JP2001513142A - 高熱伝導性重合体接着剤 - Google Patents
高熱伝導性重合体接着剤Info
- Publication number
- JP2001513142A JP2001513142A JP53859398A JP53859398A JP2001513142A JP 2001513142 A JP2001513142 A JP 2001513142A JP 53859398 A JP53859398 A JP 53859398A JP 53859398 A JP53859398 A JP 53859398A JP 2001513142 A JP2001513142 A JP 2001513142A
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- adhesive
- paste
- thermosetting
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 63
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 63
- 229920001940 conductive polymer Polymers 0.000 title description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 27
- 239000002904 solvent Substances 0.000 claims description 59
- 238000004132 cross linking Methods 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 10
- 229920001169 thermoplastic Polymers 0.000 claims description 10
- 239000004416 thermosoftening plastic Substances 0.000 claims description 10
- 239000000654 additive Substances 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000011231 conductive filler Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 5
- 239000001856 Ethyl cellulose Substances 0.000 claims description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 4
- 229920001249 ethyl cellulose Polymers 0.000 claims description 4
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 150000001298 alcohols Chemical class 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 150000002170 ethers Chemical class 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000000806 elastomer Substances 0.000 claims description 2
- 239000004849 latent hardener Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000005060 rubber Substances 0.000 claims description 2
- 239000002562 thickening agent Substances 0.000 claims 2
- 239000003054 catalyst Substances 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 12
- 239000011230 binding agent Substances 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 238000001035 drying Methods 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 5
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 5
- 229940116411 terpineol Drugs 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- -1 halide ions Chemical class 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000004848 polyfunctional curative Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- UWNADWZGEHDQAB-UHFFFAOYSA-N i-Pr2C2H4i-Pr2 Natural products CC(C)CCC(C)C UWNADWZGEHDQAB-UHFFFAOYSA-N 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/810,554 US6265471B1 (en) | 1997-03-03 | 1997-03-03 | High thermally conductive polymeric adhesive |
| US08/810,554 | 1997-03-03 | ||
| PCT/US1998/003721 WO1998039395A1 (en) | 1997-03-03 | 1998-02-25 | High thermally conductive polymeric adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001513142A true JP2001513142A (ja) | 2001-08-28 |
| JP2001513142A5 JP2001513142A5 (enExample) | 2005-11-10 |
Family
ID=25204104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53859398A Pending JP2001513142A (ja) | 1997-03-03 | 1998-02-25 | 高熱伝導性重合体接着剤 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6265471B1 (enExample) |
| JP (1) | JP2001513142A (enExample) |
| CA (1) | CA2283412A1 (enExample) |
| WO (1) | WO1998039395A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003206469A (ja) * | 2001-11-12 | 2003-07-22 | Hitachi Chem Co Ltd | 接着剤組成物及びこれを用いた半導体装置 |
| JP2003221573A (ja) * | 2001-11-12 | 2003-08-08 | Hitachi Chem Co Ltd | 接合材料及びこれを用いた半導体装置 |
| JP2008545869A (ja) * | 2005-06-07 | 2008-12-18 | モーメンティブ・パフォーマンス・マテリアルズ・インク | Ｂステージ化可能フィルム、電子装置および関連プロセス |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6888257B2 (en) * | 2002-06-28 | 2005-05-03 | Lord Corporation | Interface adhesive |
| WO2004011848A2 (en) | 2002-07-25 | 2004-02-05 | Dahm Jonathan S | Method and apparatus for using light emitting diodes for curing |
| US7160496B2 (en) * | 2002-11-01 | 2007-01-09 | Delphi Technologies, Inc. | Thermoplastic compositions containing metal material |
| US7550097B2 (en) * | 2003-09-03 | 2009-06-23 | Momentive Performance Materials, Inc. | Thermal conductive material utilizing electrically conductive nanoparticles |
| US20050056365A1 (en) * | 2003-09-15 | 2005-03-17 | Albert Chan | Thermal interface adhesive |
| US8344523B2 (en) | 2006-05-08 | 2013-01-01 | Diemat, Inc. | Conductive composition |
| TWI380325B (en) * | 2006-09-26 | 2012-12-21 | Polytronics Technology Corp | Heat-conductive dielectric polymer composition and heat dissipation substrate containing the same |
| US7422707B2 (en) * | 2007-01-10 | 2008-09-09 | National Starch And Chemical Investment Holding Corporation | Highly conductive composition for wafer coating |
| US8795837B2 (en) * | 2007-08-20 | 2014-08-05 | Diemat, Inc. | Adhesives with thermal conductivity enhanced by mixed silver fillers |
| AU2010213946B2 (en) * | 2009-02-16 | 2012-09-06 | Cytec Technology Corp. | Conductive surfacing films for lightning strike and electromagnetic interference shielding of thermoset composite materials |
| TW201335350A (zh) * | 2012-02-29 | 2013-09-01 | Ritedia Corp | 熱傳導膏 |
| EP3732940A4 (en) | 2017-12-27 | 2021-10-20 | 3M Innovative Properties Company | CURRENT EPOXY RESIN COMPOSITION SUITABLE FOR AN ELECTRONIC DEVICE ENCLOSURE, ARTICLES AND METHODS |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE237840C (enExample) * | ||||
| BE510386A (enExample) * | 1951-04-05 | 1900-01-01 | ||
| US3716489A (en) | 1970-10-02 | 1973-02-13 | American Cyanamid Co | Supersaturated solid solutions of photochromic materials in epoxies |
| JPS601221A (ja) * | 1983-06-17 | 1985-01-07 | Sumitomo Bakelite Co Ltd | 導電性樹脂ペ−スト |
| US4469714A (en) * | 1983-09-02 | 1984-09-04 | Okuno Chemical Industry Co., Ltd. | Composition for bonding electroconductive metal coating to electrically nonconductive material |
| US4564563A (en) | 1983-09-30 | 1986-01-14 | Electro Materials Corp. Of America | Solderable conductor |
| US4780371A (en) * | 1986-02-24 | 1988-10-25 | International Business Machines Corporation | Electrically conductive composition and use thereof |
| DE3809331C1 (enExample) | 1988-03-19 | 1989-04-27 | Degussa Ag, 6000 Frankfurt, De | |
| JP2688692B2 (ja) * | 1988-06-01 | 1997-12-10 | 旭化成工業株式会社 | 金属粉含有エポキシ樹脂組成物 |
| US4933030A (en) | 1989-06-21 | 1990-06-12 | Dietz Raymond L | Low temperature glass composition, paste and method of use |
| US5480957A (en) | 1991-05-28 | 1996-01-02 | W. R. Grace & Co.-Conn. | Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation |
| JPH0536738A (ja) * | 1991-07-26 | 1993-02-12 | Hitachi Chem Co Ltd | 導電性樹脂ペーストおよび半導体装置 |
| JPH05214214A (ja) * | 1992-02-06 | 1993-08-24 | Mitsubishi Petrochem Co Ltd | エポキシ樹脂組成物及びその硬化物 |
| US5391604A (en) | 1993-07-30 | 1995-02-21 | Diemat, Inc. | Adhesive paste containing polymeric resin |
| JP2915379B2 (ja) * | 1996-06-18 | 1999-07-05 | レイセオン・カンパニー | 落下衝撃に耐える導電接着剤 |
-
1997
- 1997-03-03 US US08/810,554 patent/US6265471B1/en not_active Expired - Lifetime
-
1998
- 1998-02-25 CA CA002283412A patent/CA2283412A1/en not_active Abandoned
- 1998-02-25 WO PCT/US1998/003721 patent/WO1998039395A1/en not_active Ceased
- 1998-02-25 JP JP53859398A patent/JP2001513142A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003206469A (ja) * | 2001-11-12 | 2003-07-22 | Hitachi Chem Co Ltd | 接着剤組成物及びこれを用いた半導体装置 |
| JP2003221573A (ja) * | 2001-11-12 | 2003-08-08 | Hitachi Chem Co Ltd | 接合材料及びこれを用いた半導体装置 |
| JP2008545869A (ja) * | 2005-06-07 | 2008-12-18 | モーメンティブ・パフォーマンス・マテリアルズ・インク | Ｂステージ化可能フィルム、電子装置および関連プロセス |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2283412A1 (en) | 1998-09-11 |
| US6265471B1 (en) | 2001-07-24 |
| WO1998039395A1 (en) | 1998-09-11 |
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