JP2002009452A - 多層プリント回路基板 - Google Patents

多層プリント回路基板

Info

Publication number
JP2002009452A
JP2002009452A JP2001117268A JP2001117268A JP2002009452A JP 2002009452 A JP2002009452 A JP 2002009452A JP 2001117268 A JP2001117268 A JP 2001117268A JP 2001117268 A JP2001117268 A JP 2001117268A JP 2002009452 A JP2002009452 A JP 2002009452A
Authority
JP
Japan
Prior art keywords
processor
circuit board
printed circuit
board
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001117268A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002009452A5 (enExample
Inventor
Shaun Harris
シャウン・ハリス
Charles S Harden
スチュアート・チャールズ・ハーデン
C Dei Michael
マイケル・シー・デイ
Christian L Belady
クリスチャン・ラズィオ・ベレディ
Heid Pallotti Risa
リサ・ヘイド・パロッティ
T Artman Paul
ポール・ティー・アートマン
Eric C Peterson
エリック・シー・ピーターソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2002009452A publication Critical patent/JP2002009452A/ja
Publication of JP2002009452A5 publication Critical patent/JP2002009452A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2001117268A 2000-04-28 2001-04-16 多層プリント回路基板 Pending JP2002009452A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/560794 2000-04-28
US09/560,794 US6596948B1 (en) 2000-04-28 2000-04-28 Processor and power supply circuit

Publications (2)

Publication Number Publication Date
JP2002009452A true JP2002009452A (ja) 2002-01-11
JP2002009452A5 JP2002009452A5 (enExample) 2005-08-11

Family

ID=24239402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001117268A Pending JP2002009452A (ja) 2000-04-28 2001-04-16 多層プリント回路基板

Country Status (2)

Country Link
US (2) US6596948B1 (enExample)
JP (1) JP2002009452A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192321A (ja) * 2013-03-27 2014-10-06 Ibiden Co Ltd 電子部品内蔵配線板およびその製造方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7312402B2 (en) * 2002-10-11 2007-12-25 International Business Machines Corporation Method and apparatus for providing improved loop inductance of decoupling capacitors
US6846992B2 (en) * 2003-06-03 2005-01-25 Agilent Technologies, Inc. Power plane splitting using a contour method
JP4506303B2 (ja) * 2003-08-29 2010-07-21 株式会社デンソー 電子制御装置
US7358446B2 (en) * 2003-10-14 2008-04-15 Hewlett-Packard Development Company, L.P. Power distribution system
US7187556B2 (en) * 2003-10-14 2007-03-06 Hewlett-Packard Development Company, L.P. Power distribution system
US7555665B2 (en) * 2004-12-29 2009-06-30 Hewlett-Packard Development Company, L.P. Method and apparatus of disabling converters in a power module
US7345381B2 (en) * 2005-01-25 2008-03-18 Hewlett-Packard Development Company, L.P. Converter to provide an output voltage for plural input voltages
US7355125B2 (en) * 2005-11-17 2008-04-08 International Business Machines Corporation Printed circuit board and chip module
US7809025B2 (en) 2006-09-29 2010-10-05 Hewlett-Packard Development Company, L.P. System and method for distributing clock signals
US20080112134A1 (en) * 2006-11-09 2008-05-15 Brandon Rubenstein Dust accumulation resistant heat sink
US7974404B2 (en) * 2006-12-21 2011-07-05 General Instrument Corporation Parallel split powering
US8018738B2 (en) * 2008-06-02 2011-09-13 Oracle America, Inc., Voltage regulator attach for high current chip applications
ES2630162T3 (es) * 2008-12-12 2017-08-18 Bae Systems Plc Blindaje
JP6153319B2 (ja) * 2011-12-08 2017-06-28 キヤノン株式会社 プリント回路板、プリント配線板及び電子機器
EP2607986B1 (de) * 2011-12-22 2014-10-29 Schroff GmbH Stromeinspeisemodul für ein modulares Computersystem
GB2574668B (en) * 2018-06-15 2020-12-09 Drayson Tech Europe Ltd Circuitry for use in smart cards and other applications
WO2020214150A1 (en) * 2019-04-15 2020-10-22 Hewlett-Packard Development Company, L.P. Printed circuit boards with processors, voltage regulators, and solder joints of higher melting temperatures
US20230402499A1 (en) * 2022-06-08 2023-12-14 Intel Corporation High density metal layers in electrode stacks for transition metal oxide dielectric capacitors

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527998A (en) * 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
JP3113153B2 (ja) * 1994-07-26 2000-11-27 株式会社東芝 多層配線構造の半導体装置
US5611696A (en) * 1994-12-14 1997-03-18 International Business Machines Corporation High density and high current capacity pad-to-pad connector comprising of spring connector elements (SCE)
US5912809A (en) * 1997-01-21 1999-06-15 Dell Usa, L.P. Printed circuit board (PCB) including channeled capacitive plane structure
JPH10270496A (ja) * 1997-03-27 1998-10-09 Hitachi Ltd 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
JP3926880B2 (ja) * 1997-03-31 2007-06-06 富士通株式会社 多層プリント板
JP3961092B2 (ja) * 1997-06-03 2007-08-15 株式会社東芝 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法
US6252177B1 (en) * 1998-02-18 2001-06-26 Compaq Computer Corporation Low inductance capacitor mounting structure for capacitors of a printed circuit board
US6201194B1 (en) * 1998-12-02 2001-03-13 International Business Machines Corporation Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric
US6208501B1 (en) * 1999-06-14 2001-03-27 Dielectric Laboratories, Inc. Standing axial-leaded surface mount capacitor
US6553555B1 (en) * 1999-08-27 2003-04-22 Dell Products L.P. Maintaining signal guard bands when routing through a field of obstacles
US6337798B1 (en) * 2000-01-25 2002-01-08 Dell Usa, L.P. Digital circuit decoupling for EMI reduction
US6661943B2 (en) * 2002-01-30 2003-12-09 Intel Corporation Fiber-free optical interconnect system for chip-to-chip signaling

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192321A (ja) * 2013-03-27 2014-10-06 Ibiden Co Ltd 電子部品内蔵配線板およびその製造方法

Also Published As

Publication number Publication date
US6818835B2 (en) 2004-11-16
US20030156398A1 (en) 2003-08-21
US6596948B1 (en) 2003-07-22

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