JP2001345018A - Tin-plated copper wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tin-plated copper wire wherein the manufacturing process is not complicated and a conducting body does not soften even if a tin plating using a hot dipping is made. SOLUTION: This is made to be composed of a hard-drawn copper wire having a larger tensile strength than a predetermined value and made to contain from 5 ppm to 200 ppm by the weight of the metal not less than one kind of tin and indium.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tin-plated copper wire, and more particularly to a wire for equipment, in particular, a core wire of a micro coaxial cable, and
The present invention relates to a tin-plated copper wire suitable for a shield wire.

[0002]

2. Description of the Related Art Conventionally, copper and copper alloy wires have been used as conductors of cables for electronic equipment. With the recent miniaturization and weight reduction of electronic devices, cable diameter reduction is required, and the copper wire used for it also needs to be reduced in diameter,
At present, ultra-fine wires having a wire diameter of 0.02 mm have been used. Some conductors are plated with tin or silver for the purpose of suppressing deterioration in surface quality due to corrosion or the like.

As a plating method for the above conductor, there are an electroplating method and a hot-dip plating method. The production of a plated wire by the electroplating method is performed by applying electroplating to a large-sized core wire and repeating cold drawing to make the wire extremely fine, and is used for producing a silver-plated wire. On the other hand, when producing a tin-plated wire by the electroplating method, it is considered that whiskers are generated due to the strain remaining in the plating layer after the above-described cold drawing, and the hot-dip plating in which no distortion remains in the plating layer is considered. Has been applied.

[0004]

However, according to the conventional tin-plated copper wire, the conductor is softened by the heat applied at the time of hot-dip plating, so that there is a problem that required conductor strength cannot be obtained. In particular, it is remarkable for ultra-fine wires with a small heat capacity compared to thick copper wires, and it is necessary to lower the temperature of the plating bath or shorten the immersion distance of the plating bath to suppress softening of the conductor of the ultra-fine wires. It is conceivable, however, that the production process becomes complicated and causes a decrease in productivity.

Accordingly, an object of the present invention is to provide a tin-plated copper wire whose conductor is not softened even when tin-plated by hot-dip plating without complicating the manufacturing process.

[0006]

According to the present invention, there is provided a tin-plated copper wire having a diameter of 0.08 mm or less, which is made of tough pitch copper containing more than 100 ppm and less than 500 ppm of oxygen. Is composed of a hard copper wire having a diameter larger than a predetermined value.
Provide a tin-plated copper wire containing 0 ppm or less.

According to the above-mentioned tin-plated copper wire, it has a predetermined tensile strength and contains one or more metals in an amount of 5 ppm or more and 200 ppm or less by weight, whereby softening due to heat such as plating and mechanical properties of the metal are reduced. Deterioration and reduction in conductivity are suppressed.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a tin-plated copper wire of the present invention will be described in detail with reference to the drawings.

Using an SCR continuous casting apparatus, tough pitch copper containing 200 to 400 ppm of oxygen was cast to produce a rough drawn wire having a diameter of 8 mm. By adding tin, indium, or both in varying amounts to the molten copper, 12 types of rough drawn wires for core wires were cast. Table 1 shows the results of quantifying the tin and indium contents of these rough drawn lines by ICP analysis. No. No. 1 to No. No. 5 is a rough drawing line according to the present invention. 6 to No. 6 Up to 12 are compositions other than the present invention for comparison.

[Table 1] As a result of measuring the oxygen content of the rough drawn line, 200 to 4
It was within the range of 00 ppm. A rough drawn wire having a diameter of 8 mm was cold drawn to a diameter of 0.9 mm, once annealed completely, and further cold drawn to 0.04 mm to obtain an ultrafine hard copper wire serving as a core wire. Tin plating was performed on the ultrafine hard copper wire with a hot-dip plating apparatus.

FIG. 1 shows a hot-dip plating apparatus, in which a supply bobbin 2 for supplying the above-mentioned ultrafine hard copper wire 1 and a flux 3 are provided.
, A flux bath 4 for receiving the hot-dip plating of tin 5, a guide 7 for immersing the ultra-fine hard copper wire 1 surface-treated by the flux in the hot-dip plating 5, and a plating process. A winding device 8 having a winding bobbin 8A for winding the ultrafine hard copper wire 1 and a guide pulley 9 for guiding the ultrafine hard copper wire 1 are provided.

Prior to hot-dip plating, No. 1 shown in Table 1 was used. No. 1 to No. The softening characteristics of the wire material were evaluated at the stage where a rough drawn wire having a diameter of 8 mm of a copper material up to 12 was cold drawn to a diameter of 0.9 mm. As a result, no. No. 1 to No.
The wire of the present invention No. 5 is No. 5 which is ordinary tough pitch copper. 6, No. 7, No. 10 softening temperature than 8
C to 20 C higher. In addition, No. of the comparative example. 9, N
o. 10, No. In the case of No. 11, the total amount of element addition is the More than 5, but the softening temperature was the same. In addition, No. 2 containing an extremely large amount of tin was used.
No. 12, the softening temperature of the normal material (No. 6, No. 7, N
o. The temperature was improved by 150 ° C. as compared with 8).

After the formation of the tin-plated copper wire, the tensile strength after plating is measured and compared with the tensile strength of the ultrafine hard copper wire before plating. Rate (tensile strength after plating / tensile strength before plating). Table 2 shows the results.

[Table 2] As shown in Table 2, the tin-plated copper wire No. 1
-No. In No. 5, softening of the conductor due to heat during hot-dip plating is hardly recognized. On the other hand, in Comparative Example No. using normal tough pitch copper, 6, No. 7, No. With regard to the ultrafine hard copper wire of No. 8, softening of the conductor due to heat during plating was observed. In addition, the ultra-fine hard copper wire of Comparative Example No. 9-No.
No. 11, although the residual ratio of the tensile strength is not a problem, the improvement of the softening temperature due to the addition of the element is saturated as described above, or the oxide of the added element is excessively formed, which may cause a problem in ultrafine drawing. It is not preferable because of its properties. In addition, No. 1 containing a large amount of tin was used. In No. 12, the conductivity is greatly reduced.

According to the above-mentioned tin-plated copper wire, 100 p
It is made of tough pitch copper containing oxygen exceeding 500 ppm and not more than 500 ppm, and is not softened by heat at the time of immersion in hot-dip plating by containing one or more metals of 5 ppm or more and 200 ppm or less by weight of tin and indium. No deterioration in mechanical properties. Further, softening can be prevented not only for the heat effect at the time of plating but also for the heat effect at the insulator covering step in the cable manufacturing step. Further, since the content of tin or indium is very small, it has excellent conductivity equivalent to that of ordinary tough pitch copper.

In the present embodiment, the manufacturing process of applying a hot-dip plating of tin to an ultra-fine hard copper wire has been described. However, the present invention is applied to the manufacture of a plated wire for applying a solder plating or a zinc plating to an ultra-fine hard copper wire. Can also.

[0015]

As described above, according to the tin-plated copper wire of the present invention, the tin-plated copper wire is constituted by a hard copper wire having a tensile strength larger than a predetermined value, and one or more metals of tin and indium are weighed. In order to contain at 5ppm or more and 200ppm or less, without complicating the manufacturing process,
The conductor can be prevented from being softened even when tin-plated by hot-dip plating.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a hot-dip plating apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ultrafine hard copper wire 2 Supply bobbin 3 Flux 4 Flux tank 5 Hot-dip plating 6 Hot-dip plating tank 7 Guide 8 Winding device 8A Winding bobbin 9 Guide pulley

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Hiroyuki Akutsu 4-10-1, Kawajiri-cho, Hitachi-shi, Ibaraki F-term within Hitachi Wire Co., Ltd. (Reference) 4K027 AA02 AA06 AA25 AB05 AB46 AC03 AC32 5G307 BA01 BB02 BC06

Claims (3)

[Claims] 1. A tin-plated copper wire made of tough pitch copper containing oxygen of more than 100 ppm and not more than 500 ppm and having a diameter of 0.08 mm or less, comprising a hard copper wire having a tensile strength larger than a predetermined value, A tin-plated copper wire comprising one or more metals of at least 5 ppm and at most 200 ppm by weight of tin and indium. 2. The hard copper wire having a tensile strength of 500
2. The tin-plated copper wire according to claim 1, wherein said tin-plated copper wire has a configuration larger than MPa. 3. The tin-plated copper wire according to claim 1, wherein said hard copper wire is covered with a tin plating layer formed by immersion in hot-dip plating of tin.