JP2002057196A - プローブ方法及びプローブ装置 - Google Patents
プローブ方法及びプローブ装置Info
- Publication number
- JP2002057196A JP2002057196A JP2000238654A JP2000238654A JP2002057196A JP 2002057196 A JP2002057196 A JP 2002057196A JP 2000238654 A JP2000238654 A JP 2000238654A JP 2000238654 A JP2000238654 A JP 2000238654A JP 2002057196 A JP2002057196 A JP 2002057196A
- Authority
- JP
- Japan
- Prior art keywords
- stage
- inspected
- probing
- chip
- subject
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 234
- 238000000034 method Methods 0.000 title claims abstract description 80
- 238000012937 correction Methods 0.000 claims abstract description 41
- 238000012360 testing method Methods 0.000 claims description 110
- 238000007689 inspection Methods 0.000 claims description 101
- 238000006073 displacement reaction Methods 0.000 claims description 26
- 238000003384 imaging method Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 description 27
- 230000015572 biosynthetic process Effects 0.000 description 11
- 230000008602 contraction Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012491 analyte Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000238654A JP2002057196A (ja) | 2000-08-07 | 2000-08-07 | プローブ方法及びプローブ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000238654A JP2002057196A (ja) | 2000-08-07 | 2000-08-07 | プローブ方法及びプローブ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002057196A true JP2002057196A (ja) | 2002-02-22 |
| JP2002057196A5 JP2002057196A5 (enrdf_load_stackoverflow) | 2007-09-20 |
Family
ID=18730324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000238654A Pending JP2002057196A (ja) | 2000-08-07 | 2000-08-07 | プローブ方法及びプローブ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002057196A (enrdf_load_stackoverflow) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008522581A (ja) * | 2004-12-01 | 2008-06-26 | バイオ−ラッド ラボラトリーズ，インコーポレイティド | リニアステッパモーターによる対象物の正確な位置決めのための方法と装置 |
| JP2008311618A (ja) * | 2007-05-15 | 2008-12-25 | Tokyo Electron Ltd | プローブ装置 |
| JP2009147320A (ja) * | 2007-11-21 | 2009-07-02 | Horiba Ltd | 検査装置 |
| JP2010062237A (ja) * | 2008-09-02 | 2010-03-18 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
| KR101315563B1 (ko) | 2009-03-31 | 2013-10-08 | 도쿄엘렉트론가부시키가이샤 | 콘택트 파라미터의 설정 방법 및 콘택트 파라미터의 설정용 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체 |
| CN113030691A (zh) * | 2019-12-24 | 2021-06-25 | 芯恩（青岛）集成电路有限公司 | 芯片电性测试探针头对位方法、系统、存储介质及终端 |
| CN113086238A (zh) * | 2021-03-29 | 2021-07-09 | 中国航空制造技术研究院 | 一种基于基准孔孔位测量的自动制孔孔位在线修正方法 |
| CN115090917A (zh) * | 2022-08-25 | 2022-09-23 | 成都飞机工业（集团）有限责任公司 | 一种制孔方法、装置、存储介质及设备 |
| CN115902327A (zh) * | 2023-02-23 | 2023-04-04 | 长春光华微电子设备工程中心有限公司 | 一种探针台定位补偿的标定方法和探针台 |
| WO2023134168A1 (zh) * | 2022-01-14 | 2023-07-20 | 上海世禹精密机械有限公司 | 自动化焊球阵列封装植球检测系统 |
| CN118644412A (zh) * | 2024-07-02 | 2024-09-13 | 长春乙天科技有限公司 | 一种图像均衡的定标方法 |
-
2000
- 2000-08-07 JP JP2000238654A patent/JP2002057196A/ja active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008522581A (ja) * | 2004-12-01 | 2008-06-26 | バイオ−ラッド ラボラトリーズ，インコーポレイティド | リニアステッパモーターによる対象物の正確な位置決めのための方法と装置 |
| JP2008311618A (ja) * | 2007-05-15 | 2008-12-25 | Tokyo Electron Ltd | プローブ装置 |
| JP2009147320A (ja) * | 2007-11-21 | 2009-07-02 | Horiba Ltd | 検査装置 |
| JP2010062237A (ja) * | 2008-09-02 | 2010-03-18 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
| KR101315563B1 (ko) | 2009-03-31 | 2013-10-08 | 도쿄엘렉트론가부시키가이샤 | 콘택트 파라미터의 설정 방법 및 콘택트 파라미터의 설정용 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체 |
| CN113030691B (zh) * | 2019-12-24 | 2022-07-19 | 芯恩（青岛）集成电路有限公司 | 芯片电性测试探针头对位方法、系统、存储介质及终端 |
| CN113030691A (zh) * | 2019-12-24 | 2021-06-25 | 芯恩（青岛）集成电路有限公司 | 芯片电性测试探针头对位方法、系统、存储介质及终端 |
| CN113086238A (zh) * | 2021-03-29 | 2021-07-09 | 中国航空制造技术研究院 | 一种基于基准孔孔位测量的自动制孔孔位在线修正方法 |
| WO2023134168A1 (zh) * | 2022-01-14 | 2023-07-20 | 上海世禹精密机械有限公司 | 自动化焊球阵列封装植球检测系统 |
| CN115090917A (zh) * | 2022-08-25 | 2022-09-23 | 成都飞机工业（集团）有限责任公司 | 一种制孔方法、装置、存储介质及设备 |
| CN115090917B (zh) * | 2022-08-25 | 2023-01-10 | 成都飞机工业（集团）有限责任公司 | 一种制孔方法、装置、存储介质及设备 |
| CN115902327A (zh) * | 2023-02-23 | 2023-04-04 | 长春光华微电子设备工程中心有限公司 | 一种探针台定位补偿的标定方法和探针台 |
| CN118644412A (zh) * | 2024-07-02 | 2024-09-13 | 长春乙天科技有限公司 | 一种图像均衡的定标方法 |
| CN118644412B (zh) * | 2024-07-02 | 2025-04-04 | 长春乙天科技有限公司 | 一种图像均衡的定标方法 |
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Legal Events
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