JP2002016131A5 - - Google Patents

Download PDF

Info

Publication number
JP2002016131A5
JP2002016131A5 JP2000197552A JP2000197552A JP2002016131A5 JP 2002016131 A5 JP2002016131 A5 JP 2002016131A5 JP 2000197552 A JP2000197552 A JP 2000197552A JP 2000197552 A JP2000197552 A JP 2000197552A JP 2002016131 A5 JP2002016131 A5 JP 2002016131A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000197552A
Other versions
JP4843129B2 (ja
JP2002016131A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000197552A priority Critical patent/JP4843129B2/ja
Priority claimed from JP2000197552A external-priority patent/JP4843129B2/ja
Priority to US09/754,117 priority patent/US6545336B2/en
Publication of JP2002016131A publication Critical patent/JP2002016131A/ja
Publication of JP2002016131A5 publication Critical patent/JP2002016131A5/ja
Application granted granted Critical
Publication of JP4843129B2 publication Critical patent/JP4843129B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2000197552A 2000-06-30 2000-06-30 半導体装置およびその製造方法 Expired - Fee Related JP4843129B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000197552A JP4843129B2 (ja) 2000-06-30 2000-06-30 半導体装置およびその製造方法
US09/754,117 US6545336B2 (en) 2000-06-30 2001-01-05 Semiconductor device, and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000197552A JP4843129B2 (ja) 2000-06-30 2000-06-30 半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2002016131A JP2002016131A (ja) 2002-01-18
JP2002016131A5 true JP2002016131A5 (ja) 2007-07-26
JP4843129B2 JP4843129B2 (ja) 2011-12-21

Family

ID=18695864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000197552A Expired - Fee Related JP4843129B2 (ja) 2000-06-30 2000-06-30 半導体装置およびその製造方法

Country Status (2)

Country Link
US (1) US6545336B2 (ja)
JP (1) JP4843129B2 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7057299B2 (en) * 2000-02-03 2006-06-06 Taiwan Semiconductor Manufacturing Co., Ltd. Alignment mark configuration
US6358816B1 (en) * 2000-09-05 2002-03-19 Motorola, Inc. Method for uniform polish in microelectronic device
US6614062B2 (en) * 2001-01-17 2003-09-02 Motorola, Inc. Semiconductor tiling structure and method of formation
JP4504633B2 (ja) * 2003-05-29 2010-07-14 パナソニック株式会社 半導体集積回路装置
DE50308795D1 (de) * 2003-07-23 2008-01-24 Gretag Macbeth Ag Digitaldrucker
JP2008098286A (ja) * 2006-10-10 2008-04-24 Rohm Co Ltd 半導体装置
JP4977052B2 (ja) * 2008-01-31 2012-07-18 旭化成エレクトロニクス株式会社 半導体装置
US8368136B2 (en) * 2008-07-03 2013-02-05 Taiwan Semiconductor Manufacturing Company, Ltd. Integrating a capacitor in a metal gate last process
JP5356742B2 (ja) * 2008-07-10 2013-12-04 ラピスセミコンダクタ株式会社 半導体装置、半導体装置の製造方法および半導体パッケージの製造方法
US11789667B2 (en) 2019-11-05 2023-10-17 Hewlett-Packard Development Company, L.P. Printer colour deviation detection

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5665633A (en) * 1995-04-06 1997-09-09 Motorola, Inc. Process for forming a semiconductor device having field isolation
KR0155874B1 (ko) * 1995-08-31 1998-12-01 김광호 반도체장치의 평탄화방법 및 이를 이용한 소자분리방법
JP3128205B2 (ja) * 1996-03-14 2001-01-29 松下電器産業株式会社 平坦化パターンの生成方法、平坦化パターンの生成装置及び半導体集積回路装置
JP4187808B2 (ja) * 1997-08-25 2008-11-26 株式会社ルネサステクノロジ 半導体装置の製造方法
US6020616A (en) * 1998-03-31 2000-02-01 Vlsi Technology, Inc. Automated design of on-chip capacitive structures for suppressing inductive noise
JPH11330223A (ja) 1998-05-15 1999-11-30 Rohm Co Ltd 半導体装置および半導体装置の製造方法
JP2000124305A (ja) * 1998-10-15 2000-04-28 Mitsubishi Electric Corp 半導体装置
US6396158B1 (en) * 1999-06-29 2002-05-28 Motorola Inc. Semiconductor device and a process for designing a mask
JP3539549B2 (ja) * 1999-09-20 2004-07-07 シャープ株式会社 半導体装置
JP4307664B2 (ja) * 1999-12-03 2009-08-05 株式会社ルネサステクノロジ 半導体装置
JP3906005B2 (ja) * 2000-03-27 2007-04-18 株式会社東芝 半導体装置の製造方法

Similar Documents

Publication Publication Date Title
BE2016C059I2 (ja)
BE2010C009I2 (ja)
BE2009C057I2 (ja)
BRPI0113085B8 (ja)
JP2003503847A5 (ja)
JP2003518195A5 (ja)
JP2002005093A5 (ja)
BRPI0110940B8 (ja)
BE2014C025I2 (ja)
JP2002016131A5 (ja)
CH694022C1 (ja)
BRPI0000763B8 (ja)
CN3141398S (ja)
CN3144671S (ja)
BY4905C1 (ja)
AU2000280319A8 (ja)
CL2001002979A1 (ja)
CN3134893S (ja)
CN3135488S (ja)
AU2000276891A8 (ja)
CN3139026S (ja)
CN3139842S (ja)
CN3139850S (ja)
CN3141017S (ja)
AU2000266391A8 (ja)