CN202443223U - Unit mother board for producing liquid crystal display device - Google Patents

Unit mother board for producing liquid crystal display device Download PDF

Info

Publication number
CN202443223U
CN202443223U CN2012200681292U CN201220068129U CN202443223U CN 202443223 U CN202443223 U CN 202443223U CN 2012200681292 U CN2012200681292 U CN 2012200681292U CN 201220068129 U CN201220068129 U CN 201220068129U CN 202443223 U CN202443223 U CN 202443223U
Authority
CN
China
Prior art keywords
mother substrate
support component
unit
support
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2012200681292U
Other languages
Chinese (zh)
Inventor
郝金刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Beijing BOE Optoelectronics Technology Co Ltd
Original Assignee
Beijing BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing BOE Optoelectronics Technology Co Ltd filed Critical Beijing BOE Optoelectronics Technology Co Ltd
Priority to CN2012200681292U priority Critical patent/CN202443223U/en
Application granted granted Critical
Publication of CN202443223U publication Critical patent/CN202443223U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The embodiment of the utility model relates to the liquid crystal display field, in particular to a unit mother board for producing the liquid crystal display device, which aims at solving the problems in the prior art that when the unit mother board of the liquid crystal display device is cut, the damage of a liquid crystal display panel is easy to occur. The unit mother board for producing the liquid crystal display device comprises a first mother substrate, a second mother substrate and a supporting part which is connected with the first mother substrate and/or the second mother substrate, wherein the unit mother board consists of more than one unit panels, and the supporting part is arranged on a position of the unit mother board to be cut. Through the supporting part for supporting the first and/or the second mother substrate when the first and/or the second mother substrate is cut, the cracking or breaking probability of the edge of the first and/or the second mother substrate to be cut is reduced when the first and/or the second mother substrate is cut, so that the damage of the liquid crystal display panel can be avoided.

Description

A kind of unit motherboard that is used to make LCD
Technical field
The utility model relates to field of liquid crystal display, particularly a kind of unit motherboard that is used to make LCD.
Background technology
Liquid crystal indicator has that volume is little, in light weight, low in energy consumption, radiation is low and characteristics such as low cost of manufacture, has been widely used in the various electronic equipments, like the display of digital electronic devices such as TV, mobile phone, digital camera.
TFT-LCD (Thin Film Transistor Liquid Crystal Display; Thin Film Transistor-LCD) generally comprises display panels and module backlight; Wherein display panels generally is by TFT (Thin Film Transistor; TFT) array base palte, CF (color filter, colored filter) substrate and be infused between two substrates and form by the liquid crystal of envelope frame glue (seal) sealing.In order to improve output, to reduce cost, present technological process all is a unit motherboard of making display panels earlier, again this unit motherboard is cut into a plurality of unit panels, and the concrete manufacturing process of display panels may further comprise the steps:
On first mother substrate 1, make tft array, and on second mother substrate 2, make the CF corresponding with tft array;
On first mother substrate 1 and second mother substrate 2, apply PI (Polyimide, polyimide) alignment films respectively;
On first mother substrate 1, splash into liquid crystal 3, and isolation is cut apart in a plurality of viewing areas with envelope frame glue 4;
First mother substrate 1 and second mother substrate 2 are carried out box is handled the unit motherboard that forms liquid crystal display face device, and carry out cured;
The unit motherboard of display panels is carried out cutting process, finally form a plurality of unit panels.
When first mother substrate 1 and second mother substrate 2 are carried out cutting process; In order to guarantee that liquid crystal 3 and other interstitital textures in the display panels all are in the envelope frame glue 4; Generally cut point is arranged on the position of envelope frame glue 4 outside certain distances; Specifically referring to like Fig. 1, the direction among the figure shown in the arrow is a cut direction, and the position shown in the arrow is a cutting position.In the cutting process process because that the edge to be cut of first mother substrate 1 and second mother substrate 2 is in is unsettled, when being under pressure, cause edge crack to be cut easily, even produce broken, thereby reduced the quality of display panels.
In sum, when the unit motherboard of cutting display panels, cause the damage of display panels easily in the prior art.
The utility model content
The utility model embodiment provides a kind of unit motherboard that is used to make LCD, when being used for solving the motherboard in the unit of cutting display panels that prior art exists, causes the problem of the damage of display panels easily.
The utility model embodiment provides a kind of unit motherboard that is used to make LCD, comprises first mother substrate and second mother substrate, and said unit motherboard is made up of an above unit panel, and wherein, said unit motherboard also comprises:
With the support component that said first mother substrate and/or said second mother substrate are connected, this support component is positioned at the position to be cut of said unit motherboard.
Preferably, said support component is used to support said first mother substrate, and said support component is positioned at the position to be cut of said first mother substrate;
Said support component is used to support said second mother substrate, and said support component is positioned at the position to be cut of said second mother substrate.
Preferably, said support component is used to support said first mother substrate and said second mother substrate;
Said support component is between said first mother substrate and said second mother substrate.
Preferably, the height of said support component is not more than the distance between said first mother substrate and said second mother substrate.
Preferably, the height of said support component equals the distance between said first mother substrate and said second mother substrate.
Preferably, said support component comprises first supporting member and second supporting member;
Said first supporting member is identical with the material of the deposit film of thin film transistor (TFT) array, and said second supporting member is identical with the material of the support spacer of colored filter; Or the material of the support spacer of said first supporting member and said colored filter (PS, Post Spacer) is identical, and the material of the deposit film of said second supporting member and said thin film transistor (TFT) (TFT, Thin Film Transistor) array is identical.
Preferably, the height of said first supporting member and second supporting member and equal said first mother substrate and said second mother substrate between distance.
Preferably, said support component is identical with the material of the deposit film of thin film transistor (TFT) array, or said support component is identical with the material of the support spacer of colored filter.
Preferably, the material of said support component is a fluid sealant.
The utility model embodiment is through being provided for when cutting first mother substrate and/or second mother substrate, supporting the support component of first mother substrate and/or second mother substrate; When cutting first mother substrate and/or second mother substrate; Reduce the generation crackle in edge to be cut or the broken probability of first mother substrate and/or second mother substrate, thereby avoided the damage of display panels.
Description of drawings
Fig. 1 is the synoptic diagram of the unit motherboard of cutting display panels in the background technology;
Fig. 2 A is the synoptic diagram of first kind of unit motherboard of the utility model embodiment one;
Fig. 2 B is the synoptic diagram of second kind of unit motherboard of the utility model embodiment one;
Fig. 3 is the synoptic diagram of the unit motherboard of the utility model embodiment two;
Fig. 4 is the synoptic diagram of the unit motherboard of the utility model embodiment three;
Fig. 5 is the synoptic diagram of the unit motherboard of the utility model embodiment four;
Fig. 6 A is the synoptic diagram of first kind of unit motherboard of the utility model embodiment five;
Fig. 6 B is the synoptic diagram of second kind of unit motherboard of the utility model embodiment five;
Fig. 7 A is the synoptic diagram of first kind of unit motherboard of the utility model embodiment six;
Fig. 7 B is the synoptic diagram of second kind of unit motherboard of the utility model embodiment six.
Embodiment
To in the background technology when the unit motherboard of cutting display panels; The problem that causes display panels to damage easily; The utility model embodiment is through being provided for when cutting first mother substrate and/or second mother substrate, supporting the support component of this first mother substrate and/or second mother substrate; Thereby when cutting first mother substrate and/or second mother substrate, reduced the generation crackle in edge to be cut or the broken probability of first mother substrate and/or second mother substrate.
Need to prove, can on first mother substrate, make thin film transistor (TFT) array among the utility model embodiment, then on second mother substrate, make the colored filter corresponding with thin film transistor (TFT) array; Obviously, the structure of first mother substrate and second mother substrate can be exchanged, and promptly on first mother substrate, makes colored filter, then on second mother substrate, makes the thin film transistor (TFT) array corresponding with colored filter.
All on first mother substrate, to make thin film transistor (TFT) array, make the colored filter corresponding with thin film transistor (TFT) array on second mother substrate is that example describes to the utility model embodiment, and another kind of situation is similar with it, repeats no more here.
Be described in detail below in conjunction with the unit motherboard that is used to make LCD of Figure of description the utility model embodiment.
A kind of unit motherboard that is used to make LCD that the utility model embodiment provides; This unit motherboard is made up of an above unit panel; It comprises: first mother substrate, second mother substrate and the support component that is connected with first mother substrate and/or second mother substrate, and this support component is positioned at the position to be cut of unit motherboard; This support component is used to support this first mother substrate when cutting first mother substrate; And/or when cutting second mother substrate, be used to support this second mother substrate, and/or when cutting first mother substrate and second mother substrate, be used to support first mother substrate and second mother substrate.
If support component is used to support first mother substrate when cutting first mother substrate, then this support component is positioned at the position to be cut of this first mother substrate; If support component is used to support second mother substrate when cutting second mother substrate, then this support component is positioned at the position to be cut of this second mother substrate.
The unit motherboard of the utility model embodiment comprises at least one support component;
If the unit motherboard comprises a plurality of support components, preferably, these a plurality of support components can evenly distribute in the position to be cut of first mother substrate and/or the position to be cut of second mother substrate; Can make the edge to be cut of first mother substrate and/or second mother substrate all have support component to be used for supporting; Thereby it is unsettled to have avoided edge to be cut to be in; When cutting first mother substrate and/or second mother substrate, effectively reduce the generation crackle in edge to be cut or the broken probability of first mother substrate and/or second mother substrate.
Need to prove; In the position to be cut of first mother substrate and/or the quantity of the support component that is provided with of the position to be cut of second mother substrate many more; Then support effect is good more, and then can more effectively avoid the edge to be cut of first mother substrate and/or second mother substrate to crack and fragmentation.
Be described in detail below in conjunction with several kinds of structures of accompanying drawing, but the structure of the support component of the utility model embodiment is not limited to this support component of the utility model embodiment.
Embodiment one: shown in Fig. 2 A, the unit motherboard comprises first mother substrate 1, second mother substrate 2, a plurality ofly is arranged at envelope frame glue 4 and at least one that being used between first mother substrate 1 and second mother substrate 2 seal liquid crystal 3 and is arranged at the support component 5 between first mother substrate 1 and second mother substrate 2; Wherein first mother substrate 1 comprises the setting strong point 10 on it, this strong point 10 be by the single or multiple lift deposit film through overexposure, etching, operation such as peel off and be made; Second mother substrate 2 comprises setting support spacer 20 on it, and the box that this support spacer 20 is used to support display panels is thick; This support component 5 is positioned at the position to be cut of unit motherboard.
Need to prove, the strong point 10 of first mother substrate 1 can be on first mother substrate 1 with the corresponding tft array in position that supports spacer 20; Also can be extra making and identical with tft array material structural member on the position corresponding of tft array with supporting spacer 20, but the extra increase production process of the making meeting of this structural member.
The cut direction of first mother substrate 1 and second mother substrate 2 and cutting position are shown in the arrow among Fig. 2 A; The to be cut position of support component 5 between first mother substrate 1 and second mother substrate 2, and this support component 5 is connected with first mother substrate 1 and second mother substrate 2 respectively; This support component 5 is used to support this first mother substrate 1 when cutting first mother substrate 1, and this support component 5 is used to support this second mother substrate 2 when cutting second mother substrate 2; Shown in Fig. 2 A, the height of this support component 5 equals the distance between first mother substrate 1 and second mother substrate 2.
The not restriction of the material of support component can be selected metal material for use in the present embodiment, also can select non-metallic material for use, and all materials well-known to those skilled in the art all are applicable to the support component of the utility model embodiment; The shape of this support component is not restriction also, and its shape can be set as required, and all shapes well-known to those skilled in the art all are applicable to the support component of the utility model embodiment.
Preferably, the material of the support component in the present embodiment 5 can be identical with the material of envelope frame glue 4; Shown in Fig. 2 B, the material of the support component 5 in the present embodiment can be a fluid sealant.
Preferably, for all can be supported when the cutting support of parts of the edge to be cut that guarantees first mother substrate and second mother substrate, can a plurality of support components evenly be set at cutting position.
Embodiment two: the height of the support component 5 among the embodiment one also can be less than the distance between first mother substrate 1 and second mother substrate 2, and as shown in Figure 3, support component 5 one end faces are connected with second mother substrate 2, and the other end does not contact with first mother substrate 1; When cutting first mother substrate 1, first mother substrate 1 has flexural deformation to a certain degree, makes the other end of support component 5 be resisted against second mother substrate 2, thereby plays the effect of supporting first mother substrate 1; Same, when cutting second mother substrate 2, second mother substrate 2 has flexural deformation to a certain degree, and second mother substrate 2 can be contacted with the end face of support component 5, thereby plays the effect of supporting second mother substrate 2.
The height of the support component 5 among the embodiment two is less than the distance between first mother substrate 1 and second mother substrate 2; When cutting first mother substrate 1 (or second mother substrate 2); Can make first mother substrate 1 (or second mother substrate 2) produce flexural deformation, edge to be cut cracks or broken probability so increase than embodiment for a moment.
Need to prove that an end face of the support component 5 among the embodiment two also can be connected with first mother substrate 1, the support component in its structure and the unit motherboard shown in Figure 3 is similar, repeats no more here.
The not restriction of the material of support component can be selected metal material for use in the present embodiment, also can select non-metallic material for use, and all materials well-known to those skilled in the art all are applicable to the support component of the utility model embodiment; The shape of this support component is not restriction also, and its shape can be set as required, and all shapes well-known to those skilled in the art all are applicable to the support component of the utility model embodiment.
Preferably, for all can be supported when the cutting support of parts of the edge to be cut that guarantees first mother substrate and second mother substrate, can a plurality of support components evenly be set in the position to be cut of first mother substrate and second mother substrate.
Embodiment three: if the cutting position apart from each other of first mother substrate 1 and second mother substrate 2; As shown in Figure 4; Then can support component 5 be set in the position to be cut of first mother substrate 1; Simultaneously same support component 5 ' also is set, to play the effect of supporting first mother substrate 1 and second mother substrate 2 respectively in the position to be cut of second mother substrate 2;
Wherein, the height of support component 5 can equal the distance between first mother substrate 1 and second mother substrate 2, and is as shown in Figure 4; The height of support component 5 also can be less than the distance between first mother substrate 1 and second mother substrate 2;
Same, the height of support component 5 ' can equal the distance between first mother substrate 1 and second mother substrate 2, and is as shown in Figure 4; The height of support component 5 ' also can be less than the distance between first mother substrate 1 and second mother substrate 2.
The not restriction of the material of support component can be selected metal material for use in the present embodiment, also can select non-metallic material for use, and all materials well-known to those skilled in the art all are applicable to the support component of the utility model embodiment; The shape of this support component is not restriction also, and its shape can be set as required, and all shapes well-known to those skilled in the art all are applicable to the support component of the utility model embodiment.
Preferably, for all can be supported when the cutting support of parts of the edge to be cut that guarantees first mother substrate and second mother substrate, can a plurality of support components evenly be set in the position to be cut of first mother substrate and second mother substrate.
Embodiment four: in order not increase new production process; Support component among the utility model embodiment comprises first supporting member 51 and second supporting member 52; As shown in Figure 5, the height of first supporting member 51 and second supporting member 52 and equal first mother substrate 1 and second mother substrate 2 between distance;
Wherein, The production process of the strong point 10 of second supporting member 52 and first mother substrate 1 is synchronous; And material is identical; When promptly making the strong point 10 of first mother substrate 1, the single or multiple lift deposit film is set, and makes public synchronously, obtain second supporting member 52 after the etching, lift-off processing in the position synchronous to be cut of first mother substrate 1;
The production process of the support spacer 20 of first supporting member 51 and second mother substrate 2 is synchronous, and material is identical, when promptly making the support spacer 20 of second mother substrate 2, makes first supporting member 51 in the position synchronous to be cut of second mother substrate 2;
First supporting member among the utility model embodiment and the shape of second supporting member be restriction not; Its shape can be set as required, and all shapes well-known to those skilled in the art all are applicable to first supporting member and second supporting member of the utility model embodiment.
Need to prove; First supporting member 51 in the present embodiment and the height of second supporting member 52 and also can be less than the distance between first mother substrate 1 and second mother substrate 2; Concrete structure sees also among the embodiment one support component 5 height less than the distance between first mother substrate 1 and second mother substrate 2, repeats no more here.
Preferably, for all can be supported when the cutting support of parts of the edge to be cut that guarantees first mother substrate and second mother substrate, can a plurality of support components evenly be set in the position to be cut of first mother substrate and second mother substrate.
Embodiment five: the support component among the embodiment four can only be made first supporting member 51 in manufacturing process, to play the effect of supporting first mother substrate 1 and second mother substrate 2.Shown in Fig. 6 A; The same prior art of the making of first mother substrate 1; When making the support spacer 20 of second mother substrate 2, make support component 5 synchronously, and the material of support component 5 is identical with the material that supports spacer 20; When promptly making the support spacer 20 of second mother substrate 2, make support component 5 in the position synchronous to be cut of second mother substrate 2.
The height of support component can equal the distance between first mother substrate and second mother substrate in the present embodiment, shown in Fig. 6 A; The height of support component can be less than the distance between first mother substrate and second mother substrate, shown in Fig. 6 B.
The also not restriction of the shape of support component can be provided with its shape as required in the present embodiment, and all shapes well-known to those skilled in the art all are applicable to the support component of the utility model embodiment.
Preferably, for all can be supported when the cutting support of parts of the edge to be cut that guarantees first mother substrate and second mother substrate, can a plurality of support components evenly be set in the position to be cut of first mother substrate and second mother substrate.
Embodiment six: the support component among the embodiment four can only be made second supporting member 52 in manufacturing process, to play the effect of supporting first mother substrate 1 and second mother substrate 2.Shown in Fig. 7 A, the same prior art of the making of second mother substrate 2 is when making the strong point 10 of first mother substrate 1; Make support component 5 synchronously; And the material of support component 5 is identical with the material of the strong point 10, when promptly making the strong point 10 of first mother substrate 1, in the position synchronous to be cut of first mother substrate 1 the single or multiple lift deposit film is set; And make public synchronously, etching, lift-off processing, parts 5 are supported.
The height of support component 5 can equal the distance between first mother substrate 1 and second mother substrate 2 in the present embodiment, shown in Fig. 7 A; The height of support component 5 can be less than the distance between first mother substrate 1 and second mother substrate 2, shown in Fig. 7 B.
The also not restriction of the shape of support component can be provided with its shape as required in the present embodiment, and all shapes well-known to those skilled in the art all are applicable to the support component of the utility model embodiment.
Preferably, for all can be supported when the cutting support of parts of the edge to be cut that guarantees first mother substrate and second mother substrate, can a plurality of support components evenly be set in the position to be cut of first mother substrate and second mother substrate.
Although described the preferred embodiment of the utility model, in a single day those skilled in the art get the basic inventive concept could of cicada, then can make other change and modification to these embodiment.So accompanying claims is intended to be interpreted as all changes and the modification that comprises preferred embodiment and fall into the utility model scope.
The utility model embodiment is through being provided for when cutting first mother substrate and/or second mother substrate, supporting the support component of first mother substrate and/or second mother substrate; When cutting first mother substrate and/or second mother substrate; Reduce the generation crackle in edge to be cut or the broken probability of first mother substrate and/or second mother substrate, thereby avoided the damage of display panels.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from the spirit and the scope of the utility model.Like this, belong within the scope of the utility model claim and equivalent technologies thereof if these of the utility model are revised with modification, then the utility model also is intended to comprise these changes and modification interior.

Claims (9)

1. a unit motherboard that is used to make LCD comprises first mother substrate and second mother substrate, and said unit motherboard is made up of an above unit panel, it is characterized in that, said unit motherboard also comprises:
With the support component that said first mother substrate and/or said second mother substrate are connected, said support component is positioned at the position to be cut of said unit motherboard.
2. unit as claimed in claim 1 motherboard is characterized in that, said support component is used to support said first mother substrate, and said support component is positioned at the position to be cut of said first mother substrate;
Said support component is used to support said second mother substrate, and said support component is positioned at the position to be cut of said second mother substrate.
3. unit as claimed in claim 2 motherboard is characterized in that, said support component is used to support said first mother substrate and said second mother substrate;
Said support component is between said first mother substrate and said second mother substrate.
4. unit as claimed in claim 3 motherboard is characterized in that, the height of said support component is not more than the distance between said first mother substrate and said second mother substrate.
5. unit as claimed in claim 4 motherboard is characterized in that, the height of said support component equals the distance between said first mother substrate and said second mother substrate.
6. unit as claimed in claim 4 motherboard is characterized in that, said support component comprises first supporting member and second supporting member;
Said first supporting member is identical with the material of the deposit film of thin film transistor (TFT) array, and said second supporting member is identical with the material of the support spacer of colored filter; Or said first supporting member is identical with the material of the support spacer of said colored filter, and said second supporting member is identical with the material of the deposit film of said thin film transistor (TFT) array.
7. unit as claimed in claim 6 motherboard is characterized in that, the height of said first supporting member and second supporting member and equal said first mother substrate and said second mother substrate between distance.
8. like the arbitrary described unit of claim 1~5 motherboard, it is characterized in that said support component is identical with the material of the deposit film of thin film transistor (TFT) array, or said support component is identical with the material of the support spacer of colored filter.
9. like the arbitrary described unit of claim 1~5 motherboard, it is characterized in that the material of said support component is a fluid sealant.
CN2012200681292U 2012-02-27 2012-02-27 Unit mother board for producing liquid crystal display device Active CN202443223U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012200681292U CN202443223U (en) 2012-02-27 2012-02-27 Unit mother board for producing liquid crystal display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012200681292U CN202443223U (en) 2012-02-27 2012-02-27 Unit mother board for producing liquid crystal display device

Publications (1)

Publication Number Publication Date
CN202443223U true CN202443223U (en) 2012-09-19

Family

ID=46824666

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012200681292U Active CN202443223U (en) 2012-02-27 2012-02-27 Unit mother board for producing liquid crystal display device

Country Status (1)

Country Link
CN (1) CN202443223U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103955085A (en) * 2014-04-14 2014-07-30 京东方科技集团股份有限公司 Substrate bonding process and substrate module to be bonded
WO2014187142A1 (en) * 2013-05-24 2014-11-27 北京京东方光电科技有限公司 Display panel and display device
CN104409662A (en) * 2014-11-10 2015-03-11 京东方科技集团股份有限公司 OLED (organic light emitting diode) panel and manufacture method thereof, silk screen printing plate and display device
CN104995550A (en) * 2013-02-05 2015-10-21 夏普株式会社 Liquid crystal display device
CN106549116A (en) * 2017-01-25 2017-03-29 京东方科技集团股份有限公司 A kind of motherboard and preparation method thereof
CN106990580A (en) * 2015-12-30 2017-07-28 乐金显示有限公司 Non-boundary display device including display module
CN107068907A (en) * 2017-05-11 2017-08-18 京东方科技集团股份有限公司 A kind of display panel and display device
CN107238960A (en) * 2017-07-19 2017-10-10 深圳市华星光电技术有限公司 Narrow frame LCDs and preparation method thereof

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104995550A (en) * 2013-02-05 2015-10-21 夏普株式会社 Liquid crystal display device
CN104995550B (en) * 2013-02-05 2018-06-26 夏普株式会社 Liquid crystal display device
WO2014187142A1 (en) * 2013-05-24 2014-11-27 北京京东方光电科技有限公司 Display panel and display device
CN104181730A (en) * 2013-05-24 2014-12-03 北京京东方光电科技有限公司 Display panel and display device
US9612482B2 (en) 2014-04-14 2017-04-04 Boe Technology Group Co., Ltd. Substrate fitting process and substrate assembly to be fitted
CN103955085B (en) * 2014-04-14 2017-04-05 京东方科技集团股份有限公司 Baseplate-laminating technique and board unit to be fit
CN103955085A (en) * 2014-04-14 2014-07-30 京东方科技集团股份有限公司 Substrate bonding process and substrate module to be bonded
CN104409662A (en) * 2014-11-10 2015-03-11 京东方科技集团股份有限公司 OLED (organic light emitting diode) panel and manufacture method thereof, silk screen printing plate and display device
US9722214B2 (en) 2014-11-10 2017-08-01 Boe Technology Group Co., Ltd. OLED panel, method for fabricating the same, screen printing plate, display device
CN104409662B (en) * 2014-11-10 2017-07-18 京东方科技集团股份有限公司 Oled panel and preparation method, screen printing plate, display device
CN106990580A (en) * 2015-12-30 2017-07-28 乐金显示有限公司 Non-boundary display device including display module
CN106549116A (en) * 2017-01-25 2017-03-29 京东方科技集团股份有限公司 A kind of motherboard and preparation method thereof
CN107068907A (en) * 2017-05-11 2017-08-18 京东方科技集团股份有限公司 A kind of display panel and display device
CN107068907B (en) * 2017-05-11 2020-06-02 京东方科技集团股份有限公司 Display panel and display device
US10707440B2 (en) 2017-05-11 2020-07-07 Boe Technology Group Co., Ltd. Display panel with an elastic component surrounding by a frame sealant
CN107238960A (en) * 2017-07-19 2017-10-10 深圳市华星光电技术有限公司 Narrow frame LCDs and preparation method thereof

Similar Documents

Publication Publication Date Title
CN202443223U (en) Unit mother board for producing liquid crystal display device
CN202166809U (en) Film transistor liquid crystal display screen and display device
CN105097885A (en) OLED (organic light-emitting diode) panel and packaging method therefor, and display device
CN103472641B (en) A kind of array base palte, its preparation method, display panels and display device
CN104503150A (en) Liquid crystal panel and manufacturing method thereof
CN103217845B (en) Lower substrate, manufacturing method thereof, liquid crystal display panel and liquid crystal displayer
US10394087B2 (en) Display panel and manufacturing method thereof
CN203133441U (en) Display panel and display device
CN102650771B (en) Liquid crystal display panel and manufacturing method thereof and display
CN104020601A (en) Color film substrate and display device
CN104793403A (en) Plane display panel and manufacturing method
US20160126259A1 (en) Array substrate and method of producing the same, display panel and display device
CN103745953A (en) Manufacturing method of flexible OLED (organic light emitting diode) panel
CN103698947B (en) A kind of TN type liquid crystal panel and preparation method thereof and liquid crystal indicator
CN101109860A (en) Panel Used for LCD device
CN203444197U (en) Locating frame, backlight source and display device
CN104898316A (en) Manufacturing method for thin type liquid crystal panel
CN103698946A (en) TN (twisted nematic) type liquid crystal display panel, TN type liquid crystal display panel preparation method and liquid crystal display device
CN101634761B (en) Protective film for liquid crystal display module
CN103412430A (en) Liquid crystal display panel mother board to be cut and manufacturing method thereof
CN108508647B (en) Liquid crystal panel
CN102681263A (en) Manufacturing method for liquid crystal display device
CN203337962U (en) Display panel and display device with display panel
CN103984154A (en) Display panel, manufacturing method thereof and display device
CN204086765U (en) A kind of motherboard of liquid crystal display

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD

Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD.

Effective date: 20150623

Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY

Effective date: 20150623

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150623

Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No.

Patentee after: BOE Technology Group Co., Ltd.

Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd.

Address before: 100176 Beijing city in Western Daxing District economic and Technological Development Zone, Road No. 8

Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd.