JP2002151834A5 - - Google Patents

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Publication number
JP2002151834A5
JP2002151834A5 JP2000343824A JP2000343824A JP2002151834A5 JP 2002151834 A5 JP2002151834 A5 JP 2002151834A5 JP 2000343824 A JP2000343824 A JP 2000343824A JP 2000343824 A JP2000343824 A JP 2000343824A JP 2002151834 A5 JP2002151834 A5 JP 2002151834A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000343824A
Other languages
Japanese (ja)
Other versions
JP2002151834A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000343824A priority Critical patent/JP2002151834A/ja
Priority claimed from JP2000343824A external-priority patent/JP2002151834A/ja
Publication of JP2002151834A publication Critical patent/JP2002151834A/ja
Publication of JP2002151834A5 publication Critical patent/JP2002151834A5/ja
Pending legal-status Critical Current

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JP2000343824A 2000-11-10 2000-11-10 基板の防湿方法 Pending JP2002151834A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000343824A JP2002151834A (ja) 2000-11-10 2000-11-10 基板の防湿方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000343824A JP2002151834A (ja) 2000-11-10 2000-11-10 基板の防湿方法

Publications (2)

Publication Number Publication Date
JP2002151834A JP2002151834A (ja) 2002-05-24
JP2002151834A5 true JP2002151834A5 (de) 2007-12-20

Family

ID=18818131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000343824A Pending JP2002151834A (ja) 2000-11-10 2000-11-10 基板の防湿方法

Country Status (1)

Country Link
JP (1) JP2002151834A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4918701B2 (ja) * 2006-12-18 2012-04-18 株式会社トプコン 偏光板の防湿コーティング方法及びその方法により製造された偏光板
JP2013143563A (ja) * 2012-01-10 2013-07-22 Hzo Inc 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム
JP2013183079A (ja) * 2012-03-02 2013-09-12 Sumitomo Wiring Syst Ltd プリント回路板及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61184898A (ja) * 1985-02-12 1986-08-18 日立化成工業株式会社 防湿絶縁性実装回路板
JP2707537B2 (ja) * 1986-04-28 1998-01-28 株式会社デンソー 電子回路基板用絶縁被覆層およびその形成方法
JPH02214194A (ja) * 1989-02-14 1990-08-27 Tokai Rika Co Ltd プリント基板の防湿層形成装置
JPH05275487A (ja) * 1991-11-22 1993-10-22 Sumitomo 3M Ltd 電子部品表面保護材、その表面保護材を備えた電子部品、およびその表面保護材を使用した電子部品の電気的接続方法
JPH06152109A (ja) * 1992-11-02 1994-05-31 Matsushita Electric Ind Co Ltd プリント基板およびその製造方法
JPH06314873A (ja) * 1993-04-30 1994-11-08 Tokyo Electric Co Ltd プリント配線板
JPH1093228A (ja) * 1996-09-18 1998-04-10 Sumitomo Wiring Syst Ltd プリント回路基板およびその製造方法
JP3797763B2 (ja) * 1997-09-08 2006-07-19 富士通テン株式会社 フラックス組成物
JP2000013006A (ja) * 1998-06-19 2000-01-14 Fujitsu Ten Ltd プリント配線板の防湿方法およびフラックス残渣を残りやすくしたプリント配線板

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