JP2002026217A - Method for cutting out semiconductor device, and apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cut out individual semiconductor devices with high productivity without generating burrs and lead exfoliation, from a semiconductor device row wherein a plurality of lead frames are continuously formed as interposers in many rows or a single row, semiconductor chips are mounted on the lead frames, and the semiconductor chip mounting side is sealed with resin. SOLUTION: The plurality of lead frames are formed continuously in many rows or a single row. The semiconductor chip is mounted on a chip mounting part of each of the lead frames. The chips are electrically connected with leads. The single surfaces of the lead frames mounting the chips are sealed with resin and semiconductor devices are formed. In the method for cutting out each of the devices, the resin-sealed side 9 is put on a table 13, and cutting-out is performed individually from the lead frame 1 side exposed from the sealing resin, by using a rotary cutter 14 or a blade equipped with a slit on the peripheral surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for cutting out individual semiconductor devices from a resin-sealed semiconductor device row.

[0002]

2. Description of the Related Art Semiconductor devices are required to be reduced in size, and semiconductor devices having a chip size similar to that of a semiconductor chip are being manufactured.

[0003] Some chip size semiconductor devices are manufactured using a lead frame as an interposer. In the semiconductor device, a plurality of lead frames are continuously formed as a multi-row or a single row, semiconductor chips are mounted on a semiconductor chip mounting portion or a semiconductor chip mounting area of each lead frame, and the semiconductor chips and the leads are electrically metallized. The individual semiconductor devices are cut out by connecting them via thin wires or the like and collectively and continuously sealing with resin.

[0004] As a cutting device for individually cutting semiconductor devices, there is, for example, a diamond cutter or a dicer. Each of the semiconductor devices is cut and cut from a plurality of semiconductor devices that are manufactured continuously in rows and columns. .

In the above-mentioned cutting, in a semiconductor device in which both sides of a lead frame are resin-sealed, the lead is in the resin and the generation of cutting burrs is somewhat suppressed, but the semiconductor device is further reduced in size and heat dissipation is improved. Therefore, in a semiconductor device in which only one side of a lead frame is resin-sealed, burrs are frequently generated at the time of cutting. In addition, lead separation also occurs.

[0006]

In the cutting and cutting of the semiconductor device in which one side is sealed with resin, the material to be cut is copper,
Since a lead made of a metal such as a copper alloy or a Ni-iron alloy is a composite of a sealing resin having different physical properties from the lead, heat and cutting heat generated by friction between the cutting device and the semiconductor device to be cut are generated. A clogging phenomenon occurs due to a difference in influences, and a cutting resistance increases, an overload is applied to a semiconductor device to be cut, the burrs are generated, and a lead is peeled. This causes a problem in that the semiconductor device becomes defective.

Further, the cutting device is liable to be worn and broken by friction with the semiconductor device to be cut, so that the cutting speed cannot be increased and the productivity is low.

According to the present invention, there is provided a semiconductor device array in which a plurality of lead frames are continuously formed in multiple rows or single rows as interposers, semiconductor chips are mounted, and the semiconductor chip mounting side is resin-sealed. It is an object of the present invention to cut individual semiconductor devices without burr and lead peeling, and at high cutting speed with high productivity. Another object of the present invention is to provide a semiconductor device cutting device having excellent cutting performance.

[0009]

SUMMARY OF THE INVENTION The gist of the present invention is that a plurality of lead frames are continuously formed in a multi-row or single row, and semiconductor chips are mounted on semiconductor chip mounting portions of individual lead frames. In a method of electrically connecting leads and cutting out individual semiconductor devices from a semiconductor device row in which one side of the lead frame is resin-sealed, the resin-sealed side is placed on a table and exposed from a sealing resin. From the side of the lead frame, which is cut by a rotary cutting device, and divided into individual pieces.

Another aspect of the present invention resides in that one side of the lead frame, which is resin-sealed, is placed on a table and cut from a lead frame side, which is exposed from the sealing resin, with a blade having a slit formed therein. This is where semiconductor devices are individually cut out.

Another aspect of the present invention resides in that the portions where the lead frames exposed from the sealing resin are individually cut are thinned before the resin sealing.

The gist of the semiconductor device cutting device of the present invention is that a plurality of lead frames are continuously formed in a multi-row or a single row, and a semiconductor chip is mounted on a semiconductor chip mounting portion of each lead frame. In a device for individually cutting out semiconductor devices each of which is electrically connected to a lead and sealed with a resin, a rotary cutting device for cutting the semiconductor device is characterized in that slits are formed at intervals on a peripheral surface. Of a semiconductor device.

According to another aspect of the present invention, the rotary cutting device is a blade, and the blade is an electroformed blade.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to the drawings. In the drawing, reference numeral 1 denotes a lead frame used for manufacturing the semiconductor device of the present embodiment, on which pads 2 for mounting a semiconductor chip, leads 3 and support bars 4 are formed. A plurality of the lead frames 1 are formed vertically and horizontally with a vertical frame 5 and a horizontal frame 6 interposed. The lead frame 1 is formed by etching or pressing a metal plate. Although the pad 2 is formed in this embodiment, a lead frame without a pad may be used. In this case, the semiconductor chip is mounted on the lead via a tape or a heat radiating plate.

Reference numeral 7 denotes a semiconductor chip mounted on the pad 2. The semiconductor chip 7 is electrically connected to the leads 3 via bonding wires 8 as shown in FIG. In FIG. 1, the semiconductor chip 7 is indicated by a dotted line, and bonding wires are omitted because the drawing is complicated.

The lead frame 1 on which the semiconductor chip 7 is mounted is sealed with resin 9 on the side on which the semiconductor chip 7 is mounted. The resin encapsulation 9 is performed in a lump and continuously over a predetermined number of the plurality of lead frames 1 formed vertically and horizontally to form a row in which the semiconductor devices 10 are arranged.

The above-mentioned resin-sealed semiconductor device array 11
The individual semiconductor device 10 is cut out of FIG. 1, and the cutting line 12 to be cut out is shown by a dotted line in FIG. In FIG. 3, the cutting line 12 is located below the arrow line.

The individual semiconductor devices 1 from the semiconductor device row 11
When cutting out 0, as shown in FIG. 3, the side on which the resin sealing 9 is performed is placed on a cutting table 13, the lead frame 1 side exposed from the sealing resin is faced up, and a rotary cutting device 14, for example, a blade is mounted. It is cut along the cutting line 12 from the lead frame 1 side to the resin sealing 9 side facing from above. By cutting from the lead frame 1 side in this way, FIG.
As shown in (1), the contact area of the lead frame 1 with the rotary cutting device 14 near the end of cutting is reduced, and the occurrence of burrs is prevented. Further, even if burrs are generated, they remain in the sealing resin and the adverse effects are reduced.

As shown in FIG. 5, the blade 14 is provided with slits 15 on its peripheral surface, for example, inward, and when the individual semiconductor devices 10 are cut out from the semiconductor device row 11 by the blades 14 as described above, the slits 15 Has a cooling action that entangles the cooling water at the time of cutting to prevent a rise in the temperature of the blade 14, a sub-cutting action that acts as a different blade from the blade itself of the blade 14, and a removing action that dispenses the facets. In addition, the cutting resistance due to the friction generated between the blade 14 and the semiconductor device 10 to be cut is reduced, the sharpness of the blade 14 is further enhanced, the occurrence of burrs and lead peeling is more strongly prevented, and the productivity of the cutting operation is further improved. improves.

In this embodiment, the slit 15 is formed to extend in the axial direction from the peripheral surface of the blade 14, but it may be formed so as to deviate from the axial center. The number of the slits 15 can be arbitrarily set, and the depth of the slit 15 from the peripheral surface of the blade 14 and the length in the peripheral surface direction maintain the temporary holding of the cooling water and the function of dispensing the cutting pieces, thereby impairing the mechanical strength. It can be set arbitrarily as long as there is no range.

The blade 14 can be made of various materials, but if it is made of an electroformed blade having high strength and excellent abrasion resistance, it can be cut sharply without breakage, and the cutting speed can be further increased. It is extremely excellent as a device for cutting out a device.

Further, as shown in FIG. 6, when the semiconductor device 10 is thinned 16 by half-etching or the like at the predetermined position of the cutting line 12 as shown in FIG. 14, the cutting speed can be further increased, and effects such as the occurrence of burrs and lead peeling can be further prevented.

The portion of the lead frame 1 where the plate thickness is reduced by the half-etching or the like may be a partial region including a line serving as the cutting line 12 or an entire region of the lead 3.

In the above embodiment, the semiconductor device cutting device has been described for cutting individual semiconductor devices 10 from the semiconductor device row 11 in which only one side of the lead frame 1 is resin-sealed. The present invention can also be applied to cutting from a resin-sealed semiconductor device row.

[0025]

According to the first invention of the present invention, when dividing a semiconductor device in which one side of a lead frame on which a semiconductor chip is mounted is resin-sealed as described above, the resin sealing surface is placed on a table. To cut out individual semiconductor devices by cutting from the exposed lead frame side with the rotary cutting device, so the rotary cutting device cuts from the lead frame side to the resin sealing surface side, and near the end of cutting. The contact area with the lead frame is reduced, thereby preventing burrs and lead peeling.

According to a second aspect of the present invention, a slit is formed on an outer periphery of a blade of a rotary cutting device at an interval, and the blade is cut from the lead frame side to cut out an individual semiconductor device. The cutting water is entangled with cooling water to prevent the temperature of the blade from rising, the sub-cutting blade acts as a blade separate from the blade itself, and the removal function for dispensing the cutting chips. Further, lead separation is further prevented, and the productivity of the cutting operation is further improved.

According to the third aspect of the present invention, since the thickness of the lead frame in the cutting line region is reduced, the cutting speed can be increased.

According to the semiconductor device cutting device according to the fourth to fifth aspects of the present invention, the blade of the rotary cutting device is formed with the slit as described above to reduce the cutting resistance at the time of cutting and to improve the cutting performance. And the effect of preventing burrs and peeling of the lead and prolonging the life of the cutting device.

[Brief description of the drawings]

FIG. 1 is a view showing a lead frame used for manufacturing a semiconductor device in one embodiment of the present invention.

FIG. 2 is a diagram showing the manufacture of a semiconductor device according to one embodiment of the present invention.

FIG. 3 is a diagram showing cutting of a semiconductor device from a semiconductor device row in one embodiment of the present invention.

FIG. 4 is a view for explaining a cutting action by a blade in one embodiment of the present invention.

FIG. 5 is a view showing a blade having a slit formed in one embodiment of the present invention.

FIG. 6 is a diagram showing a semiconductor device in which a cutting line region of a lead frame is thin in one embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 2 Pad 3 Lead 4 Support bar 5 Vertical frame 6 Horizontal frame 7 Semiconductor chip 8 Bonding wire 9 Resin sealing 10 Semiconductor device 11 Semiconductor device row 12 Cutting line 13 Cutting table 14 Rotary cutting device (blade) 15 Slit 16 Thin Location

Claims (6)

[Claims] 1. A semiconductor device comprising: a plurality of lead frames continuously formed in a multi-row or a single row; semiconductor chips mounted on semiconductor chip mounting locations of individual lead frames; and electrically connecting the semiconductor chips and the leads. In a method of individually dividing a semiconductor device in which one side of a lead frame on which resin is mounted is resin-sealed, the resin-sealed side is placed on a table, and a rotary cutting device is exposed from the lead frame side exposed from the sealing resin. And dividing the semiconductor device into individual devices. 2. A semiconductor device comprising: a plurality of lead frames formed continuously in multiple rows or a single row; semiconductor chips mounted on semiconductor chip mounting locations of individual lead frames; and electrically connecting the semiconductor chips and the leads. In a method of individually dividing a semiconductor device in which one side of a lead frame mounting a resin is resin-sealed, the resin-sealed side is placed on a table, and a slit is formed from the lead frame side exposed from the sealing resin. A method for cutting out a semiconductor device, comprising cutting the semiconductor device with a set blade and dividing the semiconductor device into individual pieces. 3. The method for cutting out a semiconductor device according to claim 1, wherein the thickness of each of the exposed cut portions of the lead frame is reduced in advance. 4. A plurality of lead frames are continuously formed in a multi-row or a single row, semiconductor chips are mounted on semiconductor chip mounting portions of individual lead frames, and the semiconductor chips and the leads are electrically connected to each other. In a device for dividing a stopped semiconductor device individually, a rotary cutting device for cutting the semiconductor device has slits formed at intervals on a peripheral surface thereof. 5. The cutting device for a semiconductor device according to claim 4, wherein said rotary cutting device is a blade. 6. The apparatus according to claim 5, wherein the blade is an electroformed blade.