JP2002109498A - Portable electronic medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a portable electronic medium capable of preventing the unevenness of a casing caused by the shrinkage of a filled resin or the like and maintaining a high strength. SOLUTION: A rib 12 is provided at a central section is a lower casing 3. If an upper casing 2 and the lower casing 3 are superimposed on each other, the rib 12 in the lower casing 3 is formed at a position equivalent to a gap provided between an IC 14 and a memory 15 on a substrate 7 and is in close contact with the substrate 7, thereby preventing a dent of the lower casing 3 caused by the shrinkage of a resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a portable electronic medium comprising a thin memory card such as an SD card.

[0002]

2. Description of the Related Art Conventionally, as a method for manufacturing a portable semiconductor device (for example, an IC card or the like) in which electronic components are embedded in a card body so that no void is formed in the body, Japanese Patent Laid-Open Publication No.
No. 241496 discloses a method for manufacturing a non-contact IC card.

In this IC card, a module on which an IC, a battery, and the like are mounted is housed in a case on a circuit board, and then a thermosetting resin is injected into the case through a hole provided in an upper case to form a gap in the case. And then heat-cured, and the case and the module are integrally solidified to be manufactured.

[0004]

In the prior art as described above, the resin injected into the case shrinks as it is hardened. Therefore, if the case is thin, the shrinkage of the resin causes the case to shrink. Is pulled inward,
There is a problem that there is a high possibility that irregularities are formed on the case surface.

In particular, when the height of the electronic components mounted on the module is not constant, there is a difference in the amount of resin on each electronic component. Therefore, when the height of the electronic components is low and the amount of resin is large, shrinkage occurs. When the amount is large and the height of the electronic component is high and the amount of resin is small, the amount of shrinkage is small, so that irregularities on the case surface are more likely to occur, not only it is hard to see in appearance but also in strength There was a problem that it was also inferior.

The present invention has been made in view of the above points, and an object of the present invention is to provide a portable electronic medium capable of preventing irregularities of a case caused by shrinkage of a filling resin and maintaining a high strength. Aim.

[0007]

In order to achieve the above object, a portable electronic medium according to the present invention has a first case portion and a second case portion which covers the first case portion. A container inserted into the information processing device, a circuit board on which electronic components housed in the container are mounted, and a resin filled in a gap between the container and the circuit board; In a portable electronic medium that accommodates electronic components by covering the electronic components on the circuit board with the case portion, the electronic components are mounted on the circuit board provided on the second case portion and opposed to the second case portion. A convex portion having a height that reaches the circuit board when the electronic component on the circuit board is covered is formed in a non-existent portion.

In order to achieve the above object, a portable electronic medium according to the present invention has a first case and a second case placed over the first case. A container inserted into the container, a circuit board on which the electronic components housed in the container are mounted, and a resin filled in a gap between the container and the circuit board; In a portable electronic medium that stores electronic components by covering the electronic components on the circuit board, the filling resin is applied on the circuit board, and a plurality of electronic components mounted on the circuit board are provided. A first resin formed on the circuit board in a substantially flat shape according to the height of the electronic component having the highest height, a first resin formed on the circuit board, and the second case. And the second resin filling the gap with the part And butterflies.

According to another aspect of the present invention, there is provided a portable electronic medium including a circuit board on which electronic components are mounted, and a circuit board on which the electronic components are mounted and covering the electronic components. In a portable electronic medium inserted into an information processing apparatus, the circuit is provided in the case member and the electronic circuit is not mounted on the opposing circuit board. A projection having a height reaching the circuit board when the electronic component on the board is covered is formed.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) An embodiment of the present invention will be described below with reference to the drawings. 1 to 5 are views for explaining the appearance of a portable electronic medium 1 according to the first embodiment of the present invention, FIG. 1 is a top view thereof, FIG. 2 is a bottom view thereof, FIG. 3 is a side view thereof.
FIG. 4 is a front view, and FIG. 5 is a rear view.

The electronic medium 1 shown in FIG. 1 has a casing 4 composed of an upper case 2 and a lower case 3 made of resin. A slide switch 5 as a detection object made of resin is provided on a side surface of the casing 4.

At one end of the upper surface of the upper case 2, contact pads 8 as a plurality of contacts are exposed at predetermined intervals. The contact pad 8 is provided for supplying power, transmitting and receiving data to and from an external device, and the like.

In the casing 4, as shown in FIG.
The substrate 7 is stored. On this substrate 7, contact pads 8 are provided. As shown in FIG. 1, the contact pad 8 is formed so as to be exposed to the outside through an opening 2 a formed in the upper case 2.

As shown in FIG. 5, a filling resin material 10 is injected into a space in the casing 4 in which the substrate 7 is accommodated. As the filling resin material 10, various filling resin materials such as a thermosetting resin, an ultraviolet curable resin, and a foamed resin can be used.

The slide switch 5 is not electrically connected and is simply slidably mounted on the side surface of the casing 4. The slide switch 5 is formed to slide between the first position P1 and the second position P2 of the casing 4.

When the casing 4 is inserted into the information processing device, the position of the slide switch 5 is physically detected by a sensor in the information processing device. When the slide switch 5 is detected at the first position P1, for example,
Writing to the memory in the electronic medium 1 is enabled, and when it is detected at the second position P2, writing to the memory is prohibited.

FIG. 6 is a view showing the casing 4, and FIG.
FIG. 6A is a plan view showing the lower case 3, and FIG. 6B is a plan view showing the upper case 2.

A plurality of ribs 11 are provided at a front end side in the lower case 3 shown in FIG.
Are protruded integrally. Further, a rib 12 to be described later is further provided at a central portion in the lower case 3. In addition, a window portion 13 for exposing the contact pad 8 formed on the substrate 7 to the outside is formed on the distal end side in the upper case 2 shown in FIG.

FIG. 7 shows a substrate 7 housed in the casing 4.
FIG. FIG. 7A is a plan view showing a first surface 7a of the substrate 7, and FIG. 7B is a plan view showing a second surface 7b of the substrate 7.
FIG. 7C is a plan view showing a case where the substrate 7 is arranged in the upper case 2 shown in FIG. 6B.

On the first surface 7a of the substrate 7 shown in FIG. 7 (a), a plurality of contact pads 8 are formed at one end of the upper surface at predetermined intervals. The contact pad 8 is exposed to the outside through the window 13 of the upper case 2 shown in FIG. The first surface 7a is formed substantially flat because no electronic components or the like are mounted thereon.

On the upper surface of the second surface 7b of the substrate 7 shown in FIG.
A control IC 14 for controlling the whole, a memory 15 for storing various data, a capacitor 16 such as a chip component and the like are mounted at predetermined intervals.

The plurality of electronic components mounted on the board 7 have different heights, and are mounted on the board 7 at different intervals.

Then, as shown in FIG. 7C, the substrate 7 constructed as described above is assembled so that the first surface 7a is located inside the upper case 2. When attaching the substrate 7 to the upper case 2, a resin (not shown) may be potted between the upper case 2 and the first surface 7a of the substrate 7.

FIG. 8 is a sectional view of the electronic medium 1 in which the upper case 2 and the lower case 3 are formed so as to overlap each other. As shown in FIG. 8, the rib 12 of the lower case 3 shown in FIG.
It is formed at a position corresponding to a gap provided between the IC 14 and the memory 15 on the substrate 7 shown in FIG. Further, the height of the rib 12 is formed at a height in contact with the substrate 7.

As described above, by providing the ribs at the portions corresponding to the gaps between the electronic components in the case member (the lower case in the present embodiment) facing the substrate 7, the shrinkage ratio of the filling resin material 10 can be reduced. The resulting dent of the casing 4 can be prevented, and the strength can be kept high. (First Modification) FIG. 9 is a sectional view showing a first modification of the first embodiment. In the first modified example shown in FIG. 9, the thickness of the lower case 23 is formed to have different thicknesses in accordance with the height (degree of protrusion) of the opposing electronic components.

That is, for example, the memory 15 and the capacitor 16
The portion of the lower case 23 facing a thin (lower) electronic component such as is formed thick, and the portion of the lower case 23 facing a thick (high) electronic component such as the IC 14 is formed thinner. ing. As a result, the gap formed between the electronic component on the substrate 7 and the lower case 23 can be formed as small (narrow) as possible.

As a result, the gap between each electronic component and the lower case 23 is made uniform, so that the amount of the filled resin can be made uniform. Therefore, as described above, the gap can be reduced, the contraction rate of the filling resin at each point can be made the same, and the sink mark can be prevented from increasing only at a specific point.

Further, in the first modified example, similarly to the first embodiment, the ribs 12 are formed in the lower case 23 so as to enter the gap between the plurality of opposing electronic components. .

Therefore, the ribs 12 are provided at the portions corresponding to the gaps between the electronic components to prevent the dent of the casing 4 caused by the shrinkage ratio of the filling resin material 10 and to further oppose the thickness of the case. By variably forming the casing in accordance with the thickness of the electronic component, the strength of the casing can be kept higher. (Second Embodiment) FIGS. 10 and 11 show an electronic medium 21 according to a second embodiment of the present invention. FIG.
0 shows a cross-sectional view of the electronic component 21 of the second embodiment,
FIG. 11 is a diagram for explaining a manufacturing process in the middle.

The same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. In the second embodiment, as shown in FIG. 10, the strength is increased by dividing the filling resin material 10 into two parts, that is, the first resin 10a and the second resin 10b. To keep it.

Electronic medium 21 according to the second embodiment
As shown in FIG. 11A, first, at the stage of the substrate 7,
The first resin 10a is placed on the electronic components on the substrate 7. Next, as shown in FIG. 11 (b), the first resin 10a is surrounded by a case 19 and cured. And FIG.
As shown in (c), unevenness due to the difference in height of the mounted electronic components formed on the substrate 7 is formed in a flat state.

At this time, when the first resin 10a is cured according to the height of the tallest component (the IC 14 in this embodiment) among the electronic components mounted on the substrate 7, the The gap between the parts is flattened and then the second resin 10
When b is filled, the entire shrinkage ratio becomes the same, and it can be formed to have uniform strength.

Further, by making the gap between each electronic component and the lower case 23 uniform, the amount of the filled resin can be made uniform. Therefore, as described above, the gap can be reduced, the contraction rate of the filling resin at each point can be made the same, and the sink mark can be prevented from increasing only at a specific point.

After the first resin 10a is applied to the substrate 7 as shown in FIG. 11, the substrate 7 is attached to the upper case 2 and the second resin 10b is removed similarly to the first embodiment. Then, the lower case 3 is overlaid and attached, whereby the electronic medium 1 is completed. (Third Embodiment) FIGS. 12 to 15 show a third embodiment of the present invention.
It is a figure for explaining portable electronic medium 31 concerning an embodiment. FIG. 12 is a view showing the substrate 37, and FIG.
12A shows one surface of the substrate 37 (hereinafter, referred to as a first surface 37a), and FIG. 12B shows the other surface of the substrate 37 (hereinafter, referred to as a second surface 37b). is there.

FIG. 13 shows the electronic medium 3 together with the substrate 37.
FIG. 3 is a view showing a case 30 forming the first case 1; FIG.
15 to 15 are schematic cross-sectional views for explaining the structure of the electronic medium 31. As shown in FIG. 12, the substrate 37 used in the third embodiment is the same as the substrate used in the first embodiment, and thus the description is omitted.

In the third embodiment, FIG.
The first surface 37a on which the contact pad 8 shown in FIG.
Is exposed to the outside, it is also possible to process the first surface 37a. For example, the first surface 37a of the substrate 37 may be subjected to resist processing in advance, and after the electronic medium 31 is completed, the name of the product, the lot number, or the like may be displayed by laser marking.

The case 30 shown in FIG. 13 is the same as the lower case 23 of the first modification of the first embodiment, and the thickness (the thickness) of the case 30 corresponds to the height of the facing electronic component. Thick)
Is formed. The case 30 has a rib 32 formed at a position corresponding to a gap provided between the IC 14 and the memory 15 on the substrate 37.

Then, as shown in FIG. 14, the second surface 37b of the substrate 37 shown in FIG. 12 is arranged inside the case 30 shown in FIG. By using and bonding, the electronic medium 31 shown in FIG. 15 is completed.

In the third embodiment, the electronic medium is formed by a substrate and a single (one-sided) case, so that the number of parts can be reduced as compared with the first and second embodiments.

Further, a rib is provided at a portion corresponding to a gap between electronic components with respect to a case used as a casing to prevent dents in the casing 4 caused by a shrinkage ratio of the filling resin material 10 and to further reduce the case. Variably in accordance with the thickness of the opposing electronic components,
It is possible to keep the strength of the casing higher. (First Modification) FIG. 16 is a diagram showing a first modification of the third embodiment. In the first modification shown in FIG. 16, when the substrate is adhered to the case, the extra adhesive is stored in the outermost peripheral portion of the case 40 so that the extra adhesive does not protrude outside. A groove-shaped concave portion 44 is formed.

Other than that, the substrate 37 is the same as that of the third embodiment, and the thickness of the case 40 is the same as that of the third embodiment, corresponding to the height of the facing electronic component. Since the thickness is changed, the description is omitted. Further, the case 40 has a rib 42 at a position corresponding to a gap provided between the IC 14 and the memory 15 on the substrate 37.
Are formed.

Then, as shown in FIG. 17, the second surface 37b of the substrate 37 shown in FIG. 12 is arranged inside the case 40 shown in FIG. By using and bonding, the electronic medium 41 shown in FIG. 18 is completed. At this time, the extra adhesive sheet 49
Is housed in a groove-shaped recess 44 of the case 40.

In the first modification of the third embodiment, in addition to the effects of the third embodiment, a dam for accommodating extra adhesive is formed in a case used as a casing. As a result, it is possible to prevent the adhesive from protruding to the outside, and to prevent poor appearance. (Second Modification) FIGS. 19 and 20 show a case 40 in which a thermosetting adhesive is applied to the outer peripheral portion (other than the groove-shaped concave portion) of the case 40 and the substrate 37 is placed from above. A second modified example in which the adhesive is heated and cured by an oven or the like while being sandwiched and held, and the adhesive is thermally cured is shown.

Similarly, in the second modification, the excess adhesive is stored in the groove-shaped concave portion 44 of the case 40 and does not flow out to the surface of the electronic medium.

That is, the second embodiment of the third embodiment
In the modification of the third embodiment, in addition to the effects of the third embodiment, a dam for accommodating an extra adhesive is formed for a case used as a casing, so that the adhesive protrudes outside. Can be prevented, and poor appearance can be prevented.

[0046]

As described above, according to the present invention,
It is possible to prevent unevenness of the case caused by shrinkage of the filling resin or the like, and to maintain high strength.

[Brief description of the drawings]

FIG. 1 is a top view for explaining the appearance of a portable electronic medium 1 according to a first embodiment of the present invention.

FIG. 2 is a bottom view for explaining the appearance of the electronic medium 1.

FIG. 3 is a side view for explaining the appearance of the electronic medium 1.

FIG. 4 is a front view for explaining the appearance of the electronic medium 1;

FIG. 5 is a rear view for explaining the appearance of the electronic medium 1;

FIG. 6 is a view showing a casing 4.

FIG. 7 is a view showing a substrate 7 housed in a casing 4.

FIG. 8 is a cross-sectional view of the electronic medium 1 in which an upper case 2 and a lower case 3 are formed so as to overlap each other.

FIG. 9 is a sectional view showing a first modification of the first embodiment.

FIG. 10 shows an electronic medium 2 according to a second embodiment of the present invention.
1 is a sectional view.

FIG. 11 is a diagram illustrating a manufacturing process in the middle of the electronic medium 21.

FIG. 12 is a view showing a substrate 37 used for a configurable electronic medium 31 according to a third embodiment of the present invention.

FIG. 13 is a view showing a case 30 in which an electronic medium 31 is formed together with a substrate 37.

FIG. 14 is a schematic cross-sectional view illustrating the structure of an electronic medium 31.

FIG. 15 is a schematic cross-sectional view illustrating the structure of an electronic medium 31.

FIG. 16 is a diagram showing a case 40 used in a first modification of the third embodiment.

FIG. 17 is a schematic sectional view illustrating the structure of an electronic medium 41.

FIG. 18 is a schematic cross-sectional view illustrating the structure of an electronic medium 41.

FIG. 19 is a schematic sectional view for explaining a second modification of the third embodiment.

FIG. 20 is a schematic cross-sectional view for explaining a second modification of the third embodiment.

[Explanation of symbols]

 1, 21, 31, 41 Electronic medium 2 Upper case 3, 23 Lower case 4 Casing 5 Slide switch 7, 37 Substrate 8 Contact pad 10 Filled resin material 10a First resin 10b Second resin 12, 42 Rib 14 For control IC 15 Memory 16 Capacitor 30, 40 Case 39, 49 Adhesive sheet 44 Groove-shaped recess

Continued on the front page F term (reference) 2C005 MA07 MA12 MA14 NA03 NA18 PA18 PA21 PA25 RA07 5B035 AA07 BA03 BB09 CA01 CA22 CA38

Claims (8)

[Claims] 1. A container having a first case portion and a second case portion covered by the first case portion, the container being inserted into an information processing device, and an electronic component being contained in the container. And a resin filled in a gap between the container and the circuit board, and the electronic component is accommodated by covering the electronic component on the circuit board with the second case portion. In the portable electronic medium, when the electronic component on the circuit board is covered by a portion provided on the second case portion and not mounting the electronic component on the opposing circuit board, the electronic component reaches the circuit board. A portable electronic medium characterized by forming a convex portion having a height that varies. 2. The portable device according to claim 1, wherein the second case portion has a plurality of thicknesses corresponding to respective heights of a plurality of electronic components on the circuit board opposed to each other. Electronic medium. 3. A container having a first case portion and a second case portion covered by the first case portion, the container being inserted into the information processing device, and the electronic component being stored in the container. And a resin filled in a gap between the container and the circuit board, and the electronic component is accommodated by covering the electronic component on the circuit board with the second case portion. In the portable electronic medium, the filling resin is applied on the circuit board, and the circuit is mounted on the circuit board in accordance with the height of the tallest electronic component among the plurality of electronic components mounted on the circuit board. First to form a substantially flat shape on the substrate
And a second resin filling a gap between the first resin formed on the circuit board and the second case portion. 4. A circuit board on which electronic components are mounted, and a case member which is placed on the surface of the circuit board on which the electronic components are mounted and covers and accommodates the electronic components,
In a portable electronic medium inserted into the information processing device, when the electronic component on the circuit board is covered by a portion provided on the case member and not mounting the electronic component on the opposing circuit board, A portable electronic medium, wherein a convex portion having a height reaching the circuit board is formed. 5. The portable electronic medium according to claim 4, wherein said case member has a plurality of thicknesses corresponding to respective heights of a plurality of electronic components on said circuit board facing each other. 6. The circuit board according to claim 4, wherein a terminal portion for transmitting and receiving data to and from an external device is formed on a surface different from the surface on which the electronic components are mounted.
A portable electronic medium as described. 7. The case member is characterized in that a groove is formed on the entire outer peripheral portion of the case member, and excess resin or adhesive used for connecting the circuit board and the case member is stored in the groove. The portable electronic medium according to claim 4, wherein 8. The portable electronic medium according to claim 6, wherein display information is printed on a portion other than the terminal portion of the surface of the circuit board on which the terminal portion is formed.