JP2002028595A - Cleaning sheet and method for cleaning substrate treatment apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning sheet for cleaning a substrate treatment apparatus avoiding foreign matters, such as a manufacturing apparatus or inspection device for a semiconductor, a flat panel display, a printed circuit board or the like, and to provide a cleaning method using the same. SOLUTION: The cleaning sheet comprises a substance of which the specific dielectric constant is more than 2.0. The cleaning sheet formed by providing a pressure-sensitive adhesive layer on the single surface of this cleaning sheet, the cleaning sheet obtained by providing a cleaning layer comprising the substance of which the specific dielectric constant is more than 2.0 on at least the single surface of a support and the cleaning sheet obtained by further providing the pressure-sensitive adhesive on the other surface of the support of which one surface is provided with the cleaning layer are also disclosed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a sheet for cleaning various substrate processing apparatuses and a method for cleaning a substrate processing apparatus using the same. 1. Field of the Invention The present invention relates to a cleaning sheet and a cleaning method for a substrate processing apparatus that dislikes foreign substances, such as an apparatus.

[0002]

2. Description of the Related Art Various substrate processing apparatuses transport substrates while physically contacting each transport system with a substrate. At this time, if foreign matter is attached to the substrate or the transport system, the subsequent substrate is contaminated one after another, and it is necessary to stop the apparatus periodically and perform a cleaning process. For this reason, there has been a problem that the operation rate is reduced and a large amount of labor is required. In order to solve these problems, a method of cleaning and removing adhered foreign matter in a substrate processing apparatus by transporting a substrate to which an adhesive substance is adhered (Japanese Patent Laid-Open No. 10-154686) and a method of transporting a plate-like member are disclosed. (Japanese Patent Laid-Open No. 11-87458) has been proposed.

[0003]

The method of cleaning and removing the adhered foreign matter in the substrate processing apparatus by transporting the substrate to which the adhesive substance is fixed is an effective method for overcoming the above-mentioned problem. However, in this method, there is a possibility that the adhesive substance and the contact portion of the device are too strongly adsorbed to be separated from each other, so that the substrate cannot be transported reliably. In particular, when a reduced-pressure suction mechanism is used for the chuck table of the substrate, there is a great risk of such a problem. In addition, the method of removing foreign matter by transporting the plate-like member can perform transportation without any trouble, but has a problem that the essential dust-removing property is inferior. The present invention has been made in view of the above circumstances, and has as its object to provide a cleaning sheet that can reliably transport a substrate into a substrate processing apparatus and that can easily and surely remove foreign substances attached to the apparatus.

[0004]

Means for Solving the Problems The present inventors have conducted intensive studies in order to achieve the above object, and as a result, have performed cleaning or transporting a transport member such as a substrate to which this sheet has been fixed, thereby obtaining a substrate processing apparatus. In cleaning and removing foreign substances adhered to the inside, it has been found that by making the relative dielectric constant of a substance as a cleaning layer larger than a specific value, foreign substances can be more easily and reliably peeled off without the problem described above. The invention has been completed.

That is, the present invention provides a cleaning sheet comprising a substance having a relative dielectric constant of greater than 2.0 (claim 1), and a cleaning sheet comprising a substance having a relative dielectric constant of greater than 2.0 being an organic substance. 2) A cleaning sheet comprising a substance having a relative permittivity of greater than 2.0 and a pressure-sensitive adhesive layer provided on one side of the cleaning sheet (Claim 3); A cleaning sheet provided with a cleaning layer made of a larger substance (Claim 4), a cleaning layer made of a substance having a relative dielectric constant larger than 2.0 provided on one side of the support, and an adhesive layer provided on the other side; The cleaning sheet according to claim 5 is provided.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The cleaning sheet of the present invention
The cleaning layer (hereinafter, the cleaning sheet alone,
(Including the form of a laminated sheet or a laminated sheet with a support), the relative dielectric constant measured under the following conditions is greater than 2.0, preferably 2.1 or more, more preferably 2.1 to 2.1. Consists of 10 substances. In the present invention, by designing the relative permittivity of the cleaning layer to be higher than the specific value and making the cleaning layer as high dielectric as possible, the effect of capturing and adsorbing foreign matter by static electricity can be obtained. As used herein, the relative permittivity refers to a ratio of electric energy stored in a material when an electric field is applied to the permittivity in a vacuum.
It is measured according to SK6911.

The material and design method of the cleaning layer are not particularly limited as long as the relative dielectric constant is within the above-mentioned range. However, in the present invention, the cleaning layer contains a conductive substance such as an additive having a conductive function. No organic substances are preferred. Specific examples include, for example, a pressure-sensitive adhesive polymer containing a compound having at least one unsaturated double bond in the molecule, rubbers, natural resins, polyethylene terephthalate, phenolic resins, polyester resins. , Alkyd resin, epoxy resin, polycarbonate,
Organic substances such as nitrocellulose, polyvinylidene fluoride, polypropylene, polyimide, nylon 6, nylon 66, synthetic resins such as polymethyl methacrylate, methyl methacrylate / styrene copolymer, and fluoroethylene / propylene copolymer are suitable. Used for The thickness of the cleaning layer is not particularly limited, but is usually 5 to 100.
It is about μm.

As a specific example of such a cleaning layer,
For example, a pressure-sensitive adhesive polymer containing at least a compound having at least one unsaturated double bond in a molecule and a polymerization initiator is subjected to a polymerization curing reaction by active energy to substantially eliminate tackiness. What is.
Examples of such a pressure-sensitive adhesive polymer include acrylic polymers having a main monomer of (meth) acrylic acid and / or (meth) acrylic ester selected from acrylic acid, acrylic ester, methacrylic acid, and methacrylic ester. Can be In synthesizing this acrylic polymer, a compound having two or more unsaturated double bonds in the molecule is used as a copolymerization monomer, or a compound having an unsaturated double bond in the molecule is synthesized from the synthesized acrylic polymer. By introducing an unsaturated double bond into the molecule of the acrylic polymer, for example, by chemically bonding through a reaction between functional groups, the polymer itself can be involved in the polymerization curing reaction by active energy. Can also.

The compound having one or more unsaturated double bonds in the molecule (hereinafter referred to as a polymerizable unsaturated compound) is a low molecular weight compound which is nonvolatile and has a weight average molecular weight of 10,000 or less. In particular, to make the three-dimensional networking of the cleaning layer at the time of curing efficient,
It preferably has a molecular weight of 00 or less.

The polymerization initiator to be added to the cleaning layer is not particularly limited, and a known initiator can be used. For example, when heat is used as an active energy source, benzoyl peroxide, azobisisobutyronitrile, etc. When a thermal polymerization initiator or light is used, benzoyl, benzoin ethyl ether, cibenzyl, isopropyl benzoin ether, benzophenone, Michler's ketone chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, acetophenone diethyl ketal, benzyl dimethyl ketal, α-hiddle Examples thereof include photopolymerization initiators such as xycyclohexylphenyl ketone, 2-hydroxydimethylphenylpropane, and 2,2-dimethoxy-2-phenylacetophenone.

According to the present invention, there is provided a cleaning sheet having a pressure-sensitive adhesive layer provided on one side of the above-mentioned specific cleaning layer (claim 3). The above-mentioned specific cleaning layer is provided on one side of a support. A cleaning sheet having a pressure-sensitive adhesive layer on the surface is also provided. The material and the like of the pressure-sensitive adhesive layer are not particularly limited as long as the pressure-sensitive adhesive function is satisfied, and a general pressure-sensitive adhesive (for example, acrylic or rubber-based) can be used. With this configuration, the cleaning sheet is attached to a transport member such as various substrates or other tapes / sheets using the adhesive layer, and is transported into the apparatus as a transport member with a cleaning function (Claim 6). Cleaning can be performed by contacting the portion to be cleaned (claim 7).

In the present invention, when the substrate is peeled off from the pressure-sensitive adhesive layer after cleaning in order to reuse the transport member such as the substrate, the adhesive force of the pressure-sensitive adhesive layer is as follows:
180 ° peel adhesion to a silicon wafer (mirror surface) is 0.20 to 0.98 N / 10 mm, especially 0.1 to 0.98 N / 10 mm.
A thickness of about 40 to 0.98 N / 10 mm is preferable because it can be easily peeled off after cleaning without peeling during transport.

A cleaning sheet having a cleaning layer provided on at least one surface of a support.
Examples of the support include, but are not particularly limited to, plastic films such as polyethylene, polyethylene terephthalate, acetylcellulose, polycarbonate, polypropylene, polyamide, polyimide, and polycarbodiimide. The thickness is usually 10
It is about 100 μm.

The transport member to which the cleaning sheet is attached is not particularly limited, and examples thereof include a semiconductor wafer, a flat panel display substrate such as an LCD and a PDP, and a substrate such as a compact disk and an MR head.

[0015]

EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples. Hereinafter, “parts” means “parts by weight”. Example 1 An acrylic polymer (weight average molecular weight 70) obtained from a monomer mixture consisting of 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate, and 5 parts of acrylic acid
100 parts of dipentaerythrol hexaacrylate (manufactured by Nippon Synthetic Chemical Co., Ltd .: trade name UV1700)
150 parts of B), 5 parts of benzyldimethyl ketanol and 3 parts of diphenylmethane diisocyanate were uniformly mixed to obtain a UV-curable pressure-sensitive adhesive solution. On the other hand, a pressure-sensitive adhesive solution was obtained in the same manner as above except that benzyldimethylketanol was removed from the pressure-sensitive adhesive.

The support is 250 mm wide and 25 μm thick
The above-mentioned pressure-sensitive adhesive solution was applied to one side of the polyethylene terephthalate so that the thickness after drying became 10 μm to form a normal pressure-sensitive adhesive layer, and a 38 μm-thick polyester release film was stuck on the surface. On the other side of the support, the ultraviolet-curable pressure-sensitive adhesive solution has a thickness of 2 after drying.
A pressure-sensitive adhesive layer was provided as a cleaning layer by coating to a thickness of 0 μm, and a similar release film was adhered to the surface thereof. The sheet was irradiated with an integrated amount of light of 2000 mJ / cm ² with ultraviolet rays having a central wavelength of 365 nm to obtain a cleaning sheet A of the present invention. The relative dielectric constant of the cleaning layer of this cleaning sheet was measured at 1 MHz using an LCR meter (TYPE4284A, manufactured by Hewlett-Packard Company) and found to be 2.8. Further, a normal adhesive layer on the other side was adhered to the mirror surface of the silicon wafer with a width of 10 mm, and the adhesive force was peeled off by 180 ° to the silicon wafer according to JIS Z0237.
5 N / 10 mm.

Example 2 An ordinary pressure-sensitive adhesive layer was provided on one side of a polyethylene terephthalate film (width 250 mm, thickness 25 μm) having a relative dielectric constant of 3.2 as in Example 1, and a similar release film was formed on the surface. To obtain a cleaning sheet B of the present invention.

The release films on the normal pressure-sensitive adhesive layer side of the obtained cleaning sheets A and B are peeled off and adhered to the back surface (mirror surface) of an 8-inch silicon wafer with a hand roller. B was prepared.

On the other hand, with a laser-type foreign matter measuring device, the mirror surface of three new 8 inch silicon wafers having a thickness of 0.2 μm was measured.
When the above foreign substances were measured, the number of the foreign substances was 11 for the first sheet, 10 for the second sheet, and 8 for the third sheet. After transporting these wafers to a substrate processing apparatus having separate electrostatic chucking mechanisms with the mirror surface facing downward, the mirror surfaces were measured with a laser type foreign matter measuring device. Pieces, 25632 pieces, 274
There were 84.

Next, the release film on the cleaning layer side of the transport cleaning wafers A and B obtained above was peeled off,
When the wafer was transported into the substrate processing apparatus having the wafer stage to which the above-mentioned 32004 and 27484 foreign substances were attached, the wafer was successfully transported. Thereafter, a new 8-inch silicon wafer having 10 and 13 foreign substances having a size of 0.2 μm or more was transported with the mirror surface facing downward, and foreign substances having a size of 0.2 μm or more were measured by a laser type foreign substance measuring device. .
This process was performed five times, and the results are shown in Table 1.

Comparative Example A cleaning sheet C was obtained in the same manner as in Example 2 except that polytetrafluoroethylene having a relative dielectric constant of 2.0 was used for the film. From this cleaning sheet, the transfer cleaning wafer C manufactured in the same manner as in the embodiment is transferred in a substrate processing apparatus having a wafer stage to which 25632 foreign substances are attached, and this operation is repeated five times as in the embodiment. Repeated, the results are shown in Table 1.

[0022]

[Table 1]

[0023]

As described above, according to the cleaning sheet of the present invention, the inside of the substrate processing apparatus can be reliably transported, and the foreign substances adhering to the apparatus can be easily and reliably removed.

Claims (7)

[Claims] 1. A cleaning sheet comprising a substance having a relative dielectric constant of more than 2.0. 2. The cleaning sheet according to claim 1, wherein the substance having a relative permittivity of more than 2.0 is an organic substance. 3. A cleaning sheet having a pressure-sensitive adhesive layer provided on one side of a cleaning sheet made of a substance having a relative dielectric constant larger than 2.0. 4. A cleaning sheet provided with a cleaning layer made of a substance having a relative dielectric constant of more than 2.0 on at least one surface of a support. 5. A cleaning sheet comprising a support having a cleaning layer made of a substance having a relative permittivity of greater than 2.0 on one side and an adhesive layer on the other side. 6. A transport member with a cleaning function, wherein the cleaning sheet according to claim 3 is provided on the transport member via an adhesive layer. 7. A method for cleaning a substrate processing apparatus, comprising transporting the cleaning sheet according to claim 1, 2 or 4, or the transport member according to claim 6 into a substrate processing apparatus.