JP2002134440A - Substrate treating method and tray used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treating method which prevents contamination with cut chip or growth of burr during dicing of a substrate and efficiently executes post-processes, such as cleaning, drying, etc., as the chips make an array, after dicing. SOLUTION: The treating method comprises laminating protective layers 4, 5 with adhesives 6a, 6b on the surface of a substrate 1 having metal pattern layers 3a, 3b, dicing the substrate 1 down to at least the protective layers into dies, mounting the substrate 1 with the laminated projective layers on a tray 9 with a base plate 9a having protrusions 9b on the upside, with the protrusions 9b loosely fitted into trenches 8 cut by dicing the substrate 1 and dipping the substrate 1 in a releasing liquid 11 to dissolve the adhesives 6a, 6b, thereby separating the protective layers 4, 5 from the substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for treating a substrate having a metal pattern layer formed on a surface thereof and an apparatus used for the method.

[0002]

2. Description of the Related Art Generally, when dicing a semiconductor wafer substrate, for example, a substrate having a metal pattern layer formed on a silicon substrate, the substrate is pasted on a flat bakelite plate with wax, diced with a diamond blade, and then baked. Semiconductor elements or chips obtained by melting the wax by applying heat to the plate are washed with an organic detergent and water.

However, in the above-mentioned method, since the chips are washed in a separated state, the chips are overlapped with each other, the efficiency of washing and drying is low, and the surface of the chips is easily damaged. Therefore, for example, Japanese Patent Application Laid-Open Nos. Sho 59-172292 and
As disclosed in JP-A-142543, a substrate is attached to an adhesive sheet usually called a wafer sheet, and half-cut or full-cut using a diamond blade, and in the case of half-cut, divided into chips through a breaking process. It is known that washing or the like is performed in a state of being attached to an adhesive tape.

However, these conventional techniques have the following problems. 1) The chip surface is easily contaminated by chips. Since a metal pattern layer is formed on the surface of the substrate and has irregularities, chips tend to adhere, and if the specific resistance of the grinding fluid is high, the chips are more likely to adhere due to static electricity.

[0005] If the cutting powder remains without being sufficiently washed, in a later step, for example, there is a possibility that defective bonding of wire bonding, cutting of electrode wiring or damage of a chip may occur.

2) When the chips are washed in a separated state, the chips are overlapped with each other, the efficiency of washing and drying is low, and the surface of the chips is easily damaged. Further, an extra step of chip alignment processing is required before the bonding operation in the assembling process.

[0007] 3) When a hard material such as a ceramic substrate is cut, the chip is easily peeled off from the adhesive sheet at the time of cutting because of high cutting resistance.

[0008] 4) In the case of a brittle material such as a ceramic substrate, chipping is likely to occur.

5) Cut the ceramic substrate in half,
When the chip is divided into chips after the breaking step, the uncut ceramic tends to be "burr" as it is, and the dimensional accuracy of the chip cannot be obtained.

[0010] 6) The metal pattern layer formed on the surface of the substrate is liable to generate “burrs” at the time of cutting, particularly when the thickness of the metal pattern layer is large.

[0011]

SUMMARY OF THE INVENTION In view of the above problems, the present invention prevents contamination by chips on the chip surface and the like, and also prevents chipping and burrs of a substrate and disturbs chip alignment after dicing. In addition, an object of the present invention is to provide a substrate processing method and a tool used therefor, which can efficiently perform post-processes such as cleaning, drying, and inspection.

[0012]

According to the present invention, the above-mentioned problem is solved as follows. (1) A protective layer is laminated with an adhesive on the surface of a substrate on which a metal pattern layer is formed, and the substrate is diced and divided at least up to the protective layer. On top, the substrate on which the protective layer is laminated,
Disposing the protrusions of the tray in a state in which the protrusions are loosely fitted into the cut grooves formed by dicing the substrate, immersing the same in a stripping solution, dissolving the adhesive, and separating the protective layer from the substrate. This is a method for processing a substrate which is a feature of the present invention.

(2) Subsequent to the processing of the above item (1), it is assumed that the substrate is washed and dried while being placed on the tray.

(3) A protective layer is laminated by an adhesive on both front and back surfaces of the substrate on which the metal pattern layer is formed, and the substrate is diced and divided from one protective layer to at least the other protective layer. The substrate was loosely fitted on the tray provided with the ridge with the protection layer located on the surface side where the dicing was started facing downward, with the ridge of the tray being cut by the dicing of the substrate. The substrate processing method is characterized in that the substrate is placed in a state, immersed in a stripping solution, the adhesive is dissolved, and a protective layer located above the substrate is separated from the substrate.

(4) Subsequent to the processing of the above item (3), it is assumed that the substrate is washed and dried while being placed on the tray.

(5) Subsequent to the treatment of the above item (3) or (4), the trays of the same type as the tray are turned upside down by abutting the tips of the ridges of both trays, and turning the substrate upside down. To separate the protective layer located on the upper surface of the substrate.

(6) In the above item (5), after transferring the substrate to the other tray, the substrate is immersed in a liquid having a specific gravity smaller than the specific gravity of the substrate and larger than the specific gravity of the protective layer, and the difference in specific gravity is used. Then, the protective layer is separated from the substrate.

(7) In any one of the above items (1) to (6), the material of the protective layer is glass.

(8) In any one of the above items (1) to (7), the base plate of the tray is provided with a large number of holes penetrating from front to back.

(9) The substrate on which the metal pattern layer is formed is
A substrate processing tray, characterized in that a ridge that can be loosely fitted to a kerf formed by dicing and dividing up to a protective layer laminated on the surface with an adhesive is provided on the upper surface of the base plate. I do.

(10) In the above item (9), the ridges of the tray are provided on the upper surface of the base plate in a grid pattern.

(11) In the above item (9) or (10),
It is assumed that a large number of holes penetrating from front to back are formed in the base plate of the tray.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 8 are views for explaining a substrate processing method of the present invention. The substrate to be used in the present invention is not particularly limited as long as a metal pattern layer such as a wiring pattern, a solder pattern, and a resistance pattern is formed on the surface of the base material layer.

The material of the base layer may be a semiconductor such as silicon, a metal such as copper or aluminum, a ceramic such as aluminum nitride, beryllium oxide, silicon carbide, alumina, mullite or boron nitride, or a glass such as borosilicate glass. A known material such as a resin such as polyimide, epoxy, or the like is arbitrarily used.

As the metal forming the metal pattern layer,
Titanium, chromium, molybdenum, tungsten, tungsten titanium, aluminum, nickel chrome,
The material may be appropriately selected from tantalum, tantalum nitride, and other known conductive metals in consideration of the adhesion to the base material layer, the application, and the like.

In FIG. 1, as a substrate 1, a base material layer 2
Although the metal pattern layers 3a and 3b are formed on both surfaces of the substrate, the metal pattern layers may be formed on only one surface.

In the substrate processing method of the present invention, the protective layers 4 and 5 are laminated on the surface of the substrate 1 on which the metal pattern layers 3a and 3b are formed by using the adhesives 6a and 6b.

As the protective layer, it is preferable to use both the protective layer 4 for receiving laminated below the substrate 1 and the protective layer 5 for retaining laminated above the substrate 1. Both protective layers 4 and 5 are metal pattern layers 3a and 3b on the upper and lower surfaces of substrate 1, respectively.
Has the role of preventing contamination with cutting chips and the like during dicing.

As shown in FIG. 3, dicing is performed by applying a cutting blade 7a of a diamond blade 7 rotated at a high speed from above the substrate 1 on which the protective layers 4 and 5 are laminated. Therefore, the upper metal pattern layer 3a does not generate burrs because the cutting blade 7a hits from the outside, but the lower metal pattern layer 3a does not.
3b is likely to generate burrs because the cutting blade 7a hits from the inside.

This burr can be effectively prevented by using a material having lower malleability and ductility than the material of the metal pattern layer 3b for the receiving protective layer 4.

Specifically, glass, a silicon substrate, a bakelite plate, a polyvinyl chloride film, a polyethylene terephthalate film, or the like is preferably used as a material of the receiving protective layer 4. In general, it is desirable to use the same material for the pressing protective layer 5 as the receiving protective layer 4.

The thickness of the protective layers 4 and 5 is usually about 0.1 to 1 mm from the viewpoint of easy handling of the protective layer at the time of bonding and cutting resistance at the time of dicing. It is preferable to make it larger.

Adhesive 6 for laminating protective layers 4 and 5 on substrate 1
The materials a and 6b are not particularly limited as long as they have an adhesive function between the substrate 1 and the protective layers 4 and 5 and do not contaminate the metal pattern layers 3a and 3b and are dissolved by a stripping solution described later. Usually, a wax, an instant adhesive or the like may be used. The stripping solution varies depending on the type of the adhesive, but usually, an organic solvent such as acetone, hot water, or the like is used.

In the present invention, as shown in FIG. 3, the substrate 1 is diced and divided at least up to the receiving protective layer 4. Next, as shown in FIG. 4, the integrated body of the diced substrate 1 and the protective layers 4 and 5 is placed on a specific tray 9 and immersed in a stripper 11 filled in a container 10.

The tray 9 has a structure in which a ridge 9b is provided on the upper surface of a base plate 9a, and the ridge 9b can be loosely fitted into a cut groove 8 generated when the substrate 1 is diced. Has become.

The thickness of the cutting blade 7a of the diamond blade 7 is usually 0.1 to 0.5 mm, and the groove width A of the cutting groove 8 is slightly larger than the thickness of the cutting blade 7a.

In order to allow the protrusion 9b of the tray 9 to be loosely fitted in the cut groove 8, it is necessary that the thickness B of the protrusion 9b is slightly smaller than the groove width A of the cut groove 8. .

The height of the ridge 9b is set to avoid contact between adjacent chips obtained by dicing the substrate.
It is desirable that the dimension be slightly larger than the thickness of the substrate 1, but it is not necessarily limited to this dimension. Further, the protruding ridge 9b may be provided with a cut-off portion as long as the action of avoiding the contact between the chips is maintained.

Generally, the substrate 1 is diced to a certain size. Therefore, a typical embodiment of the tray 9 is shown in FIG.
As shown in a perspective view, a ridge 9b is provided on the upper surface of the base plate 9a in a lattice shape.

As shown in FIG. 4, by immersing the integrated body of the substrate 1 and the protective layers 4 and 5 placed on the tray 9 in the stripping solution 11, the adhesives 6a and 6b, for example, the wax are removed. 11, the metal pattern layer 3a of the substrate 1
The adhesion between the protective layer 3b and the protective layers 4 and 5 is released, and the protective layer 4 is easily separated from the substrate 1 by pulling up the protective layer 4 located above in the immersion state in FIG.

In order to improve the contact between the adhesives 6a and 6b and the stripping solution 11 and to dissolve the adhesives 6a and 6b in the stripping solution 11 in a short time, a large number of Hole 9c
It is desirable to drill.

The thickness of the base plate 9a is usually 0.5 to 1.0 in order to maintain the strength and the flow of the stripping solution 11 in the through-hole 9c in a good condition.
It is preferable to set the dimensions to about mm.

Since the material of the tray 9 is not corroded by the stripping liquid 11 and needs to be processed with high precision, a magnesium alloy, an aluminum alloy, ceramics such as silicon or aluminum nitride are used, and a magnesium alloy is particularly preferable. Used.

FIG. 5 shows that the upper protective layer 4 is
Shows a state separated from. Next, the substrate 1 is washed and dried while being placed on the tray 9.

Since the chips obtained by dicing the substrate 1 are partitioned by the ridges 9b of the tray 9, the chips do not overlap and are not damaged during cleaning or drying. The drying efficiency is also good.

After the dicing of the substrate 1, the washing and drying are performed by a known washing and drying method which is usually performed.
For example, ultrasonic cleaning in an organic solvent such as acetone and vapor drying with isopropyl alcohol may be used.

Next, in order to separate the protective layer 5 located between the substrate 1 and the base plate 9a of the tray 9, the following is performed.
That is, as shown in FIG. 6, a tray 12 of the same type as the tray 9 is overlapped with the tips of the ridges 9a and 12a of both trays 9 and 12 adjacent to each other and turned upside down, as shown in FIG. Then, the diced substrate 1 is transferred to the other tray 12.

Next, the pressing protective layer 5 located on the upper surface of each diced substrate 1 is separated.

The adhesive 6a, such as wax, which has fixed between the protective layer 5 and the substrate 1 is dissolved by dipping in the stripping solution 11, so that the protective layer 5 can be easily separated. it can. Unlike the receiving protective layer 4, the holding protective layer 5 is diced and divided into small pieces, and therefore, it takes time to separate the individual pieces by hand.

As a countermeasure, while the diced substrate 1 and the protective layer 5 shown in FIG. 7 are placed on the tray 12, the specific gravity of the substrate 1 is made smaller than the specific gravity of the substrate 1 and larger than the specific gravity of the protective layer. It is recommended that the protective layer 5 be separated from the substrate 1 by immersing the protective layer 5 in a liquid having the specific gravity and utilizing the difference in specific gravity. For example, when the substrate 1 is a ceramic substrate and the protective layer 5 is glass, the glass protective layer 5 can be easily immersed in a bromoform solution.
Can be separated from

[0051]

According to the present invention, the following effects can be obtained. (1) According to the first aspect of the present invention, since the protective layer is laminated on the surface of the substrate, contamination of the chip surface obtained by dicing the substrate due to chips or the like is prevented.
Therefore, it is possible to prevent the chip from being damaged due to the remaining chips on the chip surface or troubles such as defective bonding of the wire bonding and disconnection of the electrode wiring in a later process. Further, by laminating the protective layer,
"Dirt" and "burr" of the substrate at the time of dicing can be prevented, a good chip can be obtained, and the yield can be improved. Further, since the obtained chips are partitioned by the protrusions of the tray and are in an aligned state, it is possible to efficiently perform post-processes such as cleaning, drying, and inspection.

(2) According to the second aspect of the present invention, the work in the washing and drying steps can be performed with good finishing and good work efficiency.

(3) According to the third aspect of the invention, the same effects as described in the above (1) can be obtained on both surfaces of the substrate.

(4) According to the fourth aspect of the present invention,
The same effect as described in the item (2) can be obtained.

(5) According to the fifth aspect of the invention, the protective layer located on the upper surface of the substrate can be easily separated without disturbing the alignment of the chips.

(6) According to the sixth aspect of the invention, at the time of dicing the substrate, the protective layer divided into a number of small pieces can be efficiently separated without requiring any trouble.

(7) According to the seventh aspect of the present invention, since the glass has almost no malleability and ductility, the "burr" of the metal pattern layer which is likely to be generated at the time of dicing the substrate can be effectively prevented. Can be prevented.

(8) According to the eighth aspect of the present invention, in the step of peeling the protective layer and the step of cleaning and drying the chip obtained by dicing the substrate, a peeling liquid, a cleaning liquid or a drying gas is supplied to the tray. The above-described steps of peeling, washing, and drying can be efficiently performed in order to make good contact with important points through the through holes of the base plate.

(9) According to the ninth aspect of the present invention, a tray which is an instrument necessary for carrying out the first to eighth aspects of the present invention can be obtained.

(10) According to the tenth aspect of the present invention, there can be obtained a tray in which chips obtained by dicing a substrate can be easily aligned by preventing contact between adjacent chips. .

(11) According to the eleventh aspect of the invention, a tray having the same effect as described in the above (8) can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view of a substrate to be processed in the present invention.

FIG. 2 is a sectional view in which a protective layer is laminated on the front and back surfaces of the substrate using an adhesive.

FIG. 3 is a view illustrating a process of dicing and dividing the substrate on which the protective layer shown in FIG. 2 is laminated.

FIG. 4 is a drawing showing a state in which a diced substrate is turned upside down, placed on a tray, and immersed in a stripping solution.

FIG. 5 is a view showing a state in which a receiving protective layer is separated from a substrate.

FIG. 6 is a view for explaining a mode of transferring a substrate from one tray to another tray.

FIG. 7 is a view showing a state where a substrate is transferred to another tray.

FIG. 8 is a view showing a state in which a holding protective layer divided into small pieces is separated from a substrate.

FIG. 9 is a perspective view showing an embodiment of the tray of the present invention.

[Explanation of symbols]

 (1) Substrate (2) Base layer (3a), (3b) Metal pattern layer (4) Protective layer (for receiving) (5) Protective layer (for holding) (6a), (6b) Adhesive (7) Diamond・ Blade (7a) Cutting blade (8) Groove (9) Tray (9a) Plate (9b) Ridge (9c) Through hole (10) Container (11) Stripper (12) Tray (12a) Plate ( 12b) Ridge (12c) Through hole

Claims (11)

[Claims] 1. A protective layer is laminated with an adhesive on a surface of a substrate on which a metal pattern layer is formed, and the substrate is diced and divided at least up to the protective layer. The substrate on which the protective layer is laminated is placed on the tray with the protrusions of the tray loosely fitted in the cut grooves formed by dicing the substrate, and immersed in a stripping solution, and And dissolving the protective layer to separate the protective layer from the substrate. 2. A method for processing a substrate, comprising: washing and drying the diced substrate while remaining on the tray, following the process according to claim 1. 3. A protective layer is laminated with an adhesive on both front and back surfaces of the substrate on which the metal pattern layer is formed, and the substrate is divided by dicing from one of the protective layers to at least the other protective layer. A state in which the protective layer located on the surface side where dicing has been started is placed on the lower side of the tray provided with the ridges, and the substrate is loosely fitted into the kerf formed by dicing the substrate with the ridges of the tray. And immersing it in a stripper, dissolving the adhesive, and separating the protective layer located above the substrate from the substrate. 4. A method of processing a substrate, comprising washing and drying the diced substrate in a state of being placed on a tray, subsequent to the processing according to claim 3. 5. The process according to claim 3 or 4, wherein the tray of the same type as the tray is turned upside down with the ridge tips of both trays adjacent to each other and overlapped, and the substrate is placed on the other tray. And separating the protective layer located on the upper surface of the substrate. 6. The method according to claim 5, wherein after transferring the substrate to the other tray, the substrate is immersed in a liquid having a specific gravity smaller than the specific gravity of the substrate and larger than the specific gravity of the protective layer, and utilizing the difference in specific gravity. A method for treating a substrate, comprising separating a protective layer from the substrate. 7. The method for processing a substrate according to claim 1, wherein the material of the protective layer is glass. 8. The substrate processing method according to claim 1, wherein a number of holes penetrating from front to back are formed in the base plate of the tray. 9. A ridge which can be loosely fitted into a cut groove formed by dicing and dividing a substrate on which a metal pattern layer is formed up to a protective layer laminated on the surface thereof with an adhesive. A substrate processing tray provided on an upper surface. 10. The substrate processing tray according to claim 9, wherein the projections of the tray are provided in a grid on the upper surface of the base plate. 11. The tray according to claim 9, wherein the base plate of the tray has a large number of holes penetrating therethrough.
0. The substrate processing tray according to 0.