JP5150220B2 - Crystal oscillator for surface mounting - Google Patents
Crystal oscillator for surface mounting Download PDFInfo
- Publication number
- JP5150220B2 JP5150220B2 JP2007298786A JP2007298786A JP5150220B2 JP 5150220 B2 JP5150220 B2 JP 5150220B2 JP 2007298786 A JP2007298786 A JP 2007298786A JP 2007298786 A JP2007298786 A JP 2007298786A JP 5150220 B2 JP5150220 B2 JP 5150220B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- main surface
- container body
- recess
- protective resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Description
本発明は表面実装用の水晶発振器(以下、表面実装発振器とする)を技術分野とし、特にICチップの保護樹脂を有した表面実装発振器に関する。 The present invention relates to a surface mount crystal oscillator (hereinafter referred to as a surface mount oscillator), and more particularly to a surface mount oscillator having an IC chip protective resin.
(発明の背景)
表面実装発振器は小型・軽量であることから、例えば携帯電話で代表される携帯型の電子機器に周波数や時間の基準源として内蔵される。このようなものの一つに、容器本体をH状として水晶片を一主面の凹部に、ICチップを他主面の凹部に収容したH構造の表面実装発振器がある。
(Background of the Invention)
Since the surface-mounted oscillator is small and light, it is built in a portable electronic device typified by a mobile phone as a reference source for frequency and time. One of these is a surface-mount oscillator having an H structure in which a container body is H-shaped, a crystal piece is accommodated in a recess on one main surface, and an IC chip is accommodated in a recess on the other main surface.
(従来技術の一例)
第3図は一従来例を説明する表面実装発振器の図で、同図(a)は断面図、同図(b)は底面図である。
(Example of conventional technology)
FIG. 3 is a diagram of a surface-mount oscillator for explaining a conventional example, in which FIG. 3 (a) is a sectional view and FIG. 3 (b) is a bottom view.
表面実装発振器は前述したH構造とし、両主面に凹部を有する容器本体1に水晶片2とICチップ3とを収容してなる。容器本体1は平面視矩形状とした積層セラミックからなり、底壁1aと上下枠壁1(bc)を有して両主面に凹部を有する。下枠壁1cは例えば100μmm程度とした2枚のセラミック(計200μ程度)を積層して形成される。 The surface-mount oscillator has the above-described H structure, and a crystal piece 2 and an IC chip 3 are accommodated in a container body 1 having recesses on both main surfaces. The container body 1 is made of a laminated ceramic having a rectangular shape in plan view, and has a bottom wall 1a and upper and lower frame walls 1 (bc), and has concave portions on both main surfaces. The lower frame wall 1c is formed by laminating two ceramics (about 200 μm in total) having a thickness of about 100 μm, for example.
下枠壁1cの開口端面(枠壁上面)にはICチップ3と電気的に接続した外部端子4を有する。これらはセラミックのグリーンシートを積層して一体的に焼成した後、個々の容器本体1に分割される。但し、外部端子4は下地電極(WやMo)を形成して一体的に焼成された後に、電界メッキ等によってNi及びAu膜が順次にメッキされる。 The opening end face (upper face of the frame wall) of the lower frame wall 1c has an external terminal 4 electrically connected to the IC chip 3. These are divided into individual container bodies 1 after laminating ceramic green sheets and firing them integrally. However, after the external terminal 4 is formed by integrally firing a base electrode (W or Mo), Ni and Au films are sequentially plated by electroplating or the like.
水晶片2は両主面に図示しない励振電極を有して例えば一端部両側に引出電極を延出する。そして、容器本体1の一主面の凹部底面の図示しない水晶端子に導電性接着剤5によって固着される。そして、水晶振動子の振動周波数(発振周波数)を調整した後、例えば開口端面に設けた金属リング6にシーム溶接によって金属カバー7を接合して密閉封入する。 The crystal piece 2 has excitation electrodes (not shown) on both main surfaces, and extends extraction electrodes on both sides of one end, for example. Then, the conductive adhesive 5 is fixed to a crystal terminal (not shown) on the bottom surface of the recess on one main surface of the container body 1. Then, after adjusting the vibration frequency (oscillation frequency) of the crystal resonator, a metal cover 7 is joined to the metal ring 6 provided on the opening end face by seam welding, for example, and hermetically sealed.
その後、水晶振動子の振動特性を容器本体1に設けた図示しない検査端子によって測定して不良品を排除した後、容器本体1の他主面にICチップ3を収容する。ICチップ3は少なくとも発振回路を集積化して必要に応じて温度補償機構が集積化される。そして、ICチップ3のIC端子が設けられた回路機能面(一主面)が、例えばバンプ8を用いた超音波熱圧着によって凹部底面に固着される(所謂フリップチップボンディング)。 Thereafter, the vibration characteristics of the crystal resonator are measured by an inspection terminal (not shown) provided on the container body 1 to eliminate defective products, and then the IC chip 3 is accommodated on the other main surface of the container body 1. The IC chip 3 integrates at least an oscillation circuit and a temperature compensation mechanism as necessary. Then, the circuit functional surface (one main surface) provided with the IC terminals of the IC chip 3 is fixed to the bottom surface of the recess by, for example, ultrasonic thermocompression using the bumps 8 (so-called flip chip bonding).
そして、通常では、容器本体1の底面にはICチップ3の回路機能面を保護する保護樹脂9が図示しないノズルから注入される。保護樹脂9は加熱硬化型として注入後に加熱して硬化させる。ここでは、ICチップ3の他主面の稜線部にノズルを当接して保護樹脂9を注入する。 Normally, a protective resin 9 for protecting the circuit function surface of the IC chip 3 is injected into the bottom surface of the container body 1 from a nozzle (not shown). The protective resin 9 is heated and cured after being injected as a thermosetting type. Here, the protective resin 9 is injected by bringing the nozzle into contact with the ridge line portion of the other main surface of the IC chip 3.
この場合、保護樹脂9の粘性は低いので、下枠壁1cの内周とICチップ3の外周との間隙を回り込見ながら全周するとともにICチップ3の回路機能面にも流入する。通常では、保護樹脂9はICチップ3の底壁1aからの高さよりも低く設定される。そして、保護樹脂9の濡れ性によって、ICチップ3の外周及び下枠壁1cの内周に這い上がって硬化する。(所謂メニスカス)。 In this case, since the viscosity of the protective resin 9 is low, the protective resin 9 goes around the gap between the inner periphery of the lower frame wall 1 c and the outer periphery of the IC chip 3 and flows into the circuit function surface of the IC chip 3. Normally, the protective resin 9 is set lower than the height from the bottom wall 1 a of the IC chip 3. Then, due to the wettability of the protective resin 9, the protective resin 9 crawls up to the outer periphery of the IC chip 3 and the inner periphery of the lower frame wall 1 c and is cured. (So-called meniscus).
なお、ICチップ3の他主面の稜線部にノズルを当接して保護樹脂9を注入するので、ICチップ3の他主面上にも例えば10μmm程度とした皮膜が形成される。また、ICチップ3の回路機能面に保護樹脂9が流入しなくても、外周側面と下枠壁の内周面に充填されれば回路機能面は保護できる。
(従来技術の問題点)
しかしながら、上記構成の表面実装発振器では、容器本体1の他主面の凹部に保護樹脂9を注入して熱硬化させると、保護樹脂9が下枠壁の内周面のみならず下枠壁1cの上面にまで這い上がる。そして、4角部の外部端子4の表面上に付着して、第4図(断面図)に示したように皮膜10を形成する問題があった。
(Problems of conventional technology)
However, in the surface mount oscillator having the above configuration, when the protective resin 9 is injected into the concave portion of the other main surface of the container body 1 and thermally cured, the protective resin 9 is not only the inner peripheral surface of the lower frame wall but also the lower frame wall 1c. Crawling up to the top. Then, there is a problem that the film 10 is deposited on the surface of the external terminal 4 at the four corners to form the film 10 as shown in FIG. 4 (cross-sectional view).
これらは、保護樹脂9の注入量にも多少の誤差を生じるので、注入量(余剰分)が多いほど這い上がりが顕著になる。なお、下枠壁1cの面積にも誤差があり、注入量が一定であったとしても、面積が小さい場合は余剰分が多くなる。これらの場合、表面実装発振器をセット基板の回路端子に接続した際に保護樹脂9の被膜によって電気的接続を困難にすることから不良品となり、生産性を低下させる。 These cause some errors in the injection amount of the protective resin 9, so that the larger the injection amount (the surplus), the more remarkable the creeping. There is an error in the area of the lower frame wall 1c, and even if the injection amount is constant, the surplus is increased when the area is small. In these cases, when the surface mount oscillator is connected to the circuit terminal of the set substrate, the electrical connection becomes difficult due to the coating of the protective resin 9, which results in a defective product, and the productivity is reduced.
(発明の目的)
本発明は保護樹脂の外部端子への付着を防止して生産性を高めた表面実装発振器を提供することを目的とする。
(Object of invention)
An object of the present invention is to provide a surface mount oscillator that prevents the adhesion of a protective resin to an external terminal and increases the productivity.
本発明の第1実施形態は、積層セラミックからなる平面視矩形状とした底壁と枠壁を有する容器本体の一主面には水晶片を搭載して密閉封入され、前記容器本体の他主面には4角部に外部端子を設けた凹部を有し、前記他主面の凹部にIC端子を有するICチップの回路機能面を固着し、前記ICチップの回路機能面に対する保護樹脂を前記他主面の凹部に充填してなる表面実装用の水晶発振器において、前記容器本体の他主面の凹部を形成する枠壁が、前記4角部の厚み方向の少なくとも中間領域に内周から枠幅方向の切欠部を有する構成とする。 In the first embodiment of the present invention, a crystal piece is mounted and sealed in one main surface of a container body having a bottom wall and a frame wall made of a multilayer ceramic and having a rectangular shape in plan view. The surface has a concave portion provided with an external terminal at the four corners, the circuit function surface of the IC chip having the IC terminal is fixed to the concave portion of the other main surface, and the protective resin for the circuit function surface of the IC chip is In the crystal oscillator for surface mounting formed by filling the concave portion of the other main surface, the frame wall forming the concave portion of the other main surface of the container main body is a frame from the inner periphery to at least an intermediate region in the thickness direction of the four corner portions. It is set as the structure which has the notch part of the width direction.
このような構成であれば、保護樹脂の注入量(余剰分)が多くなると、枠壁の中間領域に設けた切欠部に流入する。したがって、容器本体の開口端面(上面)までの這い上がりを抑制して外部端子への付着を防止する。これにより、不良品を減らして生産性を高められる。 If it is such a structure, if the injection amount (excess part) of protective resin will increase, it will flow in the notch part provided in the intermediate | middle area | region of the frame wall. Therefore, creeping up to the opening end surface (upper surface) of the container body is suppressed to prevent adhesion to the external terminal. Thereby, defective products can be reduced and productivity can be increased.
本発明の第2実施形態では、第1実施形態において、前記底壁からの前記切欠部の高さは前記ICチップの回路機能面と反対面の高さよりも高くする。これにより、保護樹脂がICチップの高さよりも低く注入された場合は、下枠壁の内周面にメニスカスが生じても、切欠部内に流入するので、外部端子の設けられた4角部の枠壁上面には付着しない。 In the second embodiment of the present invention, in the first embodiment, the height of the notch from the bottom wall is higher than the height of the surface opposite to the circuit function surface of the IC chip. Thus, if the protective resin is injected less than the height of the IC chip, even if the meniscus on the inner peripheral surface of the lower casing wall, so flowing into the cutout portion, the four corners provided with the external terminal It does not adhere to the upper surface of the frame wall.
本発明の第3実施形態では、第1実施形態において、前記容器本体の一主面に凹部を有し、前記水晶片を収容して密閉封入する。これにより、容器本体は両主面に凹部を有したH型断面構造となり、一主面の凹部に水晶片を、また、他主面の凹部にICチップを収容する。 In 3rd Embodiment of this invention, it has a recessed part in the 1st main surface of the said container main body in 1st Embodiment, and accommodates the said crystal piece and seal-encloses. Thus, the container body has an H-shaped cross-section structure having a recess on both major surfaces, a crystal piece in the recess of the one main surface, also to accommodate the IC chip in the recess of the other main surface.
(実施形態)
第1図は本発明の第1実施形態を説明する表面実装発振器の図で、同図(a)は一部破断の断面図、同図(b)は底面図、同図(c)は下枠壁の二層目を除いて見た底面図である。なお、前従来例と同一部分には同番号を付与してその説明は簡略又は省略する。
(Embodiment)
FIG. 1 is a view of a surface-mount oscillator for explaining a first embodiment of the present invention. FIG. 1 (a) is a partially broken sectional view, FIG. 1 (b) is a bottom view, and FIG. It is the bottom view seen except the 2nd layer of a frame wall. In addition, the same number is attached | subjected to the same part as a prior art example, and the description is simplified or abbreviate | omitted.
表面実装発振器は前述したようにH構造とし、平面視矩形状とした容器本体1の一主面の凹部に水晶片2を収容して金属カバー7を接合して密閉封入し、他主面の凹部にICチップ3を収容する。容器本体1の他主面における凹部の開口端面(枠壁上面)の4角部には外部端子4を有する。そして、ICチップ3はバンプ8を用いた超音波熱圧着によって回路機能面が固着され、保護樹脂9が注入される。 As described above, the surface-mount oscillator has an H structure, the crystal piece 2 is accommodated in a concave portion of one main surface of the container body 1 having a rectangular shape in plan view, a metal cover 7 is bonded and hermetically sealed, and the other main surface is sealed. The IC chip 3 is accommodated in the recess. External terminals 4 are provided at the four corners of the opening end face (upper surface of the frame wall) of the recess in the other main surface of the container body 1. The IC chip 3 is bonded to the circuit functional surface by ultrasonic thermocompression bonding using the bumps 8, and the protective resin 9 is injected.
この実施形態では、容器本体の他主面の凹部を形成する下枠壁1cは、外部端子4の設けられた4角部の厚み方向の少なくとも中間領域に内周から枠幅方向の切欠部11を有する。この例では、下枠壁1cは、例えば底壁1aから順に一層目1c1及び二層目1c2とした二層構造とする。 In this embodiment, the lower frame wall 1c that forms a recess on the other main surface of the container body has a notch 11 in the frame width direction from the inner periphery to at least an intermediate region in the thickness direction of the four corners where the external terminals 4 are provided. Have In this example, the lower frame wall 1c has a two-layer structure in which, for example, the first layer 1c1 and the second layer 1c2 are sequentially formed from the bottom wall 1a.
そして、下枠壁1cの一層目1c1の4角部には、枠幅方向とした矩形状の切欠部11を設ける。切欠部11の底壁1aからの高さh 1 (一層目1c1の厚み)は、ICチップ3の同高さh 2 よりも高くする。 Then, rectangular cutouts 11 in the frame width direction are provided at the four corners of the first layer 1c1 of the lower frame wall 1c. The height h 1 (thickness of the first layer 1 c 1) of the notch 11 from the bottom wall 1 a is made higher than the height h 2 of the IC chip 3.
このような構成であれば、容器本体1の他主面の凹部に、前述のようにICチップ3の他主面の稜線部上から保護樹脂9を注入し、特にその注入量が多い場合は、4角部の切欠部11内に流入する。したがって、保護樹脂9が切欠部11に吸収されて凹部の開口端面(下枠壁の上面)への這い上がりを抑制する。 In such a configuration, the protective resin 9 is injected into the concave portion of the other main surface of the container body 1 from the ridge line portion of the other main surface of the IC chip 3 as described above, and particularly when the injection amount is large. It flows into the cutout 11 at the four corners. Therefore, the protective resin 9 is absorbed by the notch portion 11 to suppress the creeping up to the opening end surface of the recess (the upper surface of the lower frame wall).
そして、特に実施形態では、切欠部11の高さはICチップ3の高さよりも高いので、ICチップ2の高さよりも低い領域に保護樹脂9がされると、下枠壁1cの一層目を這い上がった保護樹脂9は例えば二層目1c2の裏面にてその進行を停止する。したがって、4角部の外部端子4への付着を防止し、生産性を高められる。 In particular, in the embodiment, since the height of the notch 11 is higher than the height of the IC chip 3, when the protective resin 9 is applied to a region lower than the height of the IC chip 2, the first layer of the lower frame wall 1c is formed. The scavenging protective resin 9 stops its progress on the back surface of the second layer 1c2, for example. Therefore, adhesion to the external terminals 4 at the four corners can be prevented and productivity can be improved.
(他の事項)
上記実施形態では下枠壁1cを一層目1c1と二層目1c2との二層構造としたが、例えば第2図に示したように三層構造として二層目に切欠部11を設けてもよい。また、積層構造とすることなく例えば底壁1cの4角部を押圧して切欠部11を設けることもできる(前第1図参照)。
(Other matters)
In the above embodiment, the lower frame wall 1c has a two-layer structure of the first layer 1c1 and the second layer 1c2. However, for example, as shown in FIG. Good. Further, for example, the cutout portion 11 can be provided by pressing the four corners of the bottom wall 1c without using a laminated structure (see FIG. 1).
そして、容器本体1は単一としてH構造としたが、例えば表面実装振動子の下面に凹状とした実装基板を接合した場合でも適用でき、結果として両主面に凹部を有する構造であればよい。なお、接合型とした場合、凹状の実装基板の開口端面側又は閉塞面側を表面実装振動子の下面に接続したいずれの場合でも適用できる。 The container body 1 has a single H structure. However, for example, the container body 1 can be applied to a case where a concave mounting board is bonded to the lower surface of the surface mount vibrator. . In the case of the junction type, any case where the open end surface side or the closed surface side of the concave mounting substrate is connected to the lower surface of the surface mount vibrator can be applied.
さらには、水晶片2の密閉封入する容器本体1の一主面は凹部ではなく平坦上として凹状としたカバーを接合した場合でも同様に適用でき、要はICチップ3を収容する凹部を有する表面実装発振器であれば適用できる。 Furthermore, one main surface of the container main body 1 in which the crystal piece 2 is hermetically sealed is not a concave portion but can be similarly applied to a case where a concave cover is joined as a flat surface. In short, a surface having a concave portion for accommodating the IC chip 3 It can be applied to any mounted oscillator.
1 容器本体、2 水晶片、3 ICチップ、4 外部端子、5 金属リング、6 導電性接着剤、7 金属カバー、8 バンプ、9 保護樹脂、10 被膜、11 切欠部。 DESCRIPTION OF SYMBOLS 1 Container body, 2 Crystal piece, 3 IC chip, 4 External terminal, 5 Metal ring, 6 Conductive adhesive, 7 Metal cover, 8 Bump, 9 Protective resin, 10 Film, 11 Notch
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007298786A JP5150220B2 (en) | 2007-11-19 | 2007-11-19 | Crystal oscillator for surface mounting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007298786A JP5150220B2 (en) | 2007-11-19 | 2007-11-19 | Crystal oscillator for surface mounting |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009124619A JP2009124619A (en) | 2009-06-04 |
JP5150220B2 true JP5150220B2 (en) | 2013-02-20 |
Family
ID=40816252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007298786A Expired - Fee Related JP5150220B2 (en) | 2007-11-19 | 2007-11-19 | Crystal oscillator for surface mounting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5150220B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5875881B2 (en) * | 2012-01-31 | 2016-03-02 | 京セラクリスタルデバイス株式会社 | Piezoelectric oscillator |
US9219217B2 (en) | 2012-02-28 | 2015-12-22 | Daishinku Corporation | Surface mount type piezoelectric oscillator |
JP5904911B2 (en) * | 2012-08-31 | 2016-04-20 | 京セラクリスタルデバイス株式会社 | Piezoelectric oscillator |
JPWO2014046133A1 (en) * | 2012-09-18 | 2016-08-18 | 京セラ株式会社 | Electronic component storage package and electronic device |
JP6258007B2 (en) * | 2013-11-11 | 2018-01-10 | 日本電波工業株式会社 | Surface mount crystal oscillator |
JP6538401B2 (en) * | 2015-04-01 | 2019-07-03 | 京セラ株式会社 | Piezoelectric device and method of manufacturing the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3678148B2 (en) * | 1998-12-02 | 2005-08-03 | セイコーエプソン株式会社 | Piezoelectric device |
JP4244087B2 (en) * | 1999-08-31 | 2009-03-25 | 京セラキンセキ株式会社 | Electronic component container |
JP2002164587A (en) * | 2000-11-28 | 2002-06-07 | Kinseki Ltd | Piezoelectric part vessel |
JP2004260626A (en) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | Surface mount piezoelectric oscillator |
JP4907962B2 (en) * | 2005-11-22 | 2012-04-04 | 日本電波工業株式会社 | Surface mount crystal oscillator |
JP2007208568A (en) * | 2006-01-31 | 2007-08-16 | Nippon Dempa Kogyo Co Ltd | Surface-mounted crystal oscillator |
-
2007
- 2007-11-19 JP JP2007298786A patent/JP5150220B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009124619A (en) | 2009-06-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8031013B2 (en) | Surface-mount type crystal oscillator | |
US7760034B2 (en) | Surface-mount type crystal oscillator | |
JP5150220B2 (en) | Crystal oscillator for surface mounting | |
US6882232B2 (en) | Surface-mount crystal oscillator | |
JP2009027465A5 (en) | ||
WO2011149043A1 (en) | Member for sealing piezoelectric vibration device, and piezoelectric vibration device | |
JP2010050778A (en) | Piezoelectric device | |
JP5101201B2 (en) | Piezoelectric oscillator | |
JP2004228895A (en) | Piezoelectric oscillator and its manufacturing method | |
JP3642688B2 (en) | Electronic components | |
JP2005159575A (en) | Surface-mounted piezoelectric oscillator | |
JP2014175791A (en) | Surface-mounted crystal oscillator | |
JP2004235564A (en) | Ceramic substrate and piezoelectric resonator, and manufacturing method of piezoelectric resonator | |
JP2007104005A (en) | Surface mount crystal oscillator | |
JP2009182622A (en) | Temperature compensated oscillator for electronic card | |
JP4359934B2 (en) | Temperature compensated crystal oscillator | |
JP2009038533A (en) | Piezoelectric oscillator | |
JP2004228894A (en) | Piezoelectric oscillator and its manufacturing method | |
JP2007318033A (en) | Electronic component holding package and electronic device | |
JP6258007B2 (en) | Surface mount crystal oscillator | |
JP2001077247A (en) | Electronic part case | |
JP2009124218A (en) | Surface-mounting crystal oscillator | |
JP2009218783A (en) | Piezoelectric device | |
JP2005039791A (en) | Temperature compensated crystal oscillator | |
JP4039969B2 (en) | Package for electronic components |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20101014 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20101118 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111118 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120710 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120824 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20121106 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121203 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151207 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151207 Year of fee payment: 3 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |