JP2001502123A5 - - Google Patents
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- Publication number
- JP2001502123A5 JP2001502123A5 JP1999511887A JP51188799A JP2001502123A5 JP 2001502123 A5 JP2001502123 A5 JP 2001502123A5 JP 1999511887 A JP1999511887 A JP 1999511887A JP 51188799 A JP51188799 A JP 51188799A JP 2001502123 A5 JP2001502123 A5 JP 2001502123A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP97202432.7 | 1997-08-05 | ||
| EP97202432 | 1997-08-05 | ||
| PCT/IB1998/000916 WO1999008297A2 (en) | 1997-08-05 | 1998-06-11 | Method of manufacturing a plurality of electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001502123A JP2001502123A (ja) | 2001-02-13 |
| JP2001502123A5 true JP2001502123A5 (cg-RX-API-DMAC7.html) | 2006-01-05 |
Family
ID=8228622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11511887A Ceased JP2001502123A (ja) | 1997-08-05 | 1998-06-11 | 複数の電子部品の製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6240621B1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP0941545B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2001502123A (cg-RX-API-DMAC7.html) |
| KR (1) | KR100561792B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN1179381C (cg-RX-API-DMAC7.html) |
| DE (1) | DE69833193T2 (cg-RX-API-DMAC7.html) |
| TW (1) | TW412763B (cg-RX-API-DMAC7.html) |
| WO (1) | WO1999008297A2 (cg-RX-API-DMAC7.html) |
Families Citing this family (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7274549B2 (en) | 2000-12-15 | 2007-09-25 | X2Y Attenuators, Llc | Energy pathway arrangements for energy conditioning |
| US7110227B2 (en) | 1997-04-08 | 2006-09-19 | X2Y Attenuators, Llc | Universial energy conditioning interposer with circuit architecture |
| US6606011B2 (en) | 1998-04-07 | 2003-08-12 | X2Y Attenuators, Llc | Energy conditioning circuit assembly |
| WO1999052210A1 (en) | 1998-04-07 | 1999-10-14 | X2Y Attenuators, L.L.C. | Component carrier |
| US7106570B2 (en) | 1997-04-08 | 2006-09-12 | Xzy Altenuators, Llc | Pathway arrangement |
| US6603646B2 (en) | 1997-04-08 | 2003-08-05 | X2Y Attenuators, Llc | Multi-functional energy conditioner |
| US6954346B2 (en) | 1997-04-08 | 2005-10-11 | Xzy Attenuators, Llc | Filter assembly |
| US6894884B2 (en) | 1997-04-08 | 2005-05-17 | Xzy Attenuators, Llc | Offset pathway arrangements for energy conditioning |
| US7110235B2 (en) | 1997-04-08 | 2006-09-19 | Xzy Altenuators, Llc | Arrangement for energy conditioning |
| US6018448A (en) * | 1997-04-08 | 2000-01-25 | X2Y Attenuators, L.L.C. | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
| US7301748B2 (en) | 1997-04-08 | 2007-11-27 | Anthony Anthony A | Universal energy conditioning interposer with circuit architecture |
| US7042703B2 (en) | 2000-03-22 | 2006-05-09 | X2Y Attenuators, Llc | Energy conditioning structure |
| US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
| US20030161086A1 (en) | 2000-07-18 | 2003-08-28 | X2Y Attenuators, Llc | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
| US6650525B2 (en) | 1997-04-08 | 2003-11-18 | X2Y Attenuators, Llc | Component carrier |
| US7336467B2 (en) | 2000-10-17 | 2008-02-26 | X2Y Attenuators, Llc | Energy pathway arrangement |
| US7427816B2 (en) | 1998-04-07 | 2008-09-23 | X2Y Attenuators, Llc | Component carrier |
| US6452247B1 (en) * | 1999-11-23 | 2002-09-17 | Intel Corporation | Inductor for integrated circuit |
| US6891461B2 (en) | 1999-11-23 | 2005-05-10 | Intel Corporation | Integrated transformer |
| US6856228B2 (en) * | 1999-11-23 | 2005-02-15 | Intel Corporation | Integrated inductor |
| US6870456B2 (en) * | 1999-11-23 | 2005-03-22 | Intel Corporation | Integrated transformer |
| US6815220B2 (en) * | 1999-11-23 | 2004-11-09 | Intel Corporation | Magnetic layer processing |
| US7113383B2 (en) | 2000-04-28 | 2006-09-26 | X2Y Attenuators, Llc | Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
| EP1312148A4 (en) | 2000-08-15 | 2009-06-03 | X2Y Attenuators Llc | ELECTRODE ARRANGEMENT FOR CIRCUIT BREAKER PROCESSING |
| KR100536511B1 (ko) | 2000-10-17 | 2005-12-14 | 엑스2와이 어테뉴에이터스, 엘.엘.씨 | 공통 기준 노드를 갖는 단일 또는 다수의 회로들을 위한 차폐 아말감 및 차폐된 에너지 경로들 및 다른 엘리먼트들 |
| US7193831B2 (en) | 2000-10-17 | 2007-03-20 | X2Y Attenuators, Llc | Energy pathway arrangement |
| JP3955241B2 (ja) * | 2002-06-21 | 2007-08-08 | 東京エレクトロン株式会社 | Ｍｅｍｓアレイとその製造方法及びそれに基づくｍｅｍｓデバイスの製造方法 |
| US7075774B2 (en) * | 2002-09-10 | 2006-07-11 | Tdk Corporation | Multilayer capacitor |
| TW200423837A (en) * | 2002-09-27 | 2004-11-01 | Koninkl Philips Electronics Nv | Lithographic method for wiring a side surface of a substrate |
| US7180718B2 (en) | 2003-01-31 | 2007-02-20 | X2Y Attenuators, Llc | Shielded energy conditioner |
| US7852185B2 (en) * | 2003-05-05 | 2010-12-14 | Intel Corporation | On-die micro-transformer structures with magnetic materials |
| WO2005002018A2 (en) | 2003-05-29 | 2005-01-06 | X2Y Attenuators, Llc | Connector related structures including an energy |
| KR20060120683A (ko) | 2003-12-22 | 2006-11-27 | 엑스2와이 어테뉴에이터스, 엘.엘.씨 | 내부적으로 차폐된 에너지 컨디셔너 |
| JP2008537843A (ja) | 2005-03-01 | 2008-09-25 | エックストゥーワイ アテニュエイターズ，エルエルシー | 内部で重なり合った調整器 |
| WO2006093831A2 (en) | 2005-03-01 | 2006-09-08 | X2Y Attenuators, Llc | Energy conditioner with tied through electrodes |
| WO2006099297A2 (en) | 2005-03-14 | 2006-09-21 | X2Y Attenuators, Llc | Conditioner with coplanar conductors |
| US8134548B2 (en) | 2005-06-30 | 2012-03-13 | Micron Technology, Inc. | DC-DC converter switching transistor current measurement technique |
| EP1991996A1 (en) | 2006-03-07 | 2008-11-19 | X2Y Attenuators, L.L.C. | Energy conditioner structures |
| JP4872134B2 (ja) * | 2008-03-31 | 2012-02-08 | Ｔｄｋ株式会社 | 端子電極形成方法 |
| JP5233637B2 (ja) * | 2008-04-02 | 2013-07-10 | 日立金属株式会社 | 多層セラミック基板、及び電子部品 |
| CN102122553B (zh) * | 2010-12-17 | 2013-03-20 | 深圳顺络电子股份有限公司 | 卧式结构的低阻值片式负温度系数热敏电阻及其制造方法 |
| DE102011005658A1 (de) * | 2011-03-16 | 2012-09-20 | Sirona Dental Systems Gmbh | Träger, vorzugsweise für ein elektronisches Bauteil, eine Baugruppe solcher Träger und ein Verfahren zur Herstellung einer Baugruppe solcher Träger |
| DE102012109704A1 (de) * | 2012-10-11 | 2014-04-17 | Epcos Ag | Keramisches Bauelement mit Schutzschicht und Verfahren zu dessen Herstellung |
| JP6136507B2 (ja) * | 2013-04-16 | 2017-05-31 | Tdk株式会社 | 積層コンデンサアレイ |
| DE102018115205A1 (de) * | 2018-06-25 | 2020-01-02 | Vishay Electronic Gmbh | Verfahren zur Herstellung einer Vielzahl von Widerstandsbaueinheiten |
| CN109963409B (zh) * | 2019-04-10 | 2021-02-23 | 京东方科技集团股份有限公司 | 基板侧面导线的制造方法和基板结构 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3770434A (en) * | 1971-10-15 | 1973-11-06 | Rca Corp | Method for making an image screen structure for an apertured-mask cathode-ray tube using a mask having temporary apertures |
| US3809973A (en) * | 1973-07-06 | 1974-05-07 | Sprague Electric Co | Multilayer ceramic capacitor and method of terminating |
| US4356529A (en) * | 1981-01-21 | 1982-10-26 | Sprague Electric Company | Terminated monolithic ceramic chip capacitor |
| US4486738A (en) * | 1982-02-16 | 1984-12-04 | General Electric Ceramics, Inc. | High reliability electrical components |
| US4453199A (en) * | 1983-06-17 | 1984-06-05 | Avx Corporation | Low cost thin film capacitor |
| US4788523A (en) * | 1987-12-10 | 1988-11-29 | United States Of America | Viad chip resistor |
| US5278012A (en) * | 1989-03-29 | 1994-01-11 | Hitachi, Ltd. | Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate |
| US5144527A (en) * | 1989-08-24 | 1992-09-01 | Murata Manufacturing Co., Ltd. | Multilayer capacitor and method of fabricating the same |
| US5281769A (en) * | 1990-11-05 | 1994-01-25 | Nippon Telegraph And Telephone Corporation | Dewall plating technique |
| US5625220A (en) * | 1991-02-19 | 1997-04-29 | Texas Instruments Incorporated | Sublithographic antifuse |
| JP3018645B2 (ja) * | 1991-10-03 | 2000-03-13 | 株式会社村田製作所 | チップ部品の製造方法 |
| US5166656A (en) * | 1992-02-28 | 1992-11-24 | Avx Corporation | Thin film surface mount fuses |
| US5517385A (en) * | 1992-11-19 | 1996-05-14 | International Business Machines Corporation | Decoupling capacitor structure |
| JP2550852B2 (ja) * | 1993-04-12 | 1996-11-06 | 日本電気株式会社 | 薄膜キャパシタの製造方法 |
| US5323520A (en) * | 1993-04-29 | 1994-06-28 | Fujitsu Limited | Process for fabricating a substrate with thin film capacitor |
| US5414589A (en) * | 1993-06-07 | 1995-05-09 | Rohm Co., Ltd. | Capacitor having a changeable dielectric capacity and manufacturing method thereof |
| JP2870371B2 (ja) * | 1993-08-05 | 1999-03-17 | 株式会社村田製作所 | 積層電子部品、その製造方法およびその特性測定方法 |
| JP3027081B2 (ja) * | 1993-12-09 | 2000-03-27 | アルプス電気株式会社 | 薄膜素子 |
| JPH07161223A (ja) * | 1993-12-10 | 1995-06-23 | Murata Mfg Co Ltd | 導電性ペーストおよび積層セラミックコンデンサ |
| DE69507926T2 (de) * | 1994-04-28 | 1999-09-16 | Koninklijke Philips Electronics N.V., Eindhoven | Verfahren zur erzeugung eines kupferbildes auf einer aus elektrisch nichtleitendem material bestehenden platte mittels eines photolithographischen verfahrens |
| US5600533A (en) * | 1994-06-23 | 1997-02-04 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor having an anti-reducing agent |
| DE69603331T2 (de) | 1995-03-27 | 2000-02-17 | Koninklijke Philips Electronics N.V., Eindhoven | Herstellungsverfahren von einem elektronischen vielschichtbauteil |
| US5712759A (en) * | 1995-12-22 | 1998-01-27 | International Business Machines Corporation | Sidewall capacitor with L-shaped dielectric |
| US5699607A (en) * | 1996-01-22 | 1997-12-23 | Littelfuse, Inc. | Process for manufacturing an electrical device comprising a PTC element |
| KR100326979B1 (ko) * | 1996-12-18 | 2002-05-10 | 포만 제프리 엘 | 캐패시터형성방법및그캐패시터구조체 |
| US5880925A (en) * | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
-
1998
- 1998-06-11 DE DE69833193T patent/DE69833193T2/de not_active Expired - Fee Related
- 1998-06-11 JP JP11511887A patent/JP2001502123A/ja not_active Ceased
- 1998-06-11 CN CNB98801419XA patent/CN1179381C/zh not_active Expired - Fee Related
- 1998-06-11 KR KR1019997002927A patent/KR100561792B1/ko not_active Expired - Fee Related
- 1998-06-11 WO PCT/IB1998/000916 patent/WO1999008297A2/en not_active Ceased
- 1998-06-11 EP EP98923002A patent/EP0941545B1/en not_active Expired - Lifetime
- 1998-07-15 TW TW087111500A patent/TW412763B/zh not_active IP Right Cessation
- 1998-08-04 US US09/128,837 patent/US6240621B1/en not_active Expired - Fee Related