JP3443799B2 - Method and apparatus for cutting out semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting out individual semiconductor devices from a resin-sealed semiconductor device array and a cutting-out device.

[0002]

2. Description of the Related Art A semiconductor device is required to be miniaturized, and a chip size semiconductor device which is close to a semiconductor chip size has been manufactured.

Some chip size semiconductor devices are manufactured using a lead frame as an interposer. In this semiconductor device, a plurality of lead frames are continuously formed in multiple rows or a single row, and the semiconductor chips are mounted on a semiconductor chip mounting portion or a semiconductor chip mounting area of each lead frame, and the semiconductor chips and the leads are electrically metalized. Individual semiconductor devices are cut out by connecting them through a thin wire or the like and collectively and continuously sealing them with resin.

As a cutting device for individually cutting the semiconductor devices, there is, for example, a diamond cutter or a dicer, and each semiconductor device is cut and cut from a plurality of semiconductor devices which are continuously manufactured in a row and a row. .

In the above-mentioned cutting, in the semiconductor device in which both sides of the lead frame are resin-sealed, the leads are in the resin and the occurrence of cutting burrs is somewhat suppressed, but further miniaturization of the semiconductor device and better heat dissipation are improved. Therefore, in a semiconductor device in which only one side of the lead frame is resin-sealed, burrs frequently occur at the time of cutting. Also, lead peeling occurs.

[0006]

In the cutting and cutting of the semiconductor device whose one side is resin-sealed, the material to be cut is copper,
Since the lead made of metal such as copper alloy or Ni-iron alloy and the encapsulation resin having different physical properties are combined, heat generated by friction between the cutting device and the semiconductor device to be cut and cutting heat are generated. Due to a difference in influence or the like, a clogging phenomenon occurs, cutting resistance increases, an overload is applied to the semiconductor device to be cut, the burr is generated, and lead peeling occurs. This causes the semiconductor device to be defective and is a problem.

Further, there is a problem that the cutting device is easily worn and broken due to friction with the semiconductor device to be cut, the cutting speed cannot be increased, and the productivity is low.

According to the present invention, a plurality of lead frames are continuously formed in multiple rows or a single row as an interposer, semiconductor chips are mounted, and the semiconductor chip mounting side is resin-sealed. It is an object of the present invention to cut individual semiconductor devices with high productivity by increasing the cutting speed without causing burrs and peeling of leads. Another object of the present invention is to provide a semiconductor device cutting device having excellent cutting performance.

[0009]

SUMMARY OF THE INVENTION The gist of the present invention is to form a plurality of lead frames continuously in multiple rows or a single row, and mount the semiconductor chips at the semiconductor chip mounting locations of the individual lead frames. In a method of cutting individual semiconductor devices from a semiconductor device row in which leads are electrically connected and one surface side of the lead frame is resin-sealed, the resin-sealed side is placed on a table and exposed from the sealing resin. From the side of the lead frame that is being cut, the blade is cut with a blade having a slit formed on the peripheral surface, and is individually divided and cut out.

[0010]

[0011]

The gist of the semiconductor device cutting device of the present invention is that a plurality of lead frames are continuously formed in multiple rows or a single row, and semiconductor chips are mounted at the semiconductor chip mounting locations of the individual lead frames. In a device for cutting semiconductor devices each having leads electrically connected to each other and resin-sealed, blades for cutting the semiconductor devices are formed with slits at intervals on a peripheral surface. It is in a cutting device for a semiconductor device.

[0013]

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to the drawings. In the drawing, reference numeral 1 is a lead frame used for manufacturing the semiconductor device of the present embodiment, in which a pad 2 for mounting a semiconductor chip, a lead 3, and a support bar 4 are formed. A plurality of lead frames 1 are formed vertically and horizontally with a vertical frame 5 and a horizontal frame 6 interposed therebetween. The lead frame 1 is formed by etching or pressing a metal plate. Although the pad 2 is formed in this embodiment, it may be a lead frame without a pad, in which case the semiconductor chip is mounted on the lead via a tape or a heat radiating plate.

Reference numeral 7 denotes a semiconductor chip mounted on the pad 2, and the semiconductor chip 7 is electrically connected to the lead 3 via a bonding wire 8 as shown in FIG. In FIG. 1, the semiconductor chip 7 is shown by a dotted line, and the bonding wire is omitted because the drawing becomes complicated.

The lead frame 1 on which the semiconductor chip 7 is mounted is resin-sealed 9 on the mounting side of the semiconductor chip 7. The resin encapsulation 9 is collectively and continuously made over a predetermined number of the lead frames 1 formed in the vertical and horizontal directions to form a row in which the semiconductor devices 10 are arranged.

The semiconductor device row 11 formed by resin sealing
The individual semiconductor devices 10 are cut out from the above, and the cutting line 12 cut out is shown by a dotted line in FIG. In FIG. 3, the cutting line 12 is located below the arrow line.

Individual semiconductor devices 1 from the semiconductor device row 11
When cutting out 0, the resin-sealed 9 side is placed on the cutting table 13 as shown in FIG. 3, the lead frame 1 side exposed from the sealing resin is faced up, and the rotary cutting device 14, for example, a blade is attached. The lead frame 1 is faced from above and cut along the cutting line 12 from the lead frame 1 side toward the resin sealing 9 side. As shown in FIG.
As shown in (4), the lead frame 1 has a small contact area with the rotary cutting device 14 near the end of cutting, thus preventing the occurrence of burrs. Further, even if burrs are generated, they remain in the sealing resin and the adverse effects are reduced.

As shown in FIG. 5, the blade 14 is provided with a slit 15 on the circumferential surface, for example, inward, and when the individual semiconductor devices 10 are cut out from the semiconductor device row 11 by the blade 14 as described above, the slits are formed. Has a cooling action to prevent the temperature rise of the blade 14 by entwining the cooling water at the time of cutting, a sub-cutting blade action to act as a blade different from the blade itself of the blade 14, and a removing action to eject a facet. The cutting resistance due to friction generated between the blade 14 and the semiconductor device 10 to be cut is reduced, the sharpness of the blade 14 is further enhanced, the occurrence of burrs and lead peeling is more strongly prevented, and the productivity of cutting work is further improved. improves.

Although the slit 15 is formed in the axial direction from the peripheral surface of the blade 14 in this embodiment, it may be formed in the direction away from the axial center. Further, the number of the slits 15 can be set arbitrarily, and the depth of the slits 15 from the peripheral surface of the blade 14 and the length in the peripheral surface direction temporarily retain the cooling water and maintain the function of discharging the facets, thereby impairing the mechanical strength. It can be set arbitrarily as long as there is no range.

The blade 14 can be made of various materials, but if it is an electroformed blade having high strength and excellent wear resistance, it has good sharpness and does not break, and the cutting speed can be further increased. It excels as a cutting device.

Further, as shown in FIG. 6, if the lead frame 1 before resin-sealing as the semiconductor device 10 is cut to a predetermined cutting line 12 by a half etching or the like to reduce the plate thickness to 16, a blade is formed. It is possible to obtain an effect that the cutting speed by 14 is further increased and the occurrence of burrs and lead peeling is further prevented.

The portion of the lead frame 1 where the plate thickness is reduced by the half etching or the like may be a partial region including a line to be the cutting line 12 or the entire region of the lead 3.

In the above-described embodiment, the semiconductor device cutting device has described the cutting of individual semiconductor devices 10 from the semiconductor device row 11 in which only one side of the lead frame 1 is resin-sealed. It can also be applied to cutting out from a resin-encapsulated semiconductor device array.

[0025]

According to the first aspect of the present invention, when a semiconductor device, in which one side of a lead frame on which a semiconductor chip is mounted is resin-sealed, is individually divided, the resin-sealed surface is placed on a table. Since the individual semiconductor devices are cut out from the exposed lead frame side by a blade having a slit formed in the peripheral surface, the blade is cut from the lead frame side to the resin sealing surface side, and cut. The contact area with the lead frame near the end is reduced, so that burrs and lead peeling are prevented.

Further, according to the first aspect of the present invention, since the individual semiconductor devices are cut out by cutting from the lead frame side with a blade having slits formed at intervals on the outer circumference, the slits are cut. By entwining the cooling water at the time, the effect of preventing the temperature rise of the blade, the sub-cutting blade function that acts as a blade different from the blade itself, and the removal effect of discharging the cutting chips, further cutting performance is achieved. As the height increases, burrs and lead peeling are further prevented, thereby further improving the productivity of cutting work.

[0027]

According to the semiconductor device slicing device of the second aspect of the present invention, the blades for cutting the semiconductor device have slits formed on the circumferential surface thereof at intervals so that the cutting resistance at the time of cutting is reduced. In addition, the cutting property is improved, burrs and lead peeling are prevented, and the life of the cutting device is extended.

[Brief description of drawings]

FIG. 1 is a diagram showing a lead frame used for manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a diagram showing manufacturing of a semiconductor device according to an embodiment of the present invention.

FIG. 3 is a diagram showing cutting of a semiconductor device from a semiconductor device row in one embodiment of the present invention.

FIG. 4 is a view for explaining a cutting action by a blade in one embodiment of the present invention.

FIG. 5 is a diagram showing a blade having slits formed therein according to an embodiment of the present invention.

FIG. 6 is a diagram showing a semiconductor device in which a cutting line region of a lead frame is made thin in one embodiment of the present invention.

[Explanation of symbols]

1 lead frame 2 pads 3 leads 4 Support bar 5 vertical frames 6 horizontal frames 7 semiconductor chips 8 bonding wire 9 Resin encapsulation 10 Semiconductor device 11 Semiconductor device array 12 cutting lines 13 cutting table 14 Rotary cutting device (blade) 15 slits 16 Thin wall

─────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-4-321263 (JP, A) JP-A-2000-183262 (JP, A) JP-A-2000-286375 (JP, A) JP-A-2001-244399 (JP , A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 23/50

Claims (2)

(57) [Claims] 1. A plurality of lead frames are continuously formed in multiple rows or a single row, semiconductor chips are mounted on semiconductor chip mounting portions of individual lead frames, and the semiconductor chips and leads are electrically connected to each other. In a method of individually dividing a semiconductor device in which one side of a lead frame mounted with is sealed with resin, the resin-sealed side is placed on a table and the lead frame side exposed from the sealing resin is moved to the peripheral surface. A method of cutting a semiconductor device, which comprises cutting with a blade having a slit and dividing into individual pieces. 2. A plurality of lead frames are continuously formed in multiple rows or a single row, the semiconductor chips are mounted on the semiconductor chip mounting portions of the individual lead frames, the semiconductor chips and the leads are electrically connected, and a resin seal is used. An apparatus for dividing a semiconductor device formed by stopping, wherein a blade for cutting the semiconductor device has slits formed at intervals on a peripheral surface thereof.