JP2002043265A - Semiconductor wafer cleaning method and apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a semiconductor wafer cleaning apparatus which can prevent entry of a cleaning liquid into a semiconductor wafer. SOLUTION: The semiconductor wafer cleaning apparatus comprises a cleaning liquid supply means 15 to supply the cleaning liquid to the external circumference of the semiconductor wafer 14, a gas supply means 16 which is formed near the cleaning liquid supply means 15 to remove the cleaning liquid from a region a little wider than the external circumference the semiconductor wafer 4 to which the cleaning liquid is supplied, and a control means 19 to control the gas supply means 16 in order to immediately remove the cleaning liquid after the cleaning liquid is supplied with the cleaning liquid supply means 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer cleaning method and a semiconductor wafer cleaning apparatus for cleaning an outer peripheral portion of a semiconductor wafer, and more particularly to a semiconductor wafer cleaning device capable of reliably cleaning only the outer peripheral portion of a semiconductor wafer. It is.

[0002]

2. Description of the Related Art A semiconductor wafer is formed by repeating a process of forming a diffusion layer on a silicon substrate wafer, forming a conductive film to form a pattern, and forming an insulating film in a number of steps. It is created on a wafer.
And, as the performance of the semiconductor element becomes higher, W, Co,
In many cases, metal-based materials such as Cu are used on semiconductor wafers.

When the surface of a semiconductor wafer is cleaned after using these metal-based materials on a semiconductor wafer, the cleaning method most often used conventionally is a cleaning method called RCA cleaning. However, when this RCA cleaning method is used, the metal is eluted depending on the kind of the above-mentioned metallic material, causing fatal damage to patterns such as wirings and plugs formed on the wafer, and reducing the yield of the resulting chip. Lower it. Further, in some cases, the eluted metal-based material may cause secondary contamination and tertiary contamination, and may even lower the yield of other chips.

Therefore, a method of supplying a cleaning liquid only to the outer peripheral portion of a semiconductor wafer and performing a cleaning process is disclosed in, for example, Japanese Patent Laid-Open No.
No. 4825 has proposed this. FIG. 6 is a diagram showing a configuration of a conventional semiconductor wafer cleaning apparatus. First, the cleaning liquid from the cleaning liquid tank 1 is formed in the deaeration unit 2 provided in the container 7, passes through the hollow tube 3 connected to the vacuum pump 8, and passes through the wafer 4 placed on the spinner 5. Is supplied to the upper nozzle 6 located near the peripheral surface of the wafer and the back nozzle 9 located on the back side of the wafer. The cleaning liquid supplied by the upper nozzle 6 and the back nozzle 9 is controlled and supplied by air operated valves 10 and 11. Cleaning is performed by spraying a cleaning liquid while rotating the semiconductor wafer 4 with the spinner 5.

[0005]

In the conventional method for cleaning a semiconductor wafer, the cleaning of the peripheral portion of the semiconductor wafer is performed only by spraying the cleaning liquid to the outer peripheral portion. However, there is a problem that the cleaning liquid may remain in the semiconductor wafer, and the cleaning liquid enters the inner peripheral side of the semiconductor wafer and causes a defect of the semiconductor wafer.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and a semiconductor which can reliably clean only the outer peripheral side of a semiconductor wafer without a cleaning liquid entering the inner peripheral side of the semiconductor wafer. An object of the present invention is to provide a method for cleaning a wafer and a semiconductor wafer cleaning apparatus.

[0007]

Means for Solving the Problems Claim 1 according to the present invention.
In the method of cleaning a semiconductor wafer described above, the cleaning liquid is removed from a peripheral area of the semiconductor wafer by a removing unit immediately after the cleaning liquid is applied from a cleaning liquid supply unit to an area slightly larger than a region where the cleaning liquid is applied.

According to a second aspect of the present invention, there is provided a method of cleaning a semiconductor wafer according to the first aspect, wherein the removing means removes the cleaning liquid by radially outwardly reacting the semiconductor wafer with the semiconductor wafer. The cleaning is performed by spraying a gas having no gas on the cleaning liquid from the gas supply means, and / or by suctioning the cleaning liquid from the outermost peripheral portion of the semiconductor wafer by the suction means.

According to a third aspect of the present invention, there is provided a method for cleaning a semiconductor wafer according to the second aspect, wherein the cleaning liquid supply means and the removing means are operated in a state of orbiting the outer peripheral portion of the semiconductor wafer during cleaning and removal. Is what you do.

A semiconductor wafer cleaning method according to a fourth aspect of the present invention is the method according to the third aspect, wherein the semiconductor wafer is rotated while the surface of the semiconductor wafer is horizontal and the center axis is vertical.

A semiconductor wafer cleaning method according to a fifth aspect of the present invention is the method according to the third aspect, wherein the method is performed while rotating the semiconductor wafer with the surface thereof being vertical and the central axis being horizontal.
The supply of the cleaning liquid by the cleaning liquid supply means is performed at the lower end of the semiconductor wafer in a vertical state.

According to a sixth aspect of the present invention, there is provided a semiconductor wafer cleaning apparatus for supplying a cleaning liquid to an outer peripheral portion of a semiconductor wafer, and a cleaning liquid formed in the vicinity of the cleaning liquid supplying device for cleaning an outer peripheral portion of the semiconductor wafer. Removing means for removing the cleaning liquid for an area slightly larger than the area to which the cleaning liquid is supplied, and control means for controlling the removing means so that the cleaning liquid is removed immediately after the cleaning liquid is supplied by the cleaning liquid supply means. It is provided.

According to a seventh aspect of the present invention, there is provided the semiconductor wafer cleaning apparatus according to the sixth aspect, wherein the removing means blows a gas having no reactivity with the semiconductor wafer to the cleaning liquid radially outward of the semiconductor wafer. The supply means and / or suction means for sucking the cleaning liquid from the outermost peripheral portion of the semiconductor wafer.

According to an eighth aspect of the present invention, there is provided a semiconductor wafer cleaning apparatus according to the sixth or seventh aspect, wherein the cleaning liquid supply means and the removal means are operated in a state of orbiting the outer periphery of the semiconductor wafer. It is provided with moving means.

According to a ninth aspect of the present invention, in the semiconductor wafer cleaning apparatus of the eighth aspect, the moving means rotates the semiconductor wafer while keeping the surface of the semiconductor wafer horizontal and the center axis of the semiconductor wafer being vertical. is there.

According to a tenth aspect of the present invention, in the semiconductor wafer cleaning apparatus according to the eighth aspect, the moving means holds the surface of the semiconductor wafer vertically, rotates the semiconductor wafer with the center axis of the semiconductor wafer horizontal, and rotates the semiconductor wafer. The supply means supplies the cleaning liquid at the lower end of the vertical semiconductor wafer.

According to an eleventh aspect of the present invention, there is provided a semiconductor wafer cleaning apparatus according to any one of the sixth to tenth aspects, wherein the cleaning liquid supply means includes a holder containing a cleaning liquid. The cleaning liquid is supplied to the outer peripheral portion of the semiconductor wafer while sandwiching the outer peripheral portion of the semiconductor wafer.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, embodiments of the present invention will be described. FIG. 1 is a diagram showing a configuration of a semiconductor wafer cleaning apparatus according to a first embodiment of the present invention, and FIG. 2 is a schematic diagram for explaining a semiconductor wafer cleaning method according to the first embodiment of the present invention. In the figure, reference numeral 12 denotes a cleaning liquid tank in which a cleaning liquid is stored;
Is a cleaning liquid nozzle for supplying the cleaning liquid in the cleaning liquid tank 12 to the outer peripheral portions of the front and back surfaces of the semiconductor wafer 14, respectively. The cleaning liquid tank 12 and the cleaning liquid nozzle 13 constitute a cleaning liquid supply means 15.

A gas supply means 16 is formed near the cleaning liquid nozzle 13 and serves as a removing means for removing the cleaning liquid from an outer peripheral portion of the semiconductor wafer 14 in an area slightly larger than the area to which the cleaning liquid is supplied. The gas nozzle 17 blows a gas having no reactivity with the semiconductor wafer 14 to the outside in the radial direction of the semiconductor wafer 14, and the gas tank 18 stores the gas supplied to the gas nozzle 17. The gas used here may be a dry gas such as an inert gas such as nitrogen or argon.

At this time, the gas nozzle 17 is provided slightly inside the semiconductor wafer 14 from the cleaning liquid nozzle 13 in order to target the area for removing the cleaning liquid to be a slightly larger area than the area to which the cleaning liquid is supplied. The gas nozzle 17
Is the cleaning liquid nozzle 1 on the front and back surfaces of the semiconductor wafer 14
3 are provided in the vicinity.

Reference numeral 19 denotes control means connected to the cleaning liquid supply means 15 and the gas supply means 16 via, for example, a valve or the like. The control means 19 controls the supply of the cleaning liquid from the cleaning liquid supply means 15 by, for example, opening and closing a valve. The gas supply means 16 is controlled by, for example, opening and closing a valve so that the cleaning liquid is removed immediately after the means 15 supplies the cleaning liquid to the semiconductor wafer 14. Reference numeral 20 denotes moving means for operating the cleaning liquid nozzle 13 and the gas nozzle 17 in a state of rotating around the outer peripheral portion of the semiconductor wafer 14. Here, the surface of the semiconductor wafer 14 is horizontally held, and the center axis of the semiconductor wafer 14 is It consists of rotating means to rotate as vertical.

Next, the first embodiment configured as described above
A method for cleaning a semiconductor wafer using the semiconductor wafer cleaning apparatus described above will be described. First, the semiconductor wafer 14 is placed on the rotating means 20 with the surface horizontal, and the rotating means 20 rotates the semiconductor wafer 14 with the center axis of the semiconductor wafer 14 being vertical.
Next, the cleaning liquid is supplied from the cleaning liquid nozzle 13 to the outer peripheral portion of the semiconductor wafer 14 by the control means 19.

Immediately after the cleaning liquid is supplied to the semiconductor wafer 14, the control means 19 operates the gas supply means 16 to radiate the gas radially outward so as to cover an area slightly larger than the area to which the cleaning liquid is supplied. The spray cleaning liquid is removed (see FIG. 2). Then, while the semiconductor wafer 14 is being rotated, the above-described cleaning is continuously performed on the entire outer periphery of the semiconductor wafer 14. Note that cleaning includes removal of organic substances, metals, and the like, removal of foreign substances, and the like.

If the above-described semiconductor wafer cleaning method is performed using the semiconductor wafer cleaning apparatus of the first embodiment configured as described above, the cleaning liquid supplied to the outer peripheral portion of the semiconductor wafer is immediately removed after the supply. Therefore, it is possible to reliably prevent the cleaning liquid from entering the inner peripheral side of the semiconductor wafer, and to prevent the quality of the semiconductor wafer from deteriorating.

In the first embodiment, an example in which the cleaning liquid is supplied to both the front surface and the rear surface of the semiconductor wafer has been described. However, the present invention is not limited to this, and an example in which the cleaning liquid is supplied only to the front surface of the semiconductor wafer can be considered. However, even if the cleaning liquid is supplied only to the front surface of the semiconductor wafer, the cleaning liquid flows from the front side to the rear side at the outer peripheral portion of the semiconductor wafer.

Embodiment 2 FIG. In the first embodiment, the example in which the removing means is formed by the gas supply means has been described. However, the present invention is not limited to this, and another example shown in FIG. 3 can be considered. A suction unit 21 is formed near the cleaning liquid nozzle 13 and removes the cleaning liquid from an outer peripheral portion of the semiconductor wafer 14 in a region slightly larger than a region to which the cleaning liquid is supplied. The suction means 21 includes a suction nozzle 22 for suctioning the cleaning liquid from the outermost peripheral portion of the semiconductor wafer 14 and a suction mechanism 23 for forming the suction state.
It is composed of At this time, since the cleaning liquid is sucked from the outermost peripheral portion of the semiconductor wafer 14, the suction nozzle 22 is set at 1
The cleaning liquid on the front surface and the back surface of the semiconductor wafer 14 can be removed with one nozzle.

Numeral 24 denotes control means connected to the cleaning liquid supply means 15 and the suction means 21 via, for example, a valve or the like. The control means 24 controls the supply of the cleaning liquid from the cleaning liquid supply means 15 by, for example, opening and closing a valve. The suction means 21 is controlled by, for example, opening and closing a valve so that the cleaning liquid is removed immediately after the cleaning liquid 15 is supplied to the semiconductor wafer 14.

A method for cleaning a semiconductor wafer using the semiconductor wafer cleaning apparatus of the second embodiment configured as described above will be described. First, similarly to the first embodiment,
The semiconductor wafer 14 is placed on the rotating means 20 with the surface horizontal, and the rotating means 20 rotates the semiconductor wafer 14 with the central axis of the semiconductor wafer 14 being vertical. Next, the cleaning liquid is supplied from the cleaning liquid supply means 13 to the outer peripheral portion of the semiconductor wafer 14 by the control means 24.

As soon as the cleaning liquid is supplied to the semiconductor wafer 14, the control means 24 activates the suction means 21.
The cleaning liquid is sucked and removed so that an area slightly larger than the area to which the cleaning liquid is supplied is targeted. Then, while the semiconductor wafer 14 is being rotated, the above-described cleaning is continuously performed on the entire outer periphery of the semiconductor wafer 14.

When the above-described semiconductor wafer cleaning method is performed using the semiconductor wafer cleaning apparatus of the second embodiment configured as described above, the semiconductor wafer is supplied to the outer peripheral portion of the semiconductor wafer in the same manner as in the first embodiment. Since the cleaning liquid thus removed is removed immediately after the supply, the cleaning liquid can be reliably prevented from entering the inner peripheral side of the semiconductor wafer, and the quality of the semiconductor wafer can be prevented from deteriorating. further,
Since the cleaning liquid is absorbed and removed, the cleaning liquid after the removal can be prevented from being scattered to other portions of the semiconductor wafer cleaning apparatus.

Further, an example in which a gas supply means and an absorption means are combined as the removal means in the first and second embodiments can be considered. In that case, the cleaning liquid can be more reliably removed.

It is needless to say that the suction means as the removing means can be similarly used in the following embodiments, and the description thereof will be omitted as appropriate.

Embodiment 3 In each of the above embodiments, the example in which the supply of the cleaning liquid by the cleaning liquid supply unit is performed by the method of spraying with the cleaning liquid nozzle has been described. However, the present invention is not limited to this. For example, the one shown in FIG. FIG. 4 is a diagram schematically showing the relationship between the cleaning liquid supply means, the gas supply means, and the semiconductor wafer. As shown in the figure, the cleaning liquid supply means includes a holder 25 containing the cleaning liquid, and supplies the cleaning liquid to the outer periphery of the semiconductor wafer 14 by holding the outer periphery of the semiconductor wafer 14 with the holder 25.

The holding member may be any holding member which can hold the cleaning liquid, and for example, a sponge, a brush or the like may be used. The cleaning liquid is always supplied to the holder. In addition, it goes without saying that the method of supplying the cleaning liquid with the holder can be similarly used in the following embodiments, and the description thereof will be omitted as appropriate.

In each of the above-described embodiments, the semiconductor wafer is rotated so that the cleaning liquid supply means and the removal means perform cleaning and removal while orbiting the outer peripheral portion of the semiconductor wafer. However, the present invention is not limited to this, and it goes without saying that the cleaning liquid supply unit and the removal unit may be moved around the semiconductor wafer.

Embodiment 4 FIG. In each of the above embodiments, an example in which the surface of the semiconductor wafer is made horizontal has been described. However, the present invention is not limited to this example. FIG. 5 is a diagram schematically showing the relationship between the semiconductor wafer, the cleaning liquid supply means, and the gas supply means. As shown in the figure, the semiconductor wafer 14 is held vertically by the moving means, and the center axis of the semiconductor wafer 14 is rotated horizontally.
The cleaning liquid can be supplied at the lower end of 4. Then, the semiconductor wafer 14 is cleaned in the same manner as in the above embodiments.

When the above-described semiconductor wafer cleaning method using the semiconductor wafer cleaning apparatus of the fourth embodiment configured as described above is performed, the semiconductor wafer is supplied to the outer peripheral portion of the semiconductor wafer in the same manner as in each of the above embodiments. Since the cleaning liquid is removed immediately after the supply, the cleaning liquid can be reliably prevented from entering the inner peripheral side of the semiconductor wafer, and the quality of the semiconductor wafer can be prevented from deteriorating. further,
Since the cleaning liquid can be expected to be removed by gravity together with the removing means, the cleaning liquid can be more reliably removed.

[0038]

As described above, according to the first aspect of the present invention, immediately after the cleaning liquid is applied from the cleaning liquid supply means to the outer peripheral portion of the semiconductor wafer, an area slightly larger than the area where the cleaning liquid is applied is targeted. Since the cleaning liquid is removed by the removing means, it is possible to provide a semiconductor wafer cleaning method capable of preventing the cleaning liquid from entering the inside of the semiconductor wafer.

According to a second aspect of the present invention, in the first aspect, as the method for removing the cleaning liquid by the removing means, a gas that is not reactive with the semiconductor wafer is provided radially outward of the semiconductor wafer. The present invention provides a method for cleaning a semiconductor wafer, which can be performed by spraying the cleaning liquid from a supply unit or / and by suctioning the cleaning liquid from the outermost peripheral portion of the semiconductor wafer by a suction unit. Becomes possible.

According to a third aspect of the present invention, in the second aspect, the cleaning liquid supply means and the removing means operate in a state of circling the outer peripheral portion of the semiconductor wafer during cleaning and removal. It is possible to provide a semiconductor wafer cleaning method capable of cleaning the entire outer peripheral portion of the semiconductor wafer.

According to a fourth aspect of the present invention, in the third aspect, the cleaning is performed while the surface of the semiconductor wafer is horizontal and the center axis is vertical, so that the entire outer peripheral portion of the semiconductor wafer is reliably cleaned. It is possible to provide a method for cleaning a semiconductor wafer that can be performed.

According to a fifth aspect of the present invention, in the third aspect, the semiconductor wafer is rotated while the surface of the semiconductor wafer is vertical and the center axis is horizontal, and the supply of the cleaning liquid by the cleaning liquid supply means is performed in a vertical state. Since the cleaning is performed at the lower end of the semiconductor wafer, it is possible to provide a semiconductor wafer cleaning method capable of reliably cleaning the entire outer peripheral portion of the semiconductor wafer.

According to a sixth aspect of the present invention, a cleaning liquid supply means for supplying a cleaning liquid to the outer peripheral portion of the semiconductor wafer, and a cleaning liquid formed near the cleaning liquid supply means for supplying the cleaning liquid to the outer peripheral portion of the semiconductor wafer. Since there is provided a removing means for removing the cleaning liquid for an area slightly larger than the area and a control means for controlling the removing means so that the cleaning liquid is removed immediately after the cleaning liquid is supplied by the cleaning liquid supply means,
It is possible to provide a semiconductor wafer cleaning apparatus capable of preventing a cleaning liquid from entering a semiconductor wafer.

According to a seventh aspect of the present invention, in the sixth aspect, the removing means is a gas supply means for blowing a gas having no reactivity with the semiconductor wafer to the cleaning liquid radially outward of the semiconductor wafer, or And / or suction means for sucking the cleaning liquid from the outermost peripheral portion of the semiconductor wafer,
It is possible to provide a semiconductor wafer cleaning apparatus capable of reliably removing a cleaning liquid.

According to an eighth aspect of the present invention, in the sixth or seventh aspect, the cleaning liquid supply means and the removal means are provided with moving means for operating in a state of rotating around the outer peripheral portion of the semiconductor wafer. Therefore, it is possible to provide a semiconductor wafer cleaning apparatus capable of cleaning the entire outer peripheral portion of the semiconductor wafer.

According to a ninth aspect of the present invention, in the eighth aspect, the moving means holds the surface of the semiconductor wafer horizontally and rotates the semiconductor wafer with the center axis of the semiconductor wafer vertical, so that the outer periphery of the semiconductor wafer is rotated. It is possible to provide a semiconductor wafer cleaning apparatus capable of reliably cleaning all parts.

According to a tenth aspect of the present invention, in the eighth aspect, the moving means holds the surface of the semiconductor wafer vertically, rotates the semiconductor wafer with the central axis being horizontal, and the cleaning liquid supply means has a vertical position. Since the cleaning liquid is supplied at the lower end of the semiconductor wafer in the state, it is possible to provide a semiconductor wafer cleaning apparatus capable of reliably cleaning the entire outer peripheral portion of the semiconductor wafer.

According to an eleventh aspect of the present invention, in any one of the sixth to tenth aspects, the cleaning liquid supply means includes a holding member containing the cleaning liquid, and the holding member includes an outer periphery of the semiconductor wafer. Since the cleaning liquid is supplied to the outer peripheral portion of the semiconductor wafer while holding the portion, the semiconductor wafer cleaning apparatus capable of cleaning the outer peripheral portion of the semiconductor wafer can be provided.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a semiconductor wafer cleaning apparatus according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram showing details of the semiconductor wafer cleaning apparatus shown in FIG.

FIG. 3 is a diagram showing a configuration of a semiconductor wafer cleaning apparatus according to a second embodiment of the present invention.

FIG. 4 is a diagram schematically showing a configuration of a semiconductor wafer cleaning apparatus according to a third embodiment of the present invention.

FIG. 5 is a diagram schematically showing a configuration of a semiconductor wafer cleaning apparatus according to a fourth embodiment of the present invention.

FIG. 6 is a diagram showing a configuration of a conventional semiconductor wafer cleaning apparatus.

[Explanation of symbols]

14 semiconductor wafer, 15, 26 cleaning liquid supply means, 1
6 gas supply means, 19, 24 control means, 20 rotation means, 21 suction means, 25 holder.

Claims (11)

[Claims] The cleaning liquid is applied to an outer peripheral portion of the semiconductor wafer by a cleaning means immediately after the cleaning liquid is applied by a cleaning liquid supply means, and the cleaning liquid is removed from a region slightly larger than an area where the cleaning liquid is applied. A method for cleaning a semiconductor wafer. 2. A method of removing a cleaning liquid by a removing means, wherein a gas having no reactivity with the semiconductor wafer is sprayed on a radial direction of the semiconductor wafer from a gas supply means to the cleaning liquid, and / or 2. The method for cleaning a semiconductor wafer according to claim 1, wherein the cleaning liquid is suctioned from an outermost peripheral portion of the semiconductor wafer by suction means. 3. The cleaning liquid supply means and the removal means operate in a state of circling the outer peripheral portion of the semiconductor wafer during cleaning and removal.
3. The method for cleaning a semiconductor wafer according to item 2. 4. The method according to claim 3, wherein the rotation is performed while the surface of the semiconductor wafer is horizontal and the center axis is vertical.
3. The method for cleaning a semiconductor wafer according to item 2. 5. The method according to claim 3, wherein the cleaning liquid is supplied by a cleaning liquid supply means at a lower end of the semiconductor wafer in a vertical state while the semiconductor wafer is rotated while the surface of the semiconductor wafer is vertical and the central axis is horizontal. The method for cleaning a semiconductor wafer according to the above. 6. A cleaning liquid supply means for supplying a cleaning liquid to an outer peripheral portion of a semiconductor wafer, and an area formed in the vicinity of the cleaning liquid supply means and which is slightly larger than an area of the outer peripheral portion of the semiconductor wafer to which the cleaning liquid is supplied. Removing means for removing the cleaning liquid, and control means for controlling the removing means so that the cleaning liquid is removed immediately after the cleaning liquid is supplied by the cleaning liquid supply means. Semiconductor wafer cleaning equipment. 7. The removing means comprises: a gas supply means for blowing a gas having no reactivity with the semiconductor wafer to the cleaning liquid radially outward of the semiconductor wafer; and / or a gas supply means for supplying the cleaning liquid from the outermost peripheral portion of the semiconductor wafer. 7. The semiconductor wafer cleaning apparatus according to claim 6, comprising suction means for performing suction. 8. The cleaning of a semiconductor wafer according to claim 6, wherein the cleaning liquid supply means and the removing means have a moving means for operating the semiconductor wafer in a state of orbiting the outer periphery of the semiconductor wafer. apparatus. 9. The semiconductor wafer cleaning apparatus according to claim 8, wherein the moving means holds the surface of the semiconductor wafer horizontally, and rotates the semiconductor wafer with the central axis of the semiconductor wafer being vertical. 10. A moving means for holding the surface of the semiconductor wafer vertically, rotating the semiconductor wafer with the center axis thereof being horizontal, and a cleaning liquid supply means for supplying the cleaning liquid at a lower end of the semiconductor wafer in a vertical state. 9. The semiconductor wafer cleaning apparatus according to claim 8, wherein the cleaning is performed. 11. A cleaning liquid supply means comprising a holder containing a cleaning liquid, wherein the holder holds an outer peripheral portion of a semiconductor wafer and supplies the cleaning liquid to an outer peripheral portion of the semiconductor wafer. The semiconductor wafer cleaning apparatus according to any one of claims 6 to 10, wherein: