JP2002105169A5 - - Google Patents
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- Publication number
- JP2002105169A5 JP2002105169A5 JP2000294106A JP2000294106A JP2002105169A5 JP 2002105169 A5 JP2002105169 A5 JP 2002105169A5 JP 2000294106 A JP2000294106 A JP 2000294106A JP 2000294106 A JP2000294106 A JP 2000294106A JP 2002105169 A5 JP2002105169 A5 JP 2002105169A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- formula
- represented
- tertiary octyl
- following general
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 5
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000005205 dihydroxybenzenes Chemical class 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000005206 1,2-dihydroxybenzenes Chemical class 0.000 description 1
- CLDZVCMRASJQFO-UHFFFAOYSA-N 2,5-bis(2,4,4-trimethylpentan-2-yl)benzene-1,4-diol Chemical compound CC(C)(C)CC(C)(C)C1=CC(O)=C(C(C)(C)CC(C)(C)C)C=C1O CLDZVCMRASJQFO-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000294106A JP4605420B2 (ja) | 2000-09-27 | 2000-09-27 | エポキシ樹脂組成物及びその硬化物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000294106A JP4605420B2 (ja) | 2000-09-27 | 2000-09-27 | エポキシ樹脂組成物及びその硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002105169A JP2002105169A (ja) | 2002-04-10 |
| JP2002105169A5 true JP2002105169A5 (enrdf_load_stackoverflow) | 2007-11-15 |
| JP4605420B2 JP4605420B2 (ja) | 2011-01-05 |
Family
ID=18776778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000294106A Expired - Fee Related JP4605420B2 (ja) | 2000-09-27 | 2000-09-27 | エポキシ樹脂組成物及びその硬化物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4605420B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4208068B2 (ja) * | 2003-02-14 | 2009-01-14 | 日本化薬株式会社 | 液晶シール剤およびそれを用いた液晶表示セル |
| JP6809206B2 (ja) * | 2016-12-21 | 2021-01-06 | Dic株式会社 | エポキシ樹脂、硬化性樹脂組成物及びその硬化物 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10158362A (ja) * | 1996-11-28 | 1998-06-16 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物、硬化物及び半導体装置 |
| JP3998163B2 (ja) * | 1998-03-13 | 2007-10-24 | 日本化薬株式会社 | エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
| JP4678456B2 (ja) * | 2000-06-28 | 2011-04-27 | Ｄｉｃ株式会社 | エポキシ樹脂組成物 |
| JP2002069154A (ja) * | 2000-08-30 | 2002-03-08 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
-
2000
- 2000-09-27 JP JP2000294106A patent/JP4605420B2/ja not_active Expired - Fee Related
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