JP2001358060A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JP2001358060A
JP2001358060A JP2000181413A JP2000181413A JP2001358060A JP 2001358060 A JP2001358060 A JP 2001358060A JP 2000181413 A JP2000181413 A JP 2000181413A JP 2000181413 A JP2000181413 A JP 2000181413A JP 2001358060 A JP2001358060 A JP 2001358060A
Authority
JP
Japan
Prior art keywords
pattern
information
exposure
wafer
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000181413A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001358060A5 (enExample
Inventor
Yoshiyuki Miyamoto
佳幸 宮本
Toshiharu Miwa
俊晴 三輪
Takeshi Kato
毅 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2000181413A priority Critical patent/JP2001358060A/ja
Publication of JP2001358060A publication Critical patent/JP2001358060A/ja
Publication of JP2001358060A5 publication Critical patent/JP2001358060A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2000181413A 2000-06-16 2000-06-16 半導体装置の製造方法 Pending JP2001358060A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000181413A JP2001358060A (ja) 2000-06-16 2000-06-16 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000181413A JP2001358060A (ja) 2000-06-16 2000-06-16 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2001358060A true JP2001358060A (ja) 2001-12-26
JP2001358060A5 JP2001358060A5 (enExample) 2005-04-14

Family

ID=18682349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000181413A Pending JP2001358060A (ja) 2000-06-16 2000-06-16 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2001358060A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6801297B2 (en) 2002-07-12 2004-10-05 Renesas Technology Corp. Exposure condition determination system
JP2006073986A (ja) * 2004-08-06 2006-03-16 Fujitsu Ltd 半導体装置の製造方法
JP2008145918A (ja) * 2006-12-13 2008-06-26 Dainippon Printing Co Ltd 多重露光技術におけるマスク製造誤差検証方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6801297B2 (en) 2002-07-12 2004-10-05 Renesas Technology Corp. Exposure condition determination system
JP2006073986A (ja) * 2004-08-06 2006-03-16 Fujitsu Ltd 半導体装置の製造方法
JP2008145918A (ja) * 2006-12-13 2008-06-26 Dainippon Printing Co Ltd 多重露光技術におけるマスク製造誤差検証方法

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