JP2002151894A - Method and system for component mounting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component-mounting method and a component-mounting system, capable of simultaneously mounting even a minute component which cannot be sucked simultaneously, unless correction is performed for each suction nozzle by using the same suction nozzle as the conventional one, thereby improving the productivity of component mounting. SOLUTION: By using a suction section provided with a plurality of suction nozzles, the suction section is moved to a component feeding section for housing a plurality of components so that the components can be sucked simultaneously, and the components housed in the component feeding section are sucked simultaneously by respective nozzles. When the sucked components are to be mounted on a board, all the nozzles whose deviation amount is within an allowable range that simultaneous suction can be carried out are included as one group, and the nozzles out of the range are included in another group, then simultaneous suction is carried out by each group independently.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction unit provided with a plurality of suction nozzles, suctioning a component housed in a component supply unit to each suction nozzle of the suction unit, and accurately positioning the component. The present invention relates to a component mounting method and a component mounting apparatus for mounting on a substrate.

[0002]

2. Description of the Related Art An electronic component mounting apparatus that automatically mounts electronic components on a printed circuit board or the like includes a movable suction portion.
Some devices include a plurality of suction nozzles for holding an electronic component by suction. In this type of electronic component mounting apparatus, since the suction nozzle is installed at an equal interval with the component supply unit of the electronic component,
It is expected that all the suction nozzles are moved up and down when the electronic components are sucked, and the plurality of suction nozzles simultaneously suck the electronic components to improve the productivity.

As shown in FIG. 14, in an electronic component mounting apparatus 1 of this type, a transfer head 3 as a suction unit is movable on an XY plane, and is mounted on the transfer head 3. A plurality of (for example, eight) suction nozzles 5 are individually raised and lowered,
It is configured to be rotatable. The transfer head 3 is moved to the component supply unit 7, and the electronic components are sucked by the respective suction nozzles 5. The suction position of the sucked electronic component is recognized by the component recognition unit 9. The posture of the electronic component is corrected based on the recognition result. On the other hand, in the electronic component mounting apparatus 1, the printed circuit board carried in from the transfer device 11 is positioned at a predetermined position, and the electronic component whose posture has been corrected is sequentially mounted on the predetermined position of the printed circuit board.

In the case where the suction nozzles 5 are installed at the same interval as the component accommodating pitch in the component supply unit, if the first suction nozzle 5 is at a position where the components can be suctioned, the second to fourth suction nozzles can be used.
The suction nozzle 5 can also perform suction.

However, the electronic component mounting apparatus 1 described above has
Since the position correction at the time of component suction cannot be performed for each suction nozzle 5 but can be performed only for each transfer head 3, the comparison is performed when the shift amount between the center of the suction nozzle 5 and the center of the electronic component is not corrected. Simultaneous suction has been performed only on large electronic components that can be stably sucked.

[0006]

In recent years, as electronic devices have been reduced in size and weight, for example, 0603 and 1005 have been developed.
Micro-sized resistors and capacitors referred to as the like are becoming the mainstream of chip-shaped electronic components, and there is an increasing demand for simultaneous adsorption of such micro-electronic components for the purpose of improving productivity. However, the conventional electronic component mounting apparatus corrects a shift amount during component suction by moving the entire suction unit. For this reason, it is possible to simultaneously suction a large electronic component that does not need to correct the shift amount between the center of the suction nozzle and the center of the electronic component, but the dimensional tolerance and parallelism of the component supply unit and the nozzle are possible. For small electronic components that need to be corrected for each of the suction nozzles due to misalignment due to, for example, the center of the nozzle may be greatly deviated from the center of the small electronic component, and simultaneous suction cannot be performed. .

On the other hand, if each suction nozzle is provided with a linear motor or the like, and the suction nozzles can be operated in the X and Y directions, and correction can be performed for each suction nozzle, simultaneous suction of minute electronic components becomes possible. However, if such a mechanism is adopted, the suction section becomes large and complicated, and the cost becomes high, which is not practical.

The present invention has been made in view of the above-mentioned situation, and it is possible to simultaneously use a suction nozzle similar to the conventional one for a minute part which cannot be simultaneously suctioned unless correction is performed for each suction nozzle. It is an object of the present invention to provide a component mounting method and a component mounting apparatus that enable suction, and to improve the productivity of component mounting.

[0009]

According to a first aspect of the present invention, there is provided a component mounting method using a suction unit provided with a plurality of suction nozzles, wherein a plurality of components are simultaneously suctioned. The component mounting method of moving the suction unit to a component supply unit that can be accommodated, allowing components accommodated in the component supply unit to be simultaneously suctioned by a plurality of suction nozzles, and mounting the suctioned components on a board. In addition, all the suction nozzles in which the amount of deviation of the suction nozzles is within the allowable range where simultaneous suction is possible are grouped into one group, and the suction nozzles outside the allowable range where simultaneous suction is possible are divided into another group. A component mounting method for simultaneous suction is adopted.

In this component mounting method, all of the suction nozzles whose deviation amounts of the suction nozzles are within the allowable range for simultaneous suction are grouped into one group, and the suction nozzles outside the allowable range for simultaneous suction are divided into another group. , Are simultaneously adsorbed for each group. Thereby, the position correction of the suction unit is performed for each group, and the position correction can be substantially performed for each suction nozzle unit, so that stable component suction can be performed for each group. Therefore, even a minute component can be simultaneously suctioned to the suction nozzle, and the productivity of component mounting can be improved.

According to a second aspect of the present invention, there is provided a component mounting method, wherein a suction unit provided with a plurality of suction nozzles is used, and the suction unit is moved to a component supply unit in which a plurality of components are accommodated so as to be simultaneously suctioned. A component mounting method for simultaneously adsorbing components accommodated in a component supply unit to a plurality of suction nozzles, and mounting the plurality of sucked components on a substrate, wherein a component to be sucked by the suction nozzle and the suction nozzle are connected. As a component mounting method, all of the suction nozzles whose deviation amount is within the allowable range where simultaneous suction is possible are grouped into one group, and the suction nozzles outside the allowable range where simultaneous suction is possible are divided into another group, and a simultaneous mounting is performed for each group. I have.

In this component mounting method, all the suction nozzles in which the deviation amount between the component to be sucked by the suction nozzle and the suction nozzle is within the allowable range for simultaneous suction are grouped into one group, and the allowable range for simultaneous suction is set. The outside suction nozzles are divided into different groups, and the groups are simultaneously suctioned. Thereby, the variation in the position of each suction nozzle and the variation in the component supply position of each component supply unit are corrected, so that stable component suction is performed even when all the suction nozzles are operated simultaneously.

According to a third aspect of the present invention, there is provided a component mounting method, wherein a position correction value of a suction unit is calculated based on a shift amount for each group, and the suction unit is corrected based on the position correction value. A component mounting method according to a second aspect of the present invention is that the components are simultaneously sucked.

According to this component mounting method, the suction section is corrected by the position correction value, and the suction is simultaneously performed for each group, so that the components can be stably suctioned in each group.

According to a fourth aspect of the present invention, in the component mounting method, the position correction value of the suction unit is an average of a maximum value and a minimum value of a shift amount between the center of each suction nozzle and the center position of the component at the component suction position. The component mounting method according to claim 3 is a value.

In this component mounting method, the position correction value of the suction unit is set to the average value of the maximum value and the minimum value of the shift amount between the center of each suction nozzle and the center position of the component at the component suction position. In addition, the amount of movement of the suction unit is corrected so as to be averaged for each suction nozzle, so that a more stable suction operation can be performed.

According to a fifth aspect of the present invention, the position of each of the plurality of suction nozzles is detected, and the center of the suction nozzle and the center position of the component at the component suction position are determined from the obtained positions of the suction nozzles. A component mounting method according to claim 2 for calculating a shift amount.

In this component mounting method, the amount of shift between the center of the suction nozzle and the center position of the component at the component suction position is calculated by detecting the position of each suction nozzle.

According to a sixth aspect of the present invention, there is provided the component mounting method as described in the fifth aspect, wherein a tip end surface of the suction nozzle is recognized and a center position of the suction nozzle is detected.

In this component mounting method, the center position of the suction nozzle can be easily detected by checking the tip surface of the suction nozzle.

According to a seventh aspect of the present invention, there is provided the component mounting method according to the sixth aspect, wherein the inspection jig is mounted on the suction nozzle to detect a center position of the suction nozzle.

In this component mounting method, an image of the inspection jig mounted on the suction nozzle is taken from below, and a position matching the center position of the suction nozzle or a center mark provided around the center position is detected. The center position of the suction nozzle is obtained.

In the component mounting method according to the present invention, the deviation amount between the center of the suction nozzle and the center of the component is obtained by a component recognition device that recognizes a suction state of the component to the suction nozzle, and is obtained by the component recognition device. 4. The component mounting method according to claim 3, wherein a position correction value for each of the groups to be simultaneously sucked and the suction unit is changed for each of the groups according to the deviation amount.

In this component mounting method, the displacement between the center of the suction nozzle and the center of the component is determined by the component recognition device, and the positions of the groups to be simultaneously suctioned and the groups of the suction units are corrected according to the determined shift. Since the values are respectively changed, stable simultaneous suction that matches the amount of deviation between the actual suction nozzle and the center of the component can be realized.

In the component mounting method according to the ninth aspect, a suction nozzle in which a component suction error has occurred more than an allowable number of times or a suction nozzle whose component suction rate is equal to or less than an allowable value is suctioned in a specific group. 1 is a component mounting method.

In this component mounting method, for example, when there is a variation in the suction force among the suction nozzles, a position as close as possible to the center of the component is sucked by the suction nozzle with respect to the suction nozzle having a low suction rate. In addition, finer position correction can be performed, and a stable suction operation for each suction nozzle can be realized.

According to a tenth aspect of the present invention, there is provided a component mounting method in which grouping for simultaneous suction is set in multiple stages from a mode in which productivity is prioritized to a mode in which priority is given to component suction rate. The component mounting method according to claim 1, wherein the allowable range in which simultaneous suction is possible can be set in multiple stages.

In this component mounting method, the grouping for performing simultaneous suction is set in multiple stages from a mode in which productivity (such as throughput) is prioritized to a mode in which suction efficiency is prioritized. In other words, the width W of the allowable range, which is the width of the group,
Is set wide when productivity is prioritized, and narrow when priority is given to adsorption rate. Therefore, the user can perform the suction operation in any mode selected according to the purpose.

In the component mounting method according to the eleventh aspect, the shift amount between the center of the component at the component suction position and the center of the suction nozzle is corrected by changing the feed amount of the component in the component supply unit. In the component mounting method.

In this component mounting method, the shift amount between the center of the component at the component suction position and the center of the suction nozzle can be corrected by changing the feed amount of the component in the component supply unit.

According to a twelfth aspect of the present invention, there is provided a component mounting apparatus, comprising: a suction unit provided with a plurality of suction nozzles; a component supply unit in which a plurality of components are accommodated so as to be simultaneously suctioned; And a controller that controls the components supplied in the component supply unit to be simultaneously suctioned by the plurality of suction nozzles, and controls the plurality of suctioned components to be mounted on the substrate. The control unit includes:
All of the suction nozzles in which the amount of deviation between the component to be sucked by the suction nozzle and the suction nozzle is within the allowable range for simultaneous suction are included in one group, and the suction nozzles outside the allowable range for simultaneous suction are different groups. And a component mounting apparatus that controls so as to perform simultaneous suction for each group.

In this component mounting apparatus, the control unit sets all the suction nozzles in which the amount of deviation between the component to be suctioned by the suction nozzle and the suction nozzle is within the allowable range for simultaneous suction as one group, and performs simultaneous suction. Suction nozzles outside the permissible range are divided into different groups, and control is performed so that suction is performed simultaneously for each group, so that the position of the suction unit is corrected for each group. Can be corrected, and stable component suction can be performed for each group. Therefore, even a minute component can be simultaneously suctioned to the suction nozzle, and the productivity of component mounting can be improved.

According to a thirteenth aspect of the present invention, the control unit calculates a position correction value of the suction unit based on a shift amount for each group, and corrects the suction unit with the position correction value. A component mounting apparatus according to a twelfth aspect is provided.

In this component mounting apparatus, the control unit corrects the suction unit with the position correction value and simultaneously picks up each group, so that the components can be stably picked up in each group.

According to a fourteenth aspect of the present invention, in the component mounting apparatus, the position correction value of the suction unit is determined by determining a maximum value and a minimum value of a shift amount between the center of each suction nozzle and the center position of the component at the component suction position. The component mounting apparatus according to claim 13, which is an average value.

In this component mounting apparatus, the control unit calculates the position correction value of the suction unit as an average value of the maximum value and the minimum value of the shift amount between the center of each suction nozzle and the center position of the component at the component suction position. By doing so, the amount of movement of the suction unit is corrected so as to be averaged for each suction nozzle, and a more stable suction operation can be performed.

According to a fifteenth aspect of the present invention, a combination of the number of suction nozzles and the number of component suction positions is stored for a shift amount between the center of the suction nozzle and the center position of the component at the component suction position. A component mounting apparatus according to claim 12 including a database.

In this component mounting apparatus, the difference between the center of the suction nozzle and the center position of the component at the component suction position is:
By providing a database that stores combinations of the number of suction nozzles and the number of component suction positions, correction can be performed in consideration of the amount of deviation between the center of the suction nozzle and the component center of the component suction position.

A component mounting apparatus according to a sixteenth aspect of the present invention includes a component recognition device for recognizing a suction state of a component to a suction nozzle, wherein the control unit determines a shift amount between the center of the suction nozzle and the center of the component. 14. The component mounting apparatus according to claim 13, wherein a position correction value of the group to be simultaneously sucked and the suction unit for each of the groups is changed according to the deviation amount, obtained by the component recognition device.

In this component mounting apparatus, the control unit determines the amount of deviation between the center of the suction nozzle and the center of the component, and changes the position correction value for each group of simultaneous suction and the group of suction units according to the amount of deviation. Is done. As a result, stable simultaneous suction that matches the amount of deviation between the actual suction nozzle and the center of the component can be realized.

[0041]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a component mounting method and a component mounting apparatus according to the present invention will be described below in detail with reference to the drawings. First, an electronic component mounting apparatus used in the component mounting method according to the present invention will be described. FIG.
FIG. 2 is a perspective view of an electronic component mounting apparatus used in the present invention.
FIG. 3 is an enlarged perspective view of a transfer head as a suction unit, FIG. 3 is a schematic plan view of an electronic component mounting apparatus, and FIG. 4 is a block diagram illustrating a configuration of the electronic component mounting apparatus.

The electronic component mounting apparatus 100 selectively switches a development method, which is an improvement of the conventional step repeat method or pattern repeat method, to a circuit board composed of a plurality of small boards such as a multi-chip board or a heterogeneous board. In addition, even on a single board or other circuit boards, components are simultaneously sucked by a plurality of suction nozzles 34, thereby increasing mounting efficiency and shortening the mounting time.

As shown in FIG. 1, the electronic component mounting apparatus 10
0, the loader section 16 at the center of the upper surface of the base 10 and the substrate holding section 1
8. The unloader section 20 is provided with a pair of guide rails 14 of the circuit board 12 respectively, and the circuit board 12 is moved to one end by synchronous driving of the transport belts provided on each of the pair of guide rails 14. From the pair of guide rails 14 of the loader unit 16 to the pair of guide rails 14 of the board holding unit 18 provided at a position where a component such as an electronic component is mounted, and to the pair of guide rails 1 of the board holding unit 18.
4 to the pair of guide rails 14 of the unloader section 20 at the other end. The board holding section 18 positions and holds the conveyed circuit board 12 to prepare for component mounting.

On both sides of the upper surface of the base 10 above the circuit board 12, Y-axis robots 22 and 24 are provided, respectively.
An X-axis robot 26 is suspended between these two Y-axis robots 22 and 24, and the X-axis robot 26 can advance and retreat in the Y-axis direction by driving the Y-axis robots 22 and 24. Further, a transfer head 28 is attached to the X-axis robot 26 so that the transfer head 28 can advance and retreat in the X-axis direction, thereby enabling the transfer head 28 to move in the XY plane. ing. Each robot is configured by, for example, rotating a ball screw forward and reverse by a motor, enabling a nut member screwed to the ball screw to advance and retreat in each axial direction, and fixing a member to be advanced and retracted to the nut member.

The X-axis robot 26 and the Y-axis robot 2
A transfer device mounted on an XY robot (part of a transfer head moving device) composed of 2, 24, which freely moves on an XY plane (for example, a horizontal plane or a plane substantially parallel to the upper surface of the base 10). The head 28 includes, for example, a plurality of parts feeders 30 as an example of a component supply unit to which electronic components such as a resistance chip and a chip capacitor are supplied, or an SOP (“SOP” is “Smal”).
l Outline Package and QFP ("QFP" stands for Quad
A desired electronic component is picked up from a part tray 32 as another example of a component supply unit to which a relatively large electronic component such as an IC or a connector such as a flat package is supplied.
So that it can be mounted on the component mounting position of the circuit board 12. The mounting operation of such an electronic component is controlled by the control unit 52 in FIG. 4 based on a mounting program stored in the storage unit 1001 and set in advance.

The parts feeder 30 and the parts tray 32 correspond to an example of a parts supply unit. In addition, the arrangement interval of the components of the component supply unit means the interval between the component supply ports of the adjacent part feeders 30 in the part feeder 30,
In the case of the parts tray 32, it means the interval between the storage recesses for storing the components in the parts tray 32. Parts feeder 3
A large number of zeros 0 are arranged on both sides (upper right and lower left in FIG. 1) of the pair of guide rails 14 in the transport direction. Tape-shaped component rolls in which components are accommodated are respectively attached. In addition, the parts tray 32 can hold a total of two trays 32a that are long in a direction orthogonal to the substrate transport direction of the pair of guide rails 14, and each tray 32a has a pair of guides according to the number of parts supplied. The component is slid toward the rail 14 to keep the component take-out position in the Y direction at a constant position. A large number of electronic components such as QFPs are placed on the tray 32a.

On the side of the circuit board 12 positioned on the pair of guide rails 14, a two-dimensional displacement (suction posture) of the electronic component sucked by the suction nozzle 34 is detected, and this position shift is detected. Transfer head 2 to cancel
A component recognizing device 36 for performing correction on the side 8 is provided.

As shown in FIG. 2, a plurality of transfer heads 28 (four in this embodiment)
Mounting heads (first mounting head 38a, second mounting head 38b, third mounting head 38c, fourth mounting head 3)
8d) is configured as a multiple head connected side by side. Four mounting heads 38a, 38b, 38c, 38
d has the same structure, and each mounting head has a suction nozzle 3
4, an actuator 40 for causing the suction nozzle 34 to perform up and down operations, and a pulley 46. The forward / reverse rotation driving force of the θ rotation motor 42 a is transmitted to the pulley 46 of the first mounting head 38 a and the pulley 46 of the third mounting head 38 c by the timing belt 44, and the θ rotation is simultaneously performed to both the suction nozzles 34. (Rotation about the axis of the suction nozzle 34). The forward / reverse rotation driving force of the θ rotation motor 42 b is transmitted to the pulley 46 of the second mounting head 38 b and the pulley 46 of the fourth mounting head 38 d by the timing belt 44, and is simultaneously transmitted to both the suction nozzles 34. θ rotation is performed.

Each actuator 40 is constituted by, for example, an air cylinder, and the suction nozzle is moved up and down by turning on and off the air cylinder so that the component can be selectively held or mounted. In addition, as shown in FIG.
The power of the rotation motor 42a is transmitted by the timing belt 44 to rotate the suction nozzles 34 of the mounting heads 38a and 38c by θ, respectively. The power of the θ rotation motor 42b is transmitted by the timing belt 44 and the mounting heads 38b and 3
The 8d suction nozzle 34 is configured to rotate by θ, but such a configuration is merely an example, and each mounting head 3
8a, 38b, 38c, 38d may be provided with a θ rotation drive motor for individually θ rotation. However, in order to reduce the weight of the transfer head 28, it is preferable that the number of the θ rotation drive motors for rotating the θ be small.

The suction nozzle 34 of each mounting head is replaceable, and a spare suction nozzle to be replaced is stored in a nozzle stocker 48 on the base 10 of the electronic component mounting apparatus 100 in advance. For example, 1.0 × 0.5
S size nozzle that sucks small chip components of about mm
There is an M-size nozzle or the like that sucks an 18 mm square QFP, and is used depending on the type of electronic component to be mounted.

The operation of the electronic component mounting apparatus having the above configuration will be described below. As shown in FIG. 3, a pair of guide rails 1
When the circuit board 12 carried in from the loader section 16 of the No. 4 is transported to the board holding section 18, the transfer head 28 is moved by the XY robot in the horizontal direction, in other words, in the XY plane,
A desired electronic component is sucked from the parts feeder 30 or the parts tray 32, moved to a posture recognition camera of the component recognition device 36 to check the suction posture of the electronic component, and a θ rotation motor is driven based on the recognition result. The suction nozzle 34 is rotated by θ to perform a correction operation of the suction attitude. Then, the circuit board 1
The electronic component is mounted at the component mounting position of No. 2.

Each mounting head 38a, 38b, 38c, 3
8d is when the electronic component is sucked by the suction nozzle 34 from the parts feeder 30 or the parts tray 32, and
When an electronic component is mounted on the component mounting position of the circuit board 12, the suction nozzle 34 is moved down from the XY plane in the vertical direction (Z direction) by the operation of the actuator 40. Further, the mounting operation is performed by appropriately replacing the suction nozzle 34 according to the type of the electronic component. By repeating the above-described operation of sucking the electronic component and mounting the electronic component on the circuit board 12, the circuit board 1
2 is completed. The mounted circuit board 12 is moved from the board holding section 18 to the unloader section 20.
While being carried out, a new circuit board is carried in from the loader section 16 to the board holding section 18, and the above operation is repeated.

During the basic mounting operation of the electronic component on the circuit board 12, the electronic component mounting method of the present embodiment in which the electronic component is sucked by each of the plurality of suction nozzles 34 and mounted on the circuit board 12 is implemented. Is done. here,
When the plurality of suction nozzles constituting the suction unit are installed at equal intervals to the supply position of the component supply unit or at multiples of the interval between the component supply positions, the electronic components can be simultaneously suctioned by the plurality of suction nozzles. . However, variations in the position of each suction nozzle 34 and the component supply units 30 and 3
2, the center 62a of the electronic component 62 is displaced due to the deviation of the component supply position.

Specifically, first, a variation in the center position of each suction nozzle 34 is determined by attaching an inspection jig to each suction nozzle 34 and then recognizing the inspection jig by the lower component recognition device 36. It is calculated based on the recognition result. The inspection jig picks up the image of the suction nozzle 3
Any type can be used as long as it can recognize the center position of No. 4. FIG. 5 shows an example of the inspection jig 80. That is, FIG. 5A is a diagram showing a state in which the inspection jig 80 is temporarily mounted on the tip of the suction nozzle, and FIGS.
This is a diagram viewed from below. The inspection jig 80 is provided with a center mark 81 at a position corresponding to the center position of the suction nozzle 34 or at the periphery thereof. Component recognition device 3
6 can calculate the center position of the suction nozzle 34 by identifying the center mark 81. The center mark 81 may use various shapes such as a round shape, a cross line, and a ring shape. Note that the inspection jig 80 includes the inspection jig 8.
0 is attached to the suction nozzle 34 with no error, and the suction nozzle 34 detected by the inspection jig 80 is made precise.
Is not deviated from the original center position of the suction nozzle 34.

In order to determine the center position of the suction nozzle 34, the above-described inspection jig is not used, and the suction nozzle 34 is not used.
The center position of the suction nozzle 34 may be calculated by imaging the front end surface of the suction nozzle 34 from below and performing image processing on the front end surface of the suction nozzle 34. Further, instead of recognizing and obtaining the center position of the suction nozzle 34 in the state of the fixed rotation angle of the suction nozzle 34 as described above, the suction nozzle 34 mounted alone or with the inspection jig 80 may be used. 0 ゜, 90 ゜,
From the center position of the suction nozzle 34 obtained at each angle rotated 180 ° and 270 °, the suction nozzle 34
It is more preferable to calculate the rotation center of the suction nozzle 34 and set the rotation center as the center position of the suction nozzle 34. In this way, the amount of displacement of the suction nozzle 34 can be determined in consideration of the eccentricity of the axis of the suction nozzle 34. Also,
Further, instead of attaching the inspection jig 80 to the tip of the suction nozzle 34, an inspection jig having a center mark 81 at the tip instead of the suction nozzle 34 is attached to the transfer head 28, and the component recognition device 36 What recognizes a position may be used.

Here, as shown in FIG. 6, the center position 34 of each suction nozzle 34 measured with an inspection jig is measured.
a, 34b, 34c, and 34d have variations,
The true nozzle center 63 is obtained from the average value of these center positions.

FIG. 7 is a diagram showing the center positions 34a, 34b, 34c, and 34d of the suction nozzles in FIG. 6 and the variation of the center 62a of the component 62 to be sucked by each suction nozzle. Shows that the true nozzle center 63
And an average line of the center 62a of the component 62 is superimposed. FIG. 8 shows the variation of each suction nozzle with reference to the center 62a of the electronic component.
That is, when the center 62a of the electronic component shown in FIG. 7 is shifted on a straight line and the components 62 are aligned, the relative shift amount between each suction nozzle and the electronic component shown in FIG. As shown in the relationship, the value is included in the range of an area W indicating a range of a given value. Here, a certain arbitrary value indicates a permissible range of a shift amount that enables simultaneous suction, and a value of 10 to 30% of a short side of a chip component is set. 0.1 mm and 0.05 mm are used for 0603 parts.

In the state shown in FIG. 8, since the centers 34a, 34b, 34c and 34d of the suction nozzles 34 are included in the area W, all the suction nozzles 34
Are treated as the same group (A group), and all the suction nozzles 34 simultaneously suck the electronic components. Here, the center 62a of the electronic component and the center 34 of the suction nozzle are used.
The position correction of the suction position of the suction nozzle 34 is performed using the average value (A1 + A2) / 2 of the maximum value A1 and the minimum value A2 of the deviation amounts of a, 34b, 34c, and 34d as the position correction value. That is, the correction is performed such that the line of the true nozzle center 63 is shifted by the position correction value with respect to the average line of the center 62a of the component 62. In FIG. 8, it is assumed that the displacement is larger in the upper part of the figure and smaller in the lower part. A value above the component center 62a is a plus value, and a value below the component center 62a is a minus value. In this example,
34d is the maximum value and 34a is the minimum value.

On the other hand, in the case of the state shown in FIG. 9, the center of the electronic component 62a and the center of the suction nozzle due to the variation of the center position of each suction nozzle 34 and the variation of the electronic component position with respect to the component supply units 30 and 32. 34a, 34
The range of the amount of deviation from b, 34c, and 34d exceeds the range of an area W1 (having the same width as W), which is a range of an arbitrary value. In this case, the electronic component cannot be stably sucked by only one simultaneous suction operation to each suction nozzle 34. For this reason, the suction nozzles 34 that can simultaneously stably suction are divided into groups,
A stable suction operation is realized by performing the simultaneous suction operation for each group. That is, in the example shown in FIG. 9, the centers 34a and 34b of suction nozzles (group B including two suction nozzles on the left side) and the centers 34c and 34d of suction nozzles.
(C group consisting of two suction nozzles on the right side). Then, a position correction value is similarly obtained for each group, and the suction position is corrected.

Next, the above-described electronic component mounting method will be described with reference to FIG.
A detailed description will be given based on a flowchart showing the procedure of the electronic component mounting method shown in FIG. First, an inspection jig is attached to each suction nozzle 34, and the center position of each suction nozzle 34 is measured by recognizing the inspection jig by the component recognition device 36. The average position of the center positions of the obtained suction nozzles 34 (true nozzle center 63, see FIG. 6) is obtained.
The deviation amount from the true nozzle center 63 is acquired as an initial value (Step 1, hereinafter abbreviated as S1).

This value is a shift amount for each suction nozzle 34. On the other hand, the deviation between the electronic component center 62a sucked at the electronic component suction position in the component supply units 30 and 32 and the suction nozzle centers 34a, 34b, 34c and 34d is different from the true position of the component supply units 30 and 32. Also includes the deviation amount. That is, specifically, the suction nozzle center 34d in FIG.
In the example, the shift amount d ₀ between the suction nozzle center 34 d and the component center 62 a at the electronic component suction position is the shift amount d ₁ of the suction nozzle center 34 d with respect to the true nozzle center 63.
And component supply units 30 and 32 with respect to the true component supply unit center.
Comprising a displacement amount d ₂ of the electronic component position with those obtained by summing (true nozzle center of the suction nozzle center 34 7 6
3, the center of the part center 62a
The amount of deviation from the true nozzle center 63 (true part center) is set to be positive in the lower part of the figure. Therefore, d2 is a negative value. ). Therefore, the electronic component mounting apparatus 100
The nozzle shift amount data corresponding to the combination of [the number of component storage units in the component supply unit (corresponding to the number of mounted part feeders 30 and the part trays 32)] and [the number of suction nozzles] is stored in the database unit 1003 (FIG. 4). It is being held. The input of the initial value is performed by the component supply units 30 and 3
This is performed by inputting only the shift amount of the suction nozzle 34 with the shift amount of 2 set to 0. However, the center position 62a of the part is determined in advance.
If the steady deviation amount is known, the deviation amount is also input here.

Next, the maximum value and the minimum value of the deviation amount of each suction nozzle 34 obtained in S1 are obtained, and it is determined whether this difference is equal to or less than an arbitrary value W1 (S2). Note that W1 means an arbitrary value in W for setting the first group. W2 described later is an arbitrary value for setting a second group in the same manner. If the difference is less than or equal to W1,
Since stable suction can be performed even when all the suction nozzles 34 are simultaneously operated, all the suction nozzles 34 are set to one group (S3). On the other hand, when the difference is larger than W1, the suction nozzles 34 are grouped so that the suction can be performed stably.

In this grouping process, as shown in FIG. 9, first, a suction nozzle having a nozzle shift amount within a range W1 of an arbitrary value is extracted from the suction nozzle 34a having a maximum shift amount from the component center 62a. Then, these are grouped (S4). That is, the suction nozzles 34a and 34b are in the range W1.
And the same group (B group). Next, it is determined whether all the suction nozzles 34 have been grouped (S5). If suction nozzles that have not been grouped remain, the process returns to S4 to repeat the grouping process. That is, the suction nozzles which are set subsequent to the range W1 and have the nozzle shift amounts within the range W2 having the same width as the width W1 are extracted and grouped. Then, the suction nozzle 34
Since c and 34d are included in the range W2, they belong to the same group (C group).

After the grouping is completed in this way, a position correction value is calculated for each group (S6). As the position correction value, an average value of the maximum value and the minimum value of the nozzle shift amount of each group is used. That is, group B (maximum value B
(B1 + B2) / 2 for the position correction value of (1, the minimum value B2)
And (C1 + C2) / 2 is used as the position correction value of the C group (maximum value C1, minimum value C2). Next, the position of the transfer head 28 is corrected according to the position correction value, and the electronic components are sucked by the suction nozzle 34 by the simultaneous suction operation for each set group (S7). When the suction is performed simultaneously for each group and the components are suctioned by all the suction nozzles 34, the transfer head 28 is moved onto the component recognition device 36 to recognize all the suctioned components (S8). Then, based on the recognition result of each component in S8, the shift amount between the component center 62a and the suction nozzle center is corrected, and the component is mounted at the mounting position (S9).

Then, it is determined whether or not all the mountings have been completed normally (S10). If the mounting has been completed, the process is terminated. Despite the presence of the suction nozzle 34 that could not normally pick up the component, or the position of the transfer head was corrected based on the recognition result in S8, the deviation amount between the component center and the suction nozzle center exceeded the allowable value W. If all mounting cannot be completed normally due to reasons such as, for example, the suction nozzle centers 34a, 3a calculated from the image data obtained from the component recognition device 36,
4b, 34c, 34d and the electronic component center 62a, the respective suction nozzles 34 and the component supply unit 3
The deviation from the component center at 0 and 32 is updated to the database unit 1003 as data (S11). After the registration in the data, the process returns to S2 and repeats the processes of S2 to S10 based on the deviation amount updated in S11. It should be noted that the determination as to whether or not all of the mounting in S10 has been completed may be a determination as to whether or not the mounting has been completed until the end of the mounting program (the mounting of one circuit board has been completed). In that case, S
The recognition result of No. 8 is stored for one scan of the mounting program, and the updated result of the shift amount in S11 is reflected on the mounting on the next circuit board.

In the above example, the correction of the feed direction of the electronic component 62 in the component supply units 30 and 32 has been described. However, the correction is similarly performed in the direction orthogonal to the feed direction of the electronic component 62. I do. At this time, an arbitrary value used for grouping is, for example, 10
0.2 mm for 05 part, 0.1 for 0603 part
mm is used.

As described above, in the electronic component mounting method of the present embodiment, in order to correct the variation in the position of each suction nozzle 34 and the variation in the component supply position of each of the component supply units 30 and 32, the component center is adjusted. When the difference between the maximum value and the minimum value of the shift amount of each suction nozzle 34 with respect to the predetermined value is equal to or less than a predetermined value, it is determined that the suction nozzle 34 and the electronic component 62 are arranged with a positional accuracy within an allowable range. Even if all the suction nozzles 34 are operated simultaneously, stable component suction is performed.

On the other hand, when the difference between the maximum value and the minimum value of the deviation amount is larger than the predetermined value, the group of the suction nozzles 34 in which the deviation amount is equal to or less than the predetermined value, that is, arranged in the allowable range. The nozzle group is divided into a group of suction nozzles and another group arranged outside the allowable range, and the position of the transfer head 28 is corrected for each group. Therefore, the position can be corrected substantially in units of individual suction nozzles, and stable component suction can be performed for each group.
High-precision stable suction can be performed even on a minute resistor or capacitor such as 1005.

The centers 34a, 3 of the suction nozzles 34
In a state where 4b, 34c, and 34d are within the allowable range, simultaneous suction by all the suction nozzles 34 in the group is possible even in the state as it is, but the maximum value and the minimum value of the above-mentioned deviation amount Transfer head 28 using the average value of
Is corrected so that the moving amount of the transfer head 28 is averaged for each of the suction nozzles 34a, 34b, 34c, and 34d, and more stable suction is possible.

Further, in the electronic component mounting method according to the present embodiment, the center of the suction nozzle 34 and the electronic component 62 are mounted on the basis of the image data from the component recognizing device 36 obtained each time the electronic component is mounted. The shift amount from the center 62a is detected (S8, S11), and the position correction value of the suction unit and the group for simultaneous suction operation can be changed according to the shift amount. According to this, even for a deviation other than the steady deviation caused by the dimension crossing or the like, that is, for a variable deviation generated at each suction, a flexible position correction that follows this change can be performed. The change of the position correction value or the group may be performed every time a component is picked up, or may be performed after a predetermined number of times, after a predetermined time has elapsed, or when the shift amount is equal to or more than a predetermined value. Further, in the present embodiment, S in FIG.
At 1, the variation of the component center position 62a is set to 0, or a known value is input. However, the camera at the transfer head 28 detects the component at the component suction position before the component suction. An image may be taken and the shift amount of the component center position 62a may be obtained.

Next, a second embodiment of the electronic component mounting method according to the present invention will be described with reference to the flowchart of FIG. The electronic component mounting method according to the present embodiment is different from the above-described group for a suction nozzle 34 in which a component suction error has occurred a predetermined number of times or a suction nozzle 34 whose electronic component suction rate is equal to or less than a predetermined value. (S22). Here, the specific group is, for example, a group obtained by setting the width W within the allowable range to be narrower than the normal group (W27 in S27).
s).

According to this electronic component mounting method, the suction nozzles 34 in which component suction errors have occurred a predetermined number of times or the suction nozzles 34 whose electronic component suction rates are equal to or lower than a predetermined value are divided into a specific group. Transfer head 2 in group
8 is position-corrected. For this reason, when the suction power varies among the suction nozzles, the suction nozzle 3 having a low suction rate is used.
In contrast to 4, the suction nozzle 34 sucks a portion as close as possible to the component center position, so that finer position correction can be performed, and a stable suction operation for each suction nozzle 34 can be realized. Note that the suction nozzles 34 having the suction rate equal to or less than a predetermined value are included not in a specific group but in a normal group (width W within an allowable range), and the suction nozzle having a low suction rate is positioned at the center of the width W. It does not matter.

Next, a third embodiment of the electronic component mounting method according to the present invention will be described with reference to the flowchart of FIG. In the electronic component mounting method according to this embodiment, the grouping for performing the simultaneous suction is performed in a productivity (such as a throughput).
Are set in multiple stages from a mode in which the priority is given to a mode in which the adsorption rate is prioritized. Specifically, the width W of the allowable range, which is the width of the group, is set in multiple stages. When priority is given to productivity, W is set wide (S43), and when priority is given to the adsorption rate, W is set narrow (S44). Accordingly, the user can perform the suction operation in any mode selected according to the purpose (S42).

According to this electronic component mounting method, the value of the amount of deviation between the center of the suction nozzle 34 used for the above-described grouping and the center 62a of the electronic component 62 at the electronic component suction position can be selected by the user. Thus, grouping in a mode suitable for the electronic component 62 or the suction nozzle 34 is possible. In addition, since the selection at this time only needs to select the mode set in a stepwise manner, the operability can be improved. For example, from the stage of giving priority to the productivity, the stage of giving priority to the adsorption rate is set in advance and prepared as five stages, and the user can selectively set any one of these prepared stages. By doing so, it is possible to easily obtain an appropriate suction operation according to the purpose.

Next, a fourth embodiment of the electronic component mounting method according to the present invention will be described. In the electronic component mounting method according to this embodiment, the center 62a of the electronic component 62 at the electronic component suction position and the center of the suction nozzle 34 are changed by changing the feed amount of the electronic component 62 in each of the component supply units 30 and 32. Is corrected.

In this embodiment, a component feed mechanism that can arbitrarily change the feed amount of the electronic component 62 is provided in each of the component supply units 30 and 32. Thus, when the electronic component 62 is sucked, the amount of deviation between the center of the electronic component 62 to be sucked and the center of the suction nozzle is corrected by changing the component feed amount.

FIG. 13 is a control block diagram of the component feed mechanism. The component feed mechanism 71 shown in FIG. 13 has a component feeder 75 that moves the electronic components 62 stored in the component supply units 30 and 32 in the component feed direction. The component feeder 75, for example, drives the conveyor to move the electronic components 62 placed on the conveyor upstream and downstream in the feed direction.
Move to the downstream side. The drive of this component feeder 75 is controlled by the control unit 77 of the electronic component mounting apparatus 100.

According to this component feeding mechanism, when the image data obtained by capturing the attitude of the electronic component sucked by the suction nozzle by the component recognition device 36 is sent to the control unit 77, the control unit 7
7 calculates a shift amount between the center of the electronic component 62 sucked by the suction nozzle and the center of the nozzle based on the image data,
Feedback control of the deviation amount is performed. That is, the control unit 77
Sends a command based on the calculated shift amount to the component feeder 75, and corrects the shift amount for each component supply unit. For the correction in the direction perpendicular to the feed direction, a correction amount is calculated based on the above-described electronic component mounting method, a command is sent to the operation motor 79 of the transfer head 28, and the transfer head 28 performs the correction.

According to the electronic component mounting method according to the present embodiment, when the electronic component 62 is sucked by arbitrarily changing the feed amount of the electronic component 62 in each of the component supply units 30 and 32, the suction is performed. The deviation between the center of the electronic component 62 and the center of the suction nozzle is
Since the correction can be performed by changing the component feed amounts of 0 and 32, the shift amount is corrected and the simultaneous suction operation can be performed in a more stable state.

[0080]

As described above in detail, according to the component mounting method and the component mounting apparatus according to the present invention, the suction unit is moved to the component supply unit in which a plurality of components are accommodated so as to be simultaneously picked up. When the components accommodated in the supply unit are simultaneously suctioned by the plurality of suction nozzles, and the plurality of suctioned components are mounted on the board, the shift amount of the suction nozzles is within an allowable range where simultaneous suction is possible. All are grouped into one group, and the suction nozzles outside the allowable range that can be simultaneously suctioned are divided into different groups, and by performing simultaneous suction for each of these groups, the position of the suction unit is corrected for each group, and substantially. Position correction can be performed for each suction nozzle unit, and stable component suction can be performed for each group. Therefore, even if a suction nozzle that performs position correction in the same suction unit unit as in the related art is used, it is possible to simultaneously suction a minute component to the suction nozzle, thereby improving the productivity of component mounting.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus used in the present invention.

FIG. 2 is an enlarged perspective view of a transfer head.

FIG. 3 is a schematic plan view of the component mounting apparatus.

FIG. 4 is a block diagram illustrating a configuration of an electronic component mounting apparatus.

FIG. 5 is a diagram showing a state where the inspection jig is temporarily mounted on the tip of the suction nozzle and a state where the inspection jig is viewed from below.

FIG. 6 is a diagram showing a positional relationship between an actual suction nozzle center and a true suction nozzle center.

FIG. 7 is a diagram showing the actual positional relationship between the center of the suction nozzle and the center of the electronic component.

FIG. 8 is an explanatory diagram in a case where a positional relationship between an electronic component set in a component supply unit and a suction nozzle is one group.

FIG. 9 is an explanatory diagram in the case where the positional relationship between an electronic component set in a component supply unit and a suction nozzle is a plurality of groups.

FIG. 10 is a flowchart illustrating a procedure of an electronic component mounting method according to the first embodiment of the present invention.

FIG. 11 is a flowchart illustrating a procedure of an electronic component mounting method according to the second embodiment of the present invention.

FIG. 12 is a flowchart illustrating a procedure of an electronic component mounting method according to a third embodiment of the present invention.

FIG. 13 is a control block diagram of a component feed mechanism according to a fourth embodiment of the present invention.

FIG. 14 is a schematic configuration diagram of an electronic component mounting apparatus used in a conventional electronic component mounting method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 12 Circuit board 28 Transfer head (suction part) 30 Parts feeder (component supply part) 32 Parts tray (component supply part) 34 Suction nozzle 47a Center of suction nozzle 36 Component recognition device 62 Electronic component 62a Center of electronic component 100 Electronic component Mounting device

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Hiroshi Uchiyama 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. F term (reference) 3C007 AS08 DS06 FS01 KS29 LT14 LV06 LV11 LV20 LW03 MT08 NS17 5E313 AA01 AA11 DD00 EE02 EE24 EE25 EE37 FF24 FF28

Claims (16)

[Claims] 1. A suction unit provided with a plurality of suction nozzles, the suction unit is moved to a component supply unit in which a plurality of components are accommodated so as to be able to be simultaneously sucked, and the components accommodated in the component supply unit are moved. Attach to multiple suction nozzles at the same time,
A component mounting method for mounting a plurality of sucked components on a substrate, wherein all of the suction nozzles in which the shift amount of the suction nozzle is within a permissible range for simultaneous suction are included in one group, and a permissible range for simultaneous suction. The outside suction nozzle is divided into another group,
A component mounting method for simultaneously performing suction for each group. 2. Using a suction section provided with a plurality of suction nozzles, moving the suction section to a component supply section in which a plurality of components are stored so as to be able to simultaneously suction, and removing the components stored in the component supply section. Attach to multiple suction nozzles at the same time,
What is claimed is: 1. A component mounting method for mounting a plurality of sucked components on a substrate, wherein all of the suction nozzles in which the amount of deviation between the component sucked by the suction nozzle and the suction nozzle is within an allowable range in which simultaneous suction is possible are set to 1 A component mounting method in which suction nozzles outside a permissible range capable of simultaneous suction are divided into separate groups, and the groups are simultaneously suctioned for each group. 3. The suction unit according to claim 2, wherein a position correction value of the suction unit is calculated based on a shift amount for each group, and the suction unit is corrected based on the position correction value to simultaneously suction the groups. Component mounting method. 4. The suction correction unit according to claim 3, wherein the position correction value of the suction unit is an average value of a maximum value and a minimum value of a shift amount between the center of each suction nozzle and the center position of the component at the component suction position. Component mounting method. 5. The method according to claim 2, wherein the positions of the plurality of suction nozzles are detected, and a deviation amount between the center of the suction nozzle and the center position of the component at the component suction position is calculated from the obtained positions of the suction nozzles. The described component mounting method. 6. The component mounting method according to claim 5, wherein a center position of the suction nozzle is detected by recognizing a tip surface of the suction nozzle. 7. The component mounting method according to claim 6, wherein the inspection jig is mounted on the suction nozzle to detect a center position of the suction nozzle. 8. A shift amount between the center of the suction nozzle and the center of the component is obtained by a component recognition device that recognizes a suction state of the component to the suction nozzle, and a simultaneous shift is performed according to the shift amount obtained by the component recognition device. 4. The component mounting method according to claim 3, wherein a position correction value for each group of the group to be sucked and the suction unit is changed. 9. The component mounting method according to claim 1, wherein a suction nozzle in which a component suction error has occurred more than an allowable number of times or a suction nozzle whose component suction rate is equal to or less than an allowable value is suctioned in a specific group. 10. The allowable range for simultaneous suction is set in multiple stages so that grouping for simultaneous suction is set in multiple stages from a mode in which productivity is prioritized to a mode in which priority is given to component suction rates. 2. The component mounting method according to claim 1, wherein the component mounting method can be set. 11. The component mounting method according to claim 2, wherein a shift amount between the center of the component at the component suction position and the center of the suction nozzle is corrected by changing a feed amount of the component in the component supply unit. 12. A suction unit provided with a plurality of suction nozzles, a component supply unit in which a plurality of components are accommodated so as to be able to be simultaneously suctioned, and the suction unit moved to the component supply unit. A control unit configured to simultaneously control the plurality of suction nozzles to hold the accommodated components and mount the plurality of sucked components on a board, wherein the control unit includes the suction unit. All the suction nozzles in which the deviation between the component to be sucked by the nozzle and the suction nozzle is within the allowable range for simultaneous suction are included in one group, and the suction nozzles outside the allowable range for simultaneous suction are divided into another group. And a component mounting apparatus that performs control to simultaneously perform suction for each of the groups. 13. The control unit calculates a position correction value of the suction unit based on a shift amount for each group.
13. The suction unit is corrected by the position correction value.
A component mounting apparatus according to item 1. 14. The apparatus according to claim 13, wherein the position correction value of the suction unit is an average value of a maximum value and a minimum value of a shift amount between a center of each suction nozzle and a center position of a component at a component suction position. Component mounting equipment. 15. The database according to claim 12, further comprising a database storing a combination of the number of suction nozzles and the number of component suction positions with respect to a shift amount between the center of the suction nozzle and the center position of the component at the component suction position. Component mounting equipment. 16. A component recognition device for recognizing a suction state of a component to a suction nozzle, wherein the control unit obtains a shift amount between a center of the suction nozzle and a center of the component by the component recognition device, and 14. The component mounting apparatus according to claim 13, wherein a position correction value for each of the groups to be simultaneously suctioned and the suction unit is changed for each of the groups according to the amount.