JP2002043334A - Frame feeder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a frame feeder which can take out a lead frame surely from a frame packet and can feed the lead frame to the opposite machine. SOLUTION: In a frame feeder 100 for feeding only the lead frame 118 in a frame packet 102 constituted by clamping the lead frame 118 between upper and lower plates 114, 116 to the opposite machine, the frame packet 102 is mounted on a mounting table 120, the upper plate 114 is pushed upward by means of a pusher and removed while being clamped by a clamp mechanism 124. Furthermore, the clamp mechanism 124 is provided with a downward protrusion 156 which descends to urge the lead frame 118 downward and the mounting table 120 is provided with a movable retaining mechanism 136 projectable to the vicinity of the upper surface and the edge 118a of the lead frame 118.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a frame packet in which a lead frame is sandwiched between a lower plate and an upper plate.
The present invention relates to a frame supply device that supplies only a lead frame to a partner machine such as a resin sealing device.

[0002]

2. Description of the Related Art Conventionally, a frame supply device for supplying a lead frame to a resin sealing device accommodates a plurality of lead frames in a stacked state in a magazine by inserting an intermediate paper therebetween, and sequentially leads the lead frames from there. Only take out and supply. Here, the lead frame includes the concept of a substrate made of resin in addition to a lead frame made of iron, copper, and stainless steel.

[0003] Referring to FIG. 13, this type of frame supply device 28 will be described.

[0004] This frame supply device 28 is a magazine 5
4, an elevator 57 that pushes up the lead frames 55 stored in a stacked state, a pickup mechanism 64 that takes out the uppermost lead frame 55 pushed up by the elevator 57, and a lead conveyed by the pickup mechanism 64. Conveyor 70 that conveys frame 55 and directly supplies it to resin sealing device (not shown)
And.

The elevator 57 has a pair of vertical guide shafts 60, a ball screw shaft 61 disposed in the same direction between the guide shafts 60, and is guided by the guide shafts 60 and screwed with the ball screw shafts 61. And a push-up plate 62 which can be moved up and down. The push-up plate 62 supports the lowermost lead frame 55 in the magazine 54 from below.

The pickup mechanism 59 includes a suction plate 63 on which a plurality of suction pads 63a for sucking the lead frame 55 are provided, and a horizontal drive unit 64 for supporting the suction plate 63 so as to be able to move horizontally (laterally). The suction plate 63 is vertically moved (elevated and lowered) via the horizontal moving unit 64.
And an upper and lower drive unit 65 that is freely supported.

Next, the operation of the frame supply device 28 will be described.

First, the ball screw shaft 61 is rotated by the driving of the elevator 57, and the push-up plate 62 is moved to the lead frame 5.
Push up 5 step by step. The top lead frame 55
When the pickup reaches the upper end of the magazine 54, the pickup mechanism 5
By the drive of No. 9, the suction plate 63 is moved above the magazine 54, and is further lowered to suck and hold the uppermost lead frame 55. The suction plate 63 once rises and moves laterally, and places the lead frame 55 on the conveyor 70. The transport conveyor 70 transports and supplies the lead frame 55 to a resin sealing device (a counterpart machine for the frame supply device 28). Thereafter, by repeating this flow, the lead frames are sequentially supplied one by one to the resin sealing device.

[0009]

In recent years, the number of pins in a lead frame has increased and the lead itself has become thinner, and the lead frame has been further reduced in thickness. For this reason, when the lead frame 55 is housed in the magazine 54 with the lead frame 55 naked and taken out directly by the suction plate 63 as in the above-described conventional example, the lead may be damaged or the lead frame may be broken. . Further, since the lead frame is formed in the shape of a film, it is very difficult to handle the lead frame.

Therefore, as shown in FIG. 14, the lead frame 55 is connected to the lower plate 80 and the upper plate 82.
There is a proposal that the frame packet 84 is held as a whole and handled as a frame packet 84 having high rigidity as a whole.
In this way, the frame packet 84 in the magazine
Can be prevented from contacting each other even when the lead frames 55 are stacked.

In addition, when the lead frame is not handled by a suction mechanism such as a suction plate when the lead frame is taken out from the magazine,
By gripping the lower plate 80 or the upper plate 82,
These can be extruded by an extrusion mechanism or the like, so that the frame packet 84 can be taken out of the magazine.

While having such an advantage, only the lead frame 55 has to be supplied to a counterpart machine such as a resin sealing device. Therefore, an operation of removing the lower plate 80 and the upper plate 82 is indispensable in a process before supplying the lead frame to the partner machine.
However, to the present inventor's knowledge, the lower plate 80 and the upper plate 82 have been removed,
There is no frame supply device capable of reliably supplying the resin sealing device. This is because the (thinned) lead frame 55 and the plates 80 and 82 are intricately entangled with obstacles such as electrostatic attraction and the lead frame 55 itself is soft and easily deformed, so that the plate can be easily attached. This is because it is not possible to remove and reliably supply only the lead frame 55. or,
When the upper plate 82 is removed from the lead frame 55, the lead frame 55 is warped up due to its thinness. If the lead plate 55 is taken out by the suction plate in this state, the lead frame 55 may be damaged.

The inventor of the present invention has been made in view of the above problems, and realizes handling of a lead frame as a frame packet by reliably removing a plate and reliably supplying only a lead frame to a partner machine. It is intended to be.

[0014]

SUMMARY OF THE INVENTION According to the present invention, there is provided a frame supplying apparatus for removing an upper plate in a frame packet formed by sandwiching a lead frame between a lower plate and an upper plate, and supplying only the lead frame to a counterpart machine. In the apparatus, a mounting table on which the frame packet is mounted, a pusher provided on the mounting table to push the upper plate upward, and disposed to be able to move up and down above the mounting table, and to be lowered A clamping mechanism that clamps the upper plate and removes the upper plate by lifting the upper plate, wherein the clamping mechanism is moved down together with the main body side to urge the lead frame downward, and A lower projection for separating the upper plate from the upper plate is provided, and the placing table is provided on the placing table by the lower projection. A movable holding mechanism is provided on the upper surface and near the edge of the lead frame which is urged downward, and even after the holding mechanism holds the upper plate and rises, the movable holding mechanism holds the lead frame. The above object is achieved by suppressing warping.

According to this frame supply device, the upper plate that is in close contact with the lead frame is once lifted by the pusher, and only the upper plate is clamped by the clamping mechanism during that time. At this time, the lead frame may be lifted following the upper plate due to static electricity or the like, and may be pinched at the same time as the upper plate. However, the lead frame is provided in the lowering (or already lowered) holding mechanism. The lead frame is pushed down by the lower projection to be separated from the upper plate.
That is, this is an extremely rational configuration in which the lead frame is separated using the holding operation of descending.

When the lower projection rises integrally with the holding mechanism (main body side), the lower urging force against the lead frame is released. However, while the lower projection is urging the lead frame downward, Since the edge of the lead frame is held by the movable holding mechanism on the mounting table side, the posture of the lead frame is stabilized even after the urging force is released.

In particular, a thinned lead frame tends to "warp" at its edge, and once bent and curved, the posture becomes very unstable. In this case, for example, the lead frame is sucked and
When transporting, the suction cannot be performed reliably or the suction attitude is disturbed.

However, in the present frame supply device, the problem of "warping" is prevented from occurring at least while the lead frame is being pressed by the movable pressing mechanism. (Resin sealing device). This is because the lower projection of the clamping mechanism and the movable holding mechanism
It can be said that this is the result of working together under extremely rational ideas.

In particular, the movable holding mechanism is provided on the placing table so as to be swingable in a horizontal direction, and is movable from the outside with respect to an upper surface and an edge of the lead frame. And a driving device for swinging the arm.

With this configuration, the edge of the lead frame can be reliably held down with a simple configuration.

An opening is formed in the upper plate of the frame packet so that the lower protrusion of the holding mechanism can pass therethrough, and the lower protrusion urges the lead frame downward through the opening. Is preferable.

In this way, the upper plate can reliably protect the periphery of the lead frame and the like, and can easily separate itself (the upper plate) from the lead frame by using the lower projection. Become. Also, by forming this opening at an appropriate position, the contact area between the upper plate and the lead frame can be reduced, which leads to a reduction in unnecessary contact with the lead frame. The number, shape, arrangement, and the like of the openings are not limited at all.

[0023]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows the overall configuration of a frame transport / supply system 90 in which a frame supply device 100 according to an embodiment of the present invention is incorporated.

The frame transport / supply system 90 includes a magazine 10 in which the frame packets 102 are stacked.
4, a frame extracting device 108 for extruding and extracting the frame packet 102 by an extruding device 106 (a whole illustration is omitted), and the extracted frame packet 102 is placed and rotated 180 degrees in the horizontal direction to rotate the frame packet. A turntable mechanism 110 for exchanging the front end and the rear end of the turntable 102;
And a frame supply device 100 that takes in the frame packet 102 drawn forward by the drawer arm 112 included in the frame supply device 100 and supplies only the lead frame to a resin sealing device (not shown). Since the frame take-out mechanism 108 and the turntable mechanism 110 are not directly related to the present invention, detailed description thereof will be omitted.

The frame packet 102 includes an upper plate 114 and a lower plate 116, and a lead frame 118 sandwiched between the plates 114 and 116, as shown in an enlarged view in FIG. Both ends 1 extending in the longitudinal direction X of the lead frame 118
In the vicinity of 18a, an engaging hole 118b has an edge 118a.
Along with a pin 116b formed on the lower plate 116. this is,
This is to prevent the lead frame 118 and the lower plate 116 from shifting from each other in the horizontal direction.

The lower plate 116 is used for the lead frame 1.
The pusher opening 116c is formed in the vicinity of both end edges 116a extending in the width direction Y by the region S longer than the area S by 18. The pusher opening 116c will be described later in detail. Do). The lower plate 11
A plurality of windows 116d are formed in the central region of No. 6 in order to prevent the lead frame 118 from being damaged by reducing the contact area with the lead frame 118.

The upper plate 114 is a lower plate 116
A plurality of openings 114a are formed so that the members remain in a lattice shape. this is,
It has the function of reducing the contact area with the lead frame 118, but is also used for penetrating the lower projection of the holding mechanism (details will be described later). In the same manner as the lead frame 118, a plurality of engagement holes 114c are formed near both ends 114b of the upper plate 114 extending in the longitudinal direction X.
And the pin 116b. The upper and lower plates 114 and 116 are made of metal members, but may be made of resin such as plastic or other materials.

Returning to FIG. 1, the frame supply device 100
A mounting table 120 on which the frame packet 102 pulled out from the turntable mechanism 110 is mounted;
A pusher mechanism 134 provided below the mounting table 120 and pushing up only the upper plate 114 of the frame packet 102;
The upper plate 1 is arranged to be able to move up and down,
14 and further raised in the sandwiched state to raise the upper plate 1
And a holding mechanism 124 that removes 14.

The holding mechanism 124 is provided with an X (not shown).
-The robot is horizontally movable by a Y robot,
The removed upper plate 114 is loaded and accumulated in the upper plate stocker 126. Above the mounting table 120, a suction conveyance device 130 is movably provided. Only the lead frame 118 is suctioned and taken out and supplied to the resin sealing device. In addition, the holding mechanism 124 is the lower plate 1
16 can also be clamped, and only the lead frame 118 is taken out, and the lower plate 116 left on the mounting table 120 is clamped and carried out, and the lower plate stocker 1 is removed.
28 and stored.

Next, the holding mechanism 124 and the placing table 1
A detailed configuration such as 20 will be described.

As shown in the top view of FIG. 3 and the cross-sectional view of FIG. 4, the mounting table 120 includes a table 132 on which the (two) frame packets 102 are mounted, and a table 132 below the table 132. Pusher mechanism 134,
A movable holding mechanism 136 installed on the table 102,
Is provided.

In the table 132, the frame packet 102 carried in the direction of arrow A is inserted and positioned.
One recess 138 is formed. The recess 138 is formed with a first step 138 a having the same size as the contour of the lower plate 116 in the frame packet 102, and is formed below the first step 138 a and smaller than the first step 138 a. A second step 138b, and a space is formed below the second step 138b with the frame packet 102 positioned on the first step 138a. The table 132 is formed with a notch recess 138c so as to be continuous with the second step portion 138b, and a holding pair of a holding mechanism 120 (described later) is connected to the lower surface of the lower plate 116 via the notch recess 138c. A pusher mechanism 134 disposed below a table 132 that can be inserted into the pusher needle 140 and a pusher needle 140 projecting upward and supporting the lower part of the pusher needle 140 to reciprocate the pusher needle 140 in the vertical direction. Cylinder 142
And. When the pusher needle 140 is in the lower state (pulled state), the tip 140a of the pusher needle 140 is separated from the table 132, and when the pusher needle 140 is in the upper state (projected state), the tip 140a passes through the opening 138d of the table 132. And protrudes above the table 132.

The movable holding mechanism 136 includes a table 132
Arm 1 that is provided on the upper surface of the robot so as to be swingable in the horizontal direction.
44, and a rotary actuator 146 for swinging the movable arm 144. Therefore, the movable arm 14
4 are both end edges 11 on the upper surface of the lead frame 118;
With respect to the vicinity of 8a, it can move forward and backward from outside.

Next, the holding mechanism 124 will be described in detail.

As shown in FIGS. 5 to 8, the holding mechanism 1
Reference numeral 24 denotes a base 14 that is movable in the horizontal direction and that can be moved up and down.
8, a first holding pair 150 provided below the base 148 and capable of holding the upper plate 114 of the frame packet 102, and similarly provided below the base 148,
A second holding pair 152 capable of holding the lower plate 116,
5 is provided below the base 148, and when the base 148 is lowered, the concave portion 138 (2 in FIG.
A stopper 154 that abuts with the base frame 148 and abuts on the base frame 148 to urge the lead frame 118 downward. And a lower protrusion 156 that separates them.

The first and second holding pairs 150 and 152 can be opened and closed by driving a cylinder or the like (see dotted lines).
The upper and lower plates 114 and 116 can be held and opened. The second holding pair 152 is located below the first holding pair 150.

As shown in FIG. 5, the lower protrusion 156 is provided in the longitudinal direction X with respect to one frame packet 102.
6 are arranged at equal intervals on each of the lower projections 15.
7, three protruding ends 156a are formed to be branched in the width direction Y on the lower side as shown in FIG. Each of the protruding ends 156a is connected to the opening 114 of the upper plate shown in FIG.
By penetrating a part of c (see FIG. 2: region P), only the lead frame 118 can be urged downward.

Next, the operation of the frame supply device 100 will be described focusing on the operation of the holding mechanism 124 and the mounting table 120.

As shown in FIG. 9, the placing table 12
0 (table 138 at) in the frame packet 10
When 2 is placed, as shown in FIG. 10, the holding mechanism 124 moves above the placement table 120 and further descends. At this time, the first clamping pair 150 and the second clamping pair 152
Are both in the “open” state, and the frame packet 10
It does not collide with 2.

After the holding mechanism 124 is positioned using the stopper 154 (not shown), as shown in FIG. 11, the pusher needle 140 of the pusher mechanism 134 is raised, and the pusher opening 116c of the lower plate 116 is moved.
And only the upper plate 114 is pushed up. At this time, the lead frame 118 also attempts to follow the upper plate 114 due to static electricity or the like, but since the lead frame 118 is urged downward by the lower protrusion 156 (it can be considered that the lead frame 118 is supported from above. A), and is separated from the upper plate 114.

While the lead frame 118 is being urged by the lower protrusion 156, that is, before the holding mechanism 124 is raised, the movable arm 144 of the movable holding mechanism 136 rotates, and the upper surface and both ends of the lead frame 118 are rotated. The lead frame 118 extends near the edge 118a to hold the lead frame 118. Accordingly, even when the holding mechanism 124 is lifted to remove the upper plate 114 later, the warp or the like of the lead frame 114 is suppressed by the movable holding mechanism 136 (movable arm 144).

Thereafter, although not particularly shown, the suction transfer device 1
30 moves above the mounting table 120, takes out only the lead frame 118 by a suction pad or the like, and carries it out to a partner machine such as a resin sealing device.

After the lead frame 118 is carried out,
As shown in FIG. 12, the holding mechanism 124 moves again above the mounting table 120 and further descends. The second holding pair 152 is formed with the notch recess 13 formed in the table 132.
8c, it is inserted into the back side (lower side) of the lower plate 116, and the upper plate 116 is sandwiched and carried out.

By repeating the above steps, only the lead frame 118 in the frame packet 102 is sequentially supplied to the partner machine.

According to the frame supply device 100, when the upper plate 114 is lifted by the pusher, the lead frame 118 is separated from the upper plate 114. Therefore, even when the lead frame is attracted to the upper plate due to static electricity or the like, both can be reliably separated.

This is because the lead frame 118 is urged by the lower protrusion 156 by rationally utilizing the "down operation" which is an essential operation of the holding mechanism 124.

Further, before the lower protrusion is raised integrally with the holding mechanism (main body side) 124, the lead frame 11 is moved by the movable holding mechanism 136 on the mounting table 120 side.
The edge of 8 is suppressed. Since the posture of the lead frame 118 is extremely stable even during the unloading operation of the holding mechanism 124, as a result, as described above,
By using 0 or the like, only the lead frame 118 can be reliably carried out. In particular, the lead frame 118, which has been reduced in thickness, is liable to "warp" at its edge, and once warped up and bent, the posture becomes very unstable. You. This is a result of cooperating the lower protrusion 156 of the holding mechanism 124 and the movable holding mechanism 136 under an extremely rational concept.

Further, since the lower projection 156 urges the lead frame 118 downward by utilizing the opening 114a formed in the upper plate 114, the upper plate 114 securely covers the periphery of the lead frame 118 and the like. The lead frame 118 can be separated easily with a simple structure while being protected. Further, since the area of contact with the lead frame 118 is reduced by the opening 114a, damage to the lead frame 118 is prevented.

Although the frame supply apparatus 100 according to the present embodiment has been described only in the case where two frame packets 102 are handled as one set, the present invention is not limited to this, and only one frame packet 102 is used. It may be handled or three or more frame packets may be handled simultaneously. Further, the configuration of the movable holding mechanism 136 is not limited to the present embodiment, and the lead frame 118
Any structure may be used as long as it protrudes from the outside to the edge and is pressed down. Further, the movable holding mechanism 136
The position to be held down may be appropriately set in consideration of the warpage of the lead frame 118 and the like, and an edge along the width direction other than the edge in the longitudinal direction may be pressed.

Further, the relationship between the timing of pushing up the pusher mechanism 134 and the timing of lowering the holding mechanism 124 is not limited to the present embodiment. That is, the pusher mechanism 1
The holding mechanism 124 may be lowered “after” the upper plate 114 is pushed up at 34, or may be operated “simultaneously”.

Although one embodiment has been described here,
There are various embodiments other than the embodiment shown here without departing from the gist of the present invention. The descriptions (functions / shapes) of the members appearing in the entire text of the specification are merely examples, and the present invention is not limited to these descriptions.

[0053]

According to the present invention, when a lead frame is handled as a frame packet, only the lead frame can be reliably taken out and supplied.

[Brief description of the drawings]

FIG. 1 is an overall perspective view showing a frame transport / supply system to which a frame supply device according to an embodiment of the present invention is applied.

FIG. 2 is an exploded perspective view showing a configuration of a frame packet used in the frame supply device.

FIG. 3 is an enlarged top view showing a mounting table in the frame supply device.

FIG. 4 is a sectional view taken along line IV-IV of FIG. 3;

FIG. 5 is an enlarged front view showing a holding mechanism in the frame supply device.

6 is a sectional view taken along line VI-VI of FIG.

FIG. 7 is a sectional view taken along line VII-VII of FIG. 5;

8 is a sectional view taken along the line VIII-VIII in FIG.

FIG. 9 is an enlarged sectional view showing a lead frame supply operation (NO. 1) in the frame supply device.

FIG. 10 is an enlarged sectional view showing a lead frame supply operation (NO. 2) in the frame supply device.

FIG. 11 is an enlarged sectional view showing a lead frame supply operation (NO. 3) in the frame supply device.

FIG. 12 is an enlarged sectional view showing a lead frame supply operation (NO. 4) in the frame supply device.

FIG. 13 is an overall perspective view showing a flow of supplying a conventional lead frame.

FIG. 14 is a conceptual diagram showing a frame packet type lead frame.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 100 ... Frame supply apparatus 102 ... Frame packet 114 ... Upper plate 116 ... Lower plate 118 ... Lead frame 118a ... Edge 120 ... Mounting table 124 ... Holding mechanism 132 ... Table 134 ... Pusher mechanism 156 ... Lower projection

Claims (3)

[Claims] 1. A frame supply device for removing an upper plate from a frame packet formed by sandwiching a lead frame between a lower plate and an upper plate, and supplying only the lead frame to a counterpart machine, wherein the frame packet is mounted. A placing table to be placed, a pusher provided on the placing table to push up the upper plate, and a pusher arranged to be able to move up and down above the placing table, to descend and clamp the upper plate; A holding mechanism for lifting the upper plate to remove the upper plate, wherein the holding mechanism is moved downward together with the main body to urge the lead frame downward to separate the lead frame from the upper plate. A projection is provided, and the placing table is urged downward by the downward projection. A movable holding mechanism is provided on the upper surface of the lead frame and in the vicinity of the edge thereof, and the warp of the lead frame is suppressed by the movable holding mechanism even after the holding mechanism holds the upper plate and rises. A frame supply device. 2. The movable holding mechanism according to claim 1, wherein the movable holding mechanism is provided on the mounting table so as to be swingable in a horizontal direction, and is movable from the outside with respect to an upper surface and an edge of the lead frame. A frame supply device comprising: an arm; and a drive device for swinging the movable arm. 3. The frame according to claim 1, wherein the upper plate in the frame packet includes:
An opening through which the lower protrusion of the holding mechanism can pass is formed, and the lower protrusion urges the lead frame downward through the opening.