JP2002094020A5 - - Google Patents
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- Publication number
- JP2002094020A5 JP2002094020A5 JP2000281725A JP2000281725A JP2002094020A5 JP 2002094020 A5 JP2002094020 A5 JP 2002094020A5 JP 2000281725 A JP2000281725 A JP 2000281725A JP 2000281725 A JP2000281725 A JP 2000281725A JP 2002094020 A5 JP2002094020 A5 JP 2002094020A5
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Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000281725A JP3940883B2 (ja) | 2000-09-18 | 2000-09-18 | 強誘電体メモリ装置の製造方法 |
| CN018027881A CN1216425C (zh) | 2000-09-18 | 2001-08-21 | 强电介质存储装置及其制造方法以及混载装置 |
| PCT/JP2001/007144 WO2002023635A1 (en) | 2000-09-18 | 2001-08-21 | Ferroelectric memory device and its manufacturing method, and hybrid device |
| EP01956992A EP1263048B1 (en) | 2000-09-18 | 2001-08-21 | Ferroelectric memory device and its manufacturing method, and hybrid device |
| CNB2005100525871A CN100352039C (zh) | 2000-09-18 | 2001-08-21 | 强电介质存储装置及其制造方法 |
| US09/934,550 US6727536B2 (en) | 2000-09-18 | 2001-08-23 | Ferroelectric memory device |
| US10/780,572 US7169621B2 (en) | 2000-09-18 | 2004-02-19 | Ferroelectric memory device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000281725A JP3940883B2 (ja) | 2000-09-18 | 2000-09-18 | 強誘電体メモリ装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002094020A JP2002094020A (ja) | 2002-03-29 |
| JP2002094020A5 true JP2002094020A5 (enExample) | 2006-10-26 |
| JP3940883B2 JP3940883B2 (ja) | 2007-07-04 |
Family
ID=18766338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000281725A Expired - Fee Related JP3940883B2 (ja) | 2000-09-18 | 2000-09-18 | 強誘電体メモリ装置の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6727536B2 (enExample) |
| EP (1) | EP1263048B1 (enExample) |
| JP (1) | JP3940883B2 (enExample) |
| CN (2) | CN100352039C (enExample) |
| WO (1) | WO2002023635A1 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6498364B1 (en) * | 2000-01-21 | 2002-12-24 | Agere Systems Inc. | Capacitor for integration with copper damascene processes |
| JP3940883B2 (ja) * | 2000-09-18 | 2007-07-04 | セイコーエプソン株式会社 | 強誘電体メモリ装置の製造方法 |
| US20030001188A1 (en) * | 2001-06-27 | 2003-01-02 | Nakagawa Osamu Samuel | High-dielectric constant metal-insulator metal capacitor in VLSI multi-level metallization systems |
| US7727777B2 (en) * | 2002-05-31 | 2010-06-01 | Ebrahim Andideh | Forming ferroelectric polymer memories |
| JP2004031728A (ja) * | 2002-06-27 | 2004-01-29 | Matsushita Electric Ind Co Ltd | 記憶装置 |
| JP4525889B2 (ja) | 2002-08-14 | 2010-08-18 | セイコーエプソン株式会社 | 強誘電体メモリ、強誘電体メモリの製造方法、及び半導体装置の製造方法 |
| US7220985B2 (en) * | 2002-12-09 | 2007-05-22 | Spansion, Llc | Self aligned memory element and wordline |
| US6774004B1 (en) * | 2003-03-17 | 2004-08-10 | Sharp Laboratories Of America, Inc. | Nano-scale resistance cross-point memory array |
| US6977402B2 (en) | 2003-03-25 | 2005-12-20 | Sanyo Electric Co., Ltd. | Memory device having storage part and thin-film part |
| JP3920827B2 (ja) * | 2003-09-08 | 2007-05-30 | 三洋電機株式会社 | 半導体記憶装置 |
| WO2005074032A1 (ja) * | 2004-01-28 | 2005-08-11 | Fujitsu Limited | 半導体装置及びその製造方法 |
| KR100709462B1 (ko) * | 2004-02-16 | 2007-04-18 | 주식회사 하이닉스반도체 | 다층 나노 튜브 셀을 이용한 메모리 장치 |
| JP4880894B2 (ja) | 2004-11-17 | 2012-02-22 | シャープ株式会社 | 半導体記憶装置の構造及びその製造方法 |
| US7212431B2 (en) | 2004-12-29 | 2007-05-01 | Hynix Semiconductor Inc. | Nonvolatile ferroelectric memory device and control method thereof |
| KR100590580B1 (ko) * | 2005-03-21 | 2006-06-19 | 삼성전자주식회사 | 패턴된 강유전체 미디어의 제조방법 |
| KR100689842B1 (ko) * | 2006-01-06 | 2007-03-08 | 삼성전자주식회사 | 강유전체막을 정보저장요소로 채택하는 플래시 메모리소자들 및 그 제조방법들 |
| WO2007128620A1 (en) * | 2006-04-28 | 2007-11-15 | Agfa-Gevaert | Conventionally printable non-volatile passive memory element and method of making thereof. |
| JP5010192B2 (ja) | 2006-06-22 | 2012-08-29 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| FR2925748B1 (fr) * | 2007-12-21 | 2010-01-29 | Commissariat Energie Atomique | Support de stockage de donnees et procede associe |
| KR102092776B1 (ko) * | 2013-11-20 | 2020-03-24 | 에스케이하이닉스 주식회사 | 전자 장치 |
| US10199432B2 (en) * | 2014-04-14 | 2019-02-05 | HangZhou HaiCun Information Technology Co., Ltd. | Manufacturing methods of MOSFET-type compact three-dimensional memory |
| US10211258B2 (en) * | 2014-04-14 | 2019-02-19 | HangZhou HaiCun Information Technology Co., Ltd. | Manufacturing methods of JFET-type compact three-dimensional memory |
| US10068918B2 (en) | 2015-09-21 | 2018-09-04 | Globalfoundries Inc. | Contacting SOI subsrates |
| US12324163B1 (en) | 2022-03-15 | 2025-06-03 | Kepler Computing Inc. | Planar capacitors with shared electrode and methods of fabrication |
| US12289894B1 (en) | 2022-06-17 | 2025-04-29 | Kepler Computing Inc. | Method of fabricating transistors and stacked planar capacitors for memory and logic applications |
| US12300297B1 (en) | 2022-08-05 | 2025-05-13 | Kepler Computing Inc. | Memory array with buried or backside word-line |
| US12062584B1 (en) | 2022-10-28 | 2024-08-13 | Kepler Computing Inc. | Iterative method of multilayer stack development for device applications |
| US11741428B1 (en) | 2022-12-23 | 2023-08-29 | Kepler Computing Inc. | Iterative monetization of process development of non-linear polar material and devices |
| US20240274651A1 (en) | 2023-02-10 | 2024-08-15 | Kepler Computing Inc. | Method of forming stacked capacitors through wafer bonding |
| US11765908B1 (en) | 2023-02-10 | 2023-09-19 | Kepler Computing Inc. | Memory device fabrication through wafer bonding |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2788265B2 (ja) * | 1988-07-08 | 1998-08-20 | オリンパス光学工業株式会社 | 強誘電体メモリ及びその駆動方法，製造方法 |
| JP3570692B2 (ja) * | 1994-01-18 | 2004-09-29 | ローム株式会社 | 不揮発性メモリ |
| JP3480110B2 (ja) * | 1995-03-15 | 2003-12-15 | ソニー株式会社 | 半導体メモリ及びその作製方法 |
| JPH0991970A (ja) * | 1995-09-26 | 1997-04-04 | Olympus Optical Co Ltd | 非破壊型強誘電体メモリ及びその駆動方法 |
| JPH09102587A (ja) * | 1995-10-05 | 1997-04-15 | Olympus Optical Co Ltd | 強誘電体薄膜素子 |
| JPH1098162A (ja) * | 1996-09-20 | 1998-04-14 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
| KR100370416B1 (ko) * | 1996-10-31 | 2003-04-08 | 삼성전기주식회사 | 고밀도 데이터의 기록/재생을 위한 부호화/복호화 방법 및 그에 따른 장치 |
| NO309500B1 (no) * | 1997-08-15 | 2001-02-05 | Thin Film Electronics Asa | Ferroelektrisk databehandlingsinnretning, fremgangsmåter til dens fremstilling og utlesing, samt bruk av samme |
| DE19744095A1 (de) * | 1997-10-06 | 1999-04-15 | Siemens Ag | Speicherzellenanordnung |
| JP2000004001A (ja) * | 1998-06-15 | 2000-01-07 | Toshiba Corp | 半導体記憶装置及びその製造方法 |
| US6351406B1 (en) * | 1998-11-16 | 2002-02-26 | Matrix Semiconductor, Inc. | Vertically stacked field programmable nonvolatile memory and method of fabrication |
| JP2002026280A (ja) | 2000-06-30 | 2002-01-25 | Seiko Epson Corp | 強誘電体メモリ及びその製造方法 |
| JP3915868B2 (ja) | 2000-07-07 | 2007-05-16 | セイコーエプソン株式会社 | 強誘電体メモリ装置およびその製造方法 |
| JP3940883B2 (ja) * | 2000-09-18 | 2007-07-04 | セイコーエプソン株式会社 | 強誘電体メモリ装置の製造方法 |
-
2000
- 2000-09-18 JP JP2000281725A patent/JP3940883B2/ja not_active Expired - Fee Related
-
2001
- 2001-08-21 CN CNB2005100525871A patent/CN100352039C/zh not_active Expired - Fee Related
- 2001-08-21 CN CN018027881A patent/CN1216425C/zh not_active Expired - Fee Related
- 2001-08-21 WO PCT/JP2001/007144 patent/WO2002023635A1/ja not_active Ceased
- 2001-08-21 EP EP01956992A patent/EP1263048B1/en not_active Expired - Lifetime
- 2001-08-23 US US09/934,550 patent/US6727536B2/en not_active Expired - Fee Related
-
2004
- 2004-02-19 US US10/780,572 patent/US7169621B2/en not_active Expired - Fee Related