JP2001332949A5 - - Google Patents
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- Publication number
- JP2001332949A5 JP2001332949A5 JP2000148394A JP2000148394A JP2001332949A5 JP 2001332949 A5 JP2001332949 A5 JP 2001332949A5 JP 2000148394 A JP2000148394 A JP 2000148394A JP 2000148394 A JP2000148394 A JP 2000148394A JP 2001332949 A5 JP2001332949 A5 JP 2001332949A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000148394A JP2001332949A (en) | 2000-05-19 | 2000-05-19 | Method for manufacturing surface acoustic wave element |
| KR10-2001-0026975A KR100453083B1 (en) | 2000-05-19 | 2001-05-17 | A method for manufacturing surface acoustic wave |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000148394A JP2001332949A (en) | 2000-05-19 | 2000-05-19 | Method for manufacturing surface acoustic wave element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001332949A JP2001332949A (en) | 2001-11-30 |
| JP2001332949A5 true JP2001332949A5 (en) | 2007-08-16 |
Family
ID=18654433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000148394A Pending JP2001332949A (en) | 2000-05-19 | 2000-05-19 | Method for manufacturing surface acoustic wave element |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2001332949A (en) |
| KR (1) | KR100453083B1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003017983A (en) * | 2001-06-28 | 2003-01-17 | Kyocera Corp | Wafer for elastic wave and elastic wave device employing the same |
| JP5068511B2 (en) * | 2006-11-07 | 2012-11-07 | 信越化学工業株式会社 | Manufacturing method of surface acoustic wave device |
| JP2012135854A (en) * | 2010-12-28 | 2012-07-19 | Disco Corp | Method for grinding lithium tantalate |
| JP5668179B1 (en) | 2013-03-21 | 2015-02-12 | 日本碍子株式会社 | Composite substrate for acoustic wave device and acoustic wave device |
| JP2015062958A (en) * | 2013-09-24 | 2015-04-09 | 株式会社ディスコ | Dividing method for lithium tantalate wafer |
| JP2018042209A (en) * | 2016-09-09 | 2018-03-15 | 株式会社ディスコ | Manufacturing method for surface elastic wave device chip |
| JP6906845B2 (en) | 2017-06-22 | 2021-07-21 | 株式会社ディスコ | Processing method of work piece |
| JP7019052B2 (en) * | 2018-08-21 | 2022-02-14 | 京セラ株式会社 | Substrate for surface acoustic wave element and its manufacturing method |
| CN112152588B (en) * | 2020-09-25 | 2024-01-30 | 福建晶安光电有限公司 | Surface acoustic wave filter and method for processing wafer for surface acoustic wave filter |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5947822A (en) * | 1982-09-10 | 1984-03-17 | Sumitomo Metal Mining Co Ltd | Manufacture of substrate for surface acoustic wave |
| JP3390842B2 (en) * | 1993-04-26 | 2003-03-31 | 勝代 田原 | Chamfering and mirror polishing method for plate-like work |
| JP3286020B2 (en) * | 1993-06-18 | 2002-05-27 | 株式会社東芝 | Manufacturing method of single crystal wafer |
| JPH07264001A (en) * | 1994-03-25 | 1995-10-13 | Ngk Insulators Ltd | Surface acoustic wave filter device |
| KR970051957A (en) * | 1995-12-26 | 1997-07-29 | 이형도 | Processing method of single crystal wafer |
| JP3658454B2 (en) * | 1996-03-29 | 2005-06-08 | コマツ電子金属株式会社 | Manufacturing method of semiconductor wafer |
| JPH09270396A (en) * | 1996-03-29 | 1997-10-14 | Komatsu Electron Metals Co Ltd | Method of manufacturing semiconductor wafer |
| JPH1131670A (en) * | 1997-07-10 | 1999-02-02 | Sumitomo Metal Ind Ltd | Manufacture of semiconductor substrate |
| JPH11219923A (en) * | 1998-02-03 | 1999-08-10 | Hitachi Ltd | Semiconductor wafer and manufacture of the same, and manufacture of semiconductor device |
| JPH11284469A (en) * | 1998-03-31 | 1999-10-15 | Toshiba Corp | Production of surface acoustic wave substrate |
| JP3668647B2 (en) * | 1998-08-28 | 2005-07-06 | コウベ プレシジョン インク | Semiconductor wafer substrate regeneration method and semiconductor wafer substrate regeneration polishing liquid |
| JP2000082931A (en) * | 1998-09-07 | 2000-03-21 | Fujitsu Ltd | Piezoelectric single crystal wafer, its manufacture and surface acoustic wave device |
| JP3555465B2 (en) * | 1998-09-09 | 2004-08-18 | 信越半導体株式会社 | Semiconductor substrate manufacturing method |
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2000
- 2000-05-19 JP JP2000148394A patent/JP2001332949A/en active Pending
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2001
- 2001-05-17 KR KR10-2001-0026975A patent/KR100453083B1/en not_active IP Right Cessation