JP2001525952A - チップカード - Google Patents

チップカード

Info

Publication number
JP2001525952A
JP2001525952A JP50747698A JP50747698A JP2001525952A JP 2001525952 A JP2001525952 A JP 2001525952A JP 50747698 A JP50747698 A JP 50747698A JP 50747698 A JP50747698 A JP 50747698A JP 2001525952 A JP2001525952 A JP 2001525952A
Authority
JP
Japan
Prior art keywords
chip
card
contact
plastic
card body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP50747698A
Other languages
English (en)
Japanese (ja)
Inventor
ドゥルゴッシュ ディーター
プラス ローラント
キルシュバウアー ヨーゼフ
ディドゥシーズ ギュンター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JP2001525952A publication Critical patent/JP2001525952A/ja
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Die Bonding (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Dry Shavers And Clippers (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP50747698A 1996-08-01 1997-07-31 チップカード Abandoned JP2001525952A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19631166.7 1996-08-01
DE19631166A DE19631166C2 (de) 1996-08-01 1996-08-01 Chipkarte
PCT/DE1997/001626 WO1998006060A2 (de) 1996-08-01 1997-07-31 Chipkarte

Publications (1)

Publication Number Publication Date
JP2001525952A true JP2001525952A (ja) 2001-12-11

Family

ID=7801549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50747698A Abandoned JP2001525952A (ja) 1996-08-01 1997-07-31 チップカード

Country Status (12)

Country Link
EP (1) EP0978095B1 (enExample)
JP (1) JP2001525952A (enExample)
KR (1) KR100371019B1 (enExample)
CN (1) CN1126063C (enExample)
AT (1) ATE209802T1 (enExample)
BR (1) BR9710907A (enExample)
DE (2) DE19631166C2 (enExample)
ES (1) ES2169409T3 (enExample)
IN (1) IN192308B (enExample)
RU (1) RU2189634C2 (enExample)
UA (1) UA52672C2 (enExample)
WO (1) WO1998006060A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0998725A1 (en) * 1998-03-27 2000-05-10 Koninklijke Philips Electronics N.V. Data carrier having an implanted module based on a metal lead frame
JP4179423B2 (ja) * 1998-03-27 2008-11-12 エヌエックスピー ビー ヴィ 金属リードフレームに基づく埋め込みモジュールと二面チィプカバーを有するデータ媒体
DE10009026C1 (de) * 2000-02-25 2001-07-19 Schmalz J Gmbh Vorrichtung zum Fixieren von Werkstücken
DE10208172B4 (de) * 2002-02-26 2005-07-07 Infineon Technologies Ag Zwischenträger zum Einsetzen in einen Träger und Träger mit einem Zwischenträger
KR100467634B1 (ko) * 2002-07-16 2005-01-24 삼성에스디에스 주식회사 스마트 카드 및 그의 제조방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
FR2631200B1 (fr) * 1988-05-09 1991-02-08 Bull Cp8 Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit
JPH02261696A (ja) * 1989-03-31 1990-10-24 Toppan Printing Co Ltd Icモジュール
JPH03187792A (ja) * 1989-12-19 1991-08-15 Toshiba Corp Icカード
FR2664076A1 (fr) * 1990-03-28 1992-01-03 Schlumberger Ind Sa Procede de fabrication d'une carte a memoire electronique.
DE4441931C1 (de) * 1994-04-27 1995-07-27 Siemens Ag Chipkarte
ES2135656T3 (es) * 1994-06-15 1999-11-01 Rue Cartes Et Systemes De Procedimiento de fabricacion y ensamblaje de una tarjeta con circuito integrado.

Also Published As

Publication number Publication date
DE19631166C2 (de) 2000-12-07
UA52672C2 (uk) 2003-01-15
IN192308B (enExample) 2004-04-03
DE59705594D1 (de) 2002-01-10
BR9710907A (pt) 1999-08-17
ES2169409T3 (es) 2002-07-01
RU2189634C2 (ru) 2002-09-20
CN1126063C (zh) 2003-10-29
CN1276078A (zh) 2000-12-06
KR20000029716A (ko) 2000-05-25
WO1998006060A2 (de) 1998-02-12
ATE209802T1 (de) 2001-12-15
DE19631166A1 (de) 1998-02-05
EP0978095A1 (de) 2000-02-09
WO1998006060A3 (de) 2002-10-10
EP0978095B1 (de) 2001-11-28
KR100371019B1 (ko) 2003-02-05

Similar Documents

Publication Publication Date Title
TW469546B (en) A TLOC (thin lead on chip) semiconductor device
JP2000506653A (ja) チップカード
KR20050033860A (ko) 전자 장치 및 고무 제품 및 그들의 제조 방법
KR19980041965A (ko) 반도체 패키지 및 제조방법
US20140022745A1 (en) Component and method for producing a component
US20210078223A1 (en) Method for manufacturing busbar and manufacturing busbar through the same
JP2003521787A (ja) 携帯データサポート
US6068191A (en) Smart card with card body and semiconductor chip on a leadframe
US7152316B2 (en) Hybrid integrated circuit device and method of manufacturing the same
US6614100B1 (en) Lead frame for the installation of an integrated circuit in an injection-molded package
US6002181A (en) Structure of resin molded type semiconductor device with embedded thermal dissipator
KR100371019B1 (ko) 스마트 카드
US6804883B1 (en) Method for producing a pressure sensor
CN1824484B (zh) 铸件及应用该铸件的电子装置
KR20010014925A (ko) 비접촉형 ic 카드
JP2012084050A (ja) Rfidタグ
JP5361426B2 (ja) 半導体デバイス
CN100380638C (zh) 芯片模块
US20040036178A1 (en) Flip-chip mounted integrated circut card element
MXPA99001145A (en) Chip card
US7332804B2 (en) Semiconductor device and method of manufacturing the same
TW423087B (en) Stacked bottom lead package in semiconductor devices and fabricationg method thereof
KR100619125B1 (ko) 무선 카드
JPH0719859B2 (ja) Icカード用モジュールの製造方法
KR200141125Y1 (ko) 리드프레임의 구조

Legal Events

Date Code Title Description
A762 Written abandonment of application

Free format text: JAPANESE INTERMEDIATE CODE: A762

Effective date: 20040510