JP2001526838A5 - - Google Patents

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Publication number
JP2001526838A5
JP2001526838A5 JP1998549234A JP54923498A JP2001526838A5 JP 2001526838 A5 JP2001526838 A5 JP 2001526838A5 JP 1998549234 A JP1998549234 A JP 1998549234A JP 54923498 A JP54923498 A JP 54923498A JP 2001526838 A5 JP2001526838 A5 JP 2001526838A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP1998549234A
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English (en)
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JP4040695B2 (ja
JP2001526838A (ja
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Priority claimed from US08/856,267 external-priority patent/US5923086A/en
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Publication of JP2001526838A publication Critical patent/JP2001526838A/ja
Publication of JP2001526838A5 publication Critical patent/JP2001526838A5/ja
Application granted granted Critical
Publication of JP4040695B2 publication Critical patent/JP4040695B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

Figure 2001526838
Figure 2001526838
JP54923498A 1997-05-14 1998-04-14 半導体ダイを冷却する装置 Expired - Fee Related JP4040695B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/856,267 US5923086A (en) 1997-05-14 1997-05-14 Apparatus for cooling a semiconductor die
US08/856,267 1997-05-14
PCT/US1998/007490 WO1998052223A1 (en) 1997-05-14 1998-04-14 Method and apparatus for cooling a semiconductor die

Publications (3)

Publication Number Publication Date
JP2001526838A JP2001526838A (ja) 2001-12-18
JP2001526838A5 true JP2001526838A5 (ja) 2005-12-02
JP4040695B2 JP4040695B2 (ja) 2008-01-30

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ID=25323202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54923498A Expired - Fee Related JP4040695B2 (ja) 1997-05-14 1998-04-14 半導体ダイを冷却する装置

Country Status (7)

Country Link
US (1) US5923086A (ja)
JP (1) JP4040695B2 (ja)
KR (1) KR100381431B1 (ja)
CN (1) CN1154180C (ja)
AU (1) AU6971898A (ja)
MY (1) MY114590A (ja)
WO (1) WO1998052223A1 (ja)

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US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US8250877B2 (en) 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
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KR101343233B1 (ko) * 2011-11-28 2013-12-18 삼성전기주식회사 전력 모듈 패키지
CN102788945A (zh) * 2012-07-19 2012-11-21 中国科学院电工研究所 一种功率半导体模块通用夹具
JP6048068B2 (ja) * 2012-10-25 2016-12-21 株式会社島津製作所 プラズマ用高周波電源及びそれを用いたｉｃｐ発光分光分析装置
TWI576196B (zh) * 2012-12-05 2017-04-01 Shinkawa Kk The cooling method of the joining tool cooling device and the joining tool
TWI490956B (zh) * 2013-03-12 2015-07-01 Shinkawa Kk 覆晶接合器以及覆晶接合方法
CN108626331B (zh) 2017-03-21 2021-03-02 株式会社椿本链条 张紧装置

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