JP2001513450A - 改良研磨パッド及びこれに関連する方法 - Google Patents
改良研磨パッド及びこれに関連する方法Info
- Publication number
- JP2001513450A JP2001513450A JP2000507086A JP2000507086A JP2001513450A JP 2001513450 A JP2001513450 A JP 2001513450A JP 2000507086 A JP2000507086 A JP 2000507086A JP 2000507086 A JP2000507086 A JP 2000507086A JP 2001513450 A JP2001513450 A JP 2001513450A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- polishing
- irregularities
- hydrophilic material
- thermoforming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 97
- 238000000034 method Methods 0.000 title claims description 15
- 239000000463 material Substances 0.000 claims abstract description 55
- 238000003856 thermoforming Methods 0.000 claims abstract description 21
- 239000012530 fluid Substances 0.000 claims abstract description 20
- 229920000642 polymer Polymers 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 6
- 229920002492 poly(sulfone) Polymers 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 150000001408 amides Chemical class 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 229920001038 ethylene copolymer Polymers 0.000 claims description 3
- 150000003457 sulfones Chemical class 0.000 claims description 3
- 239000004677 Nylon Substances 0.000 claims description 2
- 239000004697 Polyetherimide Substances 0.000 claims description 2
- 229920002873 Polyethylenimine Polymers 0.000 claims description 2
- 238000000748 compression moulding Methods 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229920001778 nylon Polymers 0.000 claims description 2
- 238000005191 phase separation Methods 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 229920001470 polyketone Polymers 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 2
- 239000002243 precursor Substances 0.000 claims 2
- 150000004820 halides Chemical class 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 claims 1
- 230000001172 regenerating effect Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000012876 topography Methods 0.000 abstract description 6
- 238000009499 grossing Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 13
- 230000003750 conditioning effect Effects 0.000 description 12
- 238000005520 cutting process Methods 0.000 description 8
- -1 dielectric Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000003754 machining Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000021615 conjugation Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000007723 die pressing method Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920002401 polyacrylamide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 101100454433 Biomphalaria glabrata BG01 gene Proteins 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000010076 replication Effects 0.000 description 1
- 239000012056 semi-solid material Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/22—Rubbers synthetic or natural
- B24D3/26—Rubbers synthetic or natural for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5490697P | 1997-08-06 | 1997-08-06 | |
| US60/054,906 | 1997-08-06 | ||
| PCT/US1998/016289 WO1999007515A1 (en) | 1997-08-06 | 1998-08-05 | Improved polishing pads and methods relating thereto |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001513450A true JP2001513450A (ja) | 2001-09-04 |
| JP2001513450A5 JP2001513450A5 (https=) | 2006-01-05 |
Family
ID=21994291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000507086A Pending JP2001513450A (ja) | 1997-08-06 | 1998-08-05 | 改良研磨パッド及びこれに関連する方法 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1011919B1 (https=) |
| JP (1) | JP2001513450A (https=) |
| KR (1) | KR100499601B1 (https=) |
| CN (1) | CN1265618A (https=) |
| DE (1) | DE69827147T2 (https=) |
| WO (1) | WO1999007515A1 (https=) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000034416A (ja) * | 1998-05-15 | 2000-02-02 | Jsr Corp | 重合体組成物および研磨パッド |
| JP2007073796A (ja) * | 2005-09-08 | 2007-03-22 | Nihon Micro Coating Co Ltd | 研磨パッド及びその製造方法並びに研磨方法 |
| JP2010036301A (ja) * | 2008-08-05 | 2010-02-18 | Asahi Diamond Industrial Co Ltd | 超砥粒チップ及び超砥粒工具 |
| US8094456B2 (en) | 2006-01-10 | 2012-01-10 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8148441B2 (en) | 2005-03-08 | 2012-04-03 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and manufacturing method thereof |
| JP2012114454A (ja) * | 2000-05-27 | 2012-06-14 | Rohm & Haas Electronic Materials Cmp Holdings Inc | 化学機械平坦化用の研磨パッド |
| US8304467B2 (en) | 2005-05-17 | 2012-11-06 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8303372B2 (en) | 2006-08-31 | 2012-11-06 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8309466B2 (en) | 2005-08-30 | 2012-11-13 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8865785B2 (en) | 2007-03-28 | 2014-10-21 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8993648B2 (en) | 2006-08-28 | 2015-03-31 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| JP2018531157A (ja) * | 2015-09-25 | 2018-10-25 | キャボット マイクロエレクトロニクス コーポレイション | 高い弾性率比率を有するポリウレタンｃｍｐパッド |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1015176B1 (en) * | 1997-04-04 | 2003-03-12 | Rodel Holdings, Inc. | Improved polishing pads and methods relating thereto |
| JP4954377B2 (ja) * | 2000-02-04 | 2012-06-13 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
| US6477926B1 (en) | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
| US6679769B2 (en) | 2000-09-19 | 2004-01-20 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
| SG131737A1 (en) * | 2001-03-28 | 2007-05-28 | Disco Corp | Polishing tool and polishing method and apparatus using same |
| US6568997B2 (en) | 2001-04-05 | 2003-05-27 | Rodel Holdings, Inc. | CMP polishing composition for semiconductor devices containing organic polymer particles |
| US7214623B2 (en) * | 2003-10-13 | 2007-05-08 | International Business Machines Corporation | Planarization system and method using a carbonate containing fluid |
| US7059936B2 (en) * | 2004-03-23 | 2006-06-13 | Cabot Microelectronics Corporation | Low surface energy CMP pad |
| US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
| US20060089095A1 (en) | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| CN101244535B (zh) | 2006-02-15 | 2012-06-13 | 应用材料公司 | 抛光仓 |
| CN101541479B (zh) | 2006-07-14 | 2012-11-28 | 圣戈本磨料股份有限公司 | 无背衬研磨制品 |
| US8512427B2 (en) * | 2011-09-29 | 2013-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Acrylate polyurethane chemical mechanical polishing layer |
| FR3025741B1 (fr) * | 2014-09-15 | 2019-05-24 | Airbus Group Sas | Film adhesif multifonctionnel pour la protection de surface de pieces |
| CN104889874B (zh) * | 2015-06-25 | 2017-08-04 | 蓝思科技（长沙）有限公司 | 一种蓝宝石抛光用吸附垫及其制备方法 |
| JP6380333B2 (ja) * | 2015-10-30 | 2018-08-29 | 株式会社Sumco | ウェーハ研磨装置およびこれに用いる研磨ヘッド |
| CN105538047B (zh) * | 2015-12-11 | 2017-09-22 | 中国航空工业集团公司北京航空材料研究院 | 一种航空有机透明制件的表面研抛方法 |
| US20180134918A1 (en) * | 2016-11-11 | 2018-05-17 | Jh Rhodes Company, Inc. | Soft polymer-based material polishing media |
| CN110869166B (zh) * | 2017-07-11 | 2023-01-20 | 3M创新有限公司 | 包括适形涂层的磨料制品和由其形成的抛光系统 |
| CN109794863A (zh) * | 2019-03-05 | 2019-05-24 | 北京国瑞升精机科技有限公司 | 一种亲水性抛光膜及其制备方法 |
| CN110744444B (zh) * | 2019-10-29 | 2022-02-15 | 武汉新芯集成电路制造有限公司 | 研磨垫及研磨装置 |
| KR20240144181A (ko) | 2022-02-02 | 2024-10-02 | 주식회사 쿠라레 | 연마층, 연마 패드, 연마 패드의 제조 방법 및 연마 방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4129457A (en) * | 1977-05-23 | 1978-12-12 | International Business Machines Corporation | Post-polishing cleaning of semiconductor surfaces |
| US4581287A (en) * | 1984-06-18 | 1986-04-08 | Creative Products Resource Associates, Ltd. | Composite reticulated foam-textile cleaning pad |
| US4787732A (en) * | 1986-04-24 | 1988-11-29 | Nick Siviglia | Contact lens and method of making same |
| US5007128B1 (en) * | 1989-01-18 | 1993-12-07 | Minnesota Mining And Manufacturing Company | Compounding,glazing or polishing pad |
| US5396737B1 (en) * | 1989-01-18 | 1997-12-23 | Minnesota Mining & Mfg | Compound glazing or polishing pad |
| US5157877A (en) * | 1990-04-27 | 1992-10-27 | Shin-Etsu Handotai Co., Ltd. | Method for preparing a semiconductor wafer |
| JP2632738B2 (ja) * | 1990-04-27 | 1997-07-23 | 信越半導体 株式会社 | パッキングパッド、および半導体ウェーハの研磨方法 |
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US5704987A (en) * | 1996-01-19 | 1998-01-06 | International Business Machines Corporation | Process for removing residue from a semiconductor wafer after chemical-mechanical polishing |
-
1998
- 1998-08-05 DE DE69827147T patent/DE69827147T2/de not_active Expired - Lifetime
- 1998-08-05 KR KR10-2000-7001162A patent/KR100499601B1/ko not_active Expired - Lifetime
- 1998-08-05 WO PCT/US1998/016289 patent/WO1999007515A1/en not_active Ceased
- 1998-08-05 EP EP98938386A patent/EP1011919B1/en not_active Expired - Lifetime
- 1998-08-05 JP JP2000507086A patent/JP2001513450A/ja active Pending
- 1998-08-05 CN CN 98807897 patent/CN1265618A/zh active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000034416A (ja) * | 1998-05-15 | 2000-02-02 | Jsr Corp | 重合体組成物および研磨パッド |
| JP2012114454A (ja) * | 2000-05-27 | 2012-06-14 | Rohm & Haas Electronic Materials Cmp Holdings Inc | 化学機械平坦化用の研磨パッド |
| US8148441B2 (en) | 2005-03-08 | 2012-04-03 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and manufacturing method thereof |
| US8304467B2 (en) | 2005-05-17 | 2012-11-06 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8779020B2 (en) | 2005-05-17 | 2014-07-15 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8530535B2 (en) | 2005-05-17 | 2013-09-10 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8309466B2 (en) | 2005-08-30 | 2012-11-13 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| JP2007073796A (ja) * | 2005-09-08 | 2007-03-22 | Nihon Micro Coating Co Ltd | 研磨パッド及びその製造方法並びに研磨方法 |
| US8094456B2 (en) | 2006-01-10 | 2012-01-10 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8993648B2 (en) | 2006-08-28 | 2015-03-31 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US9358661B2 (en) | 2006-08-28 | 2016-06-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad |
| US8303372B2 (en) | 2006-08-31 | 2012-11-06 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8865785B2 (en) | 2007-03-28 | 2014-10-21 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| JP2010036301A (ja) * | 2008-08-05 | 2010-02-18 | Asahi Diamond Industrial Co Ltd | 超砥粒チップ及び超砥粒工具 |
| JP2018531157A (ja) * | 2015-09-25 | 2018-10-25 | キャボット マイクロエレクトロニクス コーポレイション | 高い弾性率比率を有するポリウレタンｃｍｐパッド |
| JP7066608B2 (ja) | 2015-09-25 | 2022-05-13 | シーエムシー マテリアルズ，インコーポレイティド | 化学機械的研磨パッド、基板を化学機械的に研磨する方法、及び化学機械的研磨パッドを製造する方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1011919A1 (en) | 2000-06-28 |
| WO1999007515A1 (en) | 1999-02-18 |
| KR20010022571A (ko) | 2001-03-26 |
| DE69827147T2 (de) | 2006-03-02 |
| DE69827147D1 (de) | 2004-11-25 |
| EP1011919A4 (en) | 2000-11-02 |
| CN1265618A (zh) | 2000-09-06 |
| EP1011919B1 (en) | 2004-10-20 |
| KR100499601B1 (ko) | 2005-07-07 |
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