JP4241430B2 - Piezoelectric oscillator - Google Patents

Description

  The present invention relates to a package structure of a surface-mount piezoelectric oscillator and an improvement of the manufacturing method thereof, and more particularly to improve the drawbacks of a conventional piezoelectric oscillator in which a piezoelectric vibrator and a mounting board are structured in a two-story structure through pillar members. Regarding technology.

Due to the price reduction accompanying the widespread use of mobile communication devices such as mobile phones and the rapid progress of miniaturization, the price and size of piezoelectric oscillators such as crystal oscillators used in these communication devices are also reduced. There is an increasing demand for thinning. In particular, there is a strong demand for cost reduction by batch processing with high productivity for piezoelectric oscillators that are produced in a variety of small quantities.
In order to meet such a demand, Japanese Patent No. 3405330 discloses a piezoelectric oscillator in which a packaged piezoelectric vibrator is fixed on a flat mounting board on which electronic components constituting an oscillation circuit and a temperature compensation circuit are mounted. Discloses a piezoelectric oscillator in which pillar members integrated at four corners of a bottom portion of a piezoelectric vibrator are electrically and mechanically connected and fixed on a pillar member fixing pattern on a mounting substrate. According to this, mass production by batch processing can be enabled while reducing the occupied area. There has also been proposed an oscillator in which a pillar member is integrated on the mounting substrate side in advance.
However, in a piezoelectric vibrator or an oscillator in which four pillar members are integrated in advance on a mounting board, the structure of the insulating container for the vibrator or the mounting board becomes complicated and takes time to manufacture. There is a problem in that there is a limit to cost reduction. In addition, since the height of the column member is set larger than the height of the electronic component mounted on the mounting substrate, a gap is formed between the upper surface of the electronic component and the bottom surface of the piezoelectric vibrator. There is a problem that the height of the piezoelectric oscillator increases.
On the other hand, when a pillar member having a structure independent of the piezoelectric vibrator and the mounting board is configured to be retrofitted to these, in addition to the problem of increasing the number of parts due to an increase in the number of parts, a small-sized pillar member Is required to be positioned and fixed at a predetermined position of the member to be attached with high accuracy, resulting in problems such as a decrease in productivity and an increase in cost.
As described above, in the piezoelectric oscillator using the conventional column member, since at least four dedicated column members are required, there is a common problem that cost reduction and downsizing cannot be sufficiently achieved. It was.
Japanese Patent No. 3405330

The present invention has been made in view of the above, and in a two-story structure piezoelectric oscillator in which a piezoelectric vibrator is connected and fixed on a mounting board, a special pillar member is not used for connection between the two, thereby reducing the number of parts. An object of the present invention is to provide a piezoelectric oscillator that achieves reduction in price and height, and a method for manufacturing the same, in order to reduce and improve productivity.
Moreover, even if it is a case where a pillar member is used, it aims at reducing the number of the use and aiming at price reduction.

To solve the above problems, the present invention includes a piezoelectric vibrator having a bottom electrode which is electrically connected to the piezoelectric vibrating element in the insulating container outer bottom accommodates the piezoelectric vibrating element in the insulating vessel, land and bonded to the insulating substrate top surface a mounting substrate on which e Bei electrodes, and an electronic component oscillating circuit mounted on the mounting board land, comprising a, placing the piezoelectric vibrator above the electronic component, the bottom electrode of the piezoelectric vibrator, junction electrodes of the mounting substrate, an electrically and mechanically bonded to the piezoelectric oscillator using a conductive bonding material, characterized in that the upper surface of the electronic component to support a lower surface of the piezoelectric vibrator.
The present invention is a mounting substrate which example Bei a piezoelectric vibrator having a bottom electrode and a land that is electrically connected to the piezoelectric vibrating element in the insulating container outer bottom accommodates the piezoelectric vibrating element in the insulating vessel, the bonding electrode on an insulating substrate top surface And an electronic component for an oscillation circuit mounted on the land of the insulating container, and electrically and mechanically bonding the bonding electrode of the mounting substrate to the bottom electrode of the piezoelectric vibrator using a conductive bonding material In the piezoelectric oscillator, the lower surface of the electronic component is supported by the upper surface of the mounting substrate.
Further, the present invention is characterized in that a buffer material is interposed between the upper surface of the electronic component and the bottom surface of the piezoelectric vibrator, or between the upper surface of the mounting substrate and the lower surface of the electronic component.
In the invention, it is preferable that the buffer material is formed of a resin applied to the upper surface of the electronic component or the lower surface of the electronic component, or a resist film applied to the mounting substrate.
The present invention has a piezoelectric vibrator comprising a G ND terminal in the bottom, characterized in that the GND terminal is faced with the electronic component top surface.
The present invention, the mounting substrate is at one with the G ND electrode on the lower surface, she characterized in that the GND electrode is faced to the electronic component underside.
In the invention, it is preferable that the electronic component is an IC component constituting an oscillation circuit.
According to another aspect of the present invention, there is provided a piezoelectric vibrator having four bottom electrodes each having a bottom electrode connected to the piezoelectric vibration element on the outer bottom of the insulation container and housed in a rectangular insulating container, A mounting substrate having a land; an electronic component mounted on the land of the mounting substrate; three bottom electrodes including a bottom electrode that is electrically connected to the piezoelectric vibration element among bottom electrodes of the piezoelectric vibrator; and the mounting substrate And a conductive bonding material for electrically bonding the lands to each other, and the piezoelectric vibrator is disposed above the electronic component.
According to another aspect of the present invention, there is provided a piezoelectric vibrator having four bottom electrodes each having a bottom electrode connected to the piezoelectric vibration element on the outer bottom of the insulation container and housed in a rectangular insulating container, A mounting substrate including a land and a bonding electrode; an electronic component mounted on the land of the mounting substrate; and three bottom electrodes including a bottom electrode electrically connected to the piezoelectric vibration element among bottom electrodes of the piezoelectric vibrator; And a conductive bonding material that electrically bonds the bonding electrode of the mounting substrate, and the piezoelectric vibrator is disposed above the electronic component.
According to another aspect of the present invention, there is provided a piezoelectric vibrator having four bottom electrodes each having a bottom electrode connected to the piezoelectric vibration element on the outer bottom of the insulation container and housed in a rectangular insulating container, A mounting substrate having a land; an electronic component mounted on the land of the mounting substrate; three bottom electrodes including a bottom electrode that is electrically connected to the piezoelectric vibration element among bottom electrodes of the piezoelectric vibrator; and the mounting substrate A conductive bonding material for electrically bonding the lands of the electronic component, the piezoelectric vibrator is disposed above the electronic component, and an upper surface of the electronic component and another bottom electrode of the piezoelectric vibrator; The electronic component is mounted on a mounting substrate so that the two face each other, and the one bottom electrode is a GND electrode.
According to another aspect of the present invention, there is provided a piezoelectric vibrator having four bottom electrodes each having a bottom electrode connected to the piezoelectric vibration element on the outer bottom of the insulation container and housed in a rectangular insulating container, A mounting substrate including a land and a bonding electrode; an electronic component mounted on the land of the mounting substrate; three bottom electrodes including a bottom electrode electrically connected to the piezoelectric vibration element among the bottom electrodes of the piezoelectric vibrator; A conductive bonding material that electrically bonds the bonding electrode of the mounting substrate, and the piezoelectric vibrator is disposed above the electronic component, and the upper surface of the electronic component and another one of the piezoelectric vibrators The electronic component is mounted on a mounting substrate so as to face the bottom electrode, and the one bottom electrode is a GND electrode.
According to the present invention, the mounting substrate includes a GND electrode on the lower surface, and the GND electrode faces the lower surface of the electronic component.
In the present invention, the conductive bonding material is a metal block.
In the invention, it is preferable that the electronic component is an IC component constituting an oscillation circuit.
The present invention is characterized in that the bottom surface of the piezoelectric vibrator is supported by the top surface of the electronic component.

  According to the present invention, in the piezoelectric oscillator in which the piezoelectric vibrator is connected and fixed on the mounting substrate and the IC component is disposed between the two, one surface of the IC component is placed on the bottom surface of the piezoelectric vibrator or the upper surface of the mounting substrate. A piezoelectric oscillator that achieves low cost and low profile by reducing the number of parts and improving productivity by supporting it without using special pillar members or by reducing the number of pillar members. Can be provided.

Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.
1A and 1B are a perspective view and a front view of a surface mount piezoelectric oscillator according to an embodiment of the present invention. FIG. 2 is a perspective view showing a state where the piezoelectric vibrator pieces are mounted on the mounting substrate base material.
The piezoelectric oscillator includes four mounting electrodes 5 for surface mounting on the bottom of the insulating substrate 2, and includes a mounting substrate 1 including four bonding electrodes 4 and lands 6 on a flat upper surface of the insulating substrate 2, and oscillation. As an electronic component constituting a circuit, a temperature compensation circuit, etc., an IC component 3 mounted on the land 6 of the mounting substrate 1 by flip chip or the like, and four bonding electrodes 4 formed on the upper surface of the mounting substrate 1 are individually soldered. The piezoelectric vibrator 10 having four bottom electrodes 11 to be joined on the lower surface thereof is joined and integrated in a two-story structure.
As shown in FIG. 3A, the piezoelectric vibrator 10 accommodates a piezoelectric vibration element 14 such as a crystal vibration element in a recess 13 formed on the upper surface of a ceramic container (insulating container) 12, and also has a recess 13. Is hermetically sealed with a metal lid 15. Two internal pads 13a are arranged on the step in the recess 13, and the piezoelectric vibration element 14 is cantilevered on the internal pads 13a by a conductive adhesive. Each internal pad 13a is electrically connected to the excitation electrode on the piezoelectric vibration element. Each internal pad 13a is electrically connected to the corresponding bottom electrode 11 through the internal conductor 13b.
The package made of the ceramic container 12 and the metal lid 15 can use, for example, a size of 3.2 × 2.5 mm. Therefore, a piezoelectric having an oscillation frequency in a frequency band of f = 15 MHz or less is included in the package. A vibration element can be accommodated.
The IC component 3 is, for example, a one-chip IC, and has an electrode connected to the land 6 at the bottom, and the upper surface 3A is a flat surface having no electrode.
The bonding electrode 4 of the mounting substrate 1 and the bottom electrode 11 of the piezoelectric vibrator 10 are electromechanically bonded and integrated using a conductive bonding material 20. As the conductive bonding material 20, for example, a brazing material such as solder or a conductive paste is used. Therefore, in this embodiment, special exclusive parts, such as a pillar member and a metal block, are not used.
Another characteristic configuration of the piezoelectric oscillator of the present invention is that the bottom surface of the piezoelectric vibrator 10 is mechanically supported directly or indirectly by the top surface 3A of the IC component 3.
Note that a buffer material 21 made of silicon resin or the like is interposed between the upper surface 3A of the IC chip 3 and the lower surface of the piezoelectric vibrator 10 to prevent direct contact between the upper surface of the IC chip 3 and the bottom surface of the ceramic container. You may make it (FIG.3 (c)). By interposing the buffer material 21 in this way, when the piezoelectric vibrator is mounted on the IC component, the IC container is directly subjected to the pressing force from the package by the ceramic container directly contacting the IC component, The possibility of destabilizing the electrical characteristics of the piezoelectric oscillator can be avoided.
The buffer material 21 may be arranged linearly or annularly along the outer peripheral edge of the IC component upper surface 3A, or may be arranged at a plurality of points in a dot shape. In the former case, the shock absorbing material 21 serving as a pressure transmission path from the piezoelectric vibrator is disposed at a position avoiding the central portion of the IC component where the integrated circuit is disposed, so that an impact to the integrated circuit is transmitted. It becomes difficult. If there is no such problem, a cushioning material may be arranged at the center of the upper surface of the IC component. In any case, since the path through which the shock is transmitted to the IC component 3 is limited by the buffer 21, it is possible to effectively relieve the impact due to pressure or the like on the protection target site such as an integrated circuit.

When manufacturing the piezoelectric oscillator of the present invention, first, a ceramic container base material having a structure in which a plurality of ceramic containers 12 are connected in a sheet shape, and a mounting substrate base material having a structure in which a plurality of mounting substrates 1 are connected in a sheet shape. Are produced by firing, respectively. Each ceramic container base material is divided into individual pieces, and then the piezoelectric vibration element 14 is mounted in each recess 13, and then hermetically sealed with a metal lid 15.
Next, the IC component 3 is flip-chip mounted on the land 6 formed on the mounting substrate piece region on the mounting substrate base material 1A, and the bottom electrode of each ceramic container is further formed on the bonding electrode 4 on the mounting substrate piece region. The piezoelectric vibrator 10 is placed through the conductive bonding material 20 while making 11 correspond one-to-one (FIG. 2).
The mounting board base material 1A has a configuration in which mounting board pieces are connected and arranged adjacent to each other in the vertical and horizontal directions, and the corners of each mounting board piece are provided at a portion where the four mounting board pieces are adjacent to each other. The junction electrodes 4 arranged in the section are gathered and arranged. Accordingly, when the conductive bonding material 20 is applied to the bonding electrode 4, the conductive bonding material 20 is collectively applied to the portion where the bonding electrodes are gathered, and then the piezoelectric vibrator 10 is mounted on each mounting board piece. To do. After that, when the conductive bonding material is solder, the solder is cured by reflow at once, and when the conductive bonding material is conductive paste, it is cured by heating. Finally, along the cutting line indicated by the broken line, the mounting substrate base material 1A is cut and divided into pieces to obtain oscillator pieces.

FIGS. 3A to 3C are process diagrams for explaining the manufacturing procedure described above, and illustrate the process of mounting the piezoelectric vibrator piece on the mounting board piece.
First, in FIG. 3A, the IC component 3 is mounted on the land 6 of the mounting substrate 1 by flip chip or the like. In the illustrated example, bumps for flip chip are not shown.
Next, in FIG. 3B, the conductive bonding material 20 is disposed on the bonding electrode 4 of the mounting substrate 1 with a required amount and a required thickness. The conductive bonding material 20 can be applied by screen printing or the like. The conductive bonding material 20 may be applied on the surface of the bottom electrode 11 of the piezoelectric vibrator.
Note that the piezoelectric vibrator 10 may be placed directly on the IC component 3 as shown in FIG. 3B, but as shown in FIG. Alternatively, a buffer material 21 such as silicon resin may be fixed in advance.
Next, as shown in FIGS. 3C and 2, the piezoelectric vibrator 10 is positioned and placed on the upper surface of the mounting substrate 1 so as to cover the electronic component 3. At this time, each conductive bonding material 20 is aligned with the bottom electrode 11 of the piezoelectric vibrator 10, and then the conductive bonding material 20 is cured by heat melting or the like, whereby the piezoelectric vibrator 10 is mounted on the mounting substrate 1. Complete electromechanical fixation.
Thereafter, after the mounting substrate base material is divided into pieces, the circuit settings in the IC component are adjusted in order to set the electrical characteristics of the piezoelectric oscillator pieces to a predetermined value. At this time, the adjustment work can be facilitated by exposing the IC adjustment terminal to the bottom surface of the mounting board piece.
As described above, according to the piezoelectric oscillator according to the present invention, since no special column member is used, the cost increase due to the increase in the number of parts and the cost increase due to the increase in the number of assembly can be solved. Support stability of the piezoelectric vibrator 10 with respect to the mounting substrate 1 can be ensured by bringing the IC component 3 and the piezoelectric vibrator 10 into direct or indirect contact. Further, an adhesive may be interposed in the contact portion between the IC component 3 and the piezoelectric vibrator 10 as necessary.

In the above embodiment, the configuration in which the IC component 3 mounted on the mounting substrate 1 is sandwiched by the piezoelectric vibrator 10 is shown. On the contrary, the IC component 3 is placed on the land provided on the bottom surface of the piezoelectric vibrator 10. After mounting in an inverted state, it is also possible to sandwich so that the lower surface 3B of the IC component 3 is supported by the upper surface of the mounting substrate.
FIG. 4 is a process diagram showing a manufacturing procedure of a piezoelectric oscillator having such a configuration.
First, in FIG. 4A, the IC component 3 is flip-chip mounted on the land 12a on the lower surface of the insulating container 12 constituting the piezoelectric vibrator 10 in the inverted direction.
Next, in FIG. 4B, the conductive bonding material 20 is disposed on the bonding electrode 4 of the mounting substrate 1 with a required amount and a required thickness. The conductive bonding material 20 can be applied by screen printing or the like. In order to reduce the cost and the size, the conductive bonding material 20 may be applied on the surface of the bottom electrode 11 of the piezoelectric vibrator.
Note that the lower surface 3B of the IC component 3 may be brought into direct contact with the upper surface of the mounting board. However, as in the example shown in FIG. In addition, a buffer material such as silicon resin may be fixed. As for the application position and the like of the cushioning material, what is described in the above embodiment is applicable as it is.
FIG. 5 is an enlarged view showing an example in which a buffer material is arranged on the upper surface of the mounting substrate. In this example, the resist film 25 provided on the mounting substrate 1 is used as the buffer material. In this case, by partially wiring the wiring pattern 8 under the resist film 25, the height of the buffer material made of the resist film can be increased.
Next, the mounting substrate 1 is positioned on the lower surface of the piezoelectric vibrator so that the electronic component 3 is covered with the mounting substrate 1 as shown in FIG. At this time, each conductive bonding material 20 is aligned with the bottom electrode 11 of the piezoelectric vibrator 10, and then the conductive bonding material 20 is cured by heat melting or the like, whereby the piezoelectric vibrator 10 is mounted on the mounting substrate 1. Complete electromechanical fixation.
Thereafter, after the mounting substrate base material is divided into pieces, the circuit settings in the IC component are adjusted in order to set the electrical characteristics of the piezoelectric oscillator pieces to a predetermined value. At this time, the adjustment work can be facilitated by exposing the IC adjustment terminal to the bottom surface of the mounting board piece.
Also in this embodiment, since no special column member is used, the cost increase due to the increase in the number of parts and the cost increase due to the increase in the number of assembly can be solved.

Next, FIG. 6A is a perspective view showing a configuration of a piezoelectric oscillator according to another embodiment of the present invention, FIG. 6B is an exploded perspective view, FIG. 6C is a front view showing an assembled state, and FIG. It is a front view of a modification.
In the piezoelectric oscillator according to this embodiment, the IC component 3 is mounted on the land 6 provided at the center of the upper surface of the mounting substrate 1, and the bonding electrode 4 disposed at three corners of the mounting substrate and the bottom surface of the piezoelectric vibrator 1. These three bottom electrodes 11 are electrically and mechanically joined to each other by a conductive joining material 30 made of a metal block or the like.
The characteristic configuration of this embodiment is that the upper surface of the IC component 3 and the bottom surface of the piezoelectric vibrator 10 are brought into contact with each other and bonded with an adhesive as necessary. That is, in this embodiment, the IC component 3 is used as a means for supporting the piezoelectric vibrator 10.
In order to further reduce the cost and size, the conductive bonding material 20 made of solder, conductive paste or the like shown in FIG. 1 may be used instead of the conductive bonding material 30 made of a metal block or the like. good.
In the case of an IC component such as a one-chip IC, if it is firmly fixed to the bottom surface of the piezoelectric vibrator with an adhesive, the IC component may receive a pressing force and destabilize the electrical characteristics of the entire oscillator. In order to avoid such a possibility, the IC component 3 and the piezoelectric vibrator bottom surface are simply brought into contact with each other, or are configured to be supported via the buffer material 21 as shown in FIG.
The buffer material 21 is formed by dropping silicon resin on the upper surface of the IC component, or when the underfill material is dropped on the lower surface side of the IC component, it is partially underfilled on the upper edge of the IC component. You may form so that a material may be apply | coated.
According to this embodiment, since the number of column members can be reduced as compared with the conventional example in which four column members are used, it is possible to realize a reduction in price and size.

In the piezoelectric oscillator shown in FIG. 6, the GND electrode (GND terminal) on the bottom surface of the piezoelectric vibrator faces the top surface of the IC component, so that the GND terminal is interposed between the IC chip and the piezoelectric vibrator. Therefore, an effect that the operation of the piezoelectric vibrator is stabilized can be obtained. Furthermore, in the piezoelectric oscillator shown in FIG. 6, if an IC component is disposed on the GND terminal of the mounting electrode 5 of the mounting substrate 1, the effect that the GND terminal functions as a shield material for the IC component can be obtained. .
In the embodiment shown in FIG. 6, the conductive bonding material 30 may be integrated on the mounting substrate in advance.
The present invention can be applied not only to a crystal oscillator but also to a general piezoelectric oscillator using a piezoelectric vibrator other than a crystal.

FIGS. 4A and 4B are a perspective view and a front view of a surface mount piezoelectric oscillator according to an embodiment of the present invention. FIGS. The perspective view which shows the state which mounts a piezoelectric vibrator piece on a mounting substrate base material. (A) thru | or (c) is a figure which shows the assembly procedure of the piezoelectric oscillator of this invention. (A) thru | or (c) is a figure which shows the assembly procedure of the piezoelectric oscillator which concerns on other embodiment of this invention. The principal part enlarged view which shows the structure of a shock absorbing material. (A) thru | or (d) is explanatory drawing of other embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Mounting board, 2 Insulating board, 3 IC component, 4 Bonding electrode, 5 Mounting electrode, 6 Land, 10 Piezoelectric vibrator, 11 Bottom electrode, 12 Ceramic container (insulating container), 13 Recessed part, 14 Piezoelectric vibration element, 15 Metal lid, 20 conductive bonding material, 21 buffer material, 25 resist film, 30 conductive bonding material.

Claims (14)

A piezoelectric vibrator having a bottom electrode which is electrically connected to the piezoelectric vibrating element in the insulating container outer bottom accommodates the piezoelectric vibrating element in the insulating vessel, a mounting board having a land and a bonding electrode on the upper surface of the insulating substrate, And an electronic component for an oscillation circuit mounted on a land of the mounting substrate, the piezoelectric vibrator is disposed above the electronic component, and a bonding electrode of the mounting substrate is disposed on a bottom electrode of the piezoelectric vibrator. A piezoelectric oscillator that is electrically and mechanically bonded using a conductive bonding material,
A piezoelectric oscillator characterized in that an outer bottom portion of an insulating container of the piezoelectric vibrator is supported by an upper surface of the electronic component. A piezoelectric vibrator having a bottom electrode and a land that is electrically connected to the piezoelectric vibrating element in the insulating container outer bottom accommodates the piezoelectric vibrating element in the insulating vessel, a mounting substrate having a bonding electrode on the upper surface of the insulating substrate, And an electronic component for an oscillation circuit mounted on the land of the insulating container, and electrically and mechanically bonding the bonding electrode of the mounting substrate to the bottom electrode of the piezoelectric vibrator using a conductive bonding material A piezoelectric oscillator,
A piezoelectric oscillator comprising a lower surface of the electronic component supported by an upper surface of the mounting substrate. Between the insulating container outside bottom of the upper surface and the piezoelectric vibrator of the electronic component, or claims between the upper surface and the lower surface of the electronic component of the mounting board, characterized in that interposed respectively cushioning material The piezoelectric oscillator according to 1 or 2. The cushioning material, the upper surface of the electronic component, or a piezoelectric according to claim 3, wherein the resin applied to the lower surface of the electronic component, or be composed of a resist film applied on the mounting board Oscillator. Wherein are those piezoelectric vibrator with a GND terminal to the insulating container outer bottom, a piezoelectric oscillator according to claim 1, characterized in that the GND terminal is opposed to the upper surface of the electronic component.   The piezoelectric oscillator according to claim 1, wherein the electronic component is an IC component that constitutes an oscillation circuit.   A piezoelectric vibrator including three bottom electrodes having a bottom electrode connected to the piezoelectric vibration element on the outer bottom of the insulation container and having a land on the upper surface of the insulating substrate. A mounting board, an electronic component mounted on the land of the mounting board, and a conductive bonding material that electrically joins the three bottom electrodes and the land of the mounting board, A piezoelectric oscillator, wherein the piezoelectric vibrator is disposed above and the outer bottom portion of the insulating container is supported by an upper surface of the electronic component.   A piezoelectric vibrator having three bottom electrodes housed in a rectangular insulating container and having a bottom electrode connected to the piezoelectric vibrating element on the outer bottom of the insulating container, and a land and a bond on the top surface of the insulating substrate A mounting board provided with an electrode; an electronic component mounted on a land of the mounting board; and a conductive bonding material that electrically joins the three bottom electrodes and the bonding electrode. The piezoelectric oscillator is characterized in that the piezoelectric vibrator is disposed above and an outer bottom portion of the insulating container is supported by an upper surface of the electronic component.   A piezoelectric vibrator having four bottom electrodes having a bottom electrode electrically connected to the piezoelectric vibration element on the outer bottom of the insulation container and having a land on the upper surface of the insulating substrate. A mounting board, an electronic component mounted on the land of the mounting board, and a conductive bonding material that electrically joins the three bottom electrodes and the land of the mounting board, The piezoelectric vibrator is disposed above, and the outer bottom portion of the insulating container is supported by the top surface of the electronic component, and the remaining bottom electrode is a GND electrode, and the bottom electrode is the GND electrode. A piezoelectric oscillator, wherein the electronic component is mounted on a mounting board so as to face an upper surface of the electronic component.   A piezoelectric vibrator having four bottom electrodes having a bottom electrode electrically connected to the piezoelectric vibration element at the outer bottom of the insulation container and having a piezoelectric vibration element housed in a rectangular insulating container, and a land and a bond on the upper surface of the insulating substrate A mounting board provided with an electrode; an electronic component mounted on a land of the mounting board; and a conductive bonding material that electrically joins the three bottom electrodes and the bonding electrode. The piezoelectric vibrator is disposed above and the outer bottom portion of the insulating container is supported by the top surface of the electronic component, and the remaining bottom electrode is a GND electrode, and the bottom electrode is the GND electrode. A piezoelectric oscillator, wherein the electronic component is mounted on a mounting board so as to face an upper surface of the electronic component.   11. The mounting board according to claim 7, wherein the mounting board includes a GND electrode on a lower surface, and the lower surface of the electronic component is disposed on the upper surface of the mounting board on the GND electrode. The piezoelectric oscillator as described.   The piezoelectric oscillator according to claim 7, wherein the conductive bonding material is a metal block.   The piezoelectric oscillator according to claim 7, wherein the electronic component is an IC component that constitutes an oscillation circuit.   14. The piezoelectric oscillator according to claim 7, wherein a buffer material is interposed between an upper surface of the electronic component and an outer bottom portion of the insulating container of the piezoelectric vibrator.

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