JP2002134885A - Circuit board, manufacturing method thereof, electronic device mounting body, and green sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a glass ceramics multilayer circuit board where junction characteristics are good between a glass ceramics and a surface conductor layer as well as between the surface conductor layer and a pin. SOLUTION: In a surface conductor layer whose main component is copper, at least a pad part has a 2-layer structure. A layer (first layer) on the glass ceramics side is formed by printing a paste whose main component is copper with inorganics (for example alumina, mullita, and titanium) for raising junction characteristics to the glass ceramics being added on a green sheet. A layer over it is formed by printing, over the first layer, a paste whose main component is copper with no inorganics contained. The green sheet comprising the surface conductor layers are laminated with another green sheet, for sintering, with the former arranged on the outermost side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer circuit board suitable for mounting a semiconductor component or mounting a pin for inputting / outputting an electric signal to constitute a functional module and a method of manufacturing the same.

[0002]

2. Description of the Related Art A circuit board has a wiring circuit made of a conductor (usually copper) formed inside and on the surface thereof. A portion of the wiring circuit formed on the surface to which a terminal of another electronic component (or an input / output pin for connecting to another electronic component) is joined is a pad. Attachment of electric signal input / output pins is performed by brazing the pads via a thin-film conductor layer, a metal plating layer, or the like.

[0003] The insulator that insulates between wiring circuits is glass,
When made of ceramics, it is considered that the bonding between the conductor forming the wiring circuit and the insulator is weak. Therefore, various studies have been made on the bonding (adhesion) properties of the two. In addition, techniques for improving the bondability have been proposed.

[0004] For example, Japanese Patent Application Laid-Open No. 6-204656 describes that high bonding strength can be obtained even when a pure metal conductor layer having no additive and a ceramic substrate are bonded. The reason for this is that an alloy layer of a conductive metal and a metal in ceramics is formed near the bonding interface.

[0005] Japanese Patent Publication No. 5-63110 discloses that a titanate-based coupling agent is added to a copper paste.
A technique for improving the adhesiveness between a copper conductor layer and a glass ceramic has been disclosed.

Japanese Patent Application Laid-Open No. 4-375575 discloses a technique for improving the adhesion between a copper conductor layer and glass ceramics by adding a metal such as aluminum to a copper paste.

[0007]

However, the fact described in JP-A-6-204656 does not apply to the case where a copper conductor and a glass ceramic are bonded.

Further, the techniques described in Japanese Patent Publication No. 5-63110 and Japanese Patent Application Laid-Open No. Hei 4-369575 can increase the adhesive strength between a copper conductor and a glass ceramic, but on the contrary, they are made of a copper conductor. There has been a problem that it is difficult to attach the pins to the pads. This is because the inorganic substances added to the copper paste in the prior art have low adhesion to the brazing agent and plating, and these inorganic substances are exposed on the surface of the pad.

The present invention provides a circuit board having good bonding (adhesion) with glass ceramics and good bonding (adhesion) with a metal plating layer or a brazing agent for input / output pin connection. It is intended to provide a manufacturing method. It is another object of the present invention to provide a green sheet used as a material for such a circuit board. It is still another object of the present invention to provide an electronic device package including such a circuit board and an electronic device mounted thereon.

[0010]

Means for Solving the Problems The present invention has been made to achieve the above-mentioned object, and the first aspect thereof is as follows.
An insulator including a glass ceramic that can be sintered at a temperature equal to or lower than the melting point of copper, and an interconnect provided on a surface of the insulator, at least a portion of which includes a plurality of layers, including: The portion composed of a plurality of layers is composed of copper as a main component and containing a bonding reinforcing agent, and a first-type conductor layer arranged in contact with the insulator, and containing copper as a main component without containing the bonding reinforcing agent. And a second type conductive layer disposed on the outermost surface side of the wiring.

[0011] The bonding enhancer is alumina, mullite,
Titanium, titanium oxide, chromium, chromium oxide, manganese,
It preferably contains at least one selected from the group consisting of manganese dioxide.

The volume ratio of the bonding reinforcing agent in the first type conductor layer is preferably 1 to 15%.

According to a second aspect of the present invention, there is provided an insulator including a glass ceramic which can be sintered at a temperature equal to or lower than the melting point of copper, and an insulator provided on a surface of the insulator, at least a part of which is provided. A wiring composed of a plurality of layers, the portion composed of a plurality of layers of the wiring is configured to include an alloy of copper and titanium, an alloy conductor layer disposed in contact with the insulator, and the bonding enhancer And a second-type conductor layer formed of copper as a main component without being included and disposed on the outermost surface side of the wiring.

The circuit board according to each of the above aspects preferably has a gold plating layer provided further outside the second type conductor layer. The gold plating layer is preferably a displacement gold plating layer.

According to a third aspect of the present invention, there is provided a circuit board as described above, a brazing agent disposed on the second type conductor layer, a pin made of a conductor fixed to the circuit board by the brazing agent, There is provided a circuit board having:

According to a fourth aspect of the present invention, there is provided an electronic device package including the above-described circuit board and a semiconductor element mounted on the circuit board.

According to a fourth aspect of the present invention, in a green sheet having a wiring formed on a surface thereof, at least a part of the wiring is composed of a plurality of layers, and a part of the wiring composed of a plurality of layers is mainly made of copper. A first-type conductor layer, which is configured to include a bonding reinforcing agent as a component, is disposed in contact with the insulator, and is configured to include copper as a main component without including the bonding reinforcing agent, and is formed on the outermost surface side of the wiring. A second-type conductor layer disposed;
And a green sheet characterized by comprising:

In this case, the bonding reinforcing agent is alumina,
Mullite, titanium, titanium oxide, chromium, chromium oxide,
It preferably contains at least one selected from the group consisting of manganese and manganese dioxide.

According to a fifth aspect of the present invention, in a green sheet having a wiring formed on its surface, at least a part of the wiring is formed of a plurality of layers, and a portion of the wiring formed of a plurality of layers is formed of copper and titanium. An alloy conductor layer arranged in contact with the insulator, and a second layer formed mainly of copper without including the bonding reinforcing agent and arranged on the outermost surface side of the wiring And a seed conductor layer.

According to a sixth aspect of the present invention, in a circuit board manufacturing method for manufacturing a circuit board by stacking green sheets having wiring formed on the surface and sintering the green sheets, the green sheet is positioned at the outermost position. In the lamination of the green sheets, there is provided a method of manufacturing a circuit board, characterized in that the above-mentioned green sheets are used, and the green sheets are laminated in a direction such that the second type conductive layer is positioned outside.

[0021]

In order to improve the connection reliability between the LSI element and the substrate, a glass ceramic material which can be sintered at a temperature lower than the melting point of copper is used as the insulator of the circuit substrate. Specifically, borosilicate glass having low thermal expansion, cordierite precipitation-type crystallized glass and 2Al ₂ O ₃ .B ₂ O ₃ and / or
Alternatively, a material mainly containing Al ₂ O ₃ .B ₂ O ₃ precipitation-type crystallized glass or the like can be used. In this specification, "
The term “glass ceramics” is used to include both amorphous glass powder and crystalline ceramic powder mixed and fired, and crystalline glass or ceramics.

The first-type conductor layer is made of copper as a main component and containing a bonding reinforcing agent. As a bonding enhancer,
Refractory materials such as alumina and mullite, which are not softened at the sintering temperature of the glass ceramic multilayer circuit board and do not change in shape, and exhibit improved adhesion to the glass ceramic as described above due to the anchor effect. Can be used. Alternatively, titanium, titanium oxide, chromium, chromium oxide, or the like, which has an effect of improving the adhesion between copper and glass ceramics by forming a reaction layer by reacting with the above glass ceramics, can be used. Further, manganese and manganese dioxide can be used.

In order to make the specific resistance of the wiring portion after firing as low as possible, it is preferable to suppress the addition amount of the bonding reinforcing agent as small as possible. Therefore, the average particle size of the bonding enhancer is desirably 5 μm or less so that the above-mentioned anchor effect and chemical bond can be expected even if the amount of addition is small.

The addition amount of the bonding enhancer is 1% by volume or more,
It is preferable that the content be 5% by volume or less. This lower limit of 1% by volume is determined from the viewpoint of the above-mentioned anchor effect and the minimum amount in which the chemical bond can be expected. The upper limit of 15% by volume is determined from the viewpoint that the specific resistance of the copper conductor after firing is close to that of copper and sufficiently low.

In place of the above-mentioned first type conductor layer, an alloy conductor layer containing an alloy of copper and titanium may be used. When this alloy conductor layer is formed by printing a paste containing copper powder and copper and titanium alloy powder, the average particle size of the copper powder and copper and titanium alloy powder is as follows:
2-8μ from the viewpoint of firing shrinkage matching with glass ceramics
m is desirable.

The wiring on the surface of the insulator actually has a structure including one first-type conductor layer (or alloy conductor layer) and one second-type conductor layer, that is, a two-layer structure as a whole. Is preferred.

A gold plating layer (particularly, a substitutional gold plating layer) may be appropriately provided further outside the second type conductor layer. FIG. 1 is an enlarged view of a main part of the circuit board of the present invention in a state where a gold plating layer is provided.

The pin is attached by using a brazing agent (for example, Au).
Sn). In this case, the gold plating layer dissolves in the brazing agent, and often does not actually exist, as shown in FIG.

As a method for manufacturing the above-mentioned circuit board,
It is desirable to use the green sheet method from the viewpoint of easy circuit formation and easy handling.

The green sheet is produced by a green sheet producing machine after degassing a slurry obtained by mixing and stirring the raw material powder, resin, solvent and the like. In this method, the thickness of the green sheet can be changed by adjusting the viscosity of the slurry and the gap between the doctor blades, but the thickness of the sheet is preferably 0.1 to 1 in order to produce a sheet without cracks or the like. 0.0 mm is desirable. After drilling, filling with conductive paste, wiring, and printing a pattern according to the application, a plurality of sheets are laminated and fired. The above-described first type conductor layer, second type conductor layer, and alloy conductor layer are also printed before firing. In stacking, the second type conductor layers are stacked in such a direction as to be located outside.

The firing atmosphere is preferably a non-oxidizing atmosphere or a vacuum in which the conductor is not oxidized and the resin is scattered and removed. The atmospheric pressure may be normal pressure, but may be increased if necessary. The firing temperature is 900 to 1050C. The sintering time is usually 0.5 to 3 hours. In addition, during firing, the laminated substrate is not usually pressed, but may be pressed and fired as necessary.

In the circuit board of the present invention, the first type conductive layer located on the insulator (glass ceramic) side is made of a material other than copper, such as alumina, mullite, titanium, titanium oxide, chromium, chromium oxide, manganese, manganese dioxide, or the like. Since it contains an inorganic substance, it has good adhesion to glass ceramics as a substrate material due to an anchor effect and chemical bonding.

On the other hand, since the second type conductive layer located on the outside is formed by firing a paste consisting of only copper powder as an inorganic substance, metal (copper) is exposed on almost the entire surface. Therefore, the adhesion to the metal plating layer and the adhesion to the brazing agent are both good.

Both of these two layers (the first type conductor layer and the second type conductor layer, or the alloy conductor layer and the second type conductor layer) are mainly composed of copper and have a temperature close to the melting point of copper. Since it is fired at a temperature, the adhesion between the two layers is extremely good.

[0035]

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples.

Example 1 First, a slurry for producing a green sheet is prepared.

The slurry had 63 parts by weight of borosilicate glass powder having an average particle diameter of 3 μm, 37 parts by weight of mullite powder having an average particle diameter of 3 μm, 20 parts by weight of a methacrylic acid-based binder, and 124 parts by weight of trichloroethylene. It is prepared by adding 32 parts by weight of tetrachloroethylene and 44 parts by weight of n-butyl alcohol and wet-mixing with a ball mill for 24 hours. The composition of the borosilicate glass used here was Si
It has a composition of 84% by weight of O2, 9% by weight of B2O3, 3% by weight of Al2O3, and 4% by weight of an alkali metal oxide. Next, a slurry is formed by adjusting the viscosity to an appropriate value by vacuum degassing.

This slurry was applied to a silicone-coated polyester film using a doctor blade to form a slurry.
It was applied to a thickness of 5 mm and then dried to produce a green sheet.

Next, holes (through holes) having a diameter of 160 μm were punched into the green sheet at a pitch of 450 μm with a punch, and a conductive paste was printed and filled. Furthermore, by printing conductor paste, surface layer, signal expansion layer, shield layer,
The power supply expansion layer, the power supply layer, the X and Y wiring layers, the conversion layer, and the back layer were formed.

The conductive paste to be filled in the through holes is as follows:
The reduced copper powder having an average particle diameter of 3 μm is 50 to 100% by volume, and the borosilicate glass powder having an average particle diameter of 3 μm is 50 to 0%.
30 parts by weight of ethyl hydroxyethyl cellulose and 100 parts by weight of butyl carbitol acetate were added to 100 parts by weight of the mixed powder to give 30 parts by weight.
The mixture was mixed with a mill for a minute, and then kneaded by passing through a three-roll mill several times to adjust the viscosity to an appropriate value.

The copper paste used for printing the surface layer, the signal expansion layer, the shield layer, the power supply expansion layer, the power supply layer, the X and Y wiring layers, and the conversion layer is a general copper paste containing only copper as an inorganic component. .

Two types of pastes (hereinafter, referred to as “first paste” and “second paste”) are printed on the back surface layer. In the present embodiment, the first paste is for forming the first type conductor layer referred to in the claims. The second paste is for forming the second type conductor layer. The back layer was produced by printing the first paste first, and then printing the second paste at the same position (pattern). The first paste contains 85 to 99% by volume of reduced copper powder having an average particle size of 3 μm,
μm α-alumina powder is blended at 15 to 1% by volume, and 100 parts by weight of this mixed powder is mixed with 30 parts by weight of ethylhydroxyethyl cellulose and 100 parts by weight of butyl carbitol acetate.
The mixture in which the parts by weight were added was mixed with a mill for 30 minutes, and then kneaded by passing through three rolls several times to adjust the viscosity to an appropriate value. The second paste is a general copper paste in which the inorganic component is only copper.

The green sheet 6 thus produced
After zero sheets were aligned and laminated, they were pressed by hot pressing. Crimping conditions are temperature 130 ° C and pressure 150kg
f / cm ² . After pressing, 100 ° C / h for degreasing
The temperature was raised at a temperature rising rate of not more than r and maintained at 850 ° C. for 15 hours. The atmosphere is in an N ₂ + H ₂ + H ₂ O airflow that does not oxidize copper and can scatter and remove the binder of the green sheet. Thereafter, the atmosphere was changed to N _2, and firing was performed at 1000 ° C. for 2 hours.

When the adhesive strength between the back conductor layer of the manufactured glass ceramic multilayer circuit board and the glass ceramic was examined, the peel strength was 20 kgf / m and the tensile strength was 8 kg.
It was as good as 00 kgf / cm ² or more. Further, when the replacement Au plating was applied to the back surface conductor layer, almost the entire surface was replaced with Au plating, and the adhesion was good. Furthermore, when an electrical signal input / output pin made of CuZr was brazed using AuSn solder thereon, the adhesion of the pin was also good.

Example 2 This example is different from Example 1 in the specific composition of the above-mentioned first paste printed on the back layer of the green sheet.
Other points are the same as in the first embodiment.

In this embodiment, as the first paste, 85 to 99% by volume of reduced copper powder having an average particle size of 3 μm and 15 to 1% by volume of titanium powder having an average particle size of 2 μm are mixed. 30 parts by weight of ethyl hydroxyethyl cellulose and 10 parts by weight of butyl carbitol acetate
The mixture to which 0 parts by weight was added was mixed with a mill for 30 minutes, and then kneaded by passing through three rolls several times to adjust the viscosity to an appropriate value. This first paste in the present embodiment is referred to as “alloy conductor layer” in claims.
Used to form

When the adhesive strength between the back conductor layer of the glass ceramic multilayer circuit board of the present embodiment and the glass ceramic was examined, the peel strength was 22 kgf / m and the tensile strength was 800 kgf / cm ² or more. . Further, when the replacement Au plating was applied to the back surface conductor layer, almost the entire surface was replaced with Au plating, and the adhesion was good. Furthermore, when an electrical signal input / output pin made of CuZr was brazed using AuSn solder thereon, the adhesion of the pin was also good.

Example 3 This example is different from Example 1 in the specific composition of the above-mentioned first paste printed on the back layer of the green sheet.
Other points are the same as in the first embodiment.

In this embodiment, as the first paste, copper-titanium alloy powder having an average particle diameter of 3 μm (0.1% by weight of titanium)
100 parts by weight of ethyl hydroxyethyl cellulose 3
A mixture prepared by adding 0 parts by weight and 100 parts by weight of butyl carbitol acetate was mixed by a mill for 30 minutes, and then kneaded by passing through three rolls several times to adjust to an appropriate viscosity. did.

When the adhesive strength between the back conductor layer of the glass ceramic multilayer circuit board of the present embodiment and the glass ceramic was examined, the peel strength was as good as 30 kgf / m and the tensile strength was at least 800 kgf / cm ² . . Further, when the replacement Au plating was applied to the back surface conductor layer, almost the entire surface was replaced with Au plating, and the adhesion was good. Furthermore, when an electrical signal input / output pin made of CuZr was brazed using AuSn solder thereon, the adhesion of the pin was also good.

Example 4 This example is different from Example 1 in the specific composition of the above-mentioned first paste printed on the back surface layer of the green sheet.
Other points are the same as in the first embodiment.

In this embodiment, as the first paste, 85 to 99% by volume of reduced copper powder having an average particle size of 3 μm and 15 to 1% by volume of mullite powder having an average particle size of 2 μm are mixed. 30 parts by weight of ethyl hydroxyethyl cellulose, 10 parts by weight of butyl carbitol acetate
The mixture to which 0 parts by weight was added was mixed with a mill for 30 minutes, and then kneaded by passing through three rolls several times to adjust the viscosity to an appropriate value.

When the adhesive strength between the back conductor layer of the glass ceramic multilayer circuit board of the present embodiment and the glass ceramic was examined, the peel strength was as good as 19 kgf / m and the tensile strength was as good as 800 kgf / cm ² or more. . Also, using AuSn solder directly on this backside conductor layer, Cu
After brazing the Zr electrical signal input / output pins,
The pin adhesion was also good.

Example 5 This example is an electronic device package including the glass ceramic multilayer circuit board 1 manufactured in Examples 1 to 4.

The glass ceramic multilayer circuit board 1 manufactured in each of Examples 1 to 4 has a line wiring 2 and a through hole 3 formed therein. A multilayer circuit 4 was formed on the upper surface of the glass ceramic multilayer circuit board 1 using copper and polyimide. Further, the LSI chip 5 was mounted with the solder 6. Thereafter, the backside conductive layer was subjected to substitutional Au plating, and CuZr electrical signal input / output pins were brazed thereon using AuSn solder. FIG. 3 shows the internal configuration of the module thus created. In this module, high-precision connection with the LSI chip 5 is achieved.

Because of the high mechanical strength of the insulating material 8, no cracks were observed around the pinned portion by brazing the pin 7, soldering the LSI chip 5, or the like. No warping or deformation of the substrate was observed.

Embodiment 6 This embodiment is an electronic device package including the glass-ceramic multilayer circuit board 1 manufactured in Embodiments 1-4.

In this embodiment, a carrier substrate 9 made of the same material as that of the multilayer circuit board 1 is interposed between the glass ceramic multilayer circuit board 1 and the LSI chip 5. Then, the cap 11 is joined with the solder 6 on the upper end of the carrier substrate 9 and the upper surface of the LSI chip 5,
The carrier substrate 9 is sealed.

The glass-ceramic multilayer circuit board 1 was manufactured in Examples 1 to 4. The thin-film multilayer wiring 4 is formed on the upper surface of the carrier substrate 9 as in the fifth embodiment. The connection between the LSI chip 5 and the multilayer circuit board 1 is made by solder 6, as in the fifth embodiment.

Example 7 In this example, the addition amount of the bonding reinforcing agent (here, alumina) was variously changed. Other points are the same as in the first embodiment. For this circuit board, the results of measuring the adhesive strength between the insulator (glass ceramic substrate) and the surface conductor layer (which is composed of the first type conductor layer and the second type conductor layer) and the specific resistance of the surface conductor layer are shown. , Shown in FIG.

As can be seen from FIG. 5, the behavior of the adhesive strength greatly changes at about 1% by volume. Addition amount is 1
Below the volume%, the adhesive strength starts to decrease rapidly.

On the other hand, the specific resistance of the conductor layer continuously increases as the amount of addition increases. In order to maintain a resistance value substantially equal to that of copper (here, on the basis of about 2.3 μΩ · cm), it is not preferable to exceed 15% by volume.

Finally, some specific compositions of the substrate to which the present invention can be applied will be described. As the substrate of the present invention, materials having the following compositions I, II, III, and IV can be used.

[0064]

[0065]

As described above, according to the present invention, both the adhesion between the back conductor layer and the glass ceramic of the base material and the adhesion between the back conductor layer, the metal plating layer and the brazing agent can be achieved.

The thermal expansion difference between glass ceramics and copper is large, and a copper conductor layer containing an inorganic substance such as alumina is inserted between a glass ceramic and a copper conductor layer obtained by firing a paste consisting of only copper powder as an inorganic substance. Since the thermal expansion coefficient of this layer is an intermediate value between the thermal expansion coefficients of glass ceramics and copper, the thermal expansion coefficient is inclined, and there is also an effect of reducing thermal stress due to the difference in thermal expansion.

[Brief description of the drawings]

FIG. 1 is a sectional view of a glass ceramic multilayer circuit board of the present invention.

FIG. 2 is a cross-sectional view showing a state where electric signal input / output pins are attached to the glass ceramic multilayer circuit board of the present invention.

FIG. 3 shows a glass ceramic multilayer circuit board according to the present invention;
It is a schematic diagram which shows the internal structure of the mounted body of the electronic element which mounted the I chip.

FIG. 4 shows a LS on the glass ceramic multilayer circuit board of the present invention.
It is a schematic diagram which shows the internal structure of the mounted body of the electronic element which mounted the I chip.

FIG. 5 is a graph showing the results of measuring the relationship between the added amount of the bonding enhancer and the adhesive strength, and the relationship between the added amount of the bonding reinforcing agent and the specific resistance.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Glass ceramic multilayer circuit board 2 ... Through hole 3 ... 1st kind conductor layer (or alloy conductor layer) 4 ... 2nd kind conductor layer 5 ... Substitute gold plating layer 6 ... AuSn brazing material 7 ... Electric signal input / output Pin 8 ... Line wiring 9 ... Insulating material 10 ... Thin film multilayer circuit 11 ... Solder 12 ... LSI chip 13 ... Carrier substrate 14 ... Cap

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[Procedure amendment]

[Submission date] August 6, 2001 (2001.8.6)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/46 H05K 3/46 Q C04B 35/00 G (72) Inventor Shoichi Iwanaga Totsuka-ku, Yokohama-shi, Kanagawa 292 Yoshida-cho, Hitachi, Ltd.Production Technology Laboratory (72) Inventor Norihiro Ami 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture, Ltd.Hitachi Manufacturing Technology Laboratory (72) Inventor Masato Nakamura Yokohama, Kanagawa Prefecture 292 Yoshida-cho, Totsuka-ku, Hitachi, Ltd.Production Technology Laboratory (72) Inventor Fumiko Kobayashi 1-Horiyamashita, Hadano-shi, Kanagawa Pref. 1 Horiyamashita, Hadano-shi F-term in the general-purpose computer division of Hitachi, Ltd. (reference) 4E351 AA07 BB01 BB29 BB31 BB33 BB35 BB38 CC06 CC11 CC12 DD04 EE01 EE02 EE08 EE10 GG02 GG15 4G030 AA01 AA07 AA22 AA25 AA35 AA36 AA37 AA41 AA61 BA12 CA07 CA08 GA19 GA24 GA03 AC01 CC05 5 AA02 AA24 BB01 BB04 BB08 BB09 BB16 BB17 BB23 BB24 BB35 BB52 BB71 BB72 DD02 DD21 GG01 GG02 GG16 GG18 5E346 AA02 AA12 AA15 AA22 AA32 AA51 BB16 CC18 CC32 CC38 DD02 DD13 EE25 GG19 EE25 GG25

Claims (12)

[Claims] An insulator comprising a glass ceramic sinterable at a temperature equal to or lower than the melting point of copper, and a wiring provided on a surface of the insulator and having at least a part thereof formed of a plurality of layers. A portion of the wiring having a plurality of layers is formed of copper as a main component and including a bonding reinforcing agent, and a first-type conductor layer disposed in contact with the insulator; and without including the bonding reinforcing agent. A second-type conductor layer composed mainly of copper and arranged on the outermost surface side of the wiring;
A circuit board, comprising: 2. The circuit board according to claim 1, wherein the bonding agent includes at least one selected from the group consisting of alumina, mullite, titanium, titanium oxide, chromium, chromium oxide, manganese, and manganese dioxide. A circuit board, characterized in that: 3. The circuit board according to claim 1, wherein a volume ratio of the bonding reinforcing agent in the first type conductor layer is 1 to 15%. 4. An insulator comprising a glass ceramic sinterable at a temperature equal to or lower than the melting point of copper, and a wiring provided on a surface of the insulator and having at least a part thereof formed of a plurality of layers. The part of the wiring having a plurality of layers is configured to include an alloy of copper and titanium, and an alloy conductor layer disposed in contact with the insulator, and copper as a main component without including the bonding reinforcing agent. A second type conductor layer that is configured and disposed on the outermost surface side of the wiring;
A circuit board, comprising: 5. The circuit board according to claim 1, further comprising a gold plating layer further provided outside said second type conductor layer. 6. The circuit board according to claim 5, wherein the gold plating layer is a displacement gold plating layer. 7. The circuit board according to claim 1, 2 or 4, a brazing agent disposed on the second type conductor layer, and a pin made of a conductor fixed to the circuit board by the brazing agent. A circuit board, comprising: 8. An electronic device package comprising: the circuit board according to claim 1, 2, 3, 4, 5, 6 or 7, and a semiconductor element mounted on the circuit board. 9. A green sheet having a wiring formed on its surface, wherein at least a part of the wiring is composed of a plurality of layers, and a part of the wiring composed of a plurality of layers contains copper as a main component and a bonding reinforcing agent. A first-type conductor layer that is configured and arranged in contact with the insulator; and a second-type conductor layer that is mainly composed of copper without including the bonding reinforcing agent and that is disposed on the outermost surface side of the wiring When,
A green sheet, comprising: 10. The green sheet according to claim 9, wherein the bonding enhancer includes at least one selected from the group consisting of alumina, mullite, titanium, titanium oxide, chromium, chromium oxide, manganese, and manganese dioxide. A green sheet, characterized in that: 11. A green sheet having a wiring formed on a surface thereof, wherein at least a part of the wiring is formed of a plurality of layers, and a part of the wiring formed of the plurality of layers is configured to include an alloy of copper and titanium; An alloy conductor layer disposed in contact with the insulator, a second-type conductor layer formed of copper as a main component without including the bonding reinforcing agent and disposed on the outermost surface side of the wiring,
A green sheet, comprising: 12. A circuit board manufacturing method for manufacturing a circuit board by stacking green sheets on which wiring is formed on the surface and sintering the green sheets.
A method for manufacturing a circuit board, comprising: using the green sheet according to claim 9 or 11, and laminating the green sheet in a direction such that the second type conductor layer is positioned outside.