacer mould plate and can be attached to the through holes in the tank bottom of the photo spacer raw material tank and move in parallel in the horizontal direction. Through the photo spacer manufacturing device, it can be guaranteed that the manufactured photo spacers are uniform, and the utilization rate of photo spacer raw materials can be increased.

Description

Make device and method, substrate and the display device of chock insulator matter
Technical field
The present invention relates to mechanical field and demonstration field, be specifically related to a kind of device and method, substrate and display device of making chock insulator matter.
Background technology
Thin Film Transistor-LCD (TFT-LCD, Thin Film Transistor Liquid Crystal Display) becomes the main flow in market with its high image quality, the high and low consumed power of space availability ratio, the many merits such as radiationless.In the display panels of Thin Film Transistor-LCD, color membrane substrates and array base palte are oppositely arranged formation liquid crystal cell.Wherein, for ensureing the thick homogeneity of box of liquid crystal cell, chock insulator matter (Photo Spacer, PS) plays important effect.
Tradition is prepared in the flow process of chock insulator matter, conventionally applies after photoresist at whole chock insulator matter substrate surface, after exposure imaging hot setting, forms chock insulator matter.But, because chock insulator matter stock size is less, traditional exposure imaging technique is difficult to control the homogeneity (particularly undersized chock insulator matter) of chock insulator matter, the chock insulator matter height of preparing is often different, easily cause the height difference due to chock insulator matter when involutory to make the thickness of liquid crystal cell occur deviation or inequality, be difficult to make display to obtain high-contrast.Meanwhile, through exposure technology and the photoresist that stays to account for the ratio of photoresist of total coating minimum, can cause very large waste.In like manner, the chock insulator matter that is applied to the other types of other displays also can produce with same cause similar problem.
Summary of the invention
(1) technical matters solving
For the deficiencies in the prior art, the invention provides a kind of device and method, substrate and display device of making chock insulator matter, not only can guarantee the homogeneity of the chock insulator matter of producing, can also improve the utilization factor of chock insulator matter raw material.
(2) technical scheme
For realizing above object, the present invention is achieved by the following technical programs:
A device of making chock insulator matter, is characterized in that, this device comprises chock insulator matter raw material tank, demarcation strip and chock insulator matter Die and mould plate, wherein:
The bottom land of described chock insulator matter raw material tank, the chock insulator matter Die and mould plate through hole corresponding with the size and location that comprise multiple and required making chock insulator matter on demarcation strip;
Described demarcation strip, between the bottom land of chock insulator matter raw material tank and the upper surface of chock insulator matter Die and mould plate, and can fit in the bottom land through hole along continuous straight runs parallel of described chock insulator matter raw material tank.
Preferably, described chock insulator matter raw material is photoresist.
Preferably, described chock insulator matter Die and mould plate is to ultraviolet light transmission.
Preferably, described chock insulator matter raw material tank and demarcation strip are to not transmission of ultraviolet light.
Preferably, the bottom land bottom surface of described chock insulator matter raw material tank and the upper surface of chock insulator matter Die and mould plate are plane, and described demarcation strip is smooth to be fitted between two planes.
A method of utilizing the above-mentioned device that any one makes chock insulator matter to make chock insulator matter, is characterized in that, the method comprises:
Mobile described demarcation strip to be to block the through hole of bottom land of described chock insulator matter raw material tank, and adds chock insulator matter raw material in described chock insulator matter raw material tank;
Mobile described demarcation strip makes the through hole alignment on bottom land, chock insulator matter Die and mould plate and the demarcation strip of described chock insulator matter raw material tank, and chock insulator matter raw material is flowed in the space that chock insulator matter Die and mould plate and chock insulator matter substrate surround;
After chock insulator matter raw material flows into completely, mobile described demarcation strip separates chock insulator matter raw material tank and the chock insulator matter raw material in chock insulator matter Die and mould plate, and the chock insulator matter raw material in described chock insulator matter Die and mould plate is solidified.
Preferably, described chock insulator matter raw material is photoresist.
Preferably, described by the chock insulator matter raw material in described chock insulator matter Die and mould plate solidify comprise:
Be shining into ultraviolet light from the side of described chock insulator matter Die and mould plate, the photoresist in described chock insulator matter Die and mould plate is solidified.
A kind of substrate, is characterized in that, comprises the chock insulator matter of the method made that adopts above-mentioned any one making chock insulator matter.
A kind of display device, is characterized in that, comprises above-mentioned any one substrate.
(3) beneficial effect
The present invention at least has following beneficial effect:
The present invention by the bottom of chock insulator matter raw material tank and between chock insulator matter Die and mould plate upper surface, arrange one can parallel demarcation strip, and be configured such that chock insulator matter raw material can flow into multiple through holes of chock insulator matter Die and mould plate smoothly, thereby can realize the inflow of controlling chock insulator matter raw material by flexible moving partition and separate.Only need be cured the chock insulator matter raw material in chock insulator matter Die and mould plate afterwards in separation, just can form the chock insulator matter that will make.
Compared with prior art, the chock insulator matter shape of made of the present invention is determined by the mold shape of chock insulator matter Die and mould plate, so can ensure the homogeneity of its shape and height.And the present invention need to not apply chock insulator matter raw material at whole chock insulator matter substrate surface in the process of making chock insulator matter, so saved the use amount of chock insulator matter raw material, improve the utilization factor of chock insulator matter raw material.
Certainly, implement arbitrary product of the present invention or method and might not need to reach above-described all advantages simultaneously.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, accompanying drawing to required use in embodiment or description of the Prior Art being done to one below simply introduces, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is a kind of structure drawing of device of making chock insulator matter in one embodiment of the invention;
Fig. 2 is the fundamental diagram of a kind of device of making chock insulator matter in one embodiment of the invention;
Fig. 3 is a kind of method flow diagram of making chock insulator matter in one embodiment of the invention;
Fig. 4 is the schematic diagram of the chock insulator matter produced on chock insulator matter substrate in one embodiment of the invention.
Wherein, in Fig. 1 to Fig. 4:
1---chock insulator matter raw material tank; 2---demarcation strip; 3---chock insulator matter Die and mould plate; 4---chock insulator matter raw material; 5---chock insulator matter substrate.
Embodiment
For making object, technical scheme and the advantage of the embodiment of the present invention clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment 1
The embodiment of the present invention has proposed a kind of device of making chock insulator matter, and referring to Fig. 1, this device comprises chock insulator matter raw material tank 1, demarcation strip 2 and chock insulator matter Die and mould plate 3, wherein:
On bottom land, chock insulator matter Die and mould plate 3 and the demarcation strip 2 of described chock insulator matter raw material tank 1, comprise the corresponding through hole of size and location of multiple and required making chock insulator matter;
Described demarcation strip 2, between the bottom land bottom surface of chock insulator matter raw material tank 1 and the upper surface of chock insulator matter Die and mould plate 3, and can fit in the bottom land through hole along continuous straight runs parallel of described chock insulator matter raw material tank.
Wherein, in chock insulator matter raw material tank 1, can hold chock insulator matter raw material 4, this device can make chock insulator matter raw material 4 flow into chock insulator matter Die and mould plate 3 by moving partition 2, and drop on the surface of chock insulator matter substrate 5, or the outflow of blocking-up chock insulator matter raw material 4, makes chock insulator matter raw material 4 natural packings in chock insulator matter raw material tank 1.
And, because the size of through hole and position are corresponding to loading and the filling position of chock insulator matter raw material, so it should decide according to the size and location of required making chock insulator matter.General design all can make the shape of through holes of same position identical, dead in line, the position of the vertical chock insulator matter corresponding to the required making on chock insulator matter substrate.
In addition, the described through hole in chock insulator matter Die and mould plate 3 is connected with a die region, and chock insulator matter raw material can be cured into predetermined shape in this region, so its die region shape decides according to the shape of required making chock insulator matter.
Described in beneficial effect above, this device not only can be guaranteed the homogeneity of the chock insulator matter of producing, and can also improve the utilization factor of chock insulator matter raw material.
Preferably, the bottom land bottom surface of described chock insulator matter raw material tank 1 and the upper surface of chock insulator matter Die and mould plate 3 are plane, and described demarcation strip 2 is smooth to be fitted between two planes.Such design is conducive to use flexibility ratio and the serviceable life of demarcation strip 2 on the one hand, is also conducive on the other hand keep chock insulator matter raw material 4 not outflow, and further improves the utilization factor of chock insulator matter raw material 4.
Preferably, in the situation that described chock insulator matter raw material 4 is photoresist, because photoresist can solidify under UV-irradiation, so can adopt, the light transmissive material of ultraviolet is made to chock insulator matter Die and mould plate 3, and adopt, the material of not transmission of ultraviolet light is made to chock insulator matter raw material tank 1 and demarcation strip 2, make can directly solidify photoresist wherein by the mode of UV-irradiation after photoresist flow into chock insulator matter Die and mould plate 3 completely.The making flow process of chock insulator matter can be further simplified in such design, optimizes and makes effect, thereby improve make efficiency.
Certainly, described device can also use the chock insulator matter raw material tank as funnel shaped or other shapes, or adopt different types of chock insulator matter raw material, its obviously and the embodiment of the present invention there is common technical characterictic, can solve same technical matters, produce same technique effect, thereby of this sort change should not make the essence of its technical scheme depart from the spirit and scope of embodiment of the present invention technical scheme.
Embodiment 2
The embodiment of the present invention has proposed a kind of method of utilizing above-mentioned any one device to make chock insulator matter, and referring to Fig. 3, the method comprises:
Step 301: make before chock insulator matter, mobile described demarcation strip 2 to be to block the through hole of bottom land of described chock insulator matter raw material tank 1, and adds chock insulator matter raw material 4(as shown in Figure 1 in described chock insulator matter raw material tank 1);
Step 302: while making chock insulator matter, mobile described demarcation strip 2 makes the through hole alignment on bottom land, chock insulator matter Die and mould plate 3 and the demarcation strip 2 of described chock insulator matter raw material tank 1, and chock insulator matter raw material 4 is flowed in the space that chock insulator matter Die and mould plate 3 and chock insulator matter substrate 5 surround (as shown in Figure 2);
Step 303: after chock insulator matter raw material 4 flows into completely, mobile described demarcation strip 2 separates chock insulator matter raw material tank 1 and the chock insulator matter raw material 4 in chock insulator matter Die and mould plate 3, and the chock insulator matter raw material in described chock insulator matter Die and mould plate 34 is solidified to (as shown in Figure 2).
Visible, utilize said method just can on the chock insulator matter substrate 5 of lower surface that is fitted in chock insulator matter Die and mould plate 3, make corresponding chock insulator matter, as shown in Figure 4, wherein the chock insulator matter raw material shown in caption 4, through overcuring processing, has formed corresponding chock insulator matter to the chock insulator matter completing.And made chock insulator matter shape is determined by the mold shape of chock insulator matter Die and mould plate, so can ensure the homogeneity of its shape and height.In addition, need to apply chock insulator matter raw material at whole chock insulator matter substrate surface in the method, so saved the use amount of chock insulator matter raw material, improve the utilization factor of chock insulator matter raw material.
Preferably, in the time that described chock insulator matter raw material is photoresist, above-mentioned chock insulator matter raw material in described chock insulator matter Die and mould plate 3 is solidified and is just specially: the chock insulator matter raw material in described chock insulator matter Die and mould plate 34 is solidified.Referring to Fig. 2, the black arrow in chock insulator matter Die and mould plate 3 has just represented the direction of UV-irradiation.Thereby under the irradiation of ultraviolet light, the photoresist 4 in chock insulator matter Die and mould plate 3 will solidify.Just can form chock insulator matter as shown in Figure 4 when solidifying after all completing, visible, the making flow process of chock insulator matter can be further simplified in such design, optimization making effect, thereby raising make efficiency.
Certainly, corresponding to different device, the method that the embodiment of the present invention proposes also can be by slightly implementing after inching, its obviously and the embodiment of the present invention there is common technical characterictic, can solve same technical matters, produce same technique effect, thereby of this sort change should not make the essence of its technical scheme depart from the spirit and scope of embodiment of the present invention technical scheme.
Embodiment 3
Based on identical inventive concept, the embodiment of the present invention has proposed a kind of substrate, and it comprises the chock insulator matter of the method made of above-mentioned any one making chock insulator matter.More specifically, described substrate comprises color membrane substrates, array base palte, and it can be also other substrates with similar structures or function certainly.
The substrate providing due to the embodiment of the present invention comprises the chock insulator matter that above-mentioned any one method is made, thereby it has identical technical characterictic, so also can solve same technical matters, produces identical technique effect.
Embodiment 4
Based on identical inventive concept, the embodiment of the present invention has proposed a kind of display device, this display device comprises any one above-mentioned substrate, this display device can be: liquid crystal panel, Electronic Paper, OLED(Organic Light Emitting Display, organic light-emitting diode display) any product or parts with Presentation Function such as panel, mobile phone, panel computer, televisor, display, notebook computer, digital album (digital photo frame), navigating instrument.
The substrate providing due to the embodiment of the present invention comprises above-mentioned any one substrate, thereby it has identical technical characterictic, so also can solve same technical matters, produces identical technique effect.
In sum, the invention provides a kind of device and method, substrate and display device of making chock insulator matter, not only can guarantee the homogeneity of the chock insulator matter of producing, can also improve the utilization factor of chock insulator matter raw material, thereby can improve the display effect of respective display apparatus, reduce corresponding cost of manufacture, be applicable to the industrial flow as Thin Film Transistor-LCD.
It should be noted that, in this article, relational terms such as the first and second grades is only used for an entity or operation to separate with another entity or operational zone, and not necessarily requires or imply and between these entities or operation, have the relation of any this reality or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thereby the process, method, article or the equipment that make to comprise a series of key elements not only comprise those key elements, but also comprise other key elements of clearly not listing, or be also included as the intrinsic key element of this process, method, article or equipment.The in the situation that of more restrictions not, the key element being limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment that comprises described key element and also have other identical element.
Above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.

Claims (10)

1. a device of making chock insulator matter, is characterized in that, this device comprises chock insulator matter raw material tank, demarcation strip and chock insulator matter Die and mould plate, wherein:
The bottom land of described chock insulator matter raw material tank, the chock insulator matter Die and mould plate through hole corresponding with the size and location that comprise multiple and required making chock insulator matter on demarcation strip;
Described demarcation strip, between the bottom land of chock insulator matter raw material tank and the upper surface of chock insulator matter Die and mould plate, and can fit in the bottom land through hole along continuous straight runs parallel of described chock insulator matter raw material tank.
2. device according to claim 1, is characterized in that, described chock insulator matter raw material is photoresist.
3. device according to claim 2, is characterized in that, described chock insulator matter Die and mould plate is to ultraviolet light transmission.
4. device according to claim 2, is characterized in that, described chock insulator matter raw material tank and demarcation strip are to not transmission of ultraviolet light.
5. according to the device described in any one in claim 1 to 4, it is characterized in that, the bottom land bottom surface of described chock insulator matter raw material tank and the upper surface of chock insulator matter Die and mould plate are plane, and described demarcation strip is smooth to be fitted between two planes.
6. a method of making chock insulator matter is installed in utilization described in claim 1 to 5 any one, it is characterized in that, the method comprises:
Mobile described demarcation strip to be to block the through hole of bottom land of described chock insulator matter raw material tank, and adds chock insulator matter raw material in described chock insulator matter raw material tank;
Mobile described demarcation strip makes the through hole alignment on bottom land, chock insulator matter Die and mould plate and the demarcation strip of described chock insulator matter raw material tank, and chock insulator matter raw material is flowed in the space that chock insulator matter Die and mould plate and chock insulator matter substrate surround;
After chock insulator matter raw material flows into completely, mobile described demarcation strip separates chock insulator matter raw material tank and the chock insulator matter raw material in chock insulator matter Die and mould plate, and the chock insulator matter raw material in described chock insulator matter Die and mould plate is solidified.
7. method according to claim 6, is characterized in that, described chock insulator matter raw material is photoresist.
8. method according to claim 7, is characterized in that, described by the chock insulator matter raw material in described chock insulator matter Die and mould plate solidify comprise:
Be shining into ultraviolet light from the side of described chock insulator matter Die and mould plate, the photoresist in described chock insulator matter Die and mould plate is solidified.
9. a substrate, is characterized in that, comprises and adopts in claim 6 to 8 chock insulator matter of method made described in any one.
10. a display device, is characterized in that, comprises substrate as claimed in claim 9.
CN201410158640.5A 2014-04-18 2014-04-18 Make the device and method of chock insulator matter, substrate and display device Expired - Fee Related CN103941482B (en)

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CN103941482B CN103941482B (en) 2016-06-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105182630A (en) * 2015-09-24 2015-12-23 深超光电(深圳)有限公司 Liquid crystal display panel

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010134550A1 (en) * 2009-05-20 2010-11-25 旭硝子株式会社 Method for manufacturing optical elements
CN102692765A (en) * 2012-04-02 2012-09-26 友达光电股份有限公司 Display device
CN102789125A (en) * 2012-07-27 2012-11-21 京东方科技集团股份有限公司 Mask plate, mat manufacturing method and LCD panel
CN103293776A (en) * 2013-05-07 2013-09-11 北京京东方光电科技有限公司 Array substrate and preparation method and display device thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010134550A1 (en) * 2009-05-20 2010-11-25 旭硝子株式会社 Method for manufacturing optical elements
CN102692765A (en) * 2012-04-02 2012-09-26 友达光电股份有限公司 Display device
CN102789125A (en) * 2012-07-27 2012-11-21 京东方科技集团股份有限公司 Mask plate, mat manufacturing method and LCD panel
CN103293776A (en) * 2013-05-07 2013-09-11 北京京东方光电科技有限公司 Array substrate and preparation method and display device thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105182630A (en) * 2015-09-24 2015-12-23 深超光电(深圳)有限公司 Liquid crystal display panel

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