JP2002050724A - Fixing cover of heat-radiating sheet for electric component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fixing cover of a heat-radiating sheet for an electrical component, by which the heat-radiating sheet has a large area making contact with the heat-producing electrical component and high radiating effect can be obtained. SOLUTION: The cover fixing structure of the heat-radiating sheet for the electrical component covers the electrical component 2 disposed on a substrate 5, so as to release heat generated by the electric component 2. Outward substantially L-shaped slits 3 are formed on the parts of the heat-radiating sheet, that correspond to four corners of the electrical component 2. When the heat- radiating sheet 1 covers the electrical component 2 and is fixed thereon, the slits 3 absorb a height of the body of the electrical component 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for covering and fixing a heat radiating sheet to an electric component, the heat radiating sheet being laid on an electric component disposed on a substrate to radiate heat generated from the electric component.

[0002]

2. Description of the Related Art Conventionally, as a structure for radiating heat generated from electric equipment provided on a substrate, for example, Japanese Utility Model Application Laid-Open No.
There is an integrated circuit heat radiating device described in Japanese Patent Application Laid-Open No. 111157. This is, as shown in FIGS. 4A, 4B and 4C,
The integrated circuit package 101 is mounted in the hole 103A provided in the mounting substrate 103, and the heat conductive sheets 104 and 105 are mounted on both the upper and lower surfaces of the integrated circuit package 101, respectively. Heat radiation plates 106 and 107 are attached to the outside.

However, in this case, the two heat conductive sheets 104 and 105 are mounted on the upper and lower surfaces of the integrated circuit package 101.
4 and 105 are not attached to the substrate 103, so that there is a problem that they are easily detached and attached in an unstable state. Further, since the heat conductive sheets 104 and 105 are only mounted on the upper surface and the lower surface of the integrated circuit package 101, heat generated from the left, right, front and rear side surfaces of the integrated circuit package 101 is generated by the heat conductive sheets 10 and 10.
There was a problem that heat could not be dissipated in 4, 105.

Further, Japanese Utility Model Publication No. 4-14937 discloses that
A heat dissipation sheet for a semiconductor device is described. As shown in FIGS. 5 (a), 5 (b), 5 (c), and 5 (d), this is an electrically insulating heat radiating sheet inserted between the semiconductor component 201 and the heat radiating member 202. A pressure-sensitive adhesive portion 232 for temporary fixing, which is made of a silicone rubber composition filled with a heat conductive material, and
Is provided. However, also in this case, the temporary fixing pressure-sensitive adhesive portion 232 of the heat radiating sheet 203 is merely attached to the semiconductor component 201, and the heat radiating sheet 203 is not attached to the heat radiating member 202. There was a problem that it was stuck in a proper state.
Further, since the heat radiation sheet 203 is in contact with only the bottom surface of the semiconductor component 201, there is a problem that the heat generated from the semiconductor component 201 cannot be sufficiently dissipated.

[0005]

DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned conventional problems, and provides a heat radiation sheet which can have a large area in close contact with the heat-generating electric parts of the heat radiation sheet and can obtain a high heat radiation effect. It is an object of the present invention to provide a coating fixing structure for an electric component.

[0006]

Means for Solving the Problems The present invention has been proposed to solve the above-mentioned problems, and the invention according to claim 1 is intended to cover an electric component disposed on a substrate. ,
In the covering and fixing structure of the heat radiating sheet to radiate heat generated from the electric component, the outward heat generating sheet is formed with outwardly substantially L-shaped slits at positions corresponding to four corners of the electric component, These slits absorb the height of the body of the electric component when the heat radiating sheet is put on and fixed to the electric component. The invention according to claim 2, wherein a linear slit is formed in the portion corresponding to the width direction edge of the electric component between the four substantially L-shaped slits in the longitudinal direction, and the heat dissipation sheet is formed. It is characterized in that these linear slits are arranged along both widthwise edges of the electric component when the cover is fixed to the electric component.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of a structure for fixing a heat radiation sheet to an electric component according to the present invention will be described.
This will be described with reference to the drawings. FIG. 1 shows a structure for fixing a heat radiation sheet to an electric component according to a first embodiment of the present invention.
(A) is a perspective view of the heat radiating sheet, (b) is a perspective view of a state in which the heat radiating sheet is covered with an electric component and is fixed to a substrate, and (c) is a plan view showing a state of attaching the heat radiating sheet to the substrate. FIG. 3D is a longitudinal sectional view thereof.

As shown in FIGS. 1 (a), 1 (b) and 1 (c), the structure for covering and fixing the heat radiating sheet to the electric components according to the first embodiment is provided at positions corresponding to the four corners of the electric component 2 in the heat radiating sheet 1. The slits 3, 3, 3, 3 having a substantially L-shaped orientation are formed. When the heat radiating sheet 1 is put on and fixed to the electric component 2, these slits 3, 3, 3, 3
, So that the height of the body of the electric component 2 is absorbed. As shown in FIGS. 1 (c) and 1 (d), the heat-radiating sheet 1 has a double-sided adhesive tape 4 stuck from the vicinity of the slits 3, 3, 3, 3 to the outer edge, and is placed on the electric component 2. Later, the double-sided adhesive tape 4 is used to adhere to the surface of the substrate 5.

According to the structure for fixing the heat radiating sheet to the electric component according to the first embodiment, as described above, the height of the electric component 2 is determined by the four slits 3, 3, 3, 3 formed in the heat radiating sheet 1. Is absorbed and fixed to the surface of the substrate 5 with the double-sided adhesive tape 4, so that the area of the heat radiation sheet 1 in close contact with the heat-generating electric components can be increased, and a high heat radiation effect can be obtained. Moreover, since only the slits 3, 3, 3, 3 are formed at four locations of the heat radiation sheet 1, an extremely simple configuration can be achieved.

FIG. 2 is a plan view of the heat radiation sheet in the structure for covering and fixing the heat radiation sheet of the second embodiment to the electric components. As shown in FIG. 2, the fixing structure of the heat radiating sheet to the electric component according to the second embodiment has a width of the electric component between four substantially L-shaped slits 3 formed in the heat radiating sheet 1. Linear slits 6, 6 are formed in the portion corresponding to the direction edge in the longitudinal direction. When the heat radiating sheet 1 is put on and fixed to the electric component 2, these linear slits 6, 6 are arranged along both edges in the width direction of the electric component 2.

According to the structure for fixing the heat radiating sheet to the electric component of the second embodiment, the heat radiating sheet 1 is closely attached to the upper surface of the electric component 2 by forming the linear slits 6 in the heat radiating sheet 1. In this state, the heat generated from the upper surface of the electric component 2 can be efficiently radiated.

FIG. 3 is an exploded perspective view showing a structure for fixing the heat radiation sheet of the third embodiment to electric components. Third
As shown in FIG. 3, the heat-radiating sheet of the embodiment has a coating and fixing structure on four corners of the heat-radiating sheet 1,
Locking pieces 8, 8, 8, 8 for engaging with the engaging holes 7, 7, 7, 7 formed at four places are formed, and a double-sided adhesive tape is provided at a plurality of places on the upper surface of the electric component 2. 9 is stuck. Then, when the heat radiating sheet 1 is covered with the electric component 2, the locking pieces 8, 8, 8, 8 at the four corners are engaged with the engaging holes 7, 7, 7, 7 formed at four places in the substrate, Heat dissipation sheet 1
The part corresponding to the upper surface of the electric component 2 in FIG.
To a plurality of double-sided pressure-sensitive adhesive tapes 9 on the upper surface.

According to the structure for covering and fixing the heat radiating sheet to the electric components according to the third embodiment, as described above, the locking pieces 8, 8, 8, 8 at the four corners of the heat radiating sheet 1 By engaging the holes 7, 7, 7, 7, the heat radiation sheet 1 can be fixed on the substrate 5 and prevented from peeling off, and furthermore, a plurality of double-sided adhesive tapes 9 on the upper surface of the electric component 2 can be prevented.
Since the heat radiation sheet 1 is stuck on the upper surface of the electric component 2,
The heat radiating sheet 1 can be adhered to the electric component, and the heat generated from the electric component 2 can be reliably radiated.

[0014]

As described above, according to the first aspect of the present invention, there is provided a heat radiating sheet which covers an electric component disposed on a substrate and radiates heat generated from the electric component. In the coating and fixing structure for the electric component, outwardly substantially L-shaped slits are respectively formed at positions corresponding to the four corners of the electric component on the heat radiation sheet, and when the heat radiation sheet is covered and fixed on the electric component, the electric component is formed by these slits. Since the configuration is such that the height of the body is absorbed, the following effects can be obtained. That is, since the height of the electric component is absorbed by the four slits formed in the heat radiation sheet and fixed to the surface of the substrate with the double-sided adhesive sheet,
The area of the heat radiating sheet in close contact with the heat-generating electric component can be increased, and a high heat radiating effect can be obtained. In addition, since only slits are formed at four places of the heat radiation sheet, an extremely simple configuration can be achieved.

According to a second aspect of the present invention, there is provided a heat dissipation sheet in which a linear slit is formed between four substantially L-shaped slits in a portion corresponding to a widthwise edge of an electric component in a longitudinal direction. When the cover is fixed on the electric component, these linear slits are configured to extend along both edges in the width direction of the electric component, so by forming the linear slits on the heat dissipation sheet, Since the heat radiation sheet is in contact with the upper surface of the electric component in a state of being in close contact therewith, the heat generated from the upper surface of the electric component can be efficiently radiated.

[Brief description of the drawings]

FIGS. 1A and 1B show a fixing structure of a heat radiating sheet to an electric component according to a first embodiment of the present invention. FIG. 1A is a perspective view of the heat radiating sheet, and FIG. (C) is a plan view showing a state in which the heat radiation sheet is adhered to a substrate, and (d) is a longitudinal sectional view thereof.

FIG. 2 is a plan view of a heat radiation sheet in a structure for covering and fixing an electric component of the heat radiation sheet according to a second embodiment.

FIG. 3 is an exploded perspective view showing a structure for fixing a heat radiation sheet to an electric component according to a third embodiment.

4A and 4B show a heat dissipation structure of a conventional integrated circuit, and FIG.
(B) and (c) are cross-sectional views of the respective examples.

5A and 5B show a conventional heat dissipation sheet for a semiconductor device, and FIG.
Is an external view thereof, (b) is an explanatory view showing a manufacturing process of the heat radiation sheet, (c) is an external view showing another example thereof, and (d) is a perspective view showing a part of the semiconductor device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 heat radiation sheet 2 electric component 3 substantially L-shaped slit 5 substrate 6 linear slit

Claims (2)

[Claims] 1. A coating and fixing structure for a heat radiating sheet, which is placed on an electric component disposed on a substrate and radiates heat generated from the electric component, to the electric component,
Outwardly substantially L-shaped slits are formed at locations corresponding to the four corners of the electric component on the heat dissipation sheet, respectively, and when the heat dissipation sheet is covered and fixed on the electric component, the height of the body of the electric component is determined by these slits. A structure for covering and fixing the heat radiating sheet to the electric component, wherein the structure is configured to absorb the heat. 2. A linear slit is formed between the four substantially L-shaped slits at a portion corresponding to a widthwise edge of the electric component in a longitudinal direction, and the heat dissipation sheet is formed on the electric component. The structure for covering and fixing a heat-radiating sheet to an electric component according to claim 1, wherein, when the cover is fixed, the linear slits are arranged along both widthwise edges of the electric component.