JP2001509213A - 新規表面変性方法 - Google Patents
新規表面変性方法Info
- Publication number
- JP2001509213A JP2001509213A JP53278398A JP53278398A JP2001509213A JP 2001509213 A JP2001509213 A JP 2001509213A JP 53278398 A JP53278398 A JP 53278398A JP 53278398 A JP53278398 A JP 53278398A JP 2001509213 A JP2001509213 A JP 2001509213A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- group
- pattern
- conductive
- surface layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1168—Graft-polymerization
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Chemical Treatment Of Metals (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Polymerisation Methods In General (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.有機質基材または有機材料の表面層を有する少なくともひとつの表面を含む 基材上に明瞭に区画されたパターン(distinct pattern)状に導電材料を適用す る方法にして、該表面層が該明瞭に区画されたパターンに応じた明瞭に区画され た(distinct)接着領域を形成するように化学的に変性され、次いで導電物質( 類)がこの領域に適用されることを特徴とする方法。 2.基材表面層の化学変性が、水素原子が表面層の明瞭に区画された領域から取 り除かれそれによって反応性ラジカルが形成されるように行われることを特徴と する請求項1に記載の方法。 3.紫外線照射によって活性化され得る開始剤の添加によって、水素原子が表面 層上の明瞭に区画された領域から取り除かれることを特徴とする請求項2に記載 の方法。 4.必要とするパターンが焦点を絞った紫外線源を使用して描かれることを特徴 とする請求項3に記載の方法。 5.必要とするパターンが、基材表面上に設置されたフィルム上に描かれ、次い で基材が光源、好ましくは紫外線光源に露光されることを特徴とする請求項3に 記載の方法。 6.化学変性が、ポリマー鎖が基材表面層に共有結合されることを含むことを特 徴とする請求項1〜5のいずれかに記載の照射方法。 7.水素原子の除去とポリマー鎖の共有結合を1段階で行うことを特徴とする請 求項6に記載の方法。 8.水素原子の除去とポリマー鎖の共有結合を連続した2段階で行うことを特徴 とする請求項6に記載の方法。 9.ポリマー鎖が導電性基または導電性基によって置換され得る基を含むことを 特徴とする請求項6に記載の方法。 10.導電性基が、パラジウム、ニッケル、銅、金および銀からなる群から選ば れる元素を含む化学基であることを特徴とする請求項9に記載の方法。 11.開始剤が芳香族ケトン類、脂肪族ケトン類、アルデヒド類およびこれらの 混合物からなる群から選ばれる化合物であることを特徴とする請求項1〜10の いずれかに記載の方法。 12.開始剤がベンゾフェノン、4−クロロベンゾフェノン、4,4'−ジクロロ ベンゾフェノン、4−ベンジルベンゾフェノン、ベンゾイルナフタレン、キサン トン、アントラキノン、9−フルオレノン、ベンゾピナコール、任意の芳香族ケ トン類、アセトフェノン、ベンゾジメチルケタール、ヒドロキシシクロヘキシル アセトフェノン、ビアセチル、3,4−ヘキサンジオン、2,3−ペンタンジオン 、1−フェニル−1,2−プロパンジオン、ベンゾール、ベンゾイルギ酸、ホル ムアルデヒド、アセトアルデヒド(acetic aldehyde)、アセトン、2−ペンタノ ン、3−ペンタノン、シクロヘキサノン、ベンゾフェノンのメタノールスルホネ ートエステル類およびこれらの混合物からなる群から選ばれる化合物であること を特徴とする請求項1〜11のいずれかに記載の方法。 13.請求項1〜12のいずれかに記載の方法によって製造される回路基板。 14.単数または複数の有機材料表面層を持つ少なくともひとつの基材および単 数または複数の金属導電体(類)のパターンを含む回路基板であって、金属導電 体(類)が、表面層に化学的に結合しているポリマーの中心を囲んで形成されて いることを特徴とする回路基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9700307A SE508280C2 (sv) | 1997-01-31 | 1997-01-31 | Förfarande för att öka vidhäftningsförmågan hos ledande material till ytskikt av polymermaterial |
SE9700307-3 | 1997-01-31 | ||
PCT/SE1998/000111 WO1998034446A1 (en) | 1997-01-31 | 1998-01-27 | New process for modification of surfaces |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001509213A true JP2001509213A (ja) | 2001-07-10 |
JP2001509213A5 JP2001509213A5 (ja) | 2005-10-06 |
Family
ID=20405596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53278398A Pending JP2001509213A (ja) | 1997-01-31 | 1998-01-27 | 新規表面変性方法 |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP0985333B1 (ja) |
JP (1) | JP2001509213A (ja) |
AT (1) | ATE373411T1 (ja) |
AU (1) | AU5888798A (ja) |
DE (1) | DE69838420T2 (ja) |
DK (1) | DK0985333T3 (ja) |
ES (1) | ES2293674T3 (ja) |
PT (1) | PT985333E (ja) |
SE (1) | SE508280C2 (ja) |
WO (1) | WO1998034446A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005347424A (ja) * | 2004-06-01 | 2005-12-15 | Fuji Photo Film Co Ltd | 多層配線板及びその製造方法 |
JP2007169763A (ja) * | 2005-12-26 | 2007-07-05 | Osaka Univ | 二種以上の金属からなる金属ナノ粒子及びその形成方法 |
JP2009533858A (ja) * | 2006-04-10 | 2009-09-17 | リネア・テルジ・リミテッド | 基材に金属を適用するための方法 |
JP2015523464A (ja) * | 2012-05-07 | 2015-08-13 | キュプトロニック テクノロジー リミテッド | 金属を塗布するための方法 |
JP2020508846A (ja) * | 2017-01-31 | 2020-03-26 | サントル ナシオナル ドゥ ラ ルシェルシェ サイアンティフィク | 金属層を有する材料及びこの材料を調製するための工程 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE533762C2 (sv) * | 2009-07-06 | 2010-12-28 | Cathprint Ab | Kateter och metod för tillverkning av sådan kateter |
CN103328686A (zh) | 2010-11-16 | 2013-09-25 | 凯普卓尼克技术公司 | 采用等离子体聚合预处理对物件的金属涂覆 |
EP2645830B1 (en) | 2012-03-29 | 2014-10-08 | Atotech Deutschland GmbH | Method for manufacture of fine line circuitry |
WO2014086844A2 (en) | 2012-12-05 | 2014-06-12 | Cuptronic Technology Ltd. | Metalization of polymeric cavity filters |
WO2015149825A1 (en) | 2014-03-31 | 2015-10-08 | Abb Technology Ltd | Electric power cable and process for the production of electric power cable |
CN106460176B (zh) | 2014-04-28 | 2020-02-07 | 凯普卓尼克技术公司 | 表面的金属化 |
WO2022018136A1 (en) | 2020-07-21 | 2022-01-27 | Ncapt Ab | METHOD FOR SURFACE TREATMENT PRIOR TO COATING and GLUING |
SE545002C2 (en) | 2020-07-24 | 2023-02-21 | Cuptronic Tech Ltd | Method for surface treatment prior to metallization |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52117985A (en) * | 1976-03-30 | 1977-10-03 | Hitachi Chem Co Ltd | Photosensitive polymer composition |
JP2605010B2 (ja) * | 1985-01-11 | 1997-04-30 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 有機基板への金属付着方法 |
US4810326A (en) * | 1987-08-31 | 1989-03-07 | International Business Machines Corporation | Interlaminate adhesion between polymeric materials and electrolytic copper surfaces |
US5114757A (en) * | 1990-10-26 | 1992-05-19 | Linde Harold G | Enhancement of polyimide adhesion on reactive metals |
US5225495A (en) * | 1991-07-10 | 1993-07-06 | Richard C. Stewart, II | Conductive polymer film formation using initiator pretreatment |
-
1997
- 1997-01-31 SE SE9700307A patent/SE508280C2/sv not_active IP Right Cessation
-
1998
- 1998-01-27 WO PCT/SE1998/000111 patent/WO1998034446A1/en active IP Right Grant
- 1998-01-27 DK DK98902332T patent/DK0985333T3/da active
- 1998-01-27 JP JP53278398A patent/JP2001509213A/ja active Pending
- 1998-01-27 AT AT98902332T patent/ATE373411T1/de active
- 1998-01-27 DE DE69838420T patent/DE69838420T2/de not_active Expired - Lifetime
- 1998-01-27 EP EP98902332A patent/EP0985333B1/en not_active Expired - Lifetime
- 1998-01-27 AU AU58887/98A patent/AU5888798A/en not_active Abandoned
- 1998-01-27 ES ES98902332T patent/ES2293674T3/es not_active Expired - Lifetime
- 1998-01-27 PT PT98902332T patent/PT985333E/pt unknown
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005347424A (ja) * | 2004-06-01 | 2005-12-15 | Fuji Photo Film Co Ltd | 多層配線板及びその製造方法 |
US7849593B2 (en) | 2004-06-01 | 2010-12-14 | Fujifilm Corporation | Method of making multi-layer circuit board |
JP2007169763A (ja) * | 2005-12-26 | 2007-07-05 | Osaka Univ | 二種以上の金属からなる金属ナノ粒子及びその形成方法 |
JP2009533858A (ja) * | 2006-04-10 | 2009-09-17 | リネア・テルジ・リミテッド | 基材に金属を適用するための方法 |
JP2015523464A (ja) * | 2012-05-07 | 2015-08-13 | キュプトロニック テクノロジー リミテッド | 金属を塗布するための方法 |
US9889471B2 (en) | 2012-05-07 | 2018-02-13 | Cuptronic Technology Ltd. | Process for application of metal |
JP2020508846A (ja) * | 2017-01-31 | 2020-03-26 | サントル ナシオナル ドゥ ラ ルシェルシェ サイアンティフィク | 金属層を有する材料及びこの材料を調製するための工程 |
Also Published As
Publication number | Publication date |
---|---|
SE9700307L (sv) | 1998-08-01 |
DE69838420T2 (de) | 2008-07-03 |
EP0985333A1 (en) | 2000-03-15 |
WO1998034446A1 (en) | 1998-08-06 |
SE508280C2 (sv) | 1998-09-21 |
DK0985333T3 (da) | 2008-01-21 |
EP0985333B1 (en) | 2007-09-12 |
AU5888798A (en) | 1998-08-25 |
PT985333E (pt) | 2007-12-17 |
ATE373411T1 (de) | 2007-09-15 |
DE69838420D1 (de) | 2007-10-25 |
ES2293674T3 (es) | 2008-03-16 |
SE9700307D0 (sv) | 1997-01-31 |
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