JP7173933B2 - Piezoelectric device and manufacturing method thereof - Google Patents

Description

The present disclosure relates to piezoelectric devices, such as piezoelectric oscillators, and methods of manufacturing the same.

A piezoelectric device is known that includes a piezoelectric vibrator, a semiconductor element, and a wiring board having an opening (see, for example, Patent Document 1). The piezoelectric vibrator is mounted on the wiring board so as to close the opening. The semiconductor element is mounted on the piezoelectric vibrator within the opening. In the opening, an underfill resin is filled between the piezoelectric vibrator and the semiconductor element.

JP 2016-054376 A

In order to fill the underfill resin between the piezoelectric vibrator and the semiconductor element, the liquid underfill resin is dropped from the discharge nozzle of the dispenser. At this time, the tip of the ejection nozzle is inserted into the gap of the opening with the semiconductor element facing upward. However, in recent years, due to the miniaturization of piezoelectric devices, the ejection nozzles have become relatively too thick, making it difficult to insert the tip of the ejection nozzle into the gap of the opening. Therefore, it is unavoidable to drop the underfill resin on the upper surface of the semiconductor element so that the underfill resin flows to the lower surface of the semiconductor element.

However, when the underfill resin is dropped onto the upper surface of the semiconductor element, the underfill resin remains on the upper surface of the semiconductor element, and the underfill resin sometimes protrudes from the opening when viewed from the side. Such a piezoelectric device is determined to be defective (defective in thickness) because the protruding underfill resin interferes and cannot be mounted on a printed wiring board or the like.

Therefore, an object of the present disclosure is to provide a piezoelectric device that can be filled with an underfill resin without dripping the underfill resin onto the upper surface of a semiconductor element even if the piezoelectric device is miniaturized.

A piezoelectric device according to the present disclosure includes:
a substantially rectangular wiring board having a first surface and a second surface that are in a front-back relationship, and an opening penetrating the first surface and the second surface;
a piezoelectric vibrator positioned on the first surface so as to cover the opening;
a semiconductor element positioned on the piezoelectric vibrator within the opening;
an underfill resin filling between the piezoelectric vibrator and the semiconductor element in the opening;
a cutout portion cut from the opening to the outer surface of the wiring substrate in plan view on one side of the rectangle of the wiring substrate;
is provided.

A method for manufacturing a piezoelectric device according to the present disclosure includes:
A method of manufacturing a piezoelectric device according to the present disclosure, comprising:
a step of forming a plurality of the wiring substrates made of one sheet with the cutout portions facing each other in a plan view;
a step of mounting the piezoelectric vibrators on a plurality of the wiring substrates;
mounting the semiconductor element on the piezoelectric vibrator;
filling the space between the piezoelectric vibrator and the semiconductor element with the underfill resin by discharging the underfill resin into the two notches facing each other;
a step of obtaining a plurality of the piezoelectric devices by cutting off the plurality of wiring substrates one by one;
including.

According to the present disclosure, even if the piezoelectric device is downsized, the underfill resin can be filled without dripping the underfill resin onto the upper surface of the semiconductor element.

1 is an exploded perspective view showing the piezoelectric device of Embodiment 1. FIG. 2[A] is a sectional view taken along line IIa-IIa in FIG. 1, and FIG. 2[B] is a sectional view taken along line IIb-IIb in FIG. It is a schematic plan view showing the piezoelectric device in FIG.1 and FIG.2 turned over, FIG.3[A] is Embodiment 1, FIG.3[B] is another Example. 4[A] is a schematic plan view showing the piezoelectric device of the comparative example turned over, and FIG. 4[B] is a sectional view along line IVb-IVb in FIG. 4[A]. 5[A] is a schematic plan view showing the piezoelectric device of Embodiment 1 turned over, and FIG. 5[B] is a sectional view taken along line Vb-Vb in FIG. 5[A]. 6[A] is a schematic plan view showing the piezoelectric device of Embodiment 1 turned over, and FIG. 6[B] is a sectional view taken along line VIb-VIb in FIG. 6[A]. 7[A] is a schematic plan view showing a piezoelectric device of another embodiment turned over, and FIG. 7[B] is a sectional view taken along the line VIIb-VIIb in FIG. 7[A]. 8[A] is a schematic plan view showing the piezoelectric device turned over in the manufacturing method of Embodiment 2, FIG. 8[B] is a cross-sectional view taken along line VIIIb-VIIIb in FIG. 8[A], and FIG. 8[C] is an embodiment. 8[D] is a cross-sectional view taken along the line VIIId-VIIId in FIG. 8[C]. 9[A] is a schematic plan view showing the piezoelectric device turned over in the manufacturing method of Embodiment 2, FIG. 9[B] is a cross-sectional view taken along line IXb-IXb in FIG. 9[A], and FIG. 9[C] is an embodiment. 9[D] is a schematic plan view showing the piezoelectric device turned over in the manufacturing method of No. 2, and FIG. 9[D] is a sectional view taken along line IXd-IXd in FIG. 10[A] is a schematic plan view showing the piezoelectric device turned over in the manufacturing method of Embodiment 2, and FIG. 10[B] is a cross-sectional view taken along the line XX in FIG. 11[A] is a schematic plan view showing the piezoelectric device turned over in the manufacturing method of Embodiment 3, FIG. 11[B] is a cross-sectional view taken along line XIb-XIb in FIG. 11[A], and FIG. 11[C] is an embodiment. 11[D] is a cross-sectional view taken along the line XId-XId in FIG. 11[C]. 12[A] is a schematic plan view showing the piezoelectric device turned over in the manufacturing method of Embodiment 3, FIG. 12[B] is a cross-sectional view taken along line XIIb-XIIb in FIG. 12[A], and FIG. 12[C] is an embodiment. 12[D] is a cross-sectional view taken along the line XIId-XIId in FIG. 12[C]. 13[A] is a schematic plan view showing the piezoelectric device turned over in the manufacturing method of Embodiment 3, and FIG. 13[B] is a sectional view taken along the line XIIIb-XIIIb in FIG.

EMBODIMENT OF THE INVENTION Hereinafter, the form (henceforth "embodiment") for implementing this indication is demonstrated, referring an accompanying drawing. In this specification and drawings, the same reference numerals are used for substantially the same components. Also, in the drawings, for a plurality of identical constituent elements, only one constituent element may be given a reference numeral. The shapes depicted in the drawings are drawn so that those skilled in the art can easily understand them, so they do not necessarily match the actual dimensions and proportions. Hereinafter, Embodiment 1 relates to the piezoelectric device according to the present disclosure, and Embodiments 2 and 3 relate to the method for manufacturing the piezoelectric device according to the present disclosure.

<Embodiment 1>
1 is an exploded perspective view showing the piezoelectric device of Embodiment 1, FIG. 2[A] is a sectional view taken along line IIa-IIa in FIG. 1, and FIG. 2[B] is a sectional view taken along line IIb-IIb in FIG. FIG. 3 is a schematic plan view showing the piezoelectric device in FIGS. 1 and 2 turned over (see FIGS. 1 and 2 for details), FIG. For example. Description will be made below based on these drawings. The solder paste 29a is shown in FIG. 1, and the underfill resin 63, the second pad 54, and the solder 29 are shown in FIG. In FIG. 3, illustration of the external connection terminals 28 is omitted.

The piezoelectric device 10 of Embodiment 1 includes a substantially rectangular wiring substrate 20 having a first surface 21 and a second surface 22 which are in a front-back relationship, and an opening 23 penetrating the first surface 21 and the second surface 22. , the piezoelectric vibrator 30 positioned on the first surface 21 so as to cover the opening 23 , the semiconductor element 60 positioned on the piezoelectric vibrator 30 within the opening 23 , and the piezoelectric vibrator 30 and the semiconductor element 60 within the opening 23 . An underfill resin 63 filling a space between the wiring board 20 and the element 60 , and a notch 24 cut from the opening 23 to the outer surface 232 of the wiring board 20 in plan view on one side 231 of the rectangle of the wiring board 20 . ing.

As shown in FIG. 3A, the cutout portion 24 is chipped larger than the outer diameter of the nozzle 64 for discharging the underfill resin 63 in plan view. For example, if the length of the notch 24 along the side 231 is a, and the outer diameter of the discharge nozzle 64 is b, then a>b. At this time, the underfill resin 63 can be supplied from the ejection nozzle 64 by inserting the ejection nozzle 64 into the notch 24 . However, a≦b may be satisfied, and in that case, the underfill resin 63 may be dripped from above the cutout portion 24 .

A piezoelectric device 10a of another embodiment shown in FIG. 3B has the same configuration as the piezoelectric device 10 except that a wiring board 20a having a notch 24a is used. Approximately the entire side 231 of the notch portion 24a is missing. For example, the notch 24 is formed by cutting the entire side of the substantially rectangular opening 23 to the outer surface 232 of the wiring board 20 . Also in this embodiment, if c is the length of the notch 24a along the side 231 and d is the outer diameter of the ejection nozzle 65, c>d or c≦d may be satisfied.

The liquid underfill resin 63 dropped onto the piezoelectric vibrator 30 in the notch 24 spreads so as to be sucked between the piezoelectric vibrator 30 and the semiconductor element 60 by capillary action.

Next, the configuration of the piezoelectric device 10 will be described in more detail.

The piezoelectric device 10 is a crystal oscillator including a wiring board 20 , a piezoelectric vibrator 30 and a semiconductor element 60 . The piezoelectric device 10 may be a voltage controlled crystal oscillator (VCXO), a temperature compensated crystal oscillator (TCXO), a crystal oscillator with an oven (OCXO), or the like. may be

The wiring board 20 has, for example, the same configuration as a general printed wiring board. In other words, the wiring substrate 20 includes an insulating substrate 25, four internal wirings 26, four vibrator pads 27, four external connection terminals 28, etc. in addition to the first surface 21, the second surface 22 and the openings 23. have. The size of the wiring board 20 in plan view may be the same as that of the piezoelectric vibrator 30 or may be larger than that of the piezoelectric vibrator 30 .

The insulating substrate 25 is made of, for example, a glass epoxy resin, and has a first surface 21 on one side and a second surface 22 on the other side. is located. Internal wiring 26, vibrator pads 27, and external connection terminals 28 are formed on the insulating substrate 25 by means of conductor patterns. That is, the vibrator pads 27 are provided around the opening 23 of the first surface 21 , and the external connection terminals 28 are provided at the four corners of the second surface 22 . The internal wiring 26 penetrates the insulating substrate 25 and electrically connects the vibrator pad 27 and the external connection terminal 28 . External wiring formed on the first surface 21 and the side surface of the insulating substrate 25 may be used instead of the internal wiring 26 .

As shown in FIG. 2, the external connection terminals 58 of the piezoelectric vibrator 30 are electrically connected to the vibrator pads 27 via solder 29 . The solder 29 is solidified after the solder paste 29a shown in FIG. 1 is melted.

The piezoelectric device 10 is mounted on another printed wiring board (not shown) via the external connection terminals 28 of the wiring board 20 . At this time, a substantial package of the piezoelectric device 10 can be configured by combining the piezoelectric vibrator 30 and the wiring board 20 . Therefore, by changing or replacing the wiring board 20, the arrangement and size of the external connection terminals 28 can be easily changed. Moreover, since the semiconductor element 60 is housed in the opening 23, the piezoelectric device 10 can be made smaller.

The piezoelectric vibrator 30 includes an element mounting member 50 having a first surface 51 and a second surface 52 which are in a front-back relationship, a piezoelectric element 40 mounted on the first surface 51 , and the piezoelectric element 40 sealed together with the element mounting member 50 . and a lid member 32 for stopping. The element mounting member 50 is mounted on the wiring board 20 so as to cover the opening 23 with the second surface 52 facing the first surface 21 of the wiring board 20 . The semiconductor element 60 is mounted on the element mounting member 50 while being arranged in the opening 23 of the wiring board 20 .

The piezoelectric element 40 has a piezoelectric piece 41 and two electrodes 42 extending to one end of the piezoelectric piece 41 . The element mounting member 50 mounts the piezoelectric element 40 thereon. The lid member 32 forms, together with the element mounting member 50 , a recessed space 31 that accommodates the piezoelectric element 40 . The two first pads 53 are provided on the element mounting member 50 and are electrically and mechanically connected to the two electrodes 42 via the conductive adhesive 55, respectively, so that the piezoelectric element 40 can be cantilevered. fixed to In other words, in the piezoelectric device 10, the piezoelectric element 40 and the semiconductor element 60 are mounted on the element mounting member 50, and the element mounting member 50 and the lid member 32 are formed of a glass sealing material or a brazing material (both not shown). etc., and the piezoelectric element 40 is hermetically sealed in the recessed space 31 .

The piezoelectric piece 41 is made of, for example, an AT-cut crystal piece. The planar shape of the piezoelectric piece 41 is substantially rectangular. The two electrodes 42 are insulated from each other, divided into an excitation electrode, a lead-out electrode, a pad electrode, and the like, and extend from one main surface of the piezoelectric piece 41 across the side surface to the other main surface. Although the piezoelectric element 40 is a thickness-shear vibration element, a tuning-fork type bending vibration element, a contour-shear vibration element, or the like may be used instead.

The element mounting member 50 includes a first surface 51 and a second surface 52 that are in a front-back relationship, a recessed space 31 and two first pads 53 provided on the first surface 51 side, and two first pads 53 provided on the second surface 52 side. It also has six second pads 54 (FIG. 2) and four external connection terminals 58 . The first pad 53, the second pad 54 and the external connection terminal 58 are electrically connected. Moreover, the element mounting member 50 is made of, for example, laminated ceramics and a metal frame, and has a substrate portion 56 and a frame portion 57 . The frame portion 57 is annularly provided along the peripheral edge of the substrate portion 56 on the first surface 51 side. In other words, the element mounting member 50 is provided with the first pad 53 on the side of the first surface 51 that is the bottom surface of the recessed space 31 , and the second pad 54 and the second pad 54 on the side of the second surface 52 that is the opposite side of the first surface 51 . An external connection terminal 58 is provided.

The first pad 53 is made of a conductor obtained by plating a metallized material such as tungsten with gold. . External connection terminals 58 are provided on the tip surfaces at the four corners of the second surface 52 . The external connection terminals 58 include, for example, a frequency control terminal, a ground terminal, an output terminal, and a power supply voltage terminal. The first pad 53, the second pad 54, and the external connection terminal 58 are electrically connected to each other by internal wiring (not shown).

The conductive adhesive 55 is made of silver paste, for example, and has fluidity before hardening. Specifically, the conductive adhesive 55 contains conductive powder as a conductive filler in a binder such as silicone resin.

The lid member 32 overlaps the upper end of the frame portion 57 of the element mounting member 50 and seals the recessed space 31 . The lid member 32 is made of metal such as Kovar, and is a substantially rectangular flat plate. That is, the lid member 32 is joined to the element mounting member 50 with a sealing material or the like to form the hermetically sealed concave space 31 . Although the concave space 31 is formed on the element mounting member 50 side in the first embodiment, it may be formed on the lid member 32 side.

The semiconductor element 60 has an electronic circuit surface (not shown), electrode pads 61 provided on the electronic circuit surface, and bump terminals 62 provided on the electrode pads 61 . An IC (Integrated Circuit) such as an oscillation circuit and a temperature compensation circuit is formed on the electronic circuit surface. The electrode pads 61 are made of aluminum, for example, and the bump terminals 62 are made of gold, for example. The semiconductor element 60 is mounted on the second surface 52 side of the element mounting member 50 by being electrically connected to the second pads 54 of the element mounting member 50 via the six bump terminals 62 . The semiconductor element 60 also includes FC (Flip Chip) or BGA (Ball Grid Array). Also, the semiconductor element 60 is not limited to an IC, and may be a thermistor, for example.

The underfill resin 63 is filled between the semiconductor element 60 and the element mounting member 50 and protects the bonded bump terminals 62 and the second pads 54 . "Underfill resin" is a general term for liquid curable resins used for sealing when electronic components are mounted on printed wiring boards, etc. Composite resins based on epoxy resin are the mainstream. In addition, since epoxy resins have large thermal expansion and thermal contraction, the underfill often contains a silicon dioxide filler having a small coefficient of linear expansion as a composite resin. Such a general underfill resin is a thermosetting resin, which is cured by heating at a constant temperature for a certain period of time after application. The underfill resin 63 is not limited to general underfill resin, and for example, a photocurable resin may be used.

Next, the action and effect of the piezoelectric device 10 will be described. Note that the external connection terminals 28 are omitted from the plan views of FIG. 4 and subsequent drawings. 4 and subsequent figures, the illustration of the internal structure of the piezoelectric vibrator 30, the vibrator pad 27, the external connection terminals 28 and 58, the electrode pad 61, the second pad 54, etc. is omitted.

First, the piezoelectric device 10b of the comparative example shown in FIG. 4 will be described. The piezoelectric device 10b has the same configuration as the piezoelectric device of the first embodiment, except that a wiring substrate 20b without cutouts is used. To fill the space between the piezoelectric vibrator 30 and the semiconductor element 60 with the underfill resin 63, the liquid underfill resin 63 is dripped from a discharge nozzle 64 of a dispenser (not shown). At this time, it is desirable to insert the tip of the ejection nozzle 64 into the gap of the opening 23 with the semiconductor element 60 facing upward. However, in recent years, due to the miniaturization of the piezoelectric device 10 b , the ejection nozzle 64 has become relatively too thick, and it is difficult to insert the tip of the ejection nozzle 64 into the gap of the opening 23 . Therefore, the underfill resin 63 is inevitably dripped onto the upper surface of the semiconductor element 60 so that the underfill resin 63 flows to the lower surface of the semiconductor element 60 .

However, when the underfill resin 63 is dropped on the upper surface of the semiconductor element 60, the underfill resin 63b remains on the upper surface of the semiconductor element 60, and the underfill resin 63b protrudes from the opening 23 when viewed from the side. Such a piezoelectric device 10b is judged as a defective product (defective thickness) because the protruding underfill resin 63b interferes and cannot be mounted on a printed wiring board or the like.

On the other hand, as shown in FIG. 5, according to the piezoelectric device 10 of the first embodiment, the wiring substrate 20 is provided with the notch 24 extending from the opening 23 to the outer surface 232 on one side 231. The underfill resin 63 can be dripped from above the notch 24 or inside the notch 24 . Therefore, even if the piezoelectric device 10 is miniaturized, it is not necessary to drop the underfill resin 63 onto the upper surface of the semiconductor element 60, so that the occurrence of defective products (thickness defects) can be avoided.

As shown in FIG. 3A, when the notch portion 24 is formed to be larger than the outer diameter of the ejection nozzle 64 in plan view, the ejection nozzle 64 can be inserted into the notch portion 24. The underfill resin 63 can be dropped at a position close to between the piezoelectric vibrator 30 and the semiconductor element 60 . Therefore, the space between the piezoelectric vibrator 30 and the semiconductor element 60 can be more reliably filled with the underfill resin 63 .

As shown in FIG. 3B, when the cutout portion 24a in which substantially the entire side 231 is cut is used, a discharge nozzle 65 having a larger outer diameter can be used. In other words, even if the piezoelectric device 10 is further miniaturized, the ejection nozzle 64 with the current outer diameter can be used. In addition, since the area over which the underfill resin 63 can be dropped is wide, the positioning of the ejection nozzle 64 can be facilitated.

Also, as shown in FIG. 6, two piezoelectric devices 10 not filled with the underfill resin 63 are prepared, and the notches 24 face each other in plan view. Then, the underfill resin 63 is dripped onto the two notch portions 24 . As a result, two piezoelectric devices 10 can be filled with the underfill resin 63 at once, so that the process of filling the underfill resin 63 can be simplified.

As shown in FIG. 7, two piezoelectric devices 10a not filled with the underfill resin 63 are prepared, and the notches 24a face each other in plan view. Then, the underfill resin 63 is dripped onto the two notch portions 24a. Thereby, two piezoelectric devices 10a can be filled with the underfill resin 63 at once. Moreover, since a discharge nozzle 65 having a larger outer diameter can be used, the discharge amount of the underfill resin 63 per unit time can be increased, and the process of filling the underfill resin 63 can be further simplified.

<Embodiment 2>
As shown in FIGS. 8 to 10, the manufacturing method of Embodiment 2 is a method of manufacturing the piezoelectric device 10 of Embodiment 1, and includes the following steps.
(1) A step of forming a plurality of wiring boards 20 each having cutout portions 24 facing each other in plan view (FIGS. 8A and 8B).
(2). A step of mounting piezoelectric vibrators 30 on a plurality of wiring boards 20 (FIGS. 8[C][D]).
(3). A step of mounting the semiconductor element 60 on the piezoelectric vibrator 30 (Fig. 9 [A] [B]).
(4) The step of filling the space between the piezoelectric vibrator 30 and the semiconductor element 60 with the underfill resin 63 by discharging the underfill resin 63 into the two cutouts 24 facing each other (FIG. 9 [C]). ][D]).
(5) A process of obtaining a plurality of piezoelectric devices 10 by cutting off the plurality of wiring substrates 20 one by one (FIGS. 10[A] and [B]).

Next, with additional reference to FIGS. 1 and 2, each step of the manufacturing method of Embodiment 1 will be described in detail.

(1) A step of forming a plurality of wiring boards 20 consisting of one sheet (Fig. 8 [A] [B])
In this step, a general printed wiring board manufacturing method is used. Although a plurality of wiring boards 20 are shown in FIG. 8A as being arranged in the horizontal direction, the wiring boards 20 may be arranged in the horizontal direction and the vertical direction.

(2). Process of mounting the piezoelectric vibrator 30 (Fig. 8 [C] [D])
As shown in FIG. 1, a solder paste 29a is applied to the vibrator pads 27 of each wiring board 20 by printing. Subsequently, the piezoelectric vibrators 30 are mounted on the respective wiring boards 20 so that the external connection terminals 58 of the piezoelectric vibrators 30 and the solder paste 29a are in contact with each other. In this state, the solder paste 29a is reflowed (for example, at 240° C. for 10 seconds) to mount the piezoelectric vibrator 30 on each wiring board 20 via the solder 29 (FIG. 2). Prior to this step, the piezoelectric element 40 is fixed to the first pad 53 via the conductive adhesive 55 , and the piezoelectric element 40 is sealed by the element mounting member 50 and the lid member 32 .

(3). Process of mounting semiconductor element 60 on piezoelectric vibrator 30 (Fig. 9 [A] [B])
As shown in FIG. 1, the bump terminals 62 are bonded to the second pads 54 by pressing the bump terminals 62 against the second pads 54 (FIG. 2) of the device mounting member 50 using both heat and ultrasonic waves. Thereby, the semiconductor element 60 is mounted on the piezoelectric vibrator 30 .

(4) Step of filling underfill resin 63 (Fig. 9 [C] [D])
A liquid underfill resin 63 is dripped from a discharge nozzle 64 into two notch portions 24 facing each other. Then, the underfill resin 63 fits between the piezoelectric vibrator 30 and the semiconductor element 60 due to its own surface tension. According to the manufacturing method of the second embodiment, two piezoelectric devices 10 can be filled with the underfill resin 63 at once, so the process of filling the underfill resin 63 can be simplified.

After that, the underfill resin 63 is cured by applying heat to the underfill resin 63 . The epoxy resin used for the underfill resin 63 is called a one-liquid type, and is generally shipped in a state in which a main agent and a curing agent are mixed and cured in a heating furnace. Heating means include an infrared lamp and a high-temperature atmosphere. Further, when a photocurable resin is used as the underfill resin 63, the underfill resin 63 is irradiated with ultraviolet rays by an ultraviolet lamp.

(5). Step of obtaining a plurality of piezoelectric devices 10 (Fig. 10 [A] [B])
Finally, the plurality of wiring boards 20 are separated one by one by, for example, dicing. FIGS. 10A and 10B show the wiring substrate 20 in which the processing allowance 201 is removed. As a result, the wiring board 20 is divided into a plurality of pieces, and a plurality of piezoelectric devices 10 are obtained. In the process of filling the underfill resin 63, the underfill resin 63 may leak into the gap 33 (FIG. 9 [D]) between the adjacent piezoelectric vibrators 30, but the underfill resin 63 is also removed in this process. be done. Laser processing or the like may be used instead of dicing.

<Embodiment 3>
As shown in FIGS. 11 to 13, the manufacturing method of Embodiment 3 is a method of manufacturing the piezoelectric device 10 of Embodiment 1, and includes the following steps.
(1) A step of forming a plurality of wiring substrates 20 each having cutout portions 24 facing each other in plan view (FIGS. 11A and 11B).
(2) A step of mounting a plurality of integrated piezoelectric vibrators 30 on a plurality of wiring boards 20 (FIGS. 11[C] and [D]).
(3). A step of mounting the semiconductor element 60 on the piezoelectric vibrator 30 (FIGS. 12[A] and [B]).
(4) The step of filling the space between the piezoelectric vibrator 30 and the semiconductor element 60 with the underfill resin 63 by discharging the underfill resin 63 into the two cutouts 24 facing each other (Fig. 12 [C]). ][D]).
(5) A step of obtaining a plurality of piezoelectric devices 10 by separating a plurality of wiring substrates 20 and a plurality of piezoelectric vibrators 30 one by one (FIGS. 13[A] and [B]).

In the manufacturing method of Embodiment 3, a plurality of piezoelectric vibrators 30 are integrated, and when the plurality of wiring substrates 20 are cut off one by one, the plurality of piezoelectric vibrators 30 are also one piece at the same time. It differs from the manufacturing method of the second embodiment in that it is cut off one by one. In FIG. 11C, the plurality of integrated piezoelectric vibrators 30 are shown as having the piezoelectric vibrators 30 arranged in the horizontal direction, but the piezoelectric vibrators 30 are arranged in the horizontal direction and the vertical direction. It can be a thing. A plurality of integrated piezoelectric vibrators 30 may be a plurality of integrated element mounting members 50 . FIGS. 13A and 13B show a state in which the machining allowance 201 of the wiring board 20 and the machining allowance 301 of the piezoelectric vibrator 30 are removed.

According to the manufacturing method of Embodiment 3, since there is no gap between the adjacent piezoelectric vibrators 30 in the step of filling the underfill resin 63 (FIGS. 12[C] and [D]), the underfill resin in the gap does not exist. 63 can be prevented from leaking. Other configurations, actions and effects of the manufacturing method of the third embodiment are the same as those of the manufacturing method of the second embodiment.

Although the present disclosure has been described with reference to the above embodiments, the present disclosure is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be added to the configuration and details of the present disclosure. In addition, the present disclosure also includes appropriate combinations of part or all of the configurations of the above-described embodiments.

The present disclosure can be applied to piezoelectric devices using piezoelectric ceramics, such as lithium niobate and lithium tantalate, as piezoelectric materials, in addition to the crystal described above.

Reference Signs List 10, 10a, 10b Piezoelectric device 20, 20a, 20b Wiring board 201 Machining allowance 21 First surface 22 Second surface 23 Opening 231 One side 232 Outer surface 24, 24a Notch 25 Insulating substrate 26 Internal wiring 27 Vibrator pad 28 External connection terminal 29 Solder 29a Solder paste 30 Piezoelectric vibrator 301 Machining margin 31 Recessed space 32 Lid member 33 Gap 40 Piezoelectric element 41 Piezoelectric piece 42 Electrode 50 Element mounting member 51 First surface 52 Second surface 53 First pad 54 Second Pad 55 Conductive adhesive 56 Substrate 57 Frame 58 External connection terminal 60 Semiconductor element 61 Electrode pad 62 Bump terminal 63, 63b Underfill resin 64, 65 Discharge nozzle

Claims (5)

a substantially rectangular wiring board having a first surface and a second surface that are in a front-back relationship, and an opening penetrating the first surface and the second surface;
a piezoelectric vibrator positioned on the first surface so as to cover the opening;
a semiconductor element positioned on the piezoelectric vibrator within the opening;
an underfill resin filling between the piezoelectric vibrator and the semiconductor element in the opening;
a cutout portion cut from the opening to the outer surface of the wiring substrate in plan view on one side of the rectangle of the wiring substrate;
Piezoelectric device with The notch is larger than the outer diameter of the underfill resin ejection nozzle in plan view.
The piezoelectric device according to claim 1. The notch part lacks substantially the entire one side,
3. The piezoelectric device according to claim 1 or 2. A method for manufacturing the piezoelectric device according to any one of claims 1 to 3,
a step of forming a plurality of the wiring substrates made of one sheet with the cutout portions facing each other in a plan view;
a step of mounting the piezoelectric vibrators on a plurality of the wiring substrates;
mounting the semiconductor element on the piezoelectric vibrator;
filling the space between the piezoelectric vibrator and the semiconductor element with the underfill resin by discharging the underfill resin into the two notches facing each other;
a step of obtaining a plurality of the piezoelectric devices by cutting off the plurality of wiring substrates one by one;
A method of manufacturing a piezoelectric device comprising: A plurality of piezoelectric vibrators are integrated in advance,
When the plurality of wiring boards are separated one by one, the plurality of piezoelectric vibrators are also separated one by one at the same time.
5. The method of manufacturing a piezoelectric device according to claim 4.

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