JP2001357369A - Icカード等搭載用のicチップ - Google Patents
Icカード等搭載用のicチップInfo
- Publication number
- JP2001357369A JP2001357369A JP2000177005A JP2000177005A JP2001357369A JP 2001357369 A JP2001357369 A JP 2001357369A JP 2000177005 A JP2000177005 A JP 2000177005A JP 2000177005 A JP2000177005 A JP 2000177005A JP 2001357369 A JP2001357369 A JP 2001357369A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- card
- temperature
- resonance frequency
- antenna
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Credit Cards Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000177005A JP2001357369A (ja) | 2000-06-13 | 2000-06-13 | Icカード等搭載用のicチップ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000177005A JP2001357369A (ja) | 2000-06-13 | 2000-06-13 | Icカード等搭載用のicチップ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001357369A true JP2001357369A (ja) | 2001-12-26 |
| JP2001357369A5 JP2001357369A5 (enExample) | 2006-09-14 |
Family
ID=18678657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000177005A Pending JP2001357369A (ja) | 2000-06-13 | 2000-06-13 | Icカード等搭載用のicチップ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001357369A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002109495A (ja) * | 2000-10-04 | 2002-04-12 | Matsushita Electric Ind Co Ltd | 非接触icカードおよびリーダライタ |
| WO2004042668A1 (en) * | 2002-11-04 | 2004-05-21 | Upm Rafsec Oy | A method for manufacturing a product sensor, and a product sensor |
| JP2008523461A (ja) * | 2004-11-23 | 2008-07-03 | センサーマティック・エレクトロニクス・コーポレーション | 一体型eas/rfidデバイス及びその無効化デバイス |
| JP2011060176A (ja) * | 2009-09-14 | 2011-03-24 | Ricoh Co Ltd | Rfタグ |
| US20160189024A1 (en) * | 2014-12-29 | 2016-06-30 | Infineon Technologies Ag | Chip card |
| WO2019103527A1 (en) * | 2017-11-24 | 2019-05-31 | Samsung Electronics Co., Ltd. | Electronic device and communication method thereof |
| US11940331B2 (en) | 2020-02-05 | 2024-03-26 | Analog Devices, Inc. | Packages for wireless temperature sensor nodes |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61195896A (ja) * | 1985-02-27 | 1986-08-30 | 株式会社日立製作所 | Icカ−ド |
| JPH1125238A (ja) * | 1997-07-04 | 1999-01-29 | Kokusai Electric Co Ltd | Icカード |
| JPH11110501A (ja) * | 1997-10-01 | 1999-04-23 | Kokusai Electric Co Ltd | 非接触icカードシステムとその伝送電力制御方法 |
-
2000
- 2000-06-13 JP JP2000177005A patent/JP2001357369A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61195896A (ja) * | 1985-02-27 | 1986-08-30 | 株式会社日立製作所 | Icカ−ド |
| JPH1125238A (ja) * | 1997-07-04 | 1999-01-29 | Kokusai Electric Co Ltd | Icカード |
| JPH11110501A (ja) * | 1997-10-01 | 1999-04-23 | Kokusai Electric Co Ltd | 非接触icカードシステムとその伝送電力制御方法 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002109495A (ja) * | 2000-10-04 | 2002-04-12 | Matsushita Electric Ind Co Ltd | 非接触icカードおよびリーダライタ |
| WO2004042668A1 (en) * | 2002-11-04 | 2004-05-21 | Upm Rafsec Oy | A method for manufacturing a product sensor, and a product sensor |
| US7492164B2 (en) | 2002-11-04 | 2009-02-17 | Upm-Kymmene Corporation | Method for manufacturing a product sensor, and a product sensor |
| JP2008523461A (ja) * | 2004-11-23 | 2008-07-03 | センサーマティック・エレクトロニクス・コーポレーション | 一体型eas/rfidデバイス及びその無効化デバイス |
| JP2011060176A (ja) * | 2009-09-14 | 2011-03-24 | Ricoh Co Ltd | Rfタグ |
| US20160189024A1 (en) * | 2014-12-29 | 2016-06-30 | Infineon Technologies Ag | Chip card |
| US9984321B2 (en) * | 2014-12-29 | 2018-05-29 | Infineon Technologies Ag | Chip card and control element |
| WO2019103527A1 (en) * | 2017-11-24 | 2019-05-31 | Samsung Electronics Co., Ltd. | Electronic device and communication method thereof |
| US11019548B2 (en) | 2017-11-24 | 2021-05-25 | Samsung Electronics Co., Ltd. | Electronic device and communication method thereof |
| US11218938B2 (en) | 2017-11-24 | 2022-01-04 | Samsung Electronics Co., Ltd. | Electronic device and communication method thereof |
| US12192843B2 (en) | 2017-11-24 | 2025-01-07 | Samsung Electronics Co., Ltd. | Electronic device and communication method using 4G and 5G communication based on temperature |
| US11940331B2 (en) | 2020-02-05 | 2024-03-26 | Analog Devices, Inc. | Packages for wireless temperature sensor nodes |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060801 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060801 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090409 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090526 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20091027 |