JP2002069415A - Bonding material and electronic-parts module using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding material for forming a bonding material layer that is excellent in a thermal history at mounting, anti-thermal fatigue at temperature cycle test (TCT) and moisture-proof at accelerated test (HAST). SOLUTION: The bonded material is constituted of a mixture of epoxy resin, a curing agent starting reaction at 100-200 deg.C, a thermoplastic resin with its weight average molecular weight of 10,000-500,000, an elastomer with its glass transition temperature of -60--20 deg.C and an inorganic insulating filler of 0.1-0.2 μm average diameter coated by resin consisting of either of epoxy resin, acrylic resin, phenol resin or acrylonitrile-styrene resin, and is characterized by a moisture permeability after curing of 10-100g/m2 measured by the method specified in JIS-Z-0208.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive for forming an adhesive layer on a surface of which a wiring conductor layer is adhered, and an electronic component module using the same. Thermal history and temperature cycle test (TC
The present invention relates to an adhesive for forming an adhesive layer having excellent thermal fatigue resistance to T) and moisture resistance to an accelerated test (HAST) and a high insulation resistance, and to a highly reliable electronic component module using the same. is there.

[0002]

2. Description of the Related Art In recent years, electronic devices have become more compact, thinner and lighter, as typified by various types of communication devices in the field of mobile or portable electronic devices. The electronic component modules mounted on such electronic devices have also been required to be smaller and higher in density.

In response to such demands, copper (C) which is a low-resistance metal is provided on an insulating substrate made of glass fiber and an organic resin.
A wiring board formed by forming a wiring conductor layer made of u) or gold (Au) by a thin film forming method has been used as an electronic component module.

[0004] Such a wiring board is made of, for example, glass fiber or aramid fiber, from the viewpoint of ensuring the demand for higher density wiring and ensuring the mechanical strength and matching the thermal expansion between the insulating base and the wiring conductor. An adhesive made of a thermosetting resin such as epoxy resin is applied to an insulating substrate that is made by impregnating a reinforcing material such as a thermosetting resin typified by an epoxy resin with excellent heat resistance and chemical resistance onto a composite insulating substrate. To form an adhesive layer,
After the adhesive layer is cured by heating, a through hole is formed in the adhesive layer with a laser or the like, and then the surface of the adhesive layer is chemically roughened. Further, the inside of the through hole is subjected to electroless plating and electrolytic plating. At the same time as forming a conductor layer by applying a copper film, a wiring conductor layer is formed on the surface of the adhesive layer, and is manufactured by a build-up method in which such formation of the adhesive layer and the wiring conductor layer is sequentially repeated. I have.

[0005] Further, such a wiring board is usually provided with an adhesive material in order to suppress heat generated when mounting various electronic components such as semiconductor elements and heat generated by the electronic components due to high-density mounting. The layer contains about 30 to 80% by weight of an inorganic insulating filler such as silica or alumina having an average particle size of 5 to 20 μm, which has a low coefficient of thermal expansion and good thermal conductivity, so that the adhesive and the insulating substrate or the wiring conductor layer Of the thermal expansion coefficients of the same.

Further, such a wiring board is provided by electrically connecting various electronic components such as semiconductor elements via conductor bumps made of solder or the like formed on a wiring conductor layer on the surface of the wiring board. It becomes an electronic component module such as a semiconductor device.

However, although the adhesive layer filled with such an inorganic insulating filler has a low coefficient of thermal expansion, the resin of the adhesive layer and the inorganic insulating filler due to the thermal stress of soldering during mounting. Interfacial peeling and interfacial cracking occur due to distortion at the interface with, for example,
When a high voltage of 500 V is applied as a withstand voltage value according to the insulation resistance measurement method specified in JIS-C-6481, there is a problem that electricity easily flows to the interface and dielectric breakdown easily occurs.

Therefore, in order to solve such problems, the surface of the adhesive layer treated with a silane coupling agent has a mean particle size of 2 to 15 μm, preferably 50 μm or less. There has been proposed a highly reliable adhesive material layer and a printed circuit board which are filled with an inorganic insulating filler having good heat dissipation, have good heat dissipation, and do not cause dielectric breakdown during mounting (see Japanese Patent Application Laid-Open No. 9-331122). .

[0009]

However, a printed circuit board having an adhesive layer filled with an inorganic insulating filler surface-treated with a silane coupling agent as described above is not suitable for insulation due to heat history when electronic components are mounted. Although destruction can be prevented, for example, between the terminals of a printed circuit board in a thermo-hygrostat at a temperature of 130 ° C and a relative humidity of 85%
Acceleration test (HAS) in which a DC voltage of 5.5 V is continuously applied
In the reliability evaluation by T), since the adhesive layer absorbs moisture and the silane coupling agent is hydrolyzed, peeling occurs at the interface between the inorganic insulating filler and the matrix made of the thermosetting resin, and water accumulates. As a result, there is a problem that ion migration is caused and the insulation resistance is rapidly reduced.

That is, such an adhesive layer easily transmits moisture along the interface between the inorganic insulating filler forming the adhesive layer and the matrix composed of the thermosetting resin when saturated water is absorbed. There is a problem that the water vapor permeability measured by the method specified in stipulated in stipulation of −0208 is as high as 150 g / m ² or more.

In addition, since the thermosetting organic resin forming the matrix of the adhesive layer contains ionic impurities that cannot be removed in the purification step of the manufacturing process, the inorganic insulating material having a particle size larger than the thickness of the adhesive layer is present. When the conductive filler is used, the particles of the inorganic insulating filler cross-link the front and back surfaces of the insulating layer. As a result, when the accelerated test (HAST) is performed, ionic impurities are present at the interface between the inorganic insulating filler and the organic resin. There is also a problem that the front and back surfaces of the adhesive layer are easily moved along the gap, thereby significantly lowering the insulation resistance of the adhesive layer and causing an electrical short circuit.

The present invention has been devised in view of the problems of the prior art described above, and has as its object a heat history at the time of mounting and a thermal fatigue resistance against a temperature cycle test (TCT) and an acceleration test (HAST) against acceleration. An object of the present invention is to provide an adhesive for forming an adhesive layer having excellent moisture resistance and preventing occurrence of ion migration and having high reliability, and a highly reliable electronic component module manufactured using the adhesive.

[0013]

The adhesive of the present invention comprises: an epoxy resin mixture; a curing agent which starts a reaction at a temperature of 100 to 200 ° C .; a thermoplastic resin having a weight average molecular weight of 10,000 to 500,000; An elastomer having a transition temperature of −60 to −20 ° C., and an inorganic insulating filler having an average particle size of 0.1 to 2 μm having a resin coating layer made of any one of an epoxy resin, an acrylic resin, a phenol resin and an acrylonitrile-styrene resin. Consisting of JIS-Z-0208
Characterized in that it is 10 to 100 g / m ^{2 as} measured by the method specified in (1).

In the adhesive of the present invention, the epoxy resin mixture may be composed of 20 to 80% by weight of a polyfunctional epoxy resin and 20 to 80% by weight of a bifunctional epoxy resin. In addition to the above, 2 to 10% by weight of a curing agent, 5 to 30% by weight of a thermoplastic resin, 10 to 40% by weight of an elastomer, and 3 to 10% by weight of an inorganic insulating filler are added. Things.

Further, the adhesive of the present invention is characterized in that it is in the form of a film in the above constitution.

The electronic equipment module of the present invention comprises an insulating substrate, an adhesive layer formed on the insulating substrate by using the above-mentioned adhesive, and a plurality of insulating layers formed on each surface of the insulating substrate and the adhesive layer. An electronic component module comprising an electronic component mounted on a wiring board including a wiring conductor layer and a through conductor formed inside a through hole formed in the adhesive layer and electrically connecting a plurality of wiring conductor layers. And the adhesive layer has a temperature of 13
It is characterized by having an insulation resistance of 10 ¹⁰ Ω or more after continuously applying a voltage of 5.5 V for 300 hours in an environment of 0 ° C. and a relative humidity of 85%.

According to the adhesive of the present invention, since the epoxy resin mixture comprises a polyfunctional epoxy resin and a bifunctional epoxy resin, the crosslinking density of the adhesive can be increased,
As a result, molecular breakage of the resin due to heat and intrusion of moisture into the resin can be suppressed, and an adhesive excellent in moisture resistance can be obtained. In addition, the weight average molecular weight is 10,000 to 50,000
Since the thermoplastic resin contains 0 thermoplastic resin, an adhesive having good stretchability and excellent film moldability can be obtained despite the increased crosslinking density. Furthermore, since it contains an elastomer having a glass transition temperature of −60 to −20 ° C., the uncured film has excellent flexibility and is easy to handle, and the cured film maintains flexibility and maintains heat. The stress caused by the change can be absorbed. Furthermore, since the surface of the contained inorganic insulating filler was coated with a resin composed of any one of an epoxy resin or an acrylic resin, a phenol resin, or an acrylonitrile-styrene resin, the solubility of the epoxy resin mixture forming the matrix of the adhesive layer was increased. The parameter value (sp value = 8 to 13) and the sp value of the resin coating the inorganic insulating filler are similar, and the molecular chain of the resin coating the inorganic insulating filler and the molecular chain of the epoxy resin mixture are satisfactorily entangled. The two firmly adhere to each other, so that good adhesion between the inorganic insulating filler and the epoxy resin mixture can be achieved, and as a result, moisture can be transmitted along the interface between the epoxy resin mixture and the inorganic insulating filler. Etc. are not transmitted. Further, in the above configuration, the moisture permeability after curing was measured by a method specified in JIS-Z-0208 to be as low as 10 to 100 g / m ² , so that the moisture resistance to the accelerated test (HAST) was improved. Excellent adhesive can be obtained.

Further, according to the electronic component module of the present invention, since the electronic component is mounted on a wiring board formed by laminating an adhesive layer formed by using the above-mentioned adhesive on an insulating substrate, heat resistance and heat resistance are improved. An electronic component module having excellent moisture resistance can be obtained. Further, in the above configuration, the adhesive layer
5.5V voltage in an environment with a temperature of 130 ° C and a relative humidity of 85%
Since the insulation resistance after continuous application for 300 hours is 10 ¹⁰ Ω or more, it excels in thermal history during mounting and thermal fatigue resistance against temperature cycle test (TCT) and moisture resistance such as accelerated test (HAST). An electronic component module having good reliability for a reliability test can be obtained.

[0019]

Next, the adhesive of the present invention and an electronic component module using the same will be described in detail.

The adhesive of the present invention comprises an epoxy resin mixture, a curing agent which initiates a reaction at a temperature of 100 to 200 ° C., a thermoplastic resin having a weight average molecular weight of 10,000 to 500,000, and a glass transition temperature of -60 to 50,000. It is composed of an elastomer at −20 ° C. and an inorganic insulating filler having an average particle size of 0.1 to 2 μm coated with a resin composed of any one of an epoxy resin, an acrylic resin, a phenol resin and an acrylonitrile-styrene resin, and after curing. Has a moisture permeability of 10 to 100 g / m ^{2 as} measured by a method specified in JIS-Z-0208.

The adhesive of the present invention can be used in the form of a liquid varnish or a solid film, but is preferably in the form of a film from the viewpoint of the surface flatness and the ease of controlling the thickness. In addition, the thickness is from several μm to several hundreds.
A thin sheet having a thickness of about μm is preferable.

Further, since the adhesive of the present invention contains an epoxy resin mixture, it is possible to increase the crosslink density, suppress molecular breakage due to heat and infiltration of moisture into the resin, As a result, an adhesive excellent in heat resistance and moisture resistance can be obtained.

As such an epoxy resin mixture,
From the viewpoints of heat resistance, chemical resistance, electrical properties, and workability, a mixture of a polyfunctional epoxy resin and a bifunctional epoxy resin is preferable. In particular, the ratio of the polyfunctional epoxy resin to the bifunctional epoxy resin is preferably a polyfunctional epoxy resin. 20-80% by weight of resin
-It is preferable to make bifunctional epoxy resin into 20 to 80 weight%. If the amount of the bifunctional epoxy resin is less than 20% by weight, the crosslinking density of the adhesive tends to be low, and the heat resistance and chemical resistance tend to decrease. Has a tendency to decrease in flexibility and to be easily broken during handling after curing. Therefore, the ratio of the polyfunctional epoxy resin to the bifunctional epoxy resin is preferably 20 to 80% by weight of the polyfunctional epoxy resin and 20 to 80% by weight of the bifunctional epoxy resin.

Examples of such polyfunctional epoxy resins include phenol novolak type epoxy resin, orthocresol novolak type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, triglycidyl isocyanurate and alicyclic epoxy resin. And bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenol type epoxy resin, etc. are used as the bifunctional epoxy resin. It is also possible to use a brominated epoxy resin in combination to impart properties.

The adhesive of the present invention contains a curing agent which initiates a reaction at a temperature of 100 to 200 ° C. with the epoxy resin mixture in an amount of 2 to 10% by weight based on the epoxy resin mixture. If the reaction start temperature of the curing agent is lower than 100 ° C., the curing of the film proceeds excessively in the drying step at the time of film formation, and the flexibility tends to be lost, which tends to cause a problem in handling the film. On the other hand, when the reaction start temperature exceeds 200 ° C., oxidative deterioration of the epoxy resin mixture starts and the film tends to become brittle. Therefore, the reaction starting temperature of the curing agent is 100 to 2
It is preferably in the range of 00 ° C.

If the amount of the curing agent is less than 2% by weight, the crosslinking density tends to be low and the chemical resistance tends to be low. The film tends to be brittle, and the reliability in the temperature cycle test (TCT) tends to decrease. Therefore, the addition amount of the curing agent is 2 to the epoxy resin mixture.
Preferably it is in the range of ~ 10% by weight.

Examples of such a curing agent include metaphenylenediamine having a reaction temperature of 130 to 150 ° C. with an epoxy resin mixture, diaminodiphenylmethane having a reaction temperature of 120 to 180 ° C., and diaminodiphenyl sulfone having a reaction temperature of 110 to 200 ° C. Aromatic amines such as dicyandiamide having a reaction temperature of 160 to 180 ° C., and 2,4-diamino-6- (2-methyl-1-imidazolylethyl) -1,3,5 having a reaction temperature of 160 to 180 ° C.
Triazine, 2,2,4-diamino-6- (2-undecyl-1-imidazolylethyl) having a reaction temperature of 115 to 155 ° C.
High-melting aromatic amines and triazines having a rigid structure represented by triazines such as -1,3,5-triazine are used.

If the reaction temperature is suitable, a phenolic curing agent and a curing accelerator may be used in combination. For example, a phenolic curing agent such as a phenol novolak resin or an ortho novolak resin, and a curing accelerator such as imidazole. A curing agent and a curing accelerator having a reaction temperature of 100 to 200 ° C. for a system compound or an organic sulfone compound may be used.

Further, since the adhesive of the present invention contains 5 to 30% by weight of a thermoplastic resin having a weight average molecular weight of 10,000 to 500,000 with respect to the epoxy resin mixture, the adhesive has good stretchability and a film. Can also be used as an adhesive having excellent moldability. If the weight average molecular weight of the thermoplastic resin is less than 10,000, the film tends to be brittle and the moldability tends to deteriorate, and if it exceeds 500,000, the viscosity of the adhesive increases and the film having a uniform thickness tends not to be obtained. There is. Therefore, the weight average molecular weight of the thermoplastic resin is
It is preferably in the range of 10,000 to 500,000. further,
When the content of the thermoplastic resin is less than 5% by weight, the film tends to be brittle and good stretchability cannot be obtained, and when it exceeds 30% by weight, the heat resistance tends to decrease. Accordingly, the amount of the thermoplastic resin added is preferably in the range of 5 to 30% by weight based on the epoxy resin mixture.

Examples of such a thermoplastic resin include polyesters such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT) and alkyl adipate, and polymethyl methacrylate (PMM).
A) It is preferable to dissolve in a roughening liquid such as acrylates such as polybutyl methacrylate (PBMA).

Since the adhesive of the present invention contains 10 to 40% by weight of an elastomer having a glass transition temperature of -60 to -20 ° C, the uncured film is excellent in flexibility and can be handled. In addition to the above, it is possible to maintain the elasticity of the film even after curing, to absorb the stress due to the thermal change, and as a result, it is possible to improve the thermal fatigue resistance. If the glass transition temperature is lower than −60 ° C., the tackiness of the adhesive after drying tends to be large and the handling of the film tends to be difficult, and if it is higher than −20 ° C., the elasticity of the film after curing Tend to be small. Therefore, the glass transition temperature of the elastomer is -60 to-
Preferably it is in the range of 20 ° C. Further, if the content of the elastomer is less than 10% by weight, flexibility tends to decrease, and if it exceeds 40% by weight, the crosslinking density of the adhesive decreases, and the heat resistance and moisture resistance decrease. Tend to be. Therefore, the content of elastomer is 10-40% by weight.
Is preferably within the range.

Examples of such an elastomer include acrylic rubber (ACM), acrylonitrile-butadiene rubber (NBR), styrene-butadiene-styrene triblock elastomer (SBS), styrene-isoprene-
Styrene triblock elastomer (SIS) or the like is used.

Further, the adhesive of the present invention has an average particle size of 0.1 to 2 having a resin coating layer made of any one of epoxy resin, acrylic resin, phenol resin and acrylonitrile-styrene resin with respect to the epoxy resin mixture.
The content of the inorganic insulating filler of 3 μm is 3 to 10% by weight.

The inorganic insulating filler has a function of increasing the strength of the film.
If it is smaller than μm, the dispersibility tends to be poor and a uniform film tends not to be obtained, and if it exceeds 2 μm, the shape when drilling through holes tends to be poor. Therefore, the average particle diameter of the inorganic insulating filler is preferably in the range of 0.1 to 2 μm.

Further, since the surface of the inorganic insulating filler is coated with a resin made of any one of an epoxy resin, an acrylic resin, a phenol resin and an acrylonitrile-styrene resin, an epoxy resin mixture forming a matrix of an adhesive layer is formed. Solubility parameter value (sp value = 8 to 1)
3) that the sp value of the resin that coats the inorganic insulating filler is close to that of the resin that coats the inorganic insulating filler, and that the molecular chains of the epoxy resin mixture and the molecular chain of the epoxy resin mixture are entangled satisfactorily, and that both are firmly adhered to each other. Accordingly, good adhesion between the inorganic insulating filler and the epoxy resin mixture can be achieved, and as a result, moisture and the like do not pass through the interface between the epoxy resin mixture and the inorganic insulating filler.

For example, the above resin is prepared by dispersing an inorganic insulating filler in an organic solution and forming a silane cup such as γ-methacryloxypropyltrimethoxysilane or γ-mercaptopropyltrimethoxysilane on the surface of the inorganic insulating filler. A ring agent is reacted, and then a monomer (monomer) such as methyl methacrylate or ethyl acrylate and a radical polymerization initiator are added to perform polymerization, thereby covering the surface of the inorganic insulating filler to a thickness of several nm to several tens nm. Is done. Further, a silane coupling agent such as γ-glycidoxypropyltrimethoxysilane or N-β- (aminoethyl) γ-aminopropyltrimethoxysilane is allowed to react on the surface of the inorganic insulating filler, and further, bisphenol A type epoxy The resin may be chemically fixed to the surface of the inorganic insulating filler by adding and reacting an epoxy resin such as epoxy resin or bisphenol F type epoxy. Further, when the content of the inorganic insulating filler is less than 3% by weight, the flatness of the film tends to deteriorate, and when the content exceeds 10% by weight, the shape at the time of forming a through hole tends to deteriorate. . Therefore, the content of the inorganic insulating filler is preferably in the range of 3 to 10% by weight. The thickness of the resin covering the inorganic insulating filler is preferably 1/100 to 1/10 of the particle diameter of the inorganic insulating filler. If the thickness is smaller than 1/100, the entanglement of the molecular chains between the resins is small, so that the adhesive strength is low. Tends to be inferior, 1/10
If the ratio exceeds the range, the filler tends to aggregate. Therefore, the thickness of the resin to be coated is 1/100 of the particle diameter of the inorganic insulating filler.
〜1 / 10 is preferred.

As such an inorganic insulating filler,
Insulating inorganic fine powders such as silicon oxide, aluminum oxide, aluminum nitride, silicon carbide, calcium titanate, titanium oxide, and zeolite are used. The shape may be any of a spherical shape, a crushed shape, a plate shape and the like, but a spherical shape is preferred from the viewpoint of dispersibility, and spherical silicon oxide and aluminum oxide are preferred from the viewpoint of thermal expansion coefficient.

In the adhesive of the present invention, the moisture permeability after curing is as low as 10 to 100 g / m ² measured by the method specified in JIS-Z-0208. And an adhesive having excellent moisture resistance to an accelerated test (HAST). The moisture permeability of the cured adhesive is 10
If it is less than g / m ² , the crosslinking density of the adhesive layer becomes too high, the flexibility of the adhesive layer is lost, and cracks and cracks tend to occur in reliability tests such as a temperature cycle test (TCT). There is. On the other hand, if it exceeds 100 g / m ² , ion migration of the adhesive layer occurs in the accelerated test (HAST), and the insulation resistance decreases in a short time.
When a high voltage of withstand voltage of 500 V is applied in the insulation resistance measuring method specified in S-C-6481, a short circuit tends to occur easily. Therefore, the moisture permeability of the adhesive after curing is JIS
10 to 100 g / measured by the method specified in -Z-0208
m ² is preferable.

Here, the moisture permeability is defined by the amount of water passing through the film when a film having a constant thickness is left in a constant-temperature and constant-humidity chamber for a certain period of time.
According to the measurement method specified in -Z-0208, an adhesive film having a thickness of 25 µm is attached to the opening of a moisture-resistant container, and the container is left for 24 hours in an environment at a temperature of 40 ° C and a relative humidity of 90%. , Calculated from the change in weight of the container before and after standing.

In the adhesive of the present invention, in order to obtain good moldability when forming a film, a material such as methyl ethyl ketone (MKE) or propylene glycol monomethyl ether acetate (PMA) / dimethylformamide (DMF) is used. The solvent may be contained in an amount of 1 to 3% by weight.

The film made of such an adhesive is kneaded with, for example, a mixture obtained by adding a curing agent, an inorganic insulating filler coated with a thermoplastic resin, an elastomer, or a resin, an additive, and a solvent to an epoxy resin mixture. A liquid varnish was obtained, and this liquid varnish was treated with polyethylene terephthalate (P
ET) It is formed by coating on a release sheet and drying at a temperature of 60 to 100 ° C. The dried film can be easily stored by laminating a polyethylene protective sheet on the upper surface of the film and winding it up in a roll.
Further, the thickness of this film can be freely set, but is preferably in the range of 20 to 100 μm from the viewpoint of insulation.

Instead of applying the liquid varnish uniformly on the insulating substrate by a screen printing method or a roll coating method, the film is pressed on a desired insulating substrate using a vacuum laminator and thermally cured in an oven. By
An adhesive layer can be formed on the insulating substrate.

Thus, according to the adhesive of the present invention, the moisture permeability after curing is determined to be 10 to 100 g / m ² by the method specified in JIS-Z-0208. Test to continuously apply a voltage of 5.5 V to an electronic component module in which electronic components are mounted on a wiring board having an insulating layer as an insulating layer in an environment at a temperature of 130 ° C. and a relative humidity of 85% (H
Even if AST is performed, ion migration of the adhesive layer can be suppressed, and the insulation resistance after 300 hours of such an accelerated test (HAST) can be 10 ¹⁰ Ω or more.

The adhesive of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. It is also possible to incorporate a hindered phenolic antioxidant for improving the moldability and a lubricant of higher fatty acid ester for further improving the moldability.

Next, an electronic component module using the adhesive of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view of a principal part showing an example of an electronic component module in which electronic components such as semiconductor elements are mounted on a wiring board using the adhesive of the present invention.

In FIG. 1, reference numeral 1 denotes an electronic component module comprising a wiring board 2 and a semiconductor element 3;
Is mainly composed of an insulating substrate 4, an adhesive layer 5 and a wiring conductor layer 6. In the example of this figure, the adhesive layer 5 has three layers of 5a, 5b, and 5c on the surface of the insulating substrate 4, and the back surface. 3 shows an example in which three layers 5d, 5e, and 5g are formed.

The insulating substrate 4 is made of a resin material generally used for wiring boards, such as glass cloth-epoxy resin, glass cloth-bismaleimide triazine resin, glass cloth-allyl-modified polyphenylene ether, aramid nonwoven fabric-epoxy resin, and an adhesive material. Functions as a support for the layer 5. In this example, a wiring conductor layer 6 made of copper (Cu), nickel (Ni), gold (Au) or the like adhered and formed on both the front and back surfaces of the insulating substrate 4 is formed in a through hole 7 formed by drilling or the like. An example of electrical connection by a through-hole conductor 8 formed inside is shown. Further, an internal wiring conductor (not shown) may be formed in an inner layer of the insulating substrate 4.

An adhesive layer 5 formed by using the adhesive of the present invention is formed on both sides of the insulating substrate 4.
The adhesive layer 5 functions as a support member for supporting the semiconductor element 3 mounted on the wiring board 2.

The adhesive layer 5 has a desired thickness after drying a liquid varnish obtained by kneading a mixture obtained by adding a solvent or the like to the adhesive of the present invention on a polyethylene terephthalate (PET) sheet. Is applied by using a roller coater, dried and cured at a temperature of 60 to 100 ° C. to produce a film, and this film is formed by pressing the film on both the front and back surfaces of the insulating substrate 4 with a vacuum laminator.

The surface of the adhesive layer 5 is roughened by using a roughening liquid to form a rough surface with a myriad of fine holes, so that the adhesion between the adhesive layer 5 and the wiring conductor layer 6 is improved. None, the peel strength can be improved, and as a result, the durability can be improved even in a reliability test such as a temperature cycle test (TCT).

Such a rough surface can be obtained, for example, by bonding the surface of the adhesive layer 5 to a solution containing about 10% of an organic solvent such as glycol ether and about 1% of an alkali such as sodium hydroxide.
After immersion for about 10 minutes to swell the surface of the adhesive layer 5, it is immersed for about 10 minutes in a solution of about 10% of an oxidizing agent such as permanganate to dissolve the thermoplastic resin on the surface of the adhesive layer 5. Finally, the adhesive layer 5 is immersed in a 5% aqueous solution of sulfuric acid for about 5 minutes.
Formed by reducing the surface of

On the surface of the adhesive layer 5, a wiring conductor layer 6 is formed.
Functions as a conductive path for electrically connecting electronic components such as the semiconductor device 3 to an external electric circuit board (not shown). Are electrically connected by flip-chip connection via conductive bumps 11 made of gold (Au), solder, or the like, and a portion exposed on the lower surface of the wiring board 2 is connected to a wiring conductor layer of an external electric circuit board via a solder or the like. By connecting, the semiconductor element 3
And other electronic components are electrically connected to the external electric circuit board via the wiring conductor layer 6.

Such a wiring conductor layer 6 is formed by a subtractive method, an additive method, or the like. Copper is adhered to the roughened surface of the adhesive layer 5 by, for example, an electroless plating method. After patterning with a resist, copper is applied to a predetermined thickness by electrolytic plating, and then a dry film is peeled off and etched to form a wiring pattern. The wiring conductor layer 6 is made of copper (Cu), nickel (Ni), gold (A
u) or the like, and copper (Cu) is preferable from the viewpoint of low resistance.

The wiring conductor layer 6 preferably has a thickness of 3 μm or more from the viewpoint of transmitting a high-speed electric signal. Without leaving a large stress on the wiring conductor layer 6,
In order to make it difficult for the wiring conductor layer 6 to peel off from the adhesive material layer 5, it is preferable to set the thickness to 50 μm or less.

Such an adhesive layer 5 and a wiring conductor layer 6
When a plurality of layers are formed on the insulating substrate 4, a plurality of films serving as the adhesive layer 5 are formed in advance, and the lamination of the adhesive layer 5 and the formation of the wiring conductor layer 6 may be sequentially performed. . Further, the plurality of wiring conductor layers 6 are formed by the through conductors 10 formed on the inner walls of the through holes 9 provided inside the adhesive material layer 5.
Are electrically connected to each other.

The through-hole 9 is formed by a method of exposing and developing, or a carbon dioxide laser or YA.
A method of drilling by a laser method such as G laser or UV laser is used, but fine processing can be performed without depending on the material of the adhesive layer, and the hole diameter of the through hole 9 can be freely set in a range of 10 to 200 μm. It is most preferable to use a carbon dioxide gas laser in terms of high processing speed.

The through-hole 9 is provided in the cured adhesive layer 5 formed on the insulating substrate 4 so that the output is 5 to 7 A and the pulse width is 50.
The through-hole 9 can be formed by irradiating the through-hole 9 with a carbon dioxide gas laser set to 100100 μs about 2 to 5 times, and the hole diameter is usually 30 to 30 μm from the viewpoint of miniaturization of the wiring board and reliability of electrical connection. Preferably it is 300 μm.

According to the adhesive of the present invention, the thermoplastic resin constituting the adhesive has a weight average molecular weight of 10,000 to 50,000.
Since the oxygen index is as large as 0 and the oxygen index is small, it is easily decomposed by the heat of the laser. When the through hole 9 is formed, the residue of the adhesive does not remain around or inside the through hole 9.
When the through conductor 10 is formed by plating, the electrical characteristics can be excellent.

The through conductor 10 may be formed by performing plating simultaneously with the wiring conductor layer 6 when the wiring conductor layer 6 is applied by plating. Further, the through conductor 10 may be formed by filling the inside of the through hole 9 with a metal by plating, in addition to the one formed by being adhered to the inner wall surface of the through hole 9.

Further, by connecting the semiconductor element 3 to the wiring conductor layer 6 formed on the surface of the outermost adhesive material layer 5 via a conductor bump 11 made of solder or the like, the semiconductor element 3 is connected to the wiring conductor layer. The semiconductor element 3 is electrically connected to the semiconductor element 3, and an underfill 12 made of a resin is injected between the semiconductor element 3 and the adhesive layer 5.
Firmly fixed to the surface of the

The electronic component module of the present invention has the above configuration.
In, the temperature of the adhesive layer 5 is 130 ° C. and the relative humidity is 85%.
Resistance after leaving the voltage of 5.5V for 300 hours in the environment
Is 10 ^TenΩ or more, the thermal history during mounting and
Excellent thermal fatigue resistance to temperature cycle test (TCT)
As well as moisture resistance reliability tests such as accelerated tests (HAST)
Electronic component module with good reliability
be able to. If the insulation resistance is 10^TenIf it is smaller than Ω,
There is a tendency that good thermal fatigue resistance and moisture resistance cannot be obtained.
You.

The conductor bump 11 has a function of electrically and mechanically connecting the wiring conductor layer 6 and the semiconductor element 3, and is composed of lead (Pb) -tin (Sn), gold (Au), and lead ( Pb)
-Tin (Sn)-Tin (Sn)-Zinc (Zn)-Tin (Sn)
-Made of a conductive material such as silver (Ag) -bismuth (Bi), for example, the conductive material is lead (Pb) -tin (Sn)
In the case of (1), after the paste prepared by using this is printed at a predetermined location by a screen printing method, the paste is fixed to the surface of the wiring conductor layer 6 by passing through a reflow furnace.

Further, the semiconductor element 3 is placed on the conductor bumps 11 and passed through a reflow furnace to electrically connect the wiring conductor layer 6 and each electrode of the semiconductor element 3, thereby obtaining the electronic component module of the present invention. It becomes 1.

Thus, according to the electronic component module of the present invention, the adhesion between the adhesive layer and the wiring conductor layer is improved, the peel strength is high, and a reliability test such as a temperature cycle test (TCT) or an acceleration test (HAST) is performed. , An electronic component module having excellent durability and high reliability can be obtained.

The electronic component module of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. The wiring board 2 was manufactured by laminating three adhesive layers 5 on each of the front and back surfaces of the insulating base 4. However, even if one, two, or four or more adhesive layers 5 were laminated, Alternatively, the adhesive layer 5 may be laminated only on the front surface or the back surface. Also, through conductor
It is also possible to fill the inside of the through hole 9 with a resin such as the adhesive of the present invention in order to enhance the adhesion between the adhesive layer 10 and the adhesive layer 5. In the above-described embodiment, the electronic component mounted on the electronic component module 1 has been described in detail with reference to the example of the semiconductor element 3. However, a resistor, a capacitor, a piezoelectric element, or the like may be mounted as the electronic component. A radiator plate such as a stiffener may be attached to the wiring board to dissipate the heat generated when the electronic component is operated.

[0067]

EXAMPLES In order to evaluate the characteristics of the adhesive of the present invention and the electronic component module using the adhesive, an electronic component module using the following adhesive film was manufactured. Example 1 of Adhesive First, spherical silicon oxide having an average particle diameter of 2 μm was dispersed in a mixture of ethanol and water, and 2% of γ-methacryloxypropyltrimethoxysilane was added as a silane coupling agent. After stirring at a temperature of 30 ° C. for 1 hour, drying is performed with a spray drier.
The above-mentioned inorganic insulating filler powder, methyl methacrylate, and benzoyl peroxide as a radical polymerization initiator were added to toluene, polymerized at 80 ° C. for 1 hour, filtered, dried, and dried to a thickness of 0.1 μm. An inorganic insulating filler (filler A) coated with a resin was obtained.

On the other hand, as an epoxy resin mixture, 70% by weight of a cresol novolac type epoxy resin as a polyfunctional epoxy resin, 20% by weight of a liquid bisphenol A type epoxy resin as a bifunctional epoxy resin, and a brominated bisphenol as a flame retardant material. A mixture comprising 10% by weight of an A-type epoxy resin was used, and 2,4-diamino-6- (2-methyl-1-imidazolylethyl) -1,3,5- 4% by weight of triazine, 20% by weight of adipic acid propionate having a weight average molecular weight of 120,000 as a thermoplastic resin, 20% by weight of an acrylic rubber having a glass transition temperature Tg of -30 ° C as an elastomer, 8% by weight of a filler A, Methyl ethyl ketone (M
EK) and dimethylformamide (DMF) were added and mixed to produce a varnish-like adhesive.

The varnish-like adhesive was applied on a polyethylene terephthalate (PET) sheet with a roller coater so that the thickness after drying became 45 μm, and then the coated varnish was heated to 60 to 100 ° C.
And dried at a temperature of 3 ° C. to obtain an adhesive film (film A). No abnormality such as dents and cracks was observed in the uncured film A.

A film having a thickness of 25 μm was prepared in the same manner, heated at 175 ° C. for 3 hours, and the moisture permeability of the obtained film was measured in accordance with JIS-Z-0208. m ² . Example 2 of Adhesive First, spherical silicon oxide having an average particle diameter of 1 μm was dispersed in a mixture of ethanol and water, and 2% of γ-glycidoxypropyltrimethoxy was used as a silane coupling agent. Add silane and add 1 at 30 ° C
After stirring for an hour, the mixture is dried with a spray dryer, and the above-mentioned inorganic insulating filler powder and bisphenol A type epoxy are added to methyl ethyl ketone (MEK), reacted at a temperature of 50 ° C. for 1 hour, filtered, and dried. Thus, an inorganic insulating filler (filler B) coated with a resin having a thickness of 0.05 μm was obtained.

On the other hand, as the epoxy resin mixture, 50% by weight of a cresol novolak type epoxy resin as a polyfunctional epoxy resin, 30% by weight of a liquid bisphenol A type epoxy resin as a bifunctional epoxy resin, and a brominated bisphenol as a flame retardant. A mixture comprising 20% by weight of an A-type epoxy resin was used. Based on the epoxy resin mixture, 2,4-diamino-6- (2-methyl-1-imidazolylethyl) -1,3,5- 3% by weight of triazine, 30% by weight of adipic acid propionate having a weight average molecular weight of 200,000 as a thermoplastic resin, and epoxidized acrylonitrile having a glass transition temperature Tg of -30 ° C. as an elastomer.
20% by weight of butadiene rubber, 10% by weight of filler B, and methyl ethyl ketone (MEK) and dimethylformamide (DMF) as solvents were added and mixed to prepare a varnish-like adhesive.

The varnish-like adhesive was applied on a polyethylene terephthalate (PET) sheet by a roller coater so that the thickness after drying became 30 μm, and then the coated varnish was heated to 60 to 100 ° C.
And dried at a temperature of 5 ° C. to obtain an adhesive film (film B). No abnormality such as dents and cracks was observed in the uncured film B.

A film having a thickness of 25 μm was prepared in the same manner, and after heat-curing at a temperature of 175 ° C. for 3 hours, the moisture permeability of the film was measured in accordance with JIS-Z-0208. ^{Was 2} . Comparative Example of Adhesive First, spherical silicon oxide having an average particle diameter of 5 μm was dispersed in a mixture of ethanol and water, and 2% of γ-glycidoxypropyltrimethoxy was used as a silane coupling agent. After adding silane and stirring at a temperature of 30 ° C. for 1 hour, the mixture was dried with a spray dryer to obtain an inorganic insulating filler (filler C).

On the other hand, as an epoxy mixture, cresol novolak type epoxy resin which is a polyfunctional epoxy resin is used.
Using a mixture of 70% by weight, a liquid bisphenol A type epoxy resin which is a bifunctional epoxy resin is 20% by weight, and a brominated bisphenol A type epoxy resin as a flame retardant is 10% by weight,
2,4-Diamino-6- (2-methyl-1-imidazolylethyl)-as a curing agent for this epoxy resin mixture
1,3,5-Triazine (4% by weight), Filler C (10% by weight), and methyl ethyl ketone (MEK) and dimethylformamide (DMF) as solvents were added and mixed to prepare a varnish-like adhesive.

The varnish-like adhesive was applied on a polyethylene phthalate (PET) sheet by a roller coater so that the thickness after drying was 45 μm, and then dried at a temperature of 60 to 100 ° C. to obtain an adhesive film (film). C) was obtained. Defects such as dents and cracks were observed in the uncured film C.

A film having a thickness of 25 μm was prepared in the same manner, and cured at a temperature of 175 ° C. for 3 hours. The moisture permeability of the film was measured in the same manner as in JIS-Z-0208.
It was 120 g / m ² .

As described above, in the film C using the adhesive of the comparative example, dents and cracks are already generated when not cured, and the moisture permeability after curing is as high as 150 g / m ² . A and B produced using the adhesive of the present invention
Is a film having excellent flatness and flexibility when not cured and having a moisture permeability after curing within the range of 10 to 100 g / m ² , and it has been confirmed that the film has excellent moisture permeability resistance. (Embodiment 1 of electronic component module) After simultaneously laminating film A on both sides of an insulating substrate made of glass fiber and epoxy resin using a vacuum laminator, a polyethylene terephthalate (PET) film was peeled from film A, and further, After curing at a temperature of 175 ° C. for 1 hour, a through-hole was formed with a carbon dioxide laser, and then the surface of the adhesive layer was roughened with a potassium permanganate solution.

Then, after treatment with a palladium-based plating catalyst, electroless copper plating was performed, and then wiring pattern processing was performed with a dry film photoresist, and a wiring conductor layer having a thickness of 18 μm was formed by electrolytic copper plating.

The peel strength of the obtained wiring conductor layer was 0.8 k.
g / cm. Further, after performing a heat treatment at 175 ° C. for 2 hours to stabilize the peel strength, laminating the film A and forming a through hole, roughening treatment, and a wiring conductor layer by plating. And formation of the through conductor is repeated a plurality of times to form six adhesive layers and wiring conductor layers on the insulating substrate, and then nickel (Ni) / gold (Au) plating is sequentially performed on the solder resist processed conductive pads. It was formed by adhesion, and a solder bump was further formed.

Then, after mounting the semiconductor element on the solder bumps of the wiring board and passing through the reflow for electrical connection, an underfill is injected into the gap between the semiconductor element and the wiring board to obtain a sample for the reliability test. A temperature cycle test (TCT) and an acceleration test (HAST) were performed as a reliability test using the sample obtained (electronic component module A), and the appearance of the wiring board, such as cracks, swelling and peeling, and the rate of change in resistance value were measured. The electronic component module was evaluated with the following values.

In the temperature cycle test (TCT), a sample was left in a gas phase at a temperature of -55 ° C. and 125 ° C. for 30 minutes using a gas phase cooling / heating test machine, and this was evaluated as a cycle, and evaluated under a condition of 1000 cycles. The test was performed, and the resistance change rate was calculated by measuring the resistance before the test and the resistance after the test.

In the accelerated test (HAST), a voltage of 5.5 V was continuously applied to the sample for 250 hours in a thermo-hygrostat at a temperature of 130 ° C. and a humidity of 85% using a temperature and humidity variable life tester. The ion migration was applied, and the insulation resistance and the insulation resistance were measured.

As a result, the electronic component module A of the present invention
No crack occurred even after 1000 cycles of the temperature cycle test (TCT), and the resistance value change rate was as low as 5%. No ion migration was observed even after 300 hours of the accelerated test (HAST), and the insulation resistance was 5 × 10 ¹¹ Ω.
It showed a high value. (Embodiment 2 of electronic component module) Film B was simultaneously laminated on both front and back surfaces of an insulating substrate made of glass fiber and epoxy resin by a vacuum laminator, and then a polyethylene terephthalate (PET) film was peeled off.
After a curing heat treatment at a temperature of 175 ° C. for 1 hour, a through-hole was formed with a carbon dioxide gas laser, and then the surface of the adhesive layer was roughened with potassium permanganate.

Then, after treatment with a palladium-based plating catalyst, electroless copper plating was performed, followed by wiring pattern processing with a dry film photoresist, and a 20 μm thick wiring conductor layer was formed by electrolytic copper plating. The peel strength of the obtained wiring conductor layer was 1.0 kg / cm, and heat treatment was performed at 175 ° C. for 2 hours to further stabilize the peel strength.

Next, the lamination of the film B and the formation of the wiring conductor layer and the through conductor by drilling, roughening treatment, and plating of the through hole are repeated a plurality of times to form the six adhesive layers and the wiring conductor layer on the insulating substrate. After that, nickel / gold plating was performed on the conductor pads processed with the solder resist, and further, solder bumps were formed.

After mounting the semiconductor element on the solder bumps of the wiring board thus obtained and passing it electrically through a reflow furnace, an underfill is injected into a gap between the semiconductor element and the wiring board for reliability testing. (Electronic component module B) was obtained.

Using this sample, a temperature cycle test (TCT) and an acceleration test (HAST) were performed as a reliability test in the same manner as in the electronic component module A, and the appearance and resistance value of the wiring board such as cracks, swelling and peeling were measured. Evaluation was made based on the value of the rate of change.

As a result, the electronic component module B of the present invention
No crack occurred even after 1000 cycles of the temperature cycle test (TCT), and the rate of change in the resistance value of the wiring conductor layer was as low as 6%.

Further, no ion migration occurred even after 300 hours of the accelerated test (HAST), and the insulation resistance showed a high value of 8 × 10 ¹⁰ Ω. (Comparative Example of Electronic Component Module) After simultaneously laminating a film C on both sides of an insulating substrate made of glass fiber and epoxy resin by a vacuum laminator, a polyethylene terephthalate (PET) film was peeled from the film C, and then 175 After curing and heat treatment at a temperature of 1 ° C. for 1 hour, a through hole is formed with a carbon dioxide gas laser, and then the surface of the adhesive layer is roughened with a potassium permanganate solution, and then treated with a palladium-based plating catalyst. Electrolytic copper plating was performed, wiring pattern processing was performed using a dry film photoresist, and a wiring conductor layer having a thickness of 18 μm was formed by electrolytic copper plating.

The peel strength of the obtained wiring conductor layer was 0.5 k.
g / cm, and after performing a heat treatment at 175 ° C. for 2 hours in order to stabilize the peel strength, laminating the film C and piercing / through-roughening / plating the wiring conductor layer by plating. Repeating the formation of the through conductor a plurality of times 6
After forming the adhesive layer and the wiring conductor layer on the insulating substrate, nickel / gold plating was performed on the pads subjected to the solder resist processing, and further, solder bumps were formed.

After the semiconductor element is mounted on the solder bumps of the wiring board and passed through a reflow furnace to be electrically connected, an underfill is injected into a gap between the semiconductor element and the wiring board for reliability testing. A sample (electronic component module C) was obtained.

Using this sample, as a reliability test, a temperature cycle test (TCT) and an acceleration test (HAST) were performed in the same manner as in the electronic component module A, and the appearance and resistance of the wiring board such as cracks, swelling and peeling were measured. Evaluation was made based on the value of the rate of change.

As a result, the electronic component module C of the comparative example
Cracks occur in 1000 cycles of the temperature cycle test (TCT) and 200 cycles in the accelerated test (HAST).
Ion migration occurs over time and insulation resistance is 1
× 10 ⁸ Ω.

[0094]

According to the adhesive of the present invention, since the epoxy resin mixture is composed of a polyfunctional epoxy resin and a bifunctional epoxy resin, the crosslink density of the adhesive can be increased, and as a result, the heat-induced resin Can be prevented from breaking molecules and infiltration of water into the resin, and an adhesive having excellent moisture resistance can be obtained. In addition, the weight average molecular weight is 10,000 to 5
Since it contains 00000 thermoplastic resins, it is possible to obtain an adhesive having good stretchability and excellent film moldability despite the increased crosslink density. Furthermore, since it contains an elastomer having a glass transition temperature of −60 to −20 ° C., the uncured film has excellent flexibility and is easy to handle, and the cured film maintains flexibility and maintains heat. The stress caused by the change can be absorbed. Furthermore, since the surface of the contained inorganic insulating filler was coated with a resin composed of any one of epoxy resin, acrylic resin, phenol resin or acrylonitrile-styrene resin, the solubility of the epoxy resin mixture forming the matrix of the adhesive layer was increased. The parameter value (sp value = 8 to 13) and the sp value of the resin coating the inorganic insulating filler are similar, and the molecular chain of the resin coating the inorganic insulating filler and the molecular chain of the epoxy resin mixture are satisfactorily entangled. As the two adhere firmly to each other, good adhesion between the inorganic insulating filler and the epoxy resin mixture can be achieved, and as a result, moisture can be transmitted along the interface between the epoxy resin mixture and the inorganic insulating filler. Etc. are not transmitted. Further, in the above configuration, the moisture permeability after curing was measured by the method specified in JIS-Z-0208 to be as low as 10 to 100 g / m ² , so that the moisture resistance to the accelerated test (HAST) was improved. Excellent adhesive can be obtained.

Further, according to the electronic component module of the present invention, since the electronic component is mounted on a wiring board formed by laminating an adhesive layer formed by using the above adhesive on an insulating substrate, heat resistance and An electronic component module having excellent moisture resistance can be obtained. Further, in the above configuration, the adhesive layer
5.5V voltage in an environment with a temperature of 130 ° C and a relative humidity of 85%
Since the insulation resistance after continuous application for 300 hours is 10 ¹⁰ Ω or more, it excels in heat history during mounting and thermal fatigue resistance against temperature cycle test (TCT) and moisture resistance such as accelerated test (HAST). An electronic component module having good reliability for a reliability test can be obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an essential part showing an example of an electronic component module when a semiconductor element is mounted as an electronic component on a wiring board using the adhesive of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Electronic component module 2 ... Wiring board 3 ... Electronic component (semiconductor element) 4 ... Insulating substrate 5 ... Adhesive Layer 6: wiring conductor layer 9: through hole 10: through conductor

Claims (4)

[Claims] 1. An epoxy resin mixture, 100 to 200
C., a curing agent whose reaction starts at a temperature of .degree. C., a thermoplastic resin having a weight average molecular weight of 10,000 to 500,000, an elastomer having a glass transition temperature of -60 to -20.degree. C., an epoxy resin, an acrylic resin, a phenol resin or acrylonitrile. An inorganic insulating filler having an average particle size of 0.1 to 2 μm having a resin coating layer of any of styrene resins, and a moisture permeability after curing is measured by a method specified in JIS-Z-0208. An adhesive of 10 to 100 g / m ² . 2. The epoxy resin mixture comprises 20 to 80% by weight of a polyfunctional epoxy resin and 20 to 80% by weight of a bifunctional epoxy resin.
80% by weight, and externally added to the epoxy resin mixture, wherein the curing agent is 2 to 10% by weight, the thermoplastic resin is 5 to 30% by weight, the elastomer is 10 to 40% by weight, 3-10 inorganic insulating filler
2. The adhesive according to claim 1, wherein the adhesive is added by weight%. 3. The adhesive according to claim 1, wherein the adhesive is in the form of a film. 4. An insulating substrate, an adhesive layer formed on the insulating substrate by using the adhesive according to claim 1, and each of the insulating substrate and the adhesive layer A wiring board comprising a plurality of wiring conductor layers formed on the surface and a through conductor formed inside a through hole formed in the adhesive layer and electrically connecting the plurality of wiring conductor layers is formed on a wiring board. An electronic component module having components mounted thereon,
The adhesive layer has an insulation resistance of 10 ¹⁰ Ω or more after continuously applying a voltage of 5.5 V for 300 hours in an environment at a temperature of 130 ° C. and a relative humidity of 85%. Component module.