JP4685461B2 - Piezoelectric oscillator and manufacturing method thereof - Google Patents

Description

  The present invention relates to a method for manufacturing a piezoelectric oscillator used in an electronic device such as a portable communication device.

  Conventionally, piezoelectric oscillators have been used as electronic components in electronic devices such as portable communication devices.

  As such a conventional piezoelectric oscillator, for example, as shown in FIG. 7, although not shown in FIG. 7, the first package body 23 in which the piezoelectric vibration element is accommodated is placed in the cavity portion 25. There is known a structure in which an integrated circuit element 26 for controlling the oscillation output based on the vibration of the piezoelectric vibration element and a second package body 21 in which an electronic component element such as a capacitor is housed are accommodated. The piezoelectric oscillator is placed on an external wiring board such as a mother board, and the external connection electrode terminals provided on the lower surface of the second package body 21 are soldered to the wiring of the external wiring board. Mounted on the board.

  The first package body 23 and the second package body 21 are usually formed of a ceramic material, and a wiring conductor is formed inside or on the surface, and a conventionally known ceramic green sheet lamination method or the like is adopted. It is manufactured by doing.

  Further, a temperature compensation circuit for correcting the oscillation frequency of the piezoelectric oscillator based on temperature compensation data created according to the temperature characteristics of the piezoelectric vibration element, for example, is provided inside the integrated circuit element 26, After assembling the piezoelectric oscillator, in order to store the temperature compensation data in the memory of the integrated circuit element 26, a write control terminal for writing temperature compensation data is provided on the lower surface or the outer surface of the second package body 21. 27 was provided. The temperature compensation data is stored in the memory of the integrated circuit element 26 by applying the probe needle of the temperature compensation data writing device to the write control terminal 27 and inputting the temperature compensation data to the memory in the integrated circuit element 26. The

The following literatures are disclosed for the piezoelectric oscillator as described above.
JP 2004-129090 A Japanese Patent No. 2974622

  The applicant has not found any prior art documents related to the present invention other than the prior art documents specified by the prior art document information described above by the time of filing of the present application.

  However, when the integrated circuit element 26 of the conventional piezoelectric oscillator described above is disposed in the concave space portion of the second package body 21, the concave space of the second package body 21 is reduced as the piezoelectric oscillator is downsized. The gap between the inner wall surface forming the portion and the integrated circuit element 26 is narrowed, and an insulating resin material for fixation is injected between the circuit forming surface (lower surface) of the integrated circuit element 26 and the second package 21. This makes it difficult to insert the device, and has a drawback that the impact resistance or productivity of the piezoelectric oscillator is remarkably lowered.

  Further, in the above-described conventional piezoelectric oscillator, usually, only the first package body 23 and the second package body 21 are individually manufactured by the “multiple picking” technique, and the obtained individual pieces (first The piezoelectric vibration element and the integrated circuit element 26 are individually mounted on the package body 23 and the second package body 21), and the both are joined to assemble the product. However, when the integrated circuit element 26, the first package body 23, etc. are mounted on the second package body 21 after the second package body 21 is divided into individual pieces, the operation is completed until the operation is completed. The second package body 21 must be individually held by a carrier or the like, and the assembling work is complicated, and additional manufacturing equipment such as a carrier is required. This also increases the productivity of the piezoelectric oscillator. It had the disadvantage of being lowered.

  The present invention has been conceived in view of the above-mentioned drawbacks, and therefore the object is to provide a piezoelectric device that can provide a compact piezoelectric oscillator having impact resistance, simple handling, and excellent productivity. To provide an oscillator and a method for manufacturing the same.

According to another method of manufacturing a piezoelectric oscillator of the present invention, a concave first space is formed on one main surface of an insulating first substrate, and a piezoelectric vibration element is mounted in the first space. Then, after the piezoelectric vibration element is electrically connected to the first package connection terminal formed on the other main surface of the first substrate, the lid body is covered with the first space opening, and the first A first package body hermetically sealing the space portion of
A concave second space is formed on one main surface of the insulating second substrate, and an integrated circuit element and an electronic component element in which at least an oscillation circuit is formed are mounted in the second space. The integrated circuit element and the electronic component element are electrically connected to the second package connection terminal formed on the top surface of the second side wall portion forming the second space, and the integrated circuit element and the electronic component element are connected to each other. The external connection electrode formed on the other main surface of the second substrate is electrically connected to the second package connection terminal formed on the top surface of the second side wall, and the integrated circuit element and the electronic component element are formed on the other main surface of the second substrate. A second package that is also electrically connected to the terminals;
In a method for manufacturing a piezoelectric oscillator formed by mechanically and electrically connecting and fixing a first package connection terminal and a second package connection terminal,
A second space is formed on one main surface, and a notch extending from the top of the second side wall to the bottom of the second space is formed in a part of the second side wall that surrounds the second space. A rectangular second substrate region is formed, and a second separation region is formed on the outer periphery of the second substrate region, and a groove portion connected to the notch is formed, and the second separation region is formed on the outer periphery. Forming a second mother substrate in which a plurality of formed second substrate regions are arranged in a matrix and configured integrally;
An integrated circuit element is formed in the second space portion formed on one main surface of the second substrate region of each of the second mother substrates, or an integrated circuit element is formed in the second space portion, and an electron is formed in the notch portion. A component element is mounted, the integrated circuit element and the electronic component element are electrically connected to a second package connection terminal formed on the top surface of the second side wall, and the integrated circuit element and the electronic component element are Electrically connecting to external connection electrode terminals formed on the other main surface of the two substrate regions;
A piezoelectric vibration element is mounted in a first space formed on one main surface of the first substrate, and a first package connection terminal and a piezoelectric vibration element formed on the other main surface of the first substrate are provided. A plurality of first package bodies, which are electrically connected and have a lid disposed so as to close the opening of the first space portion and hermetically seal the first space portion, are provided for each of the second mother substrates. Each of the first package connection terminals and the second package connection terminals are electrically connected to each other so that predetermined first package connection terminals are disposed on the second package connection terminals. A process of connecting and fixing with a bonding agent;
An insulating resin material flows out into each groove portion, and is integrated into the second space portion of each second substrate region through the notch portion to which the groove portion is connected and lower than the top surface of the second side wall portion. Injecting an insulating resin material to a height at which a part of the surface of the circuit element is exposed, and then heating and solidifying the resin material;
The second mother board to which the plurality of first package bodies are connected and fixed is cut along a cutting line along the outer periphery of the second board region of the second mother board, and each of the second mother boards provided with the grooves is provided. And a step of simultaneously obtaining a plurality of piezoelectric oscillators.

According to another method of manufacturing a piezoelectric oscillator of the present invention, a concave first space is formed on one main surface of an insulating first substrate, and a piezoelectric vibration element is formed in the first space. After mounting and electrically connecting the piezoelectric vibration element to the first package connection terminal formed on the other main surface of the first substrate, the lid body is placed over the first space portion opening portion. A first package body that hermetically seals one space;
A concave second space is formed on one main surface of the insulating second substrate, and an integrated circuit element and an electronic component element in which at least an oscillation circuit is formed are mounted in the second space. The integrated circuit element and the electronic component element are electrically connected to the second package connection terminal formed on the top surface of the second side wall portion forming the second space, and the integrated circuit element and the electronic component element are connected to each other. The external connection electrode formed on the other main surface of the second substrate is electrically connected to the second package connection terminal formed on the top surface of the second side wall, and the integrated circuit element and the electronic component element are formed on the other main surface of the second substrate. A second package that is also electrically connected to the terminals;
In a method for manufacturing a piezoelectric oscillator formed by mechanically and electrically connecting and fixing a first package connection terminal and a second package connection terminal,
A second space portion is formed on one main surface, and a notch portion extending from the top of the second side wall portion to the bottom surface of the second space portion is formed in a part of the second side wall portion surrounding the second space portion. A second substrate region having a rectangular shape and a second separation region in which a groove portion connected to the notch portion is formed on an outer periphery of the second substrate region, and the second separation region is Forming a second mother substrate in which a plurality of second substrate regions formed on the outer periphery are arranged in a matrix and configured integrally;
An integrated circuit element is mounted in the second space portion formed on one main surface of the second substrate region of each of the second mother substrates, or the integrated circuit element is mounted in the second space portion and is formed in the notch portion. Mounting an electronic component element, electrically connecting the integrated circuit element and the electronic component element to a second package connection terminal formed on the top surface of the second side wall, and further, the integrated circuit element and the electronic component element Electrically connecting the external connection electrode terminal formed on the other main surface of the second substrate region;
Insulating resin material flows out into each groove portion, and is integrated into the second space portion of each second substrate region through the notch portion to which the groove portion is connected and lower than the top surface of the second side wall portion. Injecting an insulating resin material to a height at which a part of the surface of the circuit element is exposed, and then heating and solidifying the resin material;
A rectangular first substrate region having the same surface as the second substrate region in which the first space portion is formed on one main surface, and a second abandoned region on the outer peripheral side surface of the first substrate region A plurality of first substrate regions each having a coplanar shape and a plurality of first substrate regions formed on the outer periphery are arranged in a matrix, and each of the first spaces is formed integrally. The piezoelectric vibration element is mounted on the part, and the first package connection terminal formed on the other main surface of each first substrate region and the piezoelectric vibration element are electrically connected to each other, and each first space The first mother board in which the lid is arranged so as to close the opening of the part and the first space is hermetically sealed corresponds to the second package connection terminal of each of the second mother boards. The first package connection terminals are disposed so that the first package connection terminals are arranged, and the first package connection terminals and the second package connection terminals are arranged. A step of connecting fixed with a conductive bonding material bets,
Cutting the first mother board and the second mother board, which are fixedly connected, with a cutting line along the outer periphery of the board area in each mother board, and separating the second surplus area provided with the groove, And a step of simultaneously obtaining a plurality of piezoelectric oscillators.

  In each manufacturing method of the piezoelectric oscillator described above, the width dimension of the groove portion is gradually narrowed toward each connected notch portion, and the width dimension of the notch connection end portion of the groove portion is the same as the width dimension of the notch portion. It was formed as follows.

  Further, according to the method for manufacturing a piezoelectric oscillator of the present invention, since the second cut-off region in which the groove portion connected to the notch portion is formed, the resin can be injected into the groove portion of the second cut-off region. The resin oscillator can be injected and solidified between the integrated circuit element and the inner surface of the second space portion without expanding the second space portion on which the integrated circuit element is mounted and in the mother board state, and the piezoelectric oscillator is further downsized. Even in this case, the impact resistance of the integrated circuit element can be improved, and the productivity and workability of the piezoelectric oscillator can be improved.

  In the piezoelectric oscillator of the present invention, the width of the groove is gradually narrowed toward each connected notch, and the width of the notch connection end of the groove is the same as the width of the notch. Since the resin injected into the groove portion guides the resin toward the notch portion, the resin can smoothly flow from the notch portion to the entire concave second space portion. It becomes possible to.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, in order to clarify the description in each drawing, a part of the drawing is not shown. Each dimension in the drawings is partially exaggerated, and the same reference numerals in the drawings indicate the same object.

  FIG. 1 is a partially exploded perspective view of a piezoelectric oscillator manufactured using the method for manufacturing a piezoelectric oscillator of the present invention. FIG. 2 shows a cross-sectional view when the piezoelectric oscillator shown in FIG. 1 is assembled and then cut along a virtual cutting line A1-A2 shown in FIG. FIG. 3 is a top view of the second substrate 12 in which one substrate region A cut from the insulating second mother substrate 30 and an abandoned region B are formed in a part of the periphery thereof. FIG. 4 is a top view illustrating a part of the second mother board 30 (integrated circuit element 7 and electronic component element 8 already mounted).

  In the piezoelectric oscillator shown in FIGS. 1 and 2, an external connection electrode terminal 19 is provided on the lower surface of the second substrate 10, and the concave second space portion 15 having an opening on the upper surface side of the second substrate 10. The integrated circuit element 7 and the electronic component element 8 are mounted on the. A plurality of write control terminals 11 are formed on the outer surface of the second side wall 13 surrounding the second space 15, and a part of the second side wall 13 is opened to form a notch 9. Has been. Further, a second package connection terminal 18 for mechanical and electrical connection with a first package body to be described later is formed at the corner of the top surface of the second side wall portion 13, and the second substrate. The external connection electrode terminal 19, the integrated circuit element 7, the electronic component element 8, and the second package connection terminal 18 are electrically connected by the conductive wiring formed inside and outside to constitute the second package body 2. ing.

  Further, on the second substrate 10, the first package body 1 in which the piezoelectric vibration element 5 is accommodated is placed and fixed. Further, as shown in FIG. 1, an insulating resin material 14 is provided between the integrated circuit element 7 mounted in the second space portion 15 and the inner surface of the second space portion 15. Of the integrated circuit element 7 and the like, and protects the circuit forming surface (lower surface) of the integrated circuit element 7 and the like, and strengthens the bonding strength between the integrated circuit element 7 and the second substrate 10. .

  The first package body 1 described above with reference to FIG. 1 includes a first substrate 12 made of a ceramic material such as glass-ceramic or alumina ceramic, and a lid body 4 made of a metal such as 42 alloy, Kovar, or phosphor bronze. The lid 4 is mounted on the top surface of the first side wall 13 of the first substrate 12 so as to cover the opening of the concave first space 6 formed in the first substrate. The first package body 1 is configured by being placed and fixed, and the piezoelectric vibration element 5 is mounted in the first space 6.

  1 and 2, the cutout portion 9 of the second substrate 10 is connected to a groove portion 16 formed in a second abandoned region B, which will be described later. The insulating resin material 14 is formed in the second space 15 and the notch 9 in which the integrated circuit element 7 and the like of the substrate 10 are arranged.

  The first package body 1 has piezoelectric vibration inside thereof, specifically, in a space portion surrounded by the bottom surface of the first space portion 6, the inner surface of the first side wall portion 3, and the lower surface of the lid body 4. The element 5 is accommodated and hermetically sealed, and a pair of element mounting electrode pads connected to the vibration electrode of the piezoelectric vibration element 5 are provided on the bottom surface of the first space 6. A plurality of first package connection terminals 17 are provided on the outer bottom surface of the substrate 12 so as to be opposed to and connected to the second package connection terminals 18 described above. Corresponding devices are electrically connected to each other via a wiring pattern on the surface of the substrate or a via hole embedded in the substrate.

  On the other hand, the piezoelectric vibration element 5 housed in the first package body 1 has both the front and back main faces of a flat plate-like crystal piece obtained by cutting an artificial crystal at a predetermined angle with respect to each crystal axis and polishing it. A pair of vibrating electrodes is attached to and formed on the surface, and when a variable voltage from the outside is applied to the crystal piece via the pair of vibrating electrodes, vibrations of various modes occur at a predetermined frequency.

  Here, the lid 4 of the first package body 1 is connected to the ground terminal of the external connection electrode terminals 19 via the first package connection terminal 17 and the second package connection terminal 18. In this case, since the lid 4 made of metal is connected to the reference potential during use, the shield function is provided, and thus the piezoelectric vibration element 5 and the integrated circuit element 7 are not required to be electrically operated from the outside. Can be well protected from. Therefore, the lid 4 of the first package body 1 is preferably connected to the external connection electrode terminal for the ground terminal via the first package connection terminal 17 and the second package connection terminal 18.

  The second package body 2 is formed in a substantially rectangular parallelepiped shape by a resin material such as a glass cloth base epoxy resin, polycarbonate, epoxy resin, polyimide resin, or a ceramic material such as glass-ceramic or alumina ceramic. Is formed.

  The second substrate 10 has four external connection electrode terminals 19 (a power supply voltage terminal, a ground terminal, an oscillation output terminal, an oscillation control terminal) according to the function of each terminal formed in a substantially square portion on the outer bottom surface. Among the second side wall portions 13 between the portions, a plurality of write control terminals 11 are provided on the outer side surface in the length direction.

  The four external connection electrode terminals 19 provided on the outer bottom surface of the second substrate 10 function as terminals for connecting the piezoelectric oscillator to an external wiring board such as a mother board. When mounted on the substrate, it is electrically connected to the circuit wiring of the external wiring substrate via a conductive bonding material such as solder.

  Furthermore, a plurality of electrode pads are provided in the central area of the bottom surface of the second space 15 of the second substrate 10 described above, and the connection pads of the integrated circuit element 7 are connected to these electrode pads by Au bumps or solder. Then, the integrated circuit element 7 is attached to a predetermined position in the second space portion 15 by being electrically and mechanically connected through a conductive bonding material such as an anisotropic conductive adhesive.

  The integrated circuit element 7 has, on its circuit formation surface (lower surface), a temperature sensing element such as a thermistor for detecting the ambient temperature state, a memory for storing temperature compensation data for compensating the temperature characteristics of the piezoelectric vibration element 5, and a memory Are provided with a temperature compensation circuit for correcting the vibration characteristics of the piezoelectric vibration element 5 according to the temperature change based on the temperature compensation data, and an oscillation circuit for generating a predetermined oscillation output connected to the temperature compensation circuit. The oscillation output generated by this oscillation circuit is output to the outside and then used as a reference signal such as a clock signal.

  An insulating resin material 14 made of an epoxy resin or the like is provided between the integrated circuit element 7 and the electronic component element 8 described above and the inner surface of the second space 15 and the surface of the notch 9 of the second substrate 10. The insulating resin material 14 is filled so as to cover part of the circuit forming surface (lower surface) and side surfaces of the integrated circuit element 7 and the electronic component element 8.

  Thereby, the attachment strength of the integrated circuit element 7 and the electronic component element 8 to the second substrate 10 is improved, and the circuit formation surface of the integrated circuit element 7 and the electronic component element 8 is excellent by the insulating resin material 14. It is possible to effectively prevent the electronic circuit on the circuit forming surface from being corroded by moisture in the atmosphere.

That is, in this embodiment , as shown in FIGS. 1 and 2, the top surface of the second side wall portion 13 is formed on a part of the second side wall portion 13 surrounding the second space portion 15 of the second substrate 10. Further, a notch 9 that reaches the bottom surface of the second space 15 is formed, and an insulating property is formed at a height of about 1/2 of the height of the integrated circuit element 7 in the notch 9 and the first space 15. The resin material 14 is filled .
As described above, the second space portion 15 is not completely filled with the resin agent 14, and a part of the surface of the integrated circuit element 7 is exposed in the second space portion 15, and one surface of the integrated circuit element 7 is exposed. Since the first space portion 15 where the portion is exposed is connected to the space outside the piezoelectric oscillator via the notch portion 9, heat generated from the integrated circuit element 7 and the like can be discharged outside the piezoelectric oscillator, It is possible to prevent problems in the piezoelectric oscillator characteristics due to heat generation.
Further, by mounting the electronic component element 8 such as a capacitor in the notch 9, the second space 15 can be effectively used as a space for the integrated circuit element 7, and the piezoelectric oscillator body can be further downsized. It becomes.

The method of the present invention for manufacturing a piezoelectric oscillator having such a structure will be described with reference to FIGS.
FIG. 5 illustrates a substrate region A corresponding to one piezoelectric oscillator from the second mother substrate 30 illustrated in FIG. 4 and an abandoned region B formed therearound, and is a process perspective showing a part of one manufacturing process. FIG.
FIG. 6 illustrates a substrate region A corresponding to one piezoelectric oscillator from the second mother substrate 30 illustrated in FIG. 4 and an abandoned region B formed around the substrate region, and represents a part of another manufacturing process. It is a perspective view.

  First, as shown in FIG. 4, the second substrate region A used as the second substrate 10 of the piezoelectric oscillator of the final form and the second m-th row × n-th row (second row region B) ( A second mother board 30 arranged in a matrix of n and m (natural numbers of 2 or more) is prepared. Here, the second mother substrate 30 is formed, for example, by laminating a plurality of insulating layers made of a ceramic material such as glass-ceramic or alumina ceramic with a conductor pattern therebetween.

  A plurality of concave second space portions 15 are formed at predetermined positions on one main surface in the second substrate region A of the second mother substrate 30, and the second substrate region A A rectangular second shape in which a notch 9 extending from the top surface of the second side wall 13 to the bottom surface of the second space 15 is formed in a part of the second side wall 13 surrounding the second space 15. In the outer periphery of the substrate region A and the second substrate region A, a second surplus region B in which a groove 16 connected to the notch 9 is formed, and a second surrogate region B is formed on the outer periphery. A plurality of substrate regions A are arranged in a matrix and are integrally formed to form a second mother substrate 30.

  The shape of the groove portion 16 gradually decreases as the width dimension of the groove portion 16 moves toward each notch portion 9 to be connected, and the width dimension of the notch portion connection end portion of the groove portion 16 is the same as the width dimension of the notch portion 9. It is formed so that With such a shape, the resin material 14 injected into the groove 16 can guide the resin material 14 toward the notch 9, so that the resin material 14 flows smoothly from the notch 9 to the entire second space. It becomes possible to do. Note that the shape of the groove 16 is not limited to the shape disclosed in the present embodiment as long as the resin material smoothly flows into the second space 15.

  Next, the integrated circuit element 7 is mounted in the second space portion 15 formed on one main surface of the second substrate region A formed on each of the second mother substrates 30 or the second space portion. An integrated circuit element 7 is mounted on 15, and an electronic component element 8 is mounted on the notch 9. The mounted integrated circuit element 7 and electronic component element 8 are electrically connected to a plurality of second package connection terminals 18 formed on the top surface of the second side wall portion 13, and the integrated circuit element 7 and The electronic component element 8 is also electrically connected to an external connection electrode terminal 19 formed on the other main surface of the second substrate region A.

  Next, as shown in FIG. 5, the piezoelectric vibration element 5 is mounted in the first space portion 6 formed on one main surface of the first substrate 12 and formed on the other main surface of the first substrate 12. The first package connection terminal 17 and the piezoelectric vibration element 5 are electrically connected, the lid 4 is disposed so as to close the opening of the first space 6, and the first space 6 is hermetically sealed. The plurality of stopped first package bodies 1 are respectively installed such that predetermined first package connection terminals 17 are disposed on the second package connection terminals 18 of the second mother board 30. Then, the first package connection terminals 17 and the second package connection terminals 18 are connected and fixed with a conductive bonding agent.

  Next, the tip of the nozzle 20 of the dispenser is inserted into each groove portion 16 so that the insulating resin material 14 flows out, and the second substrate regions A formed in the individual second substrate regions A through the notches 9 to which the groove portions 16 are connected. Then, the insulating resin material 14 is heated and solidified after flowing into the second space 15 to a height of about ½ of the height of the integrated circuit element 7. Since the notch portion 9 and the groove portion 16 connected to the notch portion 9 are formed in the second discarding region B, even if there is no gap in which the nozzle 20 can be inserted into each second space portion 15 due to downsizing, the second portion Since the insulating resin material 14 can be injected into the second space 15 through the notch 9 from the groove 16 in the disposal region B, it is possible to cope with further miniaturization of the piezoelectric oscillator. In addition, it is possible to inject resin into the second space portion 15 simultaneously or continuously in the state of the second mother substrate 30, and productivity and workability can be improved.

  In the above-described embodiment, the example in which the resin material 14 is caused to flow up to about half the height of the integrated circuit element 7 is disclosed. However, the circuit forming surface (lower surface) of the integrated circuit element 7 is disclosed. , And a part of the surface of the integrated circuit element 7 is exposed in the second space 15, and the second space 15 in which a part of the surface of the integrated circuit element 7 is exposed is a notch. If the space is connected to the space outside the piezoelectric oscillator via 9, the effects of exhaust heat and fixing force enhancement in the present invention can be obtained. It is determined to be lower than the top surface of the second side wall portion 13 constituting the space portion 15 and within a height range in which a part of the surface of the integrated circuit element is exposed. Further, it is desirable to select a resin material having good fluidity as the material of the insulating resin material 14.

  Finally, the second mother substrate 30 to which the plurality of first package bodies 1 are connected and fixed is cut along a cutting line C along the outer periphery of the second substrate region A in the second mother substrate 30 to obtain the groove portion 16. Is separated from the second substrate area A, and a plurality of piezoelectric oscillators can be obtained simultaneously.

  In the above-described manufacturing method of the present invention, the first package connecting terminal 17 and the second package connecting terminal 18 of the first package body 1 formed individually are connected and fixed with a conductive bonding material. Later, a process of injecting an insulating resin material 14 into the first space 15 in the second substrate 12 region is used. However, as shown in FIG. After injecting the insulating resin material 14 from the groove 16 formed in the second marginal region B, the first substrate region and the first marginal region are formed with the same dimensions as the second mother substrate 30. A first mother board (not shown) composed of a plurality of first package bodies is connected to the corresponding first package connection terminal 17 on the first mother board side and the second mother board side second. After connecting and fixing the package connection terminal 18 with a conductive bonding material, the first and second bases are connected. The taken along line D together, it may be a method of obtaining individual piezoelectric oscillators.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  For example, in the above-described embodiment, as shown in each drawing, the notch 9 formed in the second side wall 13 of the second substrate 10 is provided on the short side of the second substrate 10. It may be provided on the side. Needless to say, this case is also included in the technical scope of the present invention.

FIG. 1 is a partially exploded perspective view of a piezoelectric oscillator according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the piezoelectric oscillator shown in FIG. 1 assembled and then cut along a virtual cutting line A1-A2 shown in FIG. FIG. 3 shows a second substrate constituting one piezoelectric oscillator according to the present invention, in which a substrate region A and a surrounding region B are formed in a part of the periphery of the insulating second mother substrate. It is a top view. FIG. 4 is a top view illustrating a part of the second mother board (integrated circuit element and electronic component element mounted). FIG. 5 illustrates a substrate region A corresponding to one piezoelectric oscillator from the second mother substrate illustrated in FIG. 4 and an abandoned region B formed around the substrate region, and shows one manufacturing process of the piezoelectric oscillator according to the present invention. It is a process perspective view showing a section. FIG. 6 illustrates a substrate region A for one piezoelectric oscillator from the second mother substrate shown in FIG. 4 and an abandoned region B formed around the substrate region, and shows another manufacturing process of the piezoelectric oscillator according to the present invention. It is a process perspective view showing a part. FIG. 7 is a schematic perspective view of a conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... 1st package body 2 ... 2nd package body 3 ... 1st side wall part 4 ... Lid body 5 ... Piezoelectric vibration element 6 ... 1st space part 7 ... Integrated circuit elements
DESCRIPTION OF SYMBOLS 8 ... Electronic component element 9 ... Notch part 10 ... 2nd board | substrate 11 ... Write control terminal 12 ... 1st board | substrate 13 ... 2nd side wall part 14 ... Resin material 15 ... second space 16 ... groove 17 ... first package connection terminal 18 ... second package connection terminal 19 ... external connection electrode terminal 30 ... Second mother board A ... Board area B ... Disposal area

Claims (3)

A concave first space is formed on one main surface of the insulating first substrate, a piezoelectric vibration element is mounted in the first space, and the piezoelectric vibration element is mounted on the first substrate. A first package connecting terminal formed on the other main surface of the first, and then a lid is placed over the first space opening to hermetically seal the first space. Package body,
A concave second space is formed on one main surface of the insulating second substrate, and an integrated circuit element and an electronic component element in which at least an oscillation circuit is formed are mounted in the second space. The integrated circuit element and the electronic component element are electrically connected to a second package connection terminal formed on the top surface of the second side wall portion that forms the second space, and further, the integrated circuit element and the electronic component element The electronic component element includes a second package body that is also electrically connected to the external connection electrode terminal formed on the other main surface of the second substrate.
In the method of manufacturing a piezoelectric oscillator formed by mechanically and electrically connecting and fixing the first package connection terminal and the second package connection terminal,
A second space portion is formed on one main surface, and a part of the second side wall portion surrounding the second space portion reaches the bottom surface of the second space portion from the top surface of the second side wall portion. A second substrate region having a rectangular shape in which a notch is formed, and a second abandon region in which a groove connected to the notch is formed on the outer periphery of the second substrate region, and the second discard region is formed. A step of forming a second mother substrate in which a plurality of the second substrate regions formed on the outer periphery are arranged in a matrix and configured integrally;
The integrated circuit element is formed in the second space formed on one main surface of the second substrate region of each of the second mother substrates, or the integrated circuit element and the notch are formed in the second space. The electronic component element is mounted on the portion, and the integrated circuit element and the electronic component element are electrically connected to a second package connection terminal formed on the top surface of the second side wall portion that forms the second space. Electrically connecting the integrated circuit element and the electronic component element to an external connection electrode terminal formed on the other main surface of the second substrate region;
A piezoelectric vibration element is mounted in the first space portion of a first substrate having a first space portion formed on one main surface, and a first package connection formed on the other main surface of the first substrate. A plurality of first terminals in which the first terminal is electrically connected to the piezoelectric vibration element, a lid is disposed so as to close the opening of the first space, and the first space is hermetically sealed. The package bodies are respectively installed so that the predetermined first package connection terminals are arranged on the second package connection terminals of the second mother boards, and the first packages are arranged. Connecting and fixing the connection terminal and the second package connection terminal with a conductive bonding material;
An insulating resin material flows out into each of the groove portions, and the top of the second side wall portion enters the second space portion of each of the second substrate regions through the notch portions connected by the groove portions. Flowing the resin material to a height lower than the surface and exposing a part of the surface of the integrated circuit element, and then heating and solidifying the resin material;
The second mother board to which the plurality of first package bodies are connected and fixed is cut along the outer periphery of the second substrate area of the second mother board, and the groove portions are provided. Separating the second abandoned area and simultaneously obtaining a plurality of piezoelectric oscillators;
A method for manufacturing a piezoelectric oscillator, comprising: A concave first space is formed on one main surface of the insulating first substrate, a piezoelectric vibration element is mounted in the first space, and the piezoelectric vibration element is mounted on the first substrate. A first package connecting terminal formed on the other main surface of the first, and then a lid is placed over the first space opening to hermetically seal the first space. Package body,
A concave second space is formed on one main surface of the insulating second substrate, and an integrated circuit element and an electronic component element in which at least an oscillation circuit is formed are mounted in the second space. The integrated circuit element and the electronic component element are electrically connected to a second package connection terminal formed on the top surface of the second side wall portion that forms the second space, and the integrated circuit element and The electronic component element includes a second package body that is also electrically connected to an external connection electrode terminal formed on the other main surface of the second substrate.
In the method of manufacturing a piezoelectric oscillator formed by mechanically and electrically connecting and fixing the first package connection terminal and the second package connection terminal,
A second space portion is formed on one main surface, and a part of the second side wall portion surrounding the second space portion reaches the bottom surface of the second space portion from the top surface of the second side wall portion. A second substrate region having a rectangular shape in which a notch is formed, and a second abandon region in which a groove portion connected to the notch is formed on the outer periphery of the second substrate region, and the second discard region is formed. A step of forming a second mother substrate in which a plurality of the second substrate regions formed on the outer periphery are arranged in a matrix and configured integrally;
An integrated circuit element is formed in the second space portion formed on one main surface of the second substrate region of each of the second mother substrates, or the integrated circuit element is also formed in the second space portion. The electronic component element is mounted on the portion, the integrated circuit element and the electronic component element are electrically connected to a second package connection terminal formed on the top surface of the second side wall, and the integrated circuit element is further connected. Electrically connecting the circuit element and the electronic component element to an external connection electrode terminal formed on the other main surface of the second substrate region;
An insulating resin material flows out into each of the groove portions, and into the second space portion of each of the second substrate regions through the notch portion to which the groove portion is connected, from the top surface of the second side wall portion. Flowing the resin material to a height that is low and exposing a portion of the surface of the integrated circuit element, and then heating and solidifying the resin material;
A first substrate region having the same surface shape as the second substrate region having a first space portion formed on one main surface, and the same as the second discard region on the outer peripheral side surface of the first substrate region. A plurality of first substrate regions, each having a surface-shaped first marginal region and having the first marginal region formed on an outer periphery, are arranged in a matrix and integrally formed. A piezoelectric vibration element is mounted in the space, and the first package connection terminal formed on the other main surface of each first substrate region is electrically connected to the piezoelectric vibration element, and A first mother board in which a lid is disposed so as to close an opening of one space portion and the first space portion is hermetically sealed, and the second package connection terminals of each of the second mother boards The first package connection terminals corresponding to the first package connection terminals are arranged so as to be disposed on the first package connection terminals and the second package connection terminals. A step of connecting fixing the connection terminals with a conductive bonding material,
The first mother board and the second mother board, which are connected and fixed, are cut along the outer periphery of the substrate area of each mother board, and the first surplus area and the second groove portion are provided. Separating the abandoned area and simultaneously obtaining a plurality of piezoelectric oscillators;
A method for manufacturing a piezoelectric oscillator, comprising: 3. The method of manufacturing a piezoelectric oscillator according to claim 1 , wherein the width of the groove is gradually narrowed toward each connected notch, and the width of the notch connecting end of the groove is the width of the notch. A method for manufacturing a piezoelectric oscillator, characterized in that the piezoelectric oscillator is formed to have the same width as the notch.

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